CN218456617U - PCB structure with high heat dissipation efficiency - Google Patents

Abstract

The utility model discloses a high radiating efficiency's PCB structure, which comprises a mounting bas, the standing groove has been seted up at the top of mount pad, in the mount pad lean on the top position to be provided with the heat-conducting plate, the top of heat-conducting plate is provided with PCB board main part, bottom fixed mounting has well hollow column in the mount pad, the interior top of well hollow column is provided with the elasticity post, the bottom fixedly connected with spring of elasticity post, the bottom of spring and the interior bottom fixed connection of well hollow column, center in the well hollow column is provided with the heat conduction silk. This high radiating efficiency's structure, through mutually supporting of mount pad, heat-conducting plate, first recess, second recess and heat conduction silk, the heat-conducting plate can carry out the heat conduction with the heat of board main part bottom and with heat transfer to heat conduction silk on to can effectually in time release the heat in the board main part, make the board main part possess high radiating effect, improved the durability of board main part.

Description

PCB structure with high heat dissipation efficiency

Technical Field

The utility model relates to a PCB technical field specifically is a high radiating efficiency's PCB structure.

Background

The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.

For example, chinese patent No. CN214154939U (a PCB heat dissipation structure): be equipped with LED on the PCB board, heating element, thermal-insulated hole and heat conduction hole, arrange a plurality of heat conduction holes at the LED periphery, distribute out LED's heat through the heat conduction hole fast, simultaneously through arranging the heat conduction of a plurality of discontinuous thermal-insulated hole separation heating element to LED and LED peripheral zone, through this mode, though the heat is unbalanced on the PCB, effectual LED's that has reduced generate heat, the thermal attenuation in the LED working process has been reduced, however, there is not convenient for dismantle the maintenance to the PCB board, and simultaneously, the radiating effect is not very ideal, can't effectually derive the heat of PCB board bottom, can't satisfy the market demand, the durability of PCB board has been reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high radiating efficiency's PCB structure to it is not convenient for dismantle the maintenance to the PCB board to provide to exist among the solution above-mentioned background art, and simultaneously, the radiating effect is not very ideal, can't effectually derive the heat of PCB board bottom, can't satisfy the market demand, has reduced the problem of PCB board durability.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high radiating efficiency's PCB structure, includes the mount pad, the standing groove has been seted up at the top of mount pad, the top position of leaning on in the mount pad is provided with the heat-conducting plate, the top of heat-conducting plate is provided with the PCB board main part, bottom fixed mounting has the cavity post in the mount pad, the interior top of cavity post is provided with the elasticity post, the bottom fixedly connected with spring of elasticity post, the bottom of spring and the interior bottom fixed connection of cavity post, center in the cavity post is provided with the heat-conducting wire, first recess has been seted up at the center of cavity toe portion, the second recess has been seted up to the bottom of first recess in the top of mount pad, the inside of first recess and second recess is run through in proper order to the bottom of heat-conducting wire, the top of heat-conducting wire run through to the outside of elasticity post and with the bottom fixed connection of heat-conducting plate, the both sides position of leaning on at top has all seted up first draw-in the mount pad, the both sides position of leaning on at heat-conducting plate top has all seted up the second draw-in groove, the both sides position of leaning on of PCB board main part top and bottom has the equal fixed mounting board.

Preferably, the bottom of the PCB main body is in contact with the top of the heat conducting plate, and two sides of the top of the PCB main body are in contact with the inner top of the mounting seat.

Preferably, the number of the hollow columns is twelve, and the twelve hollow columns are equidistantly distributed on the mounting seat.

Preferably, the tops and the bottoms of two clamping plates which are arranged up and down are respectively penetrated to the insides of the two first clamping grooves and the second clamping grooves and are contacted with the inner walls of the first clamping grooves and the second clamping grooves, so that the PCB main body can be limited.

Preferably, the top of the heat conducting plate is provided with a heat radiating groove which can radiate the bottom of the PCB main body.

Preferably, the pull plate is fixedly installed at the position, close to the front end, of the center of the bottom of the heat conduction plate, the pull plate is of an L-shaped structure, and the heat conduction plate can be pulled downwards by pulling the pull plate.

Preferably, the bottom of mount pad both sides all fixed mounting have the installation piece, the front position and the back position of leaning on at installation piece top have all seted up the mounting hole, and accessible screw is with mount pad fixed mounting in appointed department.

Compared with the prior art, the beneficial effects of the utility model are that:

this structure of high radiating efficiency, through the mount pad, the heat-conducting plate, first recess, mutually support of second recess and heat conduction silk, the heat-conducting plate can carry out the heat conduction with the heat of board main part bottom and with heat transfer to heat conduction silk on, thereby can effectually in time release the heat in the board main part, make the board main part possess high radiating effect, the durability of board main part has been improved, the cavity post, the elasticity post, a spring, first draw-in groove, mutually support of second draw-in groove and cardboard, the elasticity through the spring resets the effect, can make heat conduction board movable plate main part upwards promote, make four cardboards in the board main part block respectively in two first draw-in grooves and second draw-in groove, thereby convenient effect has been played when dismantling or installing to the board main part in the later stage, be convenient to maintain to the board main part, market demand has been satisfied.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged partial view of A of FIG. 1 according to the present invention;

FIG. 3 is an enlarged view of a portion B of FIG. 1 according to the present invention;

FIG. 4 is a perspective view of the heat-conducting plate of the present invention;

FIG. 5 is a perspective view of the mounting base of the present invention;

fig. 6 is a perspective view of the PCB main body of the present invention.

In the figure: 1. a mounting seat; 2. a heat conducting plate; 3. a PCB board main body; 4. a hollow column; 5. an elastic column; 6. a spring; 7. a first groove; 8. a second groove; 9. heat conducting wires; 10. a first card slot; 11. a second card slot; 12. clamping a plate; 13. mounting blocks; 14. pulling a plate; 15. a heat dissipation groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a PCB structure of high radiating efficiency, including mount pad 1, the standing groove has been seted up at the top of mount pad 1, be provided with heat-conducting plate 2 by the top position in the mount pad 1, the top of heat-conducting plate 2 is provided with PCB board main part 3, the bottom of PCB board main part 3 contacts with the top of heat-conducting plate 2, the both sides at PCB board main part 3 top contact with the interior top of mount pad 1, bottom fixed mounting has well hollow column 4 in mount pad 1, the quantity that well hollow column 4 set up is twelve, well hollow column 4 equidistance distributes on mount pad 1 in twelve, the interior top of well hollow column 4 is provided with flexible post 5, the bottom fixedly connected with spring 6 of flexible post 5, the bottom of spring 6 and the interior bottom fixed connection of well hollow column 4, the center in well hollow column 4 is provided with heat-conducting wire 9, first recess 7 has been seted up at the center of well hollow column 4 bottom, second recess 8 has been seted up to the bottom of first recess 7 at the top of mount pad 1, the bottom of heat-conducting wire 9 runs through the inside of first recess 7 and second recess 8 in proper order, the top of heat-conducting wire 9 runs through the outside fixed connection with the bottom of flexible post 5 and heat-conducting plate 2.

First draw-in groove 10 has all been seted up by both sides position to top in the mount pad 1, second draw-in groove 11 has all been seted up by both sides position to leaning on at heat-conducting plate 2 top, 3 tops of PCB board main part and bottom have cardboard 12 by the equal fixed mounting in both sides position, the top and the bottom of two cardboard 12 that set up from top to bottom run through respectively to the inside of two first draw-in grooves 10 and second draw-in groove 11 and with the inner wall contact of first draw-in groove 10 and second draw-in groove 11, can carry on spacingly to PCB board main part 3, radiating groove 15 has been seted up at heat-conducting plate 2's top, can play and dispel the heat to the bottom of PCB board main part 3.

The heat-conducting plate 2 bottom center lean on front end position fixed mounting have arm-tie 14, and arm-tie 14 is L shape structure, can be with heat-conducting plate 2 pulling downwards through pulling arm-tie 14, and the equal fixed mounting in bottom at mount pad 1 both sides has installation piece 13, and the mounting hole has all been seted up to the front end position that leans on at installation piece 13 top and the rear end position that leans on, and accessible screw is with mount pad 1 fixed mounting in appointed department.

When installing PCB board main part 3, at first pulling arm-tie 14 makes heat-conducting plate 2 move down downwards, this moment, elasticity post 5 compresses the inside spring 6 of well hollow column 4, thereby make and open certain space between mount pad 1 and the heat-conducting plate 2, then run through two second draw-in grooves 11 on the heat-conducting plate 2 respectively with two cardboard 12 of PCB board main part 3 bottom, then, loosen arm-tie 14, this moment, the resilience through spring 6 makes elasticity post 5 promote heat-conducting plate 2 and moves up, thereby go into two first draw-in grooves 10 on the mount pad 1 respectively with two cardboard 12 at PCB board main part 3 top, accomplish the installation to PCB board main part 3 from this, and simultaneously, the bottom and the heat-conducting plate 2 contact of PCB board main part 3, and then heat transfer on the PCB board main part 3 is to on the heat-conducting plate 2, the heat release on the heat-conducting plate 2 is through heat conduction silk 9 again, thereby realize dispelling the heat to PCB board main part 3.

In summary, the following steps: this high radiating efficiency's PCB structure, through mount pad 1, heat-conducting plate 2, first recess 7, mutually support of second recess 8 and heat-conducting wire 9, heat-conducting plate 2 can carry out heat conduction with the heat of 3 bottoms of PCB board main part and with heat transfer to heat-conducting wire 9 on, thereby can effectually in time release the heat on the PCB board main part 3, make PCB board main part 3 possess high radiating effect, the durability of PCB board main part 3 has been improved, well hollow column 4, elastic column 5, spring 6, first draw-in groove 10, mutually support of second draw-in groove 11 and cardboard 12, the elasticity through spring 6 resets the effect, can make heat-conducting plate 2 drive PCB board main part 3 upwards promote, make four cardboard 12 on the PCB board main part 3 block respectively in two first draw-in grooves 10 and second draw-in groove 11, thereby play convenient effect when needing to dismantle or install PCB board main part 3 in the later stage, be convenient for maintain PCB board main part 3, the market demand has been satisfied.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a high heat dissipation efficiency's PCB structure, includes mount pad (1), its characterized in that: the top of the mounting seat (1) is provided with a placing groove, a heat conducting plate (2) is arranged at the position close to the top in the mounting seat (1), the top of the heat conducting plate (2) is provided with a PCB main body (3), a hollow column (4) is fixedly arranged at the bottom in the mounting seat (1), an elastic column (5) is arranged at the inner top of the hollow column (4), a spring (6) is fixedly connected at the bottom of the elastic column (5), the bottom of the spring (6) is fixedly connected with the inner bottom of the hollow column (4), the center in the hollow column (4) is provided with a heat conducting wire (9), a first groove (7) is arranged at the center of the bottom of the hollow column (4), the top of the mounting seat (1) is provided with a second groove (8) for the bottom of the first groove (7), the bottom of the heat conducting wire (9) sequentially penetrates through the first groove (7) and the second groove (8), the top of the heat conducting wire (9) penetrates to the outside of the elastic column (5) and is fixedly connected with the bottom of the heat conducting plate (2), the positions close to the two sides of the inner top of the mounting seat (1) are both provided with first clamping grooves (10), the positions close to the two sides of the top of the heat conducting plate (2) are both provided with second clamping grooves (11), the clamping plates (12) are fixedly mounted at the positions, close to the two sides, of the top and the bottom of the PCB main body (3).

2. A PCB structure with high heat dissipation efficiency as recited in claim 1, wherein: the bottom of PCB board main part (3) and the top contact of heat-conducting plate (2), the both sides at PCB board main part (3) top and the interior top contact of mount pad (1).

3. A PCB structure with high heat dissipation efficiency as recited in claim 1, wherein: the number that cavity post (4) set up is twelve, and twelve cavity posts (4) equidistance distribute on mount pad (1).

4. A PCB structure with high heat dissipation efficiency as recited in claim 1, wherein: the tops and the bottoms of the two clamping plates (12) which are arranged up and down respectively penetrate through the interiors of the two first clamping grooves (10) and the second clamping grooves (11) and are in contact with the inner walls of the first clamping grooves (10) and the second clamping grooves (11).

5. A PCB structure with high heat dissipation efficiency as recited in claim 1, wherein: the top of the heat conducting plate (2) is provided with a heat radiating groove (15).

6. A PCB structure with high heat dissipation efficiency as recited in claim 1, wherein: the heat-conducting plate (2) is characterized in that a pulling plate (14) is fixedly arranged at the position, close to the front end, of the center of the bottom of the heat-conducting plate (2), and the pulling plate (14) is of an L-shaped structure.

7. A PCB structure with high heat dissipation efficiency as recited in claim 1, wherein: the bottom of mount pad (1) both sides is equal fixed mounting has installation piece (13), the mounting hole has all been seted up to the front position that leans on at installation piece (13) top and the rear end position that leans on.

Images