CN218499137U

CN218499137U - Array antenna emission subassembly divides cavity structure

Info

Publication number: CN218499137U
Application number: CN202222867275.8U
Authority: CN
Inventors: 刘军; 宋晓龙; 王轶; 王星; 王志国; 郭伟娜; 杨鹏辉; 吴海洲; 丁娟; 刘大全
Original assignee: China Xian Satellite Control Center
Current assignee: China Xian Satellite Control Center
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-02-17
Anticipated expiration: 2032-10-31

Abstract

The application discloses a cavity-dividing structure of an array antenna transmitting assembly, which comprises a box body; the box body is provided with: the first cavity (1) is used for separating the DA conversion module of the circuit board structure of the array antenna emission assembly; the second sub-cavity (4) is separated from the first sub-cavity (1) and is used for separating a digital module, a power supply chip and a photoelectric module of the array antenna emission assembly circuit board structure; wherein, a plurality of feedthrough capacitors (5) are connected between the DA conversion module and the digital module. The embodiment of the application is provided with the cavity separating structure, so that the DA conversion module of the array antenna transmitting assembly circuit board structure is separated, and the digital module, the power supply chip and the photoelectric module of the array antenna transmitting assembly circuit board structure are separated, so that the actual requirements that the digital module, the power supply module and the photoelectric module in the array antenna transmitting assembly do not influence the DA module are met.

Description

Array antenna emission subassembly divides cavity structure

Technical Field

The application relates to the technical field of aerospace measurement and control, in particular to a cavity-dividing structure of an array antenna transmitting assembly.

Background

Modern radio equipment, whether it is applications in communication, radar, navigation, microwave landing, jamming and anti-jamming systems, is increasingly using array antennas. The array antenna is formed by arranging certain basic antennas with the same structure and the same size together according to a certain rule according to the principle that electromagnetic waves interfere with each other in space. The array antenna has the advantages of easily realizing extremely narrow beams, easily realizing shaped beams and multiple beams, easily realizing phased scanning of the beams and easily realizing low-sidelobe level directional diagrams. For the latter three advantages, the aperture amplitude distribution and phase distribution of the array antenna can be adopted for control, and the integrated design of the feed network and the radiating element antenna is considered, even an active phased array containing T/R components, namely transmitting/receiving components, is adopted.

The array antenna has the advantages of easy realization of extremely narrow beams, easy realization of shaped beams, easy realization of phased scanning of the beams and the like, and modern radio equipment adopts the array antenna more and more. The transmitting component is an important component of the array antenna, converts a digital signal into an analog signal through the DA conversion circuit, but the DA conversion module is easily affected by the digital signal in the digital module, the power supply and the photoelectric conversion.

Disclosure of Invention

The embodiment of the application provides a cavity-divided structure of an array antenna emission assembly, which is used for meeting the actual requirement that a digital module, a power supply module and a photoelectric module in the array antenna emission assembly do not influence a DA (digital-analog) module.

The embodiment of the application provides a cavity-dividing structure of an array antenna transmitting assembly, which comprises a box body;

the box body is provided with:

the first cavity is used for separating the DA conversion module of the array antenna transmitting assembly circuit board structure;

the second sub-cavity is separated from the first sub-cavity and is used for separating a digital module, a power supply chip and a photoelectric module of the array antenna emission assembly circuit board structure;

and a plurality of feedthrough capacitors are connected between the DA conversion module and the digital module.

Optionally, the first sub-cavity is disposed above the second sub-cavity, the first sub-cavity is connected to the second sub-cavity through a pressing sheet, and the feedthrough capacitor penetrates through the pressing sheet.

Optionally, the box body is further provided with a third sub-cavity for separating a power module, and the power module is used for supplying power to the antenna emission assembly based on the power chip.

Optionally, the power module includes a power interface for connecting an external power source based on the power interface.

Optionally, the box body is further provided with a fourth sub-cavity for separating the leading-out end of the photovoltaic module.

The embodiment of the application also provides a radio transmitting device, which comprises the array antenna transmitting component cavity-dividing structure.

The embodiment of the application is provided with the cavity separating structure, so that the DA conversion module of the array antenna transmitting assembly circuit board structure is separated, and the digital module, the power supply chip and the photoelectric module of the array antenna transmitting assembly circuit board structure are separated, so that the actual requirements that the digital module, the power supply module and the photoelectric module in the array antenna transmitting assembly do not influence the DA module are met.

The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

fig. 1 is a diagram illustrating an example of a cavity-divided structure of an array antenna radiating assembly according to an embodiment of the present application.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The transmitting component is an important component of the array antenna, and the transmitting component converts a digital signal into an analog signal through the DA conversion module, but the DA conversion module is easily affected by the digital signal in the digital module, the power supply and the photoelectric conversion. Based on the embodiment of the present application, a cavity-dividing structure of an array antenna transmitting assembly is provided, as shown in fig. 1, including a box body;

the box body is provided with:

a first cavity 1 for separating the DA conversion module of the circuit board structure of the array antenna transmission assembly;

the second sub-cavity 4 is separated from the first sub-cavity 1 and is used for separating a digital module, a power supply chip and a photoelectric module of the array antenna emission assembly circuit board structure;

and a plurality of feedthrough capacitors 5 are connected between the DA conversion module and the digital module.

In some embodiments, as shown in fig. 1, the first sub-chamber 1 is disposed above the second sub-chamber 4, the first sub-chamber 1 is connected to the second sub-chamber 4 through a pressing plate 3, and the feedthrough capacitor 5 penetrates through the pressing plate 3. The specific array antenna transmitting assembly circuit board structure is also provided with a feedthrough capacitor for grounding and eliminating high-frequency coupling, and a space is reserved on the pressing sheet 3 in the example, so that the feedthrough capacitor is exposed between the first sub-cavity 1 and the second sub-cavity 4.

In some embodiments, the box body is further provided with a third sub-cavity 6 for separating a power module, and the power module is used for supplying power to the antenna emission component based on the power chip. For example, each chip of the circuit board may be powered by a power supply chip, such as an FPGA chip and an MCU chip of the digital module.

In some embodiments, the power module includes a power interface to connect an external power source based on the power interface.

In some embodiments, the box body is further provided with a fourth sub-cavity 2 for separating the leading-out ends of the optoelectronic module.

The chambered structure of the present application chambered the digital module from the DA module, thereby separating the digital module from the DA module. And the power supply module is separated from the DA module and the digital module by dividing the power supply module into cavities, so that the power supply module is separated from the DA module, and the power supply module is separated from the digital module. And (3) the photoelectric module is separated from the DA module and the digital module by the cavity, so that the photoelectric module is separated from the DA module and the photoelectric module is separated from the digital module.

Therefore, the digital signal generated by the digital module cannot influence the DA module, and the digital signal in the digital power supply in the power supply module cannot influence the DA module and the digital module; the digital signal in the optoelectronic module does not affect the DA module and the digital module. The practical requirement that the digital module, the power supply module and the photoelectric module in the array antenna transmitting assembly do not influence the DA module is met.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A cavity-dividing structure of an array antenna transmitting component is characterized by comprising a box body;

the box body is provided with:

the first cavity (1) is used for separating the DA conversion module of the circuit board structure of the array antenna emission assembly;

the second sub-cavity (4) is separated from the first sub-cavity (1) and is used for separating a digital module, a power supply chip and a photoelectric module of the array antenna emission assembly circuit board structure;

wherein, a plurality of feedthrough capacitors (5) are connected between the DA conversion module and the digital module.

2. The cavity splitting structure of the array antenna transmitting component according to claim 1, wherein the first cavity (1) is disposed above the second cavity (4), the first cavity (1) and the second cavity (4) are connected through a pressing piece (3), and the feedthrough capacitor (5) penetrates through the pressing piece (3).

3. The cavity-splitting structure of an array antenna radiating component according to claim 1, wherein the box body is further provided with a third cavity-splitting (6) for splitting a power module for supplying power to the antenna radiating component based on the power chip.

4. The array antenna transmit assembly chambering structure of claim 3, wherein the power module includes a power interface for coupling to an external power source based on the power interface.

5. The cavity-splitting structure of the array antenna radiating component according to claim 1, wherein the box body is further provided with a fourth cavity (2) for splitting the leading-out end of the optoelectronic module.

6. A radio transmission apparatus comprising the array antenna transmission element chambering structure of any of claims 1-5.