CN218471938U - Packaging structure for photoelectronic device - Google Patents

Packaging structure for photoelectronic device Download PDF

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Publication number
CN218471938U
CN218471938U CN202222027217.4U CN202222027217U CN218471938U CN 218471938 U CN218471938 U CN 218471938U CN 202222027217 U CN202222027217 U CN 202222027217U CN 218471938 U CN218471938 U CN 218471938U
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base
fixed mounting
mounting
multiunit
wall
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CN202222027217.4U
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Chinese (zh)
Inventor
徐佳彬
徐金
姚洁
周烨峰
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Deqing County Leader Electronics Co ltd
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Deqing County Leader Electronics Co ltd
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Abstract

The utility model discloses a packaging structure for optoelectronic device relates to optoelectronic device technical field. This an encapsulation structure for optoelectronic device, including the base, for solid construction, seted up multiunit mounting hole and a set of mounting groove on the base, be provided with the apron on the base, the telescopic link sets up on the base, the number of telescopic link is the multiunit, and multiunit telescopic link fixed mounting is respectively on the multiunit mounting hole, and the equal fixed mounting of free end of multiunit telescopic link has a set of first fixed block, and the hanging hole has been seted up to one side outer wall of first fixed block, and fixed mounting has a set of first spring on the multiunit telescopic link, and the one end fixed mounting of first spring is in the bottom of first fixed block. When the photoelectronic device damaged, the staff can directly extract the fixture block from the hanging hole of first fixed block to the staff can dismantle packaging structure in the short time, thereby can be quick maintain the device of damage.

Description

Packaging structure for photoelectronic device
Technical Field
The utility model relates to an optoelectronic device technical field specifically is an encapsulation construction for optoelectronic device.
Background
The optoelectronic device is also an important component of information technology as a core component of the optoelectronic technology, and usually a worker can install the optoelectronic device on a corresponding packaging structure, but when the worker needs to repair the optoelectronic device, the worker often needs to spend a long time to disassemble a traditional packaging structure, so that the labor capacity of the worker is easily increased, and the work efficiency is also reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an encapsulated structure for optoelectronic device to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an encapsulation structure for an optoelectronic device, comprising:
the base is of a solid structure, a plurality of groups of mounting holes and a group of mounting grooves are formed in the base, and a cover plate is arranged on the base;
the telescopic link, the setting is on the base, the number of telescopic link is the multiunit, multiunit telescopic link fixed mounting is on the multiunit mounting hole respectively, the equal fixed mounting in free end of multiunit telescopic link has a set of first fixed block, the hanging hole has been seted up to one side outer wall of first fixed block, fixed mounting has a set of first spring on the multiunit telescopic link, the one end fixed mounting of first spring is in the bottom of first fixed block, the multiunit through-hole has been seted up to the both sides outer wall of base, the fixture block has been placed to through-hole department, the one end fixed mounting of fixture block has the installation piece, when optoelectronic device damages, the staff can directly extract the fixture block from the hanging hole of first fixed block, so that the staff can dismantle packaging structure in the short time, thereby can be quick maintain the device of damage.
Preferably, the bottom of the cover plate is fixedly mounted at the tops of the plurality of groups of first fixing blocks, two groups of wire holes are formed in the cover plate, the top of the cover plate is fixedly mounted with a fixing rod, the top of the fixing rod is fixedly mounted with a conductive module, and the outer wall of one side of the conductive module is fixedly mounted with a port.
Preferably, one side inner wall fixed mounting in the mounting groove of base has two sets of second fixed blocks, and the equal fixed mounting in one end of two sets of second fixed blocks has a set of second spring, and the one end fixed mounting of two sets of second springs has the buffer board.
Preferably, one side outer wall of base is provided with the support, and fixed mounting has the pneumatic cylinder on the support, and the through-hole has been seted up to one side outer wall of base, and fixed mounting has the slide rail in the through-hole, and slidable mounting has the slider on the slide rail, and the free end fixed mounting of pneumatic cylinder has the clamp plate on the terminal surface of slider, and another terminal surface fixed mounting of slider has the clamp plate, and the one end overlap joint of clamp plate is on the inside bottom of mounting groove.
Preferably, the mounting groove rear side inner wall of base rotates installs the flabellum, flabellum department fixed mounting has the screen panel, the rear side outer wall of base is provided with the support, fixed mounting has the motor on the support, the output shaft of motor pass through the shaft coupling extend the rear side inner wall of the mounting groove of base and with the center pin fixed mounting of flabellum, when photoelectronic device is long-time carry out work, its packaging structure's inside can produce a large amount of heats, the motor can drive the flabellum and carry out fast-speed rotation, so that the wind-force that the flabellum produced can be quick with the heat through-hole discharge of base front side outer wall, thereby can cool down the processing to packaging structure's inside in the short time, use that the guarantee photoelectronic device can be normal.
Preferably, the top fixed mounting of base has two sets of cushion, and two sets of cushion are the symmetric distribution, and the multiunit air vent has been seted up to the front side outer wall of base, and the cushion can play the effect of the impact force of the production when buffering apron and base merge.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) This an encapsulation structure for photoelectronic device, through first fixed block, the fixture block, clamp plate and buffer board's cooperation is used, in order to reduce staff's the amount of labour and improve holistic work efficiency, when photoelectronic device damages, the staff can directly extract the fixture block from the hanging hole of first fixed block, so that the staff can dismantle encapsulation structure in the short time, thereby can be quick maintain the device of damage, clamp plate and buffer board can play and press from both sides tight firm effect to photoelectronic device.
(2) This a packaging structure for photoelectronic device, including a motor, an end cap, a controller, and a cover plate, the cooperation of flabellum and cushion is used, when photoelectronic device long-time work that carries on, its packaging structure's inside can produce a large amount of heats, the motor can drive the flabellum and carry out fast-speed rotation, so that the wind-force that the flabellum produced can be quick with the heat through-hole discharge of base front side outer wall, thereby can cool down the processing to packaging structure's inside in the short time, in order to ensure photoelectronic device can normal use, the cushion can play the effect of the impact force of the production when buffering apron and base merge.
Drawings
Fig. 1 is a schematic cross-sectional view of the present invention;
fig. 2 is a schematic front view of the present invention;
fig. 3 is a left side schematic view of the present invention.
In the figure: 1. a base; 2. a telescopic rod; 3. a first fixed block; 4. a first spring; 5. mounting blocks; 6. a clamping block; 7. a cover plate; 8. a hydraulic cylinder; 9. a slide rail; 10. a slider; 11. pressing a plate; 12. a second fixed block; 13. a second spring; 14. a buffer plate; 15. a motor; 16. a fan blade; 17. a mesh enclosure; 18. fixing the rod; 19. a conductive module; 20. a port; 21. an elastic pad.
Detailed Description
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an encapsulation structure for optoelectronic device, including base 1 and telescopic link 2, base 1 is solid construction, multiunit mounting hole and a set of mounting groove have been seted up on the base 1, be provided with apron 7 on the base 1, telescopic link 2, the setting is on base 1, the number of telescopic link 2 is the multiunit, multiunit telescopic link 2 is fixed mounting respectively on the multiunit mounting hole, the equal fixed mounting in free end of multiunit telescopic link 2 has a set of first fixed block 3, the hanging hole has been seted up to one side outer wall of first fixed block 3, fixed mounting has a set of first spring 4 on the multiunit telescopic link 2, the one end fixed mounting of first spring 4 is in the bottom of first fixed block 3, the multiunit through-hole has been seted up to base 1's both sides outer wall, fixture block 6 has been placed to through-hole department, the one end fixed mounting of fixture block 6 has installation piece 5, when optoelectronic device damages, the staff can directly extract fixture block 6 from the hanging hole of first fixed block 3, so that the staff can dismantle encapsulation structure in the short time fast, thereby can maintain the device that damages.
Further, the bottom of the cover plate 7 is fixedly installed on the top of the plurality of groups of first fixing blocks 3, two groups of wire holes are formed in the cover plate 7, fixing rods 18 are fixedly installed on the top of the cover plate 7, conductive modules 19 are fixedly installed on the top of the fixing rods 18, ports 20 are fixedly installed on the outer wall of one side of each conductive module 19, two groups of second fixing blocks 12 are fixedly installed on the inner wall of one side in the installation groove of the base 1, one group of second springs 13 are fixedly installed at one ends of the two groups of second fixing blocks 12, a buffer plate 14 is fixedly installed at one end of each second spring 13, a support is arranged on the outer wall of one side of the base 1, a hydraulic cylinder 8 is fixedly installed on the support, a through hole is formed in the outer wall of one side of the base 1, a slide rail 9 is fixedly installed in the through hole, a slide block 10 is slidably installed on the slide rail 9, the free end of the hydraulic cylinder 8 is fixedly installed on one end face of the slide block 10, and a pressing plate 11 is fixedly installed on the other end face of the slide block 10, one end of a pressing plate 11 is lapped on the bottom of the inside of the mounting groove, the pressing plate 11 and a buffer plate 14 can play a role in clamping and stabilizing an optoelectronic device, a fan blade 16 is rotatably mounted on the inner wall of the rear side of the mounting groove of the base 1, a mesh enclosure 17 is fixedly mounted at the position of the fan blade 16, a support is arranged on the outer wall of the rear side of the base 1, a motor 15 is fixedly mounted on the support, an output shaft of the motor 15 extends out of the inner wall of the rear side of the mounting groove of the base 1 through a coupler and is fixedly mounted with a central shaft of the fan blade 16, when the optoelectronic device works for a long time, a large amount of heat can be generated inside the packaging structure, the motor 15 can drive the fan blade 16 to rotate at a high speed, so that the wind power generated by the fan blade 16 can rapidly discharge the heat through a through hole on the outer wall of the front side of the base 1, thereby cooling the inside of the packaging structure in a short time, in order to ensure that the photoelectronic device can be normally used, two groups of elastic cushions 21 are fixedly arranged at the top of the base 1, the two groups of elastic cushions 21 are symmetrically distributed, and a plurality of groups of vent holes are formed in the outer wall of the front side of the base 1.
The working principle is as follows: the staff puts the photoelectronic device earlier between clamp plate 11 and buffer board 14, then start hydraulic cylinder 8, the free end of hydraulic cylinder 8 can drive slider 10 and remove about on slide rail 9, then slider 10 can drive clamp plate 11 and press from both sides the device tightly firm, wear out and be connected with conducting module 19 through the wire guide on the apron 7 with the electric wire on the device after that, secondly press down apron 7, after apron 7 and the laminating of base 1, promote installation piece 5, then installation piece 5 can be firm apron 7 in inserting fixture block 6 the hanging of first fixed block 3, last starter motor 15, motor 15 can drive flabellum 16 and rotate, then the wind-force that flabellum 16 produced can be discharged the heat through the air vent of base 1 front side.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (6)

1. An encapsulation structure for an optoelectronic device, comprising:
the base (1) is of a solid structure, a plurality of groups of mounting holes and a group of mounting grooves are formed in the base (1), and a cover plate (7) is arranged on the base (1);
telescopic link (2), the setting is on base (1), the number of telescopic link (2) is the multiunit, multiunit telescopic link (2) is fixed mounting respectively on the multiunit mounting hole, the equal fixed mounting of free end of multiunit telescopic link (2) has a set of first fixed block (3), the hanging hole has been seted up to one side outer wall of first fixed block (3), fixed mounting has a set of first spring (4) on multiunit telescopic link (2), the one end fixed mounting of first spring (4) is in the bottom of first fixed block (3), the multiunit through-hole has been seted up to the both sides outer wall of base (1), fixture block (6) have been placed to through-hole department, the one end fixed mounting of fixture block (6) has installation piece (5).
2. A package structure for an optoelectronic device according to claim 1, wherein: the bottom fixed mounting of apron (7) has seted up two sets of wire guides at the top of the first fixed block of multiunit (3) on apron (7), and the top fixed mounting of apron (7) has dead lever (18), and the top fixed mounting of dead lever (18) has conductive module (19), and one side outer wall fixed mounting of conductive module (19) has port (20).
3. A package structure for an optoelectronic device according to claim 1, wherein: one side inner wall fixed mounting in the mounting groove of base (1) has two sets of second fixed blocks (12), and the equal fixed mounting in one end of two sets of second fixed blocks (12) has a set of second spring (13), and the one end fixed mounting of two sets of second springs (13) has buffer board (14).
4. A package structure for an optoelectronic device according to claim 1, wherein: the mounting structure is characterized in that a support is arranged on the outer wall of one side of the base (1), a hydraulic cylinder (8) is fixedly mounted on the support, a through hole is formed in the outer wall of one side of the base (1), a sliding rail (9) is fixedly mounted in the through hole, a sliding block (10) is slidably mounted on the sliding rail (9), the free end of the hydraulic cylinder (8) is fixedly mounted on one end face of the sliding block (10), a pressing plate (11) is fixedly mounted on the other end face of the sliding block (10), and one end of the pressing plate (11) is overlapped on the bottom inside the mounting groove.
5. A package structure for an optoelectronic device according to claim 1, wherein: the fan blade (16) are installed in the rotation of the mounting groove rear side inner wall of base (1), and fan blade (16) department fixed mounting has screen panel (17), and the rear side outer wall of base (1) is provided with the support, and fixed mounting has motor (15) on the support, and the output shaft of motor (15) extends the rear side inner wall of the mounting groove of base (1) and with the center pin fixed mounting of fan blade (16) through the shaft coupling.
6. A package structure for an optoelectronic device according to claim 1, wherein: the top fixed mounting of base (1) has two sets of cushion (21), and two sets of cushion (21) are the symmetric distribution, and the front side outer wall of base (1) has seted up the multiunit air vent.
CN202222027217.4U 2022-07-29 2022-07-29 Packaging structure for photoelectronic device Active CN218471938U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222027217.4U CN218471938U (en) 2022-07-29 2022-07-29 Packaging structure for photoelectronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222027217.4U CN218471938U (en) 2022-07-29 2022-07-29 Packaging structure for photoelectronic device

Publications (1)

Publication Number Publication Date
CN218471938U true CN218471938U (en) 2023-02-10

Family

ID=85138701

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222027217.4U Active CN218471938U (en) 2022-07-29 2022-07-29 Packaging structure for photoelectronic device

Country Status (1)

Country Link
CN (1) CN218471938U (en)

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