CN218499486U

CN218499486U - Work assembly and electronic equipment

Info

Publication number: CN218499486U
Application number: CN202222237979.7U
Authority: CN
Inventors: 刘福兴; 张少华; 杨欢; 张楠赓
Original assignee: Canaan Creative Co Ltd
Current assignee: Canaan Creative Co Ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2023-02-17
Anticipated expiration: 2032-08-24

Abstract

The present disclosure provides a work assembly and an electronic device, the work assembly including: the circuit board comprises a substrate, a plurality of working chips and a plurality of heat conducting elements, wherein the working chips and the heat conducting elements are arranged on the substrate, and the heat conducting elements cover at least two adjacent working chips and the area between the adjacent working chips. The technical scheme of the disclosure can improve the heat dissipation characteristic and the power supply characteristic of the circuit board.

Description

Work assembly and electronic equipment

Technical Field

The present disclosure relates to the field of heat dissipation technologies, and in particular, to a work module and an electronic device.

Background

Along with the development of artificial intelligence and the technical field of big data, the computational demand on electronic equipment is higher and higher. In order to meet the computational requirements, a plurality of working chips are usually arranged on a circuit board of the electronic device for parallel computation. The working chip can generate a large amount of heat in the working process, and a radiator is required to be arranged to radiate the circuit board. Therefore, how to improve the heat dissipation performance of the heat sink to the circuit board becomes a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The disclosed embodiments provide a work assembly and an electronic device to solve or alleviate one or more technical problems in the prior art, the work assembly including:

the circuit board comprises a substrate, a plurality of working chips and a plurality of heat conducting elements, wherein the working chips and the heat conducting elements are arranged on the substrate, and the heat conducting elements cover at least two adjacent working chips and the area between the adjacent working chips.

In one embodiment, the plurality of driver chips are arranged in rows and columns, the average spacing of the plurality of driver chips in the row direction is greater than the average spacing in the column direction, and the heat conducting element extends in the column direction.

In one embodiment, the plurality of working chips form a plurality of working chip columns, the substrate is further provided with a voltage regulating circuit, and at least part of components of the voltage regulating circuit are distributed among the working chip columns.

In one embodiment, the plurality of working chips are arranged in rows and columns, the average spacing of the plurality of working chips in the row direction is smaller than the average spacing in the column direction, and the heat conducting element extends in the row direction.

In one embodiment, the plurality of working chips form a plurality of working chip rows, the substrate is further provided with a voltage regulating circuit, and at least part of components of the voltage regulating circuit are distributed among the working chip rows.

In one embodiment, the size of each active chip is the same, and/or the heat generating area of each active chip is the same.

In one embodiment, at least one metal member is disposed between adjacent working chips connected in series, and the heat conducting element between the adjacent working chips covers the metal member.

In one embodiment, the projection of the heat conducting element on the substrate corresponds to the metal piece between adjacent active chips.

In one embodiment, the thickness of the metal member is less than or equal to the thickness of the working chip, and the thickness direction of the metal member and the thickness direction of the working chip are perpendicular to the substrate.

In one embodiment, the working assembly further comprises:

the heat radiator comprises a heat radiating main body and heat radiating fins, wherein the heat radiating main body comprises a first surface and a second surface which are opposite, the first surface is connected with the heat radiating fins, the second surface is provided with a plurality of bosses, the bosses are in contact with at least one heat conducting element, and the extension direction of the bosses is the same as that of the heat conducting element.

In one embodiment, the heat conducting element extends in a direction perpendicular to the heat dissipation direction of the heat sink.

In one embodiment, the spacing between at least some of the adjacent active chips increases in the direction of heat dissipation.

In one embodiment, the circuit board and the heat sink are both disposed in the heat dissipation air duct, and the heat dissipation direction is a wind direction of the heat dissipation air duct.

In one embodiment, the distance between at least part of the adjacent working chips is positively correlated with the distance from the adjacent working chips to the air inlet of the heat dissipation air duct.

In one embodiment, the inner cavity of the heat sink contains a heat dissipation medium, and the heat dissipation direction is a flow direction of the heat dissipation medium.

In one embodiment, the circuit board and the heat radiator are both arranged in the heat dissipation air duct;

the working assembly further comprises a sealing element which is arranged at the end parts of the radiator and the circuit board, which are close to the air inlet of the heat dissipation air duct, and the sealing element extends along the direction vertical to the wind direction of the heat dissipation air duct.

In one embodiment, the seal comprises:

the sealing element body is abutted against the circuit board and the end part of the radiator close to the air inlet;

and the convex part of the sealing element protrudes out of the sealing element body and is positioned at the gap between the heat radiator and the circuit board.

In one embodiment, the seal projection is a unitary piece that extends along a length of the seal body that is perpendicular to the direction of the wind.

In one embodiment, the seal projection includes a plurality of sub-projections arranged along a length of the seal body, the length being perpendicular to a direction of the wind.

In one embodiment, the convex part of the sealing member is provided with a convex part, and the convex direction of the convex part is vertical to the circuit board.

In one embodiment, the projection is a unitary piece that extends along a length of the seal projection, the seal projection length being perpendicular to the direction of the wind.

In one embodiment, the protrusion includes a plurality of sub-protrusions arranged along a length direction of the seal protrusion, the length direction of the seal protrusion being perpendicular to a wind direction.

In one embodiment, the air guide portion is formed on a surface of the seal body facing away from the convex portion of the seal.

In one embodiment, the cross section of the air guiding part is triangular or semicircular, and the cross section of the air guiding part is perpendicular to the circuit board.

In one embodiment, the end of the heat sink close to the air inlet is formed with a sealing member protruding toward the circuit board, and the sealing member is in contact with the end of the circuit board close to the air inlet.

In one embodiment, the plurality of working chips form a plurality of working chip rows, the working chip rows extend in a direction perpendicular to the wind direction, and the seal member extends longer than the working chip rows.

In one embodiment, the seal extends less than the length of the circuit board in a direction perpendicular to the direction of the wind.

In one embodiment, the circuit board is a single-layer circuit board, and the circuit board further includes:

at least one bridge element is arranged at the intersection of the circuit connecting lines, wherein the bridge element comprises a 0 ohm resistor and/or a 0 ohm metal patch.

In one embodiment, a 0 ohm resistor is disposed opposite a recess on the heat sink.

In one embodiment, the work module further includes a control board, and a signal transmission circuit is disposed on the substrate, the signal transmission circuit including:

the circuit comprises N stages of working circuits which are connected in series, wherein each working circuit comprises at least one working chip, N is an integer larger than 1, the 1 st stage of working circuit is connected with a first system voltage, the Nth stage of working circuit is connected with a second system voltage, and the second system voltage is higher than the first system voltage;

the first input and output end of the signal voltage conversion circuit is connected with the Nth-stage working circuit, and the second input and output end of the signal voltage conversion circuit is connected with the control board;

the signal voltage conversion circuit is used for converting the voltage of a control panel signal sent by the control panel and then sending the control panel signal to the N-level working circuit; or the signal voltage conversion circuit is used for converting the voltage of the working circuit signal sent by the N-level working circuit and then sending the working circuit signal to the control board.

In one embodiment, the 1 st stage operating circuit is configured to receive a control board signal, and the signal-to-voltage converting circuit is configured to transmit an operating circuit signal of the nth stage operating circuit to the control board.

In one embodiment, the signal transmission circuit further comprises:

the voltage regulating circuits are connected with at least partial stage working circuits in a one-to-one correspondence mode, wherein each voltage regulating circuit comprises at least one power supply chip used for providing at least one regulating voltage for the connected working circuits.

In one embodiment, the signal-voltage converting circuit includes a first power supply terminal and a first ground terminal respectively connected to the regulated-voltage power supply terminal of the nth stage operating circuit and the ground terminal of the nth stage operating circuit.

In one embodiment, the signal-voltage converting circuit further includes a second power supply terminal and a second ground terminal for connecting the power supply terminal of the control board and the ground terminal of the control board, respectively.

In one embodiment, the signal-voltage converting circuit further includes a second power supply terminal and a second ground terminal respectively connected to the regulated-voltage power supply terminal of the 1 st-stage operating circuit and the ground terminal of the 1 st-stage operating circuit.

The embodiment of the disclosure also provides an electronic device which comprises the working assembly of any embodiment of the disclosure.

The technical scheme of the embodiment of the disclosure can improve the heat dissipation performance and the power supply performance of the circuit board.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will be readily apparent by reference to the drawings and following detailed description.

Drawings

In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are not to be considered limiting of its scope.

FIG. 1 shows a schematic diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2, 3, 4, 5, and 6 respectively illustrate schematic diagrams of circuit boards according to embodiments of the present disclosure;

fig. 7, 8, 9, 10, and 11 respectively illustrate schematic diagrams of an electronic device according to an embodiment of the present disclosure;

FIG. 12 shows a schematic diagram of a circuit board according to an embodiment of the present disclosure;

fig. 13A, 13B, 13C and 14A, 14B, 14C show schematic views of a seal according to an embodiment of the disclosure.

Fig. 15, 16, and 17 show circuit diagrams of signal transmission circuits according to embodiments of the present disclosure;

fig. 18 shows a functional diagram of a signal-to-voltage conversion circuit according to an embodiment of the present disclosure;

fig. 19, 20 and 21 show circuit diagrams of signal transmission circuits according to embodiments of the present disclosure;

fig. 22 shows a schematic diagram of a circuit board according to an embodiment of the present disclosure.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art can appreciate, the described embodiments can be modified in various different ways, without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

An embodiment of the present application provides an electronic device, as shown in fig. 1, including a housing (not shown), a working assembly, a control board, and a power supply (not shown). Wherein, the quantity of work subassembly is at least two, and each work subassembly is dismantled and assembled to be installed in the casing, and the control panel is connected with the circuit board. For example, the signal connection between the control board and the circuit board is realized by a signal line, and the signal line may adopt a flexible row. Mounted within the housing is a working assembly comprising a circuit board 70 and a heat sink. The circuit board 70 includes a substrate 30 and a plurality of working chips 110 disposed on the substrate 30. The power supply is used to power the circuit board 70.

The heat sink is located on the side of the circuit board where the active chip 110 is located, and is used to dissipate heat from the circuit board 70, such as the heat sink 80. The heat sink may also be located on the side of the circuit board where the active chip 110 is not located, such as the heat sink 89. The heat sink 80 and the heat sink 89 may or may not have the same structure. Alternatively, the active chips 110 are disposed on both sides of the circuit board 70, and the heat sinks are disposed on both sides of the circuit board 70.

The opposite both ends of radiator are provided with slide 891, are provided with relative slide rail on the casing, and the dismouting of the subassembly that realizes working on the slide 891 of radiator and the slide rail on the casing mutually support.

The radiator in this embodiment may be an air-cooled radiator or a liquid-cooled radiator, which is not limited in this embodiment.

Illustratively, the size of each of the working chips 110 is the same, and the length, width, and thickness of each of the working chips 110 are the same. Further, the heat generating areas of the respective driver chips 110 are the same.

The circuit board in the embodiment can be a calculation circuit board, and the calculation force requirements in the fields of artificial intelligence, big data and the like are met. The electronic device in this embodiment may be a computing device, and is applied to a high computation amount scene in the fields of artificial intelligence, big data, and the like.

In one embodiment, the electronic device may include a plurality of heat conducting elements covering at least two adjacent working chips 110 and the region between the adjacent working chips 110. The arrangement can not only dissipate heat for the working chip 110, but also dissipate heat for the substrate 30, thereby improving the heat dissipation efficiency of the circuit board.

In one example, as shown in fig. 2, one heat conducting element 501 covers several working

chips

110A, 110B, and 110C, and the area between the working

chips

110A, 110B, and 110C. It should be noted that the number, size, and number of the heat conducting elements 501 covering the working chips 110 are not limited in this embodiment, and may be variously configured according to actual needs.

In one embodiment, the plurality of working chips 110 are distributed in rows and columns, and the spacing between adjacent working chips 110 may be different, i.e., the distribution of the working chips 110 may be in different sparse states. The heat conducting elements are adapted to extend in a distributed direction with a smaller pitch.

In one example, as shown in FIG. 3, the plurality of work chips 110 are arranged in rows and columns, the average pitch of the plurality of work chips 110 in the row direction X is greater than the average pitch in the column direction Y, and the heat-conducting element 502 extends in the column direction Y. Therefore, the area of the heat conducting element can be reduced, and the material for forming the heat conducting element is saved.

In another example, as shown in fig. 4, the average pitch of the plurality of work chips 110 in the row direction X is smaller than the average pitch in the column direction Y, and the heat conductive member 503 extends in the row direction X. Therefore, the area of the heat conducting element can be reduced, and the material for forming the heat conducting element is saved.

It should be noted that the number, size, and number of the

heat conducting elements

502 and 503 covering the working chips 110 are not limited in this embodiment, and may be variously configured according to actual needs.

In this embodiment, the heat conducting element may be made of silicone grease or silicone gel or a silicone strip, that is, the heat conducting element may be a silicone grease layer or a silicone gel layer, and is coated or attached on the surfaces of the plurality of working chips 110 and the regions between the plurality of working chips 110.

In one embodiment, the plurality of active chips are distributed in rows and columns, the distance between at least part of adjacent active chips is gradually increased along the heat dissipation direction of the heat sink, and the heat conducting element is arranged in an extending manner along the direction perpendicular to the heat dissipation direction.

In one example, as shown in FIG. 5, the heat dissipation direction is parallel to the row direction X, the spacing between adjacent active chips 110 increases gradually along the heat dissipation direction, and the heat conducting elements 504 extend along the column direction Y.

In another example, as shown in fig. 6, the heat dissipation direction is parallel to the column direction Y, the pitch of the adjacent active chips 110 gradually increases along the heat dissipation direction, and the heat conducting member 505 extends along the row direction X.

Therefore, the area of the heat conducting element can be reduced, and the material for forming the heat conducting element is saved.

It should be noted that in this embodiment, "gradually increasing" should be understood as a variation trend of the pitch, that is, the pitch of the adjacent working chips is not increased one by one, and the pitch of the plurality of adjacent working chips is allowed to decrease along the heat dissipation direction, as long as the pitch of the adjacent working chips is increased along the heat dissipation direction as a whole. For example: in order to avoid or arrange other components, the distance between a plurality of adjacent working chips can be reduced along the heat dissipation direction.

The heat sink may be an air-cooled heat sink, for example, the housing is used to enclose a heat dissipation air duct, and the circuit board and the heat sink are both disposed in the heat dissipation air duct, where the heat dissipation direction is an air direction of the heat dissipation air duct. For example: the heat dissipation air duct has an air inlet, and the distance between the adjacent working chips is positively correlated with the distance between the adjacent working chips and the air inlet, so that the distance between the adjacent working chips 110 is gradually increased along the heat dissipation direction.

The radiator may also be a liquid-cooled radiator, and a heat dissipation medium is accommodated in an inner cavity of the radiator, wherein the heat dissipation direction is a flow direction of the heat dissipation medium. So that the pitch of the adjacent operating chips 110 gradually increases in the heat dissipation direction.

Because the heat dissipation efficiency of the heat dissipation channel is gradually reduced along the heat dissipation direction, the distance between the adjacent working chips 110 is gradually increased along the heat dissipation direction, and the circuit board can be uniformly cooled. When the radiator is an air-cooled radiator, the radiating channel is a radiating air channel; when the heat sink is a liquid-cooled heat sink, the heat dissipation channel is an accommodation space formed by the heat sink for accommodating each working chip.

In one embodiment, the heat sink includes a heat dissipating body 81 and heat dissipating fins 82, and the heat dissipating body 81 includes a first surface and a second surface opposite to each other, wherein the first surface is connected to the heat dissipating fins 82, and the second surface is provided with bosses. The boss is in contact with at least one heat conduction element, and the extension direction of the boss is the same as the extension direction of the heat conduction element.

In one example, as shown in fig. 7, the heat conductive member 501 covers several working

chips

110A, 110B, and 110C, and regions between the working

chips

110A, 110B, and 110C, and the extension direction of the bosses 801 is the same as that of the heat conductive member 501.

In another example, as shown in fig. 8, the average pitch of the plurality of the work chips 110 in the row direction X is greater than the average pitch in the column direction Y, along which both the heat conductive element 502 and the lands 802 extend.

In yet another example, as shown in fig. 9, the average pitch of the plurality of work chips 110 in the row direction X is smaller than the average pitch in the column direction Y, and the heat conductive member 503 and the lands 803 each extend in the row direction X.

In yet another example, as shown in FIG. 10, the heat dissipation direction is parallel to the row direction X, the spacing between adjacent work chips 110 increases gradually along the heat dissipation direction, and both the thermally conductive element 504 and the boss 804 extend along the column direction Y.

In the next example, as shown in fig. 11, the heat dissipation direction is parallel to the column direction Y, and the pitch of adjacent work chips 110 gradually increases along the heat dissipation direction, and the heat conductive member 505 and the boss 805 extend along the row direction X.

When the boss contacts a heat conducting element, the heat conducting element can dissipate heat of the working chip 110 or a metal piece (described in detail below) covered by the heat conducting element, thereby improving heat dissipation characteristics of the circuit board. The extension direction of the boss is the same as that of the heat conducting element, so that the boss can be maximally contacted with the heat conducting element, and the heat dissipation efficiency of the circuit board is further improved.

It should be noted that, in this embodiment, the number and the size of the bosses are not limited, and various configurations may be performed according to actual needs.

In one example, the plurality of workchips 110 are arranged in rows and columns to form a plurality of rows of workchips, and the thermally conductive element may overlie a row of workchips. The substrate 30 is further provided with a voltage regulating circuit (such as an auxiliary power circuit, which will be described in detail later), and at least a part of components (such as an auxiliary power chip) of the voltage regulating circuit are distributed among the working chip rows. That is, the auxiliary power chips may be distributed over the line pitch of the active chips. Furthermore, the plurality of bosses and the plurality of working chip columns are correspondingly arranged, so that grooves formed between the adjacent bosses correspond to components of the voltage regulating circuit. Because the accommodation space that the recess formed can hold the components and parts of a certain height to when the components and parts selection of auxiliary power supply circuit, reduced the restriction to components and parts size.

In another example, the plurality of workchips 110 are arranged in rows and columns to form a plurality of rows of workchips, and the thermally conductive element can overlie a row of workchips. A voltage regulating circuit, such as an auxiliary power supply circuit, which will be described in detail later, is also disposed on the substrate 30, and at least a portion of components (such as auxiliary power supply chips) of the voltage regulating circuit are distributed among the rows of working chips. That is, the auxiliary power chips may be distributed over the column pitch of the active chips. Furthermore, the plurality of bosses and the plurality of working chips are arranged correspondingly, so that grooves formed between the adjacent bosses correspond to components of the voltage regulating circuit. Because the accommodation space that the recess formed can hold the components and parts of a certain height to when the components and parts selection of auxiliary power supply circuit, reduced the restriction to components and parts size. In one embodiment, at least one metal part is arranged between adjacent working chips connected in series, and the heat conducting element between the adjacent working chips covers the metal part between the adjacent working chips. The metal member may be a copper sheet or an aluminum sheet, and is welded on the substrate 30, and is used for dissipating heat of the two adjacent connected working chips and reducing a voltage drop between the two adjacent connected working chips. Therefore, the working stability and reliability of the working chip are improved.

The serial connection means that the power supply of the core voltage required by the adjacent chips adopts the serial mode. For example, a plurality of chips are connected in series between a power supply and ground, and the core voltages of the plurality of chips are supplied.

In one embodiment, the projection of the thermally conductive element onto the substrate 30 corresponds to a metal piece between adjacent active chips. Further, the projection of the boss on the base plate 30 corresponds to a metal piece.

In one example, as shown in fig. 7, metal pieces 61 are disposed between adjacent working

chips

110A and 110B and between adjacent working

chips

110B and 110C covered by the heat conducting element 501, and an extending direction of the heat conducting element 501 is the same as an extending direction of the two metal pieces 61, so that a projection of the heat conducting element 501 on the substrate 30 may cover the two metal pieces 61, and a projection of the boss 801 on the substrate 30 corresponds to the two metal pieces 61, thereby facilitating heat dissipation of each metal piece 61.

In another example, as shown in fig. 8, metal pieces 62 are disposed between each two adjacent active chips 110, and the extending direction of the heat conducting element 502 and the extending direction of each metal piece 62 are both the column direction Y, so that the projection of the heat conducting element 502 on the substrate 30 can cover each metal piece 62, and the projection of the boss 802 on the substrate 30 can cover each metal piece 62, thereby facilitating heat dissipation of each metal piece 62.

In yet another example, as shown in fig. 10, the heat dissipation direction is parallel to the row direction X, and along the row direction X, the distance between adjacent working chips 110 gradually increases, the heat conducting element 504 and each metal piece 64 both extend along the column direction Y, so that the projection of the heat conducting element 504 on the substrate 30 can cover each metal piece 64, and the projection of the boss 804 on the substrate 30 can cover each metal piece 64, thereby facilitating the heat dissipation of each metal piece 64.

Illustratively, the thickness of the metal piece is less than or equal to the thickness of the working chip. The thickness direction of the metal piece and the thickness direction of the working chip are perpendicular to the substrate.

In the technical scheme of this embodiment, through mutually supporting between boss, work chip, the metalwork, reduced or eliminated the space between the base plate of boss and circuit board to make the unable entering between radiator and the circuit board of the extending direction's of perpendicular to boss wind, can effectively avoid long-term the deposition between radiator and the circuit board that bloies and lead to, and then effectively solved the influence of deposition to heat dispersion.

In one embodiment, as shown in FIG. 12, each thermal conductive element 506 is disposed in a one-to-one correspondence with each of the worker chips 110 to dissipate heat for each of the worker chips 110. Wherein the heat conducting element 506 may cover a part of or the whole surface of the corresponding working chip 110.

Illustratively, the material of the heat conducting element may be silicone grease or silicone gel, that is, the heat conducting element may be a silicone grease layer or a silicone gel layer, coated or attached on the surface of the working chip 110.

In one embodiment, shown in FIG. 1, the heat sink is embodied as an air-cooled heat sink, which may be heat sink 80 and/or heat sink 89. The housing encloses a heat dissipation air duct, and the circuit board 70 and the heat sink are both arranged in the heat dissipation air duct; the electronic device further comprises a seal 90. The sealing element 90 is arranged at the end parts of the radiator and the circuit board close to the air inlet of the heat dissipation air duct, and the sealing element 90 extends along the direction vertical to the wind direction of the heat dissipation air duct.

Illustratively, the sealing member 90 is adhered to the end portions of the heat sink and the circuit board close to the air inlet of the heat dissipation air duct.

Illustratively, the sealing member 90 is disposed between the heat sink 80 and the circuit board 70 and near an air inlet of the heat dissipation air duct, and the sealing member 90 extends along a direction S2 perpendicular to the heat dissipation direction. Wherein, S1 represents the direction of the heat dissipation air duct, i.e. the heat dissipation direction, and S2 represents the direction perpendicular to the heat dissipation direction. That is, the sealing member 90 is disposed between the side of the circuit board 70 having the active chip 110 and the heat sink 80.

It should be noted that the structural details of the heat sink 80 and the layout of the active chips 110 on the circuit board 70 are only used to explain the structure of the sealing member 90 in the present embodiment, and the present embodiment is not limited thereto.

By arranging the sealing element, the sealing performance of the radiator and the circuit board 70 at the air inlet can be improved, moisture is prevented from entering from a gap between the radiator 80 and the circuit board 70, so that a working chip close to the air inlet is protected, air leakage can be avoided, the air quantity passing through the radiator 80 and/or the radiator 89 is ensured, and the heat dissipation performance of the circuit board 70 is improved.

In one embodiment, the plurality of task chips 110 are arranged in rows and columns to form a plurality of task chip rows, and the extending direction (row direction) of the task chip rows is perpendicular to the wind direction, i.e., the extending direction of the task chip rows is S2.

Further, the extending length of the sealing member 90 is greater than the length of the working chip row, that is, the length of the sealing member 90 is greater than the length of the working chip row in the S2 direction. The seal member 90 extends less than the length of the circuit board 70 in the direction perpendicular to the wind direction, that is, the length of the seal member 90 is less than the length of the circuit board 70 in the S2 direction.

Based on this, the sealing member both can avoid moisture to influence the work chip, can dodge other structures at circuit board both ends again.

In one example, as shown in fig. 13A, 13B, 13C and 14A, 14B, 14C, seal 90 includes a seal body 91 and a seal boss 92. The sealing member body 91 abuts against the circuit board 70 and the end of the heat sink 80 near the air inlet; the seal projection 92 projects from the seal body 91 in a direction away from the air inlet, and is located at a gap between the heat sink 80 and the circuit board 70.

The thickness of the sealing element body 91 ranges from 0.8 mm to 1.2mm, and exemplarily, the thickness of the sealing element body 91 may range from 1mm; the height of the seal body 91 ranges from 7 mm to 9mm, and the height of the seal body 91 may be 8mm. The height direction of the seal 91 is perpendicular to the wind direction, and the thickness direction of the seal 91 is parallel to the wind direction. The thickness of the seal land 92 may range from 0.5 mm to 1.5mm, and the thickness of the seal land 92 may be 1mm, for example. The width of the seal projection 92 may range from 2.5 mm to 3.5mm, and the width of the seal projection 92 may be 3mm, for example. The thickness direction of the seal projection 92 is perpendicular to the wind direction, and the width direction of the seal projection 92 is parallel to the wind direction.

Illustratively, the seal protrusion 92 is a single piece extending along the length direction of the seal body 91, or the seal protrusion 92 includes a plurality of sub-protrusions 922 arranged along the length direction of the seal body 91, the length direction of the seal body 91 being perpendicular to the wind direction.

Illustratively, the number of the sub-protrusions 922 is two, and the sub-protrusions are distributed at both ends of the seal body 91. Or the number of the sub protrusions 922 is 3, two of which are distributed at both ends of the sealing member body 91, and the other of which is distributed at the middle of the sealing member body 91.

In one embodiment, as shown in fig. 13A, 13B, 13C and 14A, 14B, 14C, a convex member 921 is formed on the seal convex portion 92, and a convex direction of the convex member 921 is perpendicular to the circuit board 70. The protruding pieces 921 may be two, protruding toward the heat sink 80 and the circuit board 70, respectively. Based on this, the sealing member protrusion 92 is inserted into the gap and tightly plugged without using an additional mounting and fixing structure, and the mounting and fixing of the entire sealing member 90 can be achieved.

The protrusion height of the protrusion 921 ranges from 0.2 to 0.3mm, and the protrusion height of the protrusion 921 may be 0.25mm.

Illustratively, the projection 921 is an integral piece extending in the longitudinal direction of the seal projection 92, or the projection 921 includes a plurality of sub-projections 9211 arranged in the longitudinal direction of the seal projection 92, the longitudinal direction of the seal projection 92 being perpendicular to the wind direction. For example, the sub protrusion 9211 may be a long bar shape, a semi-sphere shape, or the like, which is not limited in the present application.

Illustratively, the thickness of the seal projection 92 is less than the gap height between the heat sink 80 and the circuit board 70; the sum of the thickness of the seal projection 92 and the height of the boss 921 (or the height of the sub-boss 9211) is larger than the height of the gap between the heat sink 80 and the circuit board 70; the minimum thickness of the sealing member convex portions 92 and the convex pieces 921 after being compressed is smaller than the height of the gap between the heat sink 80 and the circuit board 70, for example, the sum of the minimum compressed height of the convex pieces 921 and the thickness of the sealing member convex portions 92 is smaller than the height of the gap between the heat sink 80 and the circuit board 70. Here, the thickness direction of the seal projection 92 is perpendicular to the wind direction, and the height direction of the projection 921 is perpendicular to the wind direction.

In one embodiment, the air guiding portion 93 is formed on the surface of the seal main body 91 facing away from the seal convex portion 92, and the cross section of the air guiding portion 93 is convex, and the convex direction of the convex shape is opposite to the convex direction of the seal convex portion 92. For example: the cross section of the air guiding part 93 is triangular or semicircular. Wherein the cross-section is perpendicular to the circuit board. The surface of the air guide part 93 is inclined toward the heat sink 80 and the heat sink 89, respectively, so that the air at the air inlet is guided to the heat sink 80 and the heat sink 89, and the amount of air entering the heat sink is increased, thereby improving heat dissipation performance.

In one embodiment, a heat sink 89 is disposed on the side of the circuit board 70 where the active chip is not disposed, and the sealing member body 91 is in contact with the end of the heat sink 80 near the air inlet and in contact with the end of the heat sink 89 near the air inlet.

Illustratively, the seal may be an elastic member, such as a rubber member, to facilitate installation of the seal.

In another example, the end of the heat sink 80 near the air inlet is formed with a sealing member protruding toward the circuit board 70, and the sealing member is in contact with the end of the circuit board 70 near the air inlet. That is, the sealing member may be integrally formed with the heat sink 80.

In one embodiment, the substrate 30 is provided with a signal transmission circuit, the circuit board is a single-layer circuit board, and the circuit board further includes at least one bridge element disposed at the intersection of the circuit connection lines, wherein the bridge element includes a 0 ohm resistor and/or a 0 ohm metal patch, thereby facilitating the routing of the signal transmission circuit on the substrate 30. In the case where the heat sink is assembled with the circuit board, the 0 ohm resistor on the circuit board is disposed opposite the recess on the heat sink. Since the 0 ohm resistor is low in cost, the 0 ohm resistor can be set when the assembly space allows, and therefore the cost is reduced. Illustratively, the recess may be a groove between adjacent bosses of the heat sink.

In an embodiment, the substrate 30 is provided with a signal transmission circuit, and the electronic device of the embodiment may further include a control board 300.

As shown in fig. 15, the signal transmission circuit includes an N-stage operation circuit 100 and a signal-voltage conversion circuit 200. For convenience of illustration, as shown in fig. 15, the N-stage operation circuits 100 are respectively numbered as a ₁ 、A ₂ 、A ₃ ……A _N-1 、A _N . Wherein N is an integer greater than 1.

The working circuits of each stage include working chips, which can be various computing chips or control chips, etc. to implement core functions such as corresponding computing functions or control functions, etc. One or more working chips may be provided in the working circuit 100 of the same stage. For example, a plurality of working chips in the same stage of the working circuit 100 may be connected in parallel.

Further, the number of the working chips in each stage of the working circuit 100 may be equal or unequal, and the working chips may be configured according to actual requirements, which is not limited in this embodiment.

Illustratively, each working chip in the working circuit of the current stage performs calculation according to the input signal of the working circuit of the current stage, and generates the output signal of the working circuit of the current stage according to the calculation result. The input signal of the current stage working circuit is from the output signal of the previous stage working circuit, and the output signal of the current stage working circuit is output to the next stage working circuit.

Further, the N-stage operating circuit 100 is connected in series to the first system voltage410 and a second system voltage 420, the second system voltage 420 being higher than the first system voltage 410, the voltage difference between the first system voltage 410 and the second system voltage 420 providing a series voltage for the series of N-stage operational circuits 100, thereby providing a core operational voltage for the core functions of each stage of operational circuits 100. As shown in FIG. 15, the 1 st stage operation circuit A ₁ An Nth stage working circuit A connected to the first system voltage 410 _N Is connected to a second system voltage 420.

Illustratively, the first system voltage 410 may be a system ground voltage and the second system voltage 420 may be a system supply voltage. For example: when the N-stage operating circuit 100 is applied to an electronic device, the first system voltage 410 is provided by a ground terminal of the electronic device, and the second system voltage 420 is provided by the electronic device connected to a power supply.

It should be noted that, the signal transmission direction of the N-stage operating circuit 100 is not limited in this embodiment, for example: can be selected from A ₁ To A _N Can also be transmitted from A _N To A ₁ Is transmitted in the direction of (1).

The control board 300 is connected to the 1 st stage operating circuit A1 and the signal-voltage converting circuit, respectively. Specifically, a first input/output (I/O) terminal IO1 of the signal-voltage converting circuit 200 is connected to the nth stage operating circuit a _N And a second input/output end IO2 of the signal-voltage conversion circuit is used for connecting the control board 300.

In the first embodiment, as shown in fig. 16, the signal-voltage converting circuit 200 is configured to convert the voltage of the operating circuit signal sent by the N-stage operating circuit 100 and send the converted operating circuit signal to the control board 300.

Specifically, the control board 300 sends its own control board signal to the N-stage operating circuit 100; the N-stage working circuit works according to the control panel signal, generates a working circuit signal according to a final working result, and sends the working circuit signal to the signal-voltage conversion circuit 200; the signal-voltage converting circuit 200 converts the voltage of the operating circuit signal and transmits the converted operating circuit signal to the control board 300.

The working circuit signal may be a data signal such as a calculation result, and the control board signal may be a data signal such as a data source. For example, the N-stage operating circuit performs calculation or operation on the data source in the control board signal to obtain a calculation result.

Illustratively, in the embodiment shown in FIG. 16, the 1 st stage operation circuit A ₁ For receiving the control board signal of the control board 300, the signal-voltage converting circuit 200 is used for transmitting the Nth stage operating circuit A to the control board 300 _N Of the operating circuit. That is, the signal transmission direction of the N-stage operating circuit 100 is: from A ₁ To A _N Is transmitted in the direction of (1).

In the second embodiment, as shown in fig. 17, the signal-voltage converting circuit 200 is configured to convert the voltage of the control board signal sent by the control board 300 and send the converted control board signal to the N-stage operating circuit 100.

Specifically, the control board 300 transmits its own control board signal to the signal-voltage conversion circuit 200; the signal-voltage conversion circuit 200 performs voltage conversion on the control board signal and then sends the control board signal to the N-stage working circuit 100; the N-stage operating circuit operates according to the voltage-converted control board signal, generates an operating circuit signal according to a final operating result (e.g., a calculation result), and transmits the operating circuit signal to the control board 300.

Illustratively, in the embodiment shown in fig. 17, the control board 300 sends a control board signal to the signal-voltage converting circuit 200, and the signal-voltage converting circuit 200 is used to send a control board signal to the nth stage operating circuit a _N Sending control panel signals after voltage conversion, 1 st-stage working circuit A ₁ For sending operating circuit signals to the control board 300. That is, the signal transmission direction of the N-stage operating circuit 100 is: from A _N To A ₁ Is transmitted in the direction of (1).

In this embodiment, the signal-voltage conversion circuit 200 may implement parallel transmission of the control board signal and the working circuit signal between the N-stage working circuit 100 and the control board 300, thereby providing working efficiency.

It should be noted that one or more signals may be transmitted by the signal-voltage conversion circuit 200. That is to say, the signal-voltage converting circuit 200 can implement parallel transmission of multiple control board signals and working circuit signals with different waveforms, and accordingly, the first input/output end IO1 and the second input/output end IO2 may be a group or multiple groups.

In one example shown in fig. 18, the signal-voltage conversion circuit 200 may implement two-way signal transmission, and accordingly, the first input/output end IO1 and the second input/output end IO2 are 2 groups, that is, IO1 ₁ 、IO2 ₁ And IO1 ₂ 、IO2 ₂ . For convenience of illustration, in this example, the signal transmission direction of the N-stage operating circuit 100 is from the first system voltage 410 to the second system voltage 420, that is, in the signal-voltage converting circuit 200, the first input/output terminal IO1 ₁ 、IO1 ₂ Used for converting the voltage of the working circuit signal in the Nth stage working circuit and then inputting and outputting the signal from the second input and output end IO2 ₁ 、IO2 ₂ The working circuit signal after the voltage conversion is output and sent to the control board 300.

In the example shown in FIG. 18, L1 ₁ Indicating input to the first input/output terminal IO1 ₁ Waveform of the operating circuit signal of (3), L2 ₁ Indicating input/output from the second input/output terminal IO2 ₁ And outputting the waveform of the working circuit signal after the voltage conversion. Illustratively, the voltage conversion function of the signal voltage conversion circuit 200 is to realize a voltage drop with a voltage difference of V0. Further, at L1 ₁ The middle low level is V1, and the high level is V2; at L2 ₁ The middle low level is V1-V0, and the high level is V2-V0.

Further, L1 ₂ Indicating input to the first input/output terminal IO1 ₂ Of the control panel signal, L2 ₂ Indicating input/output IO2 from the second input/output terminal ₂ The output voltage is converted to control the waveform of the board signal. At L1 ₁ The middle low level is V1, and the high level is V2; at L2 ₁ The middle low level is V1-V0, and the high level is V2-V0.

For example, V0 may be 14v, and V1 and V2 may be related to the transmission requirement of the operating circuit signal, for example, 1.2V, 1.8V, 2.5V, and the embodiment is not limited. In addition, the waveforms in fig. 18 are merely exemplary, and are not limited thereto.

Further, the signal transmission circuit of the present embodiment may further include a plurality of voltage adjustment circuits 430. The plurality of voltage regulating circuits 430 are connected with at least partial stage working circuit 100 in a one-to-one correspondence manner, that is, the number of voltage regulating circuits 430 is less than or equal to N. The voltage regulating circuit 430 is used to provide at least one regulated voltage to the connected operating circuit 200.

Illustratively, the regulated voltage may provide an auxiliary function voltage for a particular function other than the core function of the operational circuit 200, such as an input/output voltage or a clock signal voltage of the operational circuit 200.

Illustratively, as shown in fig. 19, the number of voltage regulating circuits 430 is equal to N. For convenience of illustration, the N voltage regulating circuits 430 are respectively B ₁ 、B ₂ 、B ₃ ……B _N-1 、B _N . Wherein, B ₁ And A ₁ Is connected as A ₁ Providing at least one regulated voltage; b is ₂ And A ₂ Is connected as A ₂ Providing at least one regulating voltage (8230) \ 8230; B _N And A _N Is connected to form A _N At least one regulated voltage is provided.

As can be known from the above description, for each stage of the working circuit 100, the power supply terminal thereof may include the series circuit power supply terminal P1, and may also include the regulated voltage power supply terminal P2, and the number of the regulated voltage power supply terminals P2 may be plural; the ground terminal is the series port P3 near the connection terminal of the first system voltage 410.

Further, the voltage regulating circuit 430 includes at least one power supply chip therein. It should be noted that fig. 19 is an example of 2 power chips and 2 regulated voltage supply terminals P2, but is not limited thereto.

When the voltage regulating circuit 430 includes a power supply chip, a regulated voltage can be provided to the connected operating circuits 200, i.e., the number of regulated voltage supply terminals P2 of the connected operating circuits 200 is 1. When the voltage regulating circuit 430 includes M power chips, it is possible to supply a regulating voltage equal to or more than M number to the connected operating circuits 200, i.e., the number of regulating voltage supply terminals P2 of the connected operating circuits 200 is equal to or more than M. For example, the regulated voltages larger than M may be output in combination through a series-parallel relationship between the plurality of power supply chips. That is, the number of the adjustment voltages is positively correlated with the number of the power chips. Moreover, the M adjustment voltages may be equal or unequal, and this embodiment is not limited.

In one embodiment, the signal-voltage converting circuit 200 includes a first power supply terminal P4 and a first ground terminal P5. Wherein, the first power supply terminal P4 is connected to the Nth stage working circuit A _N The first grounding end P5 is connected to the Nth-stage working circuit A _N As shown in fig. 20 and 21, the ground terminal P3 of (a).

Further, the signal-voltage converting circuit 200 further includes a second power supply terminal P6 and a second ground terminal P7. In one example, as shown in fig. 20, the second power supply terminal P6 and the second ground terminal P7 are respectively used for connecting the 1 st stage operating circuit a ₁ Any one of the regulated voltage supply terminal P2 and the 1 st stage operating circuit A ₁ Ground terminal P3. In another example, as shown in fig. 21, the second power supply terminal P6 and the second ground terminal P7 are respectively used for connecting the power supply terminal VCC and the ground terminal GND of the control board 300.

That is, the power supply of the signal-voltage converting circuit 200 can be configured according to actual requirements, so as to adapt to circuits with different circuit layouts.

According to the technical scheme of the embodiment, bidirectional parallel signal transmission between the working circuit and the control board can be realized, and the signal transmission efficiency is improved.

Further, a first system voltage interface 10 and a second system voltage interface 20 are disposed on the substrate 70. The first system voltage interface 10 and the second system voltage interface 20 are respectively used for connecting with a power supply and a system ground to respectively provide a first system voltage 410 and a second system voltage 420.

Illustratively, as shown in fig. 22, the N-stage operating circuits 100 are arranged along the length direction X of the circuit board. In one example, each stage of the working circuit 100 includes 3 working chips 110 connected in parallel. That is to say, along the positive direction of X, the working circuit of level 1 to the working circuit of level N/2 are connected in series in sequence, along the negative direction of X, the working circuit of level N/2+1 to the working circuit of level N are connected in series in sequence, and the working circuit of level N/2+1 is connected in series with the working circuit of level N/2+1, so that the working circuit of level 1 to the working circuit of level N are connected in series in sequence between the first system voltage interface 10 and the second system voltage interface 20.

Other configurations of the circuit board or the electronic device of the above embodiments may be adopted by various technical solutions known by those skilled in the art now and in the future, and will not be described in detail herein.

In the description of the present specification, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; the connection can be mechanical connection, electrical connection or communication; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present disclosure can be understood as a specific case by a person of ordinary skill in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. The first feature being "under," "beneath," and "under" the second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different features of the disclosure. In order to simplify the disclosure of the present disclosure, specific example components and arrangements are described above. Of course, they are merely examples and are not intended to limit the present disclosure. Moreover, the present disclosure may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of the various changes or substitutions within the technical scope of the present disclosure, and these should be covered by the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A work assembly, comprising:

the circuit board comprises a substrate, a plurality of working chips and a plurality of heat conducting elements, wherein the working chips and the heat conducting elements are arranged on the substrate, and the heat conducting elements cover at least two adjacent working chips and an area between the adjacent working chips.

2. The working assembly of claim 1, wherein a plurality of said working chips are arranged in rows and columns, the average spacing of said plurality of working chips in the row direction is greater than the average spacing in the column direction, and said heat conducting element extends in the column direction.

3. The work module of claim 2, wherein a plurality of the work chips form a plurality of work chip columns, and wherein the substrate further comprises a voltage regulating circuit disposed thereon, at least some of the components of the voltage regulating circuit being distributed between the work chip columns.

4. The working assembly according to claim 1, wherein a plurality of the working chips are arranged in rows and columns, an average pitch of the plurality of working chips in a row direction is smaller than an average pitch in a column direction, and the heat conducting element extends in the row direction.

5. The working assembly according to claim 4, wherein a plurality of the working chips form a plurality of working chip rows, and the substrate is further provided with a voltage regulating circuit, and at least part of components of the voltage regulating circuit are distributed among the working chip rows.

6. The working assembly according to claim 1, wherein the size of each working chip is the same and/or the heat generating area of each working chip is the same.

7. The working assembly according to claim 1, wherein at least one metal member is disposed between the adjacent working chips connected in series, and the heat conducting element between the adjacent working chips covers the metal member.

8. The working assembly according to claim 7, wherein a projection of the heat conducting element on the substrate corresponds to a metal piece between the adjacent working chips.

9. The working assembly according to claim 8, wherein the thickness of the metal piece is less than or equal to the thickness of the working chip, and the thickness direction of the metal piece and the thickness direction of the working chip are perpendicular to the substrate.

10. The work assembly of any of claims 1-9, further comprising:

the radiator, the radiator includes heat dissipation main part and heat radiation fins, heat dissipation main part includes relative first face and second face, first face with heat radiation fins connects, the second face is provided with a plurality of bosss, the boss with at least one the heat-conducting component contacts, just the extending direction of boss with the extending direction of heat-conducting component is the same.

11. The working assembly according to claim 10, wherein the heat conducting element extends in a direction perpendicular to the heat dissipation direction.

12. The working assembly according to claim 11, wherein the pitch of at least some adjacent working chips increases gradually along the heat dissipation direction.

13. The work assembly of claim 12, wherein the circuit board and the heat sink are both disposed in a heat dissipation air duct, and the heat dissipation direction is a wind direction of the heat dissipation air duct.

14. The work assembly of claim 13, wherein the pitch of at least some adjacent work chips is positively correlated to the distance from the at least some adjacent work chips to the air inlet of the heat dissipation air duct.

15. The working assembly according to claim 12, wherein the inner cavity of the heat sink contains a heat dissipation medium, and the heat dissipation direction is a flow direction of the heat dissipation medium.

16. The work assembly of claim 10, wherein the circuit board and the heat sink are both disposed in a heat sink duct;

the working assembly further comprises a sealing element which is arranged at the end part, close to the air inlet of the heat dissipation air channel, of the radiator and the circuit board, and the sealing element extends in the direction perpendicular to the air direction of the heat dissipation air channel.

17. The working assembly of claim 16, wherein the seal comprises:

and the sealing part convex part protrudes out of the sealing part body along the direction deviating from the air inlet and is positioned in the gap between the radiator and the circuit board.

18. The working assembly of claim 17, wherein the seal boss is a unitary piece extending along a length of the seal body that is perpendicular to a direction of wind.

19. The working assembly of claim 17, wherein the seal projection comprises a plurality of sub-projections arranged along a length of the seal body, the seal body length being perpendicular to a direction of wind.

20. The working assembly according to claim 17, wherein the sealing member protrusion is formed with a protrusion member having a protrusion direction perpendicular to the circuit board.

21. The work assembly of claim 20, wherein the projection is a unitary piece extending along a length of the seal projection, the seal projection length being perpendicular to a direction of wind.

22. The work assembly of claim 20, wherein the protrusion comprises a plurality of sub-protrusions arranged along a length of the seal protrusion, the seal protrusion length being perpendicular to a direction of the wind.

23. The work assembly of claim 17, wherein a wind-guiding portion is formed on a surface of the seal body facing away from the seal projection.

24. The work assembly of claim 23, wherein the cross-section of the wind-guiding portion is triangular or semicircular, and the cross-section of the wind-guiding portion is perpendicular to the circuit board.

25. The work assembly of claim 16, wherein the end of the heat sink proximate the air inlet is formed with a seal projecting toward the circuit board, the seal contacting the end of the circuit board proximate the air inlet.

26. The working assembly according to claim 16, wherein a plurality of the working chips form a plurality of working chip rows, the working chip rows extending in a direction perpendicular to the wind direction, and the sealing member extends over a length greater than the length of the working chip rows.

27. The work assembly of claim 16, wherein the seal extends less than a length of the circuit board in a direction perpendicular to the direction of the wind.

28. The working assembly of claim 1, wherein the circuit board is a single layer circuit board, the circuit board further comprising:

at least one bridge element arranged at the intersection of the circuit connection lines, wherein the bridge element comprises a 0 ohm resistor and/or a 0 ohm metal patch.

29. The working assembly of claim 28 wherein the 0 ohm resistor is disposed opposite a recess on the heat sink.

30. The work module of claim 1, further comprising a control board, and wherein the substrate has disposed thereon a signal transmission circuit comprising:

a first input/output end of the signal voltage conversion circuit is connected to the Nth-stage working circuit, and a second input/output end of the signal voltage conversion circuit is connected to the control board;

the signal voltage conversion circuit is used for converting the voltage of a control panel signal sent by the control panel and then sending the control panel signal to the N-level working circuit; or the signal voltage conversion circuit is used for converting the voltage of the working circuit signal sent by the N-stage working circuit and then sending the working circuit signal to the control board.

31. The operating assembly of claim 30, wherein the stage 1 operating circuit is configured to receive the control board signal, and the signal-to-voltage conversion circuit is configured to send an operating circuit signal of the stage N operating circuit to the control board.

32. The operational assembly of claim 30, wherein the signal transmission circuit further comprises:

33. The operating module of claim 32, wherein the signal-to-voltage conversion circuit comprises a first power supply terminal and a first ground terminal respectively connected to the regulated-voltage power supply terminal of the nth stage operating circuit and the ground terminal of the nth stage operating circuit.

34. The operating assembly of claim 32, wherein the signal-to-voltage converter circuit further comprises a second power supply terminal and a second ground terminal for connecting the power supply terminal of the control board and the ground terminal of the control board, respectively.

35. The operating assembly of claim 32, wherein the signal-to-voltage converter circuit further comprises a second power supply terminal and a second ground terminal respectively connected to the regulated-voltage power supply terminal of the level 1 operating circuit and the ground terminal of the level 1 operating circuit.

36. An electronic device comprising the working assembly of any one of claims 1-35.