CN218447859U - Wafer high temperature treatment is with bearing device - Google Patents

Wafer high temperature treatment is with bearing device Download PDF

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Publication number
CN218447859U
CN218447859U CN202222823947.5U CN202222823947U CN218447859U CN 218447859 U CN218447859 U CN 218447859U CN 202222823947 U CN202222823947 U CN 202222823947U CN 218447859 U CN218447859 U CN 218447859U
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China
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limiting
fixing
plate
fixed
wafer
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CN202222823947.5U
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Chinese (zh)
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王达
朱联联
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Shanghai Langtai Precision Machinery Co ltd
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Shanghai Langtai Precision Machinery Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model provides a bearing device for high-temperature treatment of a wafer, which relates to the technical field of wafer processing, and comprises two side plates, wherein a lower fixing plate is arranged below the inner sides of the two side plates, a plurality of fixing cavities are arranged inside the side plates, connecting mechanisms are arranged inside the fixing cavities, side fixing plates are arranged inside a group of fixing cavities, a moving mechanism is arranged above the inner part of each side plate, and an upper fixing plate is detachably arranged inside the moving mechanism; through being provided with coupling mechanism in the inside of fixed chamber, utilize mutually supporting of coupling mechanism's mount pad, connecting rod, fixed slot, installation cavity, expanding spring, fly leaf, fixture block, spacing groove and stopper, can adjust the position of offside fixed plate, and then bear the weight of the processing to the wafer of different models for the device is more convenient when using, and is more comprehensive, thereby has improved the commonality of the device when using greatly.

Description

Wafer high temperature treatment is with bearing device
Technical Field
The utility model relates to a wafer processing technology field especially relates to a wafer high temperature treatment is with bearing device.
Background
With the development of economy and the continuous improvement of the technological level, the development of the semiconductor industry in China is very rapid, and a silicon wafer is also called a wafer, wherein elemental silicon is a gray, fragile and tetravalent nonmetallic chemical element, 27.8 percent of crustal components are formed by silicon elements, and the second is just next to the content of oxygen elements, and the silicon is a relatively rich element in nature;
wafer when carrying out high temperature treatment, need use and bear the weight of the device and bear the weight of the wafer, current wafer high temperature treatment is with bearing the weight of the device when using, the structure that bears the weight of the device is basically fixed, inconvenient when using adjusts the size that bears the weight of the device according to the wafer, because the size of wafer differs, bear the weight of the inconvenient wafer to different models size of device and bear for this bears the weight of the device and has certain limitation when using, comprehensive not enough, therefore, the utility model provides a wafer high temperature treatment is with bearing the weight of the device and is used for solving above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
To the problem, the utility model provides a wafer high temperature handle is with bearing device, the structure of bearing the device among the solution prior art is basically fixed, inconvenient when using carries the device to carrying the problem of adjusting according to the size of wafer.
For realizing the purpose of the utility model, the utility model discloses a following technical scheme realizes: a bearing device for high-temperature treatment of a wafer comprises two side plates, wherein a lower fixing plate is arranged below the inner sides of the two side plates, a plurality of fixing cavities are arranged on the inner sides of the side plates, connecting mechanisms are arranged inside the fixing cavities, side fixing plates are arranged on the inner sides of a group of fixing cavities, a moving mechanism is arranged above the inner sides of the side plates, and an upper fixing plate is detachably arranged on the inner sides of the moving mechanism;
the connecting mechanism comprises a mounting seat, a connecting rod, a fixed groove, a mounting cavity, a telescopic spring, a movable plate, a clamping block and a limiting structure; the utility model discloses a fixing device for fixing a lamp, including mount pad, fixed chamber, connecting rod, expanding spring, fly leaf, fixture block, the one end of fixture block extends to the outside of fixed chamber, the top of connecting rod is connected with the bottom of side fixed plate, the inside of connecting rod is provided with the fixed slot, the mount pad is installed in the bottom of fixed chamber inside, the one end of connecting rod extends to the outside of fixed chamber, the top of connecting rod is connected with the bottom of side fixed plate, the mounting chamber is all installed at the both ends of fixed slot, expanding spring is installed to one side of mounting chamber inside, the fly leaf is installed to expanding spring's one end, the fixture block is installed to the one end of fly leaf, the one end of fixture block extends to the inside of fixed slot.
The further improvement lies in that: the inner diameter of the fixing groove is larger than the outer diameter of the clamping block, and a clamping structure is formed between the fixing groove and the clamping block.
The further improvement lies in that: the limiting structure comprises a limiting groove and a limiting block, the limiting groove is arranged in the installation cavity, the limiting block is arranged in the limiting groove, and one end of the limiting block is connected with one end of the movable plate.
The further improvement lies in that: the fixed cavities are arranged on the inner sides of the side plates and are symmetrically distributed relative to the central axis of the side plates.
The further improvement lies in that: moving mechanism includes runner, threaded rod, thread bush, installation piece, gag lever post and stop collar, the runner is installed in one the top of curb plate, the threaded rod is installed in one the inside of curb plate, the one end of runner is connected with the one end of threaded rod, the lateral wall of threaded rod is provided with the thread bush, the gag lever post is installed in another the inside of curb plate, the lateral wall of gag lever post is provided with the stop collar, the installation piece is all installed with one side of stop collar to the thread bush, the one end of installation piece can be dismantled with the one end of upper fixed plate respectively and be connected.
The further improvement lies in that: the cross section of the limiting rod is smaller than that of the limiting sleeve, and a sliding structure is formed between the limiting rod and the limiting sleeve.
The utility model has the advantages that: the connecting mechanism is arranged in the fixed cavity, and the mounting seat, the connecting rod, the fixed groove, the mounting cavity, the telescopic spring, the movable plate, the clamping block, the limiting groove and the limiting block of the connecting mechanism are matched with each other, so that the position of the side fixing plate can be adjusted, and further wafer wafers of different types can be subjected to bearing treatment, so that the device is more convenient and more comprehensive to use, and the universality of the device in use is greatly improved; through being provided with moving mechanism in the inside of curb plate, utilize mutually supporting of moving mechanism's runner, threaded rod, thread bush, installation piece, gag lever post and stop collar, can drive the upper fixed plate and remove, the convenient fixed processing of wafer for the wafer is more stable when high temperature handle, thereby has improved the stability of the device when using greatly.
Drawings
FIG. 1 is a schematic view of the front cross-sectional structure of the present invention;
fig. 2 is a schematic side view of the moving mechanism of the present invention;
FIG. 3 is a schematic side view of the cross-sectional structure of the connection mechanism of the present invention;
fig. 4 is a schematic diagram of a partially enlarged structure at a position in fig. 1 according to the present invention.
Wherein: 1. a side plate; 2. a lower fixing plate; 3. a fixed cavity; 4. a side fixing plate; 5. an upper fixing plate; 6. a mounting base; 7. a connecting rod; 8. a fixing groove; 9. a mounting cavity; 10. a tension spring; 11. a movable plate; 12. a clamping block; 13. a limiting groove; 14. a limiting block; 15. a rotating wheel; 16. a threaded rod; 17. a threaded sleeve; 18. mounting a block; 19. a limiting rod; 20. a limiting sleeve.
Detailed Description
In order to deepen the understanding of the present invention, the following embodiments will be combined to make the present invention do further details, and the present embodiment is only used for explaining the present invention, and does not constitute the limitation of the protection scope of the present invention.
According to shown in fig. 1, 2, 3, 4, this embodiment provides a wafer high temperature treatment is with bearing device, including two curb plates 1, two bottom plate 2 is installed to the below of curb plate 1 inboard, a plurality of fixed chambeies 3 are installed to the inboard of curb plate 1, the inside in fixed chamber 3 all is provided with coupling mechanism, and is a set of side fixing plate 4 is installed to the inboard in fixed chamber 3, the inside top of curb plate 1 is provided with moving mechanism, moving mechanism's inboard demountable installation has upper fixed plate 5.
The connecting mechanism comprises a mounting seat 6, a connecting rod 7, a fixing groove 8, a mounting cavity 9, a telescopic spring 10, a movable plate 11, a clamping block 12 and a limiting structure; the mounting seat 6 is mounted at the bottom end inside the fixed cavity 3, the connecting rod 7 is arranged inside the mounting seat 6, one end of the connecting rod 7 extends to the outside of the fixed cavity 3, the top end of the connecting rod 7 is connected with the bottom end of the side fixing plate 4, the fixing groove 8 is arranged inside the connecting rod 7, the mounting cavities 9 are mounted at two ends of the fixing groove 8, the telescopic spring 10 is mounted at one side inside the mounting cavity 9, the movable plate 11 is mounted at one end of the telescopic spring 10, the clamping block 12 is mounted at one end of the movable plate 11, one end of the clamping block 12 extends to the inside of the fixing groove 8, the inner diameter of the fixing groove 8 is larger than the outer diameter of the clamping block 12, a clamping structure is formed between the fixing groove 8 and the clamping block 12, when the mounting seat 6 and the connecting rod 7 are clamped with each other, the fixing groove 8 is located right ahead of the clamping block 12, the telescopic spring 10 is under the action of the elastic force applied to the limiting groove 13 and the limiting block 14, the limiting spring 10 moves towards two sides, the clamping block 12 is moved to drive the clamping block 12 to move the side fixing plate, and accordingly, the side fixing plate can be mounted on a wafer to more conveniently and more conveniently process wafers with different models of the wafer when the mounting seat 6 and the wafer.
The limiting structure comprises a limiting groove 13 and a limiting block 14, the limiting groove 13 is arranged inside the installation cavity 9, the limiting block 14 is arranged inside the limiting groove 13, one end of the limiting block 14 is connected with one end of the movable plate 11, and when the limiting structure is used, the movable plate 11 can be limited when being moved by utilizing the mutual matching of the limiting groove 13 and the limiting block 14, so that the movable plate 11 and the clamping block 12 are more stable when being moved.
The fixed cavities 3 are arranged on the inner sides of the side plates 1 and are symmetrically distributed on the central axis of the side plates 1 among the fixed cavities 3, and the fixed cavities 3 can carry and process wafers of different models.
The moving mechanism comprises a rotating wheel 15, a threaded rod 16, a threaded sleeve 17, an installation block 18, a limiting rod 19 and a limiting sleeve 20, the rotating wheel 15 is installed at the top end of one side plate 1, the threaded rod 16 is installed inside one side plate 1, one end of the rotating wheel 15 is connected with one end of the threaded rod 16, the threaded sleeve 17 is arranged on the outer side wall of the threaded rod 16, the limiting rod 19 is installed inside the other side plate 1, the limiting sleeve 20 is arranged on the outer side wall of the limiting rod 19, the installation block 18 is installed on one side of each of the threaded sleeve 17 and the limiting sleeve 20, one end of each installation block 18 is detachably connected with one end of the upper fixing plate 5, the upper fixing plates 5 are installed on the inner sides of the installation blocks 18 through bolts during use, the rotating wheel 15 drives the threaded rod 16 to rotate, the threaded sleeves 17 are driven to move, the upper fixing plates 5 are driven to move downwards under the limiting of the limiting rods 19 and the limiting sleeves 20, the wafer is fixed by the upper fixing plates 5, and the wafer is conveniently fixed, so that the wafer is more stable during high-temperature treatment, and the stability of the wafer device during use is greatly improved.
The cross section of gag lever post 19 is less than the cross section of stop collar 20, constitute sliding construction between gag lever post 19 and the stop collar 20, during the use, utilize mutually supporting between gag lever post 19 and the stop collar 20, can carry out spacing processing when upper fixed plate 5 removes for upper fixed plate 5 is more stable when removing.
The working principle is as follows: the staff takes out side fixing plate 4 at first, then place connecting rod 7 into the inside of suitable fixed cavity 3, connecting rod 7 extrudes two fixture blocks 12 this moment, make two fixture blocks 12 move to both sides, when mount pad 6 and connecting rod 7 block each other, fixed slot 8 appears in the dead ahead of fixture block 12, telescopic spring 10 receives the effect of elasticity this moment, under the spacing of spacing groove 13 and stopper 14, drive fly leaf 11 through telescopic spring 10 and move, and then drive fixture block 12 and move forward, make mutual block between fixture block 12 and the fixed slot 8, accomplish the installation of side fixing plate 4, install side fixing plate 4 in suitable position according to the model of wafer, then place the wafer on the recess of bottom plate 2, utilize the inboard recess of side fixing plate 4 to carry out the spacing to the side of wafer, then install upper fixing plate 5 in the inboard of installation piece 18 through the bolt, it drives threaded rod 16 to rotate runner 15, so drive thread bush 17 and move, and then under the spacing of gag lever 19 and stop bush 20, drive upper fixing plate 5 and move down, utilize upper fixing plate 5 to carry out the wafer, the wafer's completion wafer bearing the weight of wafer.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a wafer high temperature handle is with bearing device, includes two curb plates (1), its characterized in that: a lower fixing plate (2) is arranged below the inner sides of the two side plates (1), a plurality of fixing cavities (3) are arranged on the inner sides of the side plates (1), connecting mechanisms are arranged inside the fixing cavities (3), side fixing plates (4) are arranged on the inner sides of a group of fixing cavities (3), a moving mechanism is arranged above the inner side of each side plate (1), and an upper fixing plate (5) is detachably arranged on the inner side of each moving mechanism;
the connecting mechanism comprises a mounting seat (6), a connecting rod (7), a fixing groove (8), a mounting cavity (9), a telescopic spring (10), a movable plate (11), a clamping block (12) and a limiting structure; install in the inside bottom of fixed chamber (3) mount pad (6), the inside of mount pad (6) is provided with connecting rod (7), the one end of connecting rod (7) extends to the outside of fixed chamber (3), the top of connecting rod (7) is connected with the bottom of side fixing board (4), the inside of connecting rod (7) is provided with fixed slot (8), installation cavity (9) are all installed at the both ends of fixed slot (8), expanding spring (10) are installed to one side of installation cavity (9) inside, fly leaf (11) are installed to the one end of expanding spring (10), fixture block (12) are installed to the one end of fly leaf (11), the one end of fixture block (12) extends to the inside of fixed slot (8).
2. The carrier as set forth in claim 1, wherein: the inner diameter of the fixing groove (8) is larger than the outer diameter of the clamping block (12), and a clamping structure is formed between the fixing groove (8) and the clamping block (12).
3. The carrier device as claimed in claim 2, wherein: the limiting structure comprises a limiting groove (13) and a limiting block (14), the limiting groove (13) is arranged in the mounting cavity (9), the limiting block (14) is arranged in the limiting groove (13), and one end of the limiting block (14) is connected with one end of the movable plate (11).
4. The carrier device as claimed in claim 3, wherein: the fixed cavities (3) are arranged on the inner sides of the side plates (1) in a plurality of symmetrical distribution relative to the central axis of the side plates (1) among the fixed cavities (3).
5. The carrier device as claimed in claim 1, wherein: moving mechanism includes runner (15), threaded rod (16), thread bush (17), installation piece (18), gag lever post (19) and stop collar (20), install in one runner (15) the top of curb plate (1), install in one threaded rod (16) the inside of curb plate (1), the one end of runner (15) is connected with the one end of threaded rod (16), the lateral wall of threaded rod (16) is provided with thread bush (17), install in another gag lever post (19) the inside of curb plate (1), the lateral wall of gag lever post (19) is provided with stop collar (20), installation piece (18) are all installed to one side of thread bush (17) and stop collar (20), the one end of installation piece (18) can be dismantled with the one end of upper fixed plate (5) respectively and be connected.
6. The carrier as set forth in claim 5, wherein: the cross section of the limiting rod (19) is smaller than that of the limiting sleeve (20), and a sliding structure is formed between the limiting rod (19) and the limiting sleeve (20).
CN202222823947.5U 2022-10-25 2022-10-25 Wafer high temperature treatment is with bearing device Active CN218447859U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222823947.5U CN218447859U (en) 2022-10-25 2022-10-25 Wafer high temperature treatment is with bearing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222823947.5U CN218447859U (en) 2022-10-25 2022-10-25 Wafer high temperature treatment is with bearing device

Publications (1)

Publication Number Publication Date
CN218447859U true CN218447859U (en) 2023-02-03

Family

ID=85070934

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222823947.5U Active CN218447859U (en) 2022-10-25 2022-10-25 Wafer high temperature treatment is with bearing device

Country Status (1)

Country Link
CN (1) CN218447859U (en)

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