CN218494941U

CN218494941U - Low-volatility heat conduction material composition

Info

Publication number: CN218494941U
Application number: CN202221983587.9U
Authority: CN
Inventors: 雷强; 雷栋
Original assignee: Kunshan Jiuju New Material Technology Co ltd
Current assignee: Kunshan Jiuju New Material Technology Co ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2023-02-17
Anticipated expiration: 2032-07-29

Abstract

The utility model discloses a low heat conduction material composition that volatilizees, concretely relates to heat conduction gasket technical field, including heat conduction silica gel plate, a plurality of heat conduction holes have been seted up in heat conduction silica gel plate's top embedding, and both ends face and lie in position department between two adjacent heat conduction holes and all be equipped with the silica gel plate at the bottom of the top of heat conduction silica gel plate, and the top of silica gel plate installs arc silica gel piece, a plurality of louvres that distribute have been seted up in the outer wall embedding of arc silica gel piece. The utility model discloses a carry out the heat conduction with a plurality of silica gel boards of heat conduction silica gel board bottom, carry out the heat conduction by heat conduction silica gel board again, accomplish the heat conduction operation along a plurality of heat conduction holes on the heat conduction silica gel board, on heat conduction to the silica gel board, on the arc silica gel piece is guided into by the silica gel board again, on the silica gel board guided into the arc silica gel piece, can realize the radiating operation through the three louvre that distributes on the arc silica gel piece, can effectively increase heat conduction area, the radiating effect is better.

Description

Low-volatility heat conduction material composition

Technical Field

The utility model relates to a heat conduction gasket technical field, more specifically say, the utility model relates to a low heat conduction material composition that volatilizees.

Background

The heat-conducting silica gel is a high-end heat-conducting compound, and has the characteristics of no solidification, no electric conduction and the like, so that risks such as short circuit of a circuit can be avoided, and the low-volatility selective raw material resin controls the content of the organic silicon monomers D4-D10 to be below 300ppm, so that the low-volatility effect is achieved.

Patent application publication No. CN110982278A discloses a heat conduction gasket with low volatilization volume and a preparation method thereof. According to the invention, the content of the organic silicon monomers D4-D10 is controlled to be below 300ppm by selecting raw material resin, the heat-conducting filler is baked at high temperature for use, and loose and porous gas-phase silicon and a chain extender are added to react with small molecules, so that the heat-conducting gasket with low volatilization is prepared. The obtained gasket is baked for 24 hours at 150 ℃, the weight loss is less than 0.03 percent, and the gasket is successfully applied to the fields of monitoring and the like. The heat conducting gasket is used for monitoring and inside the LED lamp tube, can play a role in heat conducting and radiating, and does not influence the brightness and definition of the lamp; but a flaky gasket is formed after pressing, and the heat conduction area is smaller in the process of low-volatilization heat conduction, so that the heat conduction effect is poorer.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defects of the prior art, the embodiments of the present invention provide a low-volatilization heat conduction material composition, so as to solve the problem that the prior art provides a flaky gasket formed after pressing, and the heat conduction area is smaller and the heat conduction effect is poorer when the heat conduction process is performed with low volatilization.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a low heat conduction material composition that volatilizees, includes the heat conduction silica gel board, a plurality of heat conduction holes have been seted up in the top embedding of heat conduction silica gel board, and both ends face and lie in position department between two adjacent heat conduction holes at the bottom of the top of heat conduction silica gel board and all be equipped with the silica gel board, and the top of silica gel board installs arc silica gel block, a plurality of louvres that distribute have been seted up in the outer wall embedding of arc silica gel block.

In a preferred embodiment, it is fixed to bond through the hot melt adhesive between silica gel plate and the heat conduction silica gel plate, and the upper surface of heat conduction silica gel plate is handled through the chamfer, and is a plurality of the distribution louvre is the setting of arc equidistance distribution, and the vertical section shape of arc silica gel piece establishes to the arc, and is a plurality of the setting is arranged according to fourteen by nine to arc silica gel piece.

In a preferred embodiment, the outer wall of heat conduction silica gel board is installed a plurality of from the top down reinforcement aluminum sheets of equidistance range in proper order, just is close to four turning position department and all imbeds and is equipped with and is used for reinforced (rfd) support column reinforcing aluminum sheet's top, the outer wall of reinforcing aluminum sheet just is located four turning line position department and all is equipped with the fixed block, fixed connection between support column and the reinforcement aluminum sheet, and be formed with the space between two adjacent reinforcement aluminum sheets, welded fastening between reinforcement aluminum sheet and the fixed block, and the embedding of fixed block top is run through and has been seted up the cross section and establish to the circular shape through-hole.

The utility model discloses a technological effect and advantage:

1. the heat is conducted through the plurality of silica gel plates at the bottom of the heat conducting silica gel plate, the silica gel plates are guided into the arc-shaped silica gel block, and the heat dissipation operation can be realized through the three distributed heat dissipation holes in the arc-shaped silica gel block, so that the heat conducting area can be effectively increased, and the heat dissipation effect is better;

2. the fixed block plays the effect of support to a plurality of reinforcement aluminum sheets, and the support column plays the effect of support to a plurality of reinforcement aluminum sheets, and a plurality of reinforcement aluminum sheets can play reinforced effect to heat conduction silica gel board outside, can improve the radiating effect and can play the reinforcement protection operation to heat conduction silica gel board's outside again.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic view of the bottom structure of the present invention.

Fig. 3 is the utility model discloses a part of reinforcing aluminum sheet and support column junction cuts the schematic diagram.

Fig. 4 is an enlarged schematic structural diagram of a point a in fig. 2 of the present invention.

The reference signs are: 1. a heat conductive silica gel plate; 2. a heat conduction hole; 3. a silica gel plate; 4. an arc-shaped silica gel block; 5. distributing heat dissipation holes; 6. reinforcing an aluminum sheet; 7. a support column; 8. and fixing blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

The low-volatilization heat conduction material composition shown in the attached figures 1-4 comprises a heat conduction silica gel plate 1, wherein a plurality of heat conduction holes 2 are formed in the top end of the heat conduction silica gel plate 1 in an embedded mode, silica gel plates 3 are arranged on the top end face of the heat conduction silica gel plate 1 and the positions between two adjacent heat conduction holes 2, an arc-shaped silica gel block 4 is installed above each silica gel plate 3, and a plurality of distributed heat dissipation holes 5 are formed in the outer wall of each arc-shaped silica gel block 4 in an embedded mode.

In some embodiments, as shown in fig. 1 to 3, the silicone rubber plate 3 and the heat conductive silicone rubber plate 1 are bonded and fixed by a hot melt adhesive, and the upper surface of the heat conductive silicone rubber plate 1 is subjected to chamfering treatment, so that the silicone rubber plate 3 and the heat conductive silicone rubber plate 1 are bonded more firmly, and the upper surface of the heat conductive silicone rubber plate 1 is subjected to chamfering treatment, so as to realize upward movement and diversion operation of hot air, the plurality of distributed heat dissipation holes 5 are distributed and arranged in an arc shape at equal intervals, and the vertical section of the arc-shaped silicone rubber block 4 is set to be an arc shape, so that the plurality of distributed heat dissipation holes 5 can present three-point upstream, heat dissipation and diversion operation is performed along the three distributed heat dissipation holes 5, and the vertical section of the heat conductive silicone rubber plate 1 is set to be an arc shape, so as to increase heat conduction area, and achieve better heat dissipation effect, the plurality of arc-shaped silicone rubber blocks 4 are arranged according to fourteen by nine, so that the arc-shaped silicone rubber blocks 4 are arranged one by fourteen by one, thereby realizing multi-point distribution, and better heat dissipation effect.

In some embodiments, as shown in fig. 1 to 4, a plurality of reinforcing aluminum sheets 6 are installed on the outer wall of the heat-conducting silica gel plate 1, the reinforcing aluminum sheets 6 are sequentially arranged at equal intervals from top to bottom, supporting columns 7 for reinforcing are embedded in positions, close to four corners, of the top ends of the reinforcing aluminum sheets 6, fixing blocks 8 are arranged on the outer wall of the reinforcing aluminum sheets 6 and located at the four corners, so that bolts can be used for entering circular holes inside the fixing blocks 8, the fixing blocks 8 can be installed at designated positions under the action of the bolts, the fixing blocks 8 can support the reinforcing aluminum sheets 6, the supporting columns 7 can support the reinforcing aluminum sheets 6, the reinforcing aluminum sheets 6 can reinforce the outside of the heat-conducting silica gel plate 1, and meanwhile, heat dissipation of the reinforcing aluminum sheets 6 at layered intervals can be realized, the heat dissipation effect is better, the heat dissipation effect can be improved, and the reinforcing effect can be performed on the outside of the heat-conducting silica gel plate 1, and damage to the heat-conducting silica gel plate 1 is avoided.

In some embodiments, as shown in fig. 4, the supporting columns 7 are fixedly connected with the reinforcing aluminum sheets 6, and a gap is formed between two adjacent reinforcing aluminum sheets 6, so that the supporting columns 7 support a plurality of reinforcing aluminum sheets 6, the firmness of the reinforcing aluminum sheets 6 is improved, the reinforcing aluminum sheets 6 and the fixing block 8 are welded and fixed, the top end of the fixing block 8 is embedded and penetrated, the cross section of the fixing block is set to be a circular through hole, so that the fixing block 8 supports a plurality of reinforcing aluminum sheets 6, and the firmness of the reinforcing aluminum sheets 6 is improved.

The utility model discloses the theory of operation: can install heat conduction silica gel plate 1 in the inside heat dissipation position department of control, the heat conducts heat through a plurality of silica gel plates 3 of 1 bottoms of heat conduction silica gel plate, conduct heat by heat conduction silica gel plate 1 again, accomplish the heat conduction operation along a plurality of heat conduction holes 2 on the heat conduction silica gel plate 1, heat conduction to silica gel plate 3 on, introduce into arc silica gel block 4 by silica gel plate 3 again on, can realize the radiating operation through three distribution louvre 5 on the arc silica gel block 4, can effectively increase heat conduction area like this, the radiating effect is better.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A low-volatility heat-conducting material composition comprises a heat-conducting silica gel plate (1), and is characterized in that: a plurality of heat conduction holes (2) have been seted up in the top embedding of heat conduction silica gel board (1), and both ends face and lie in position department between two adjacent heat conduction holes (2) and all be equipped with silica gel board (3) at the top of heat conduction silica gel board (1), and the top of silica gel board (3) installs arc silica gel piece (4), a plurality of louvres (5) that distribute have been seted up in the outer wall embedding of arc silica gel piece (4).

2. A low volatile thermal conductive material composition according to claim 1, wherein: the silica gel plate (3) is fixedly bonded with the heat-conducting silica gel plate (1) through hot melt adhesive, and the upper surface of the heat-conducting silica gel plate (1) is subjected to chamfering treatment.

3. A low volatile thermal conductive composition according to claim 1, wherein: the distributed heat dissipation holes (5) are distributed in an arc shape at equal intervals, and the vertical section of the arc-shaped silica gel block (4) is in an arc shape.

4. A low volatile thermal conductive material composition according to claim 1, wherein: the arc-shaped silica gel blocks (4) are arranged in a fourteen-by-nine arrangement mode.

5. A low volatile thermal conductive material composition according to claim 1, wherein: the outer wall of heat conduction silica gel plate (1) is installed a plurality of from the top down reinforcement aluminum sheet (6) of equidistance range in proper order, just is close to four turning position departments on the top of reinforcement aluminum sheet (6) and all imbeds and is equipped with and is used for reinforced (7), the outer wall of reinforcement aluminum sheet (6) just is located four turning line position departments and all is equipped with fixed block (8).

6. A low volatile thermal conductive material composition according to claim 5, wherein: the supporting columns (7) are fixedly connected with the reinforcing aluminum sheets (6), and gaps are formed between every two adjacent reinforcing aluminum sheets (6).

7. A low volatile thermal conductive material composition according to claim 5, wherein: the reinforcing aluminum sheet (6) and the fixing block (8) are welded and fixed, and the top end of the fixing block (8) is embedded and penetrates through the through hole which is formed by arranging a cross section into a circular shape.