CN218505420U - High-temperature-resistant composite substrate film - Google Patents
High-temperature-resistant composite substrate film Download PDFInfo
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- CN218505420U CN218505420U CN202221955519.1U CN202221955519U CN218505420U CN 218505420 U CN218505420 U CN 218505420U CN 202221955519 U CN202221955519 U CN 202221955519U CN 218505420 U CN218505420 U CN 218505420U
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- temperature
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Abstract
The utility model discloses a high temperature resistant composite substrate membrane, including top layer, middle level and inlayer, and the middle level sets up between top layer and inlayer. The heat-seal strength and heat-resistant index of the high-temperature-resistant composite base material film meet the requirement of 160-DEG C-resistant aluminum-plastic composite film, the manufacturing process is simple, and the high-temperature-resistant composite base material film is suitable for large-scale production.
Description
Technical Field
The utility model belongs to the technical field of the soft-packing, concretely relates to compound substrate membrane of high temperature resistant.
Background
In the adhesive packaging, the packaging temperature of one type of adhesive is 160 ℃, otherwise, the flowability is influenced, the packaging is not good, and an aluminum-plastic composite film capable of resisting the high temperature of 160 ℃ is required to be used for manufacturing a packaging bag. It is known that an aluminum-plastic composite film is made of a plastic substrate film with heat sealing property and an aluminum foil or an aluminum-plated film, and in order to make the aluminum-plastic composite film resistant to a high temperature of 160 ℃, the substrate film is required to have a heat sealing function and also resistant to a high temperature of 160 ℃. The traditional high-temperature resistant substrate film comprises a pp film and a pa film, the heat sealing performance of the pp film is still acceptable, but the heat-resistant temperature is less than 160 ℃; pa films have no problem in resistance to 160 ℃, but have poor heat sealability; in recent years, a PP/PA alloy material is developed abroad, has two material characteristics, but is expensive, and a new material with higher cost performance needs to be developed urgently to meet the requirement of a high-temperature-resistant aluminum-plastic composite film on a base material film.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant composite substrate membrane to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high temperature resistant composite substrate film comprises
The surface layer, the middle layer and the inner layer, and the middle layer is arranged between the surface layer and the inner layer.
Preferably, the surface layer is made of PA material, and the thickness thereof is set to 15 μm.
In any of the above schemes, preferably, the middle layer is made of PP/PA alloy, and the thickness thereof is set to 20 μm.
In any of the above embodiments, the inner layer is preferably made of PP, and has a thickness of 25 μm.
In any of the above embodiments, the content ratio of PA to PP in the PP/PA alloy material is preferably 45% or 55%.
The utility model discloses a technological effect and advantage: the heat-seal strength and heat-resistance index of the high-temperature-resistant composite base material film meet the requirements of 160-DEG C-resistant high-temperature aluminum-plastic composite films, the manufacturing process is simple, and the high-temperature-resistant composite base material film is suitable for large-scale production.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1. an outer layer; 2. a middle layer; 3. an inner layer.
Detailed Description
The following description will further explain embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
The utility model provides a high temperature resistant composite substrate membrane as shown in figure 1, include
A surface layer 1, the surface layer 1 is made of PA (polyamide) material, the thickness is 15 μm,
the middle layer 2 is made of PP/PA alloy material, the thickness of the middle layer 2 is 20 mu m, the content ratio of PA (polyamide) to PP (polypropylene) in the PP/PA alloy material is 45 percent to 55 percent,
an inner layer 3, the inner layer 3 is made of PP (polypropylene) and the thickness is 25 μm,
the middle layer 2 is arranged between the surface layer 1 and the inner layer 3.
When the high-temperature-resistant composite base material film is prepared, three raw materials of PA, PP/PA alloy and PP are respectively added into hoppers of an outer layer 1, a middle layer 2 and an inner layer 3 of a three-layer co-extrusion blow molding machine, and a film is directly blown by selecting proper parameters.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (4)
1. A high temperature resistant composite substrate film characterized by: comprises that
The surface layer (1), the middle layer (2) and the inner layer (3), wherein the middle layer (2) is arranged between the surface layer (1) and the inner layer (3);
the surface layer (1) is made of PA material;
the middle layer (2) is made of PP/PA alloy material;
the inner layer (3) is made of PP materials.
2. The high temperature resistant composite substrate film of claim 1, wherein: the thickness of the surface layer (1) is set to 15 μm.
3. The high temperature resistant composite substrate film of claim 1, wherein: the thickness of the middle layer (2) is set to be 20 μm.
4. The high temperature resistant composite substrate film of claim 1, wherein: the thickness of the inner layer (3) is set to 25 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221955519.1U CN218505420U (en) | 2022-07-27 | 2022-07-27 | High-temperature-resistant composite substrate film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221955519.1U CN218505420U (en) | 2022-07-27 | 2022-07-27 | High-temperature-resistant composite substrate film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218505420U true CN218505420U (en) | 2023-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221955519.1U Active CN218505420U (en) | 2022-07-27 | 2022-07-27 | High-temperature-resistant composite substrate film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218505420U (en) |
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2022
- 2022-07-27 CN CN202221955519.1U patent/CN218505420U/en active Active
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