CN218446082U

CN218446082U - Optical receiving module, bidirectional optical module, and communication device

Info

Publication number: CN218446082U
Application number: CN202221045050.8U
Authority: CN
Inventors: 李书; 林华枫
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-04-28
Filing date: 2022-04-28
Publication date: 2023-02-03
Anticipated expiration: 2032-04-28

Abstract

The embodiment of the application provides a light receiving component, a bidirectional light component and a communication device, relates to the technical field of optical communication, and can solve the problem that the receiving efficiency of the existing light receiving component is low. The light receiving component comprises a base and a pipe cap which is packaged together with the base, wherein a first lens is arranged on the pipe cap; in the encapsulation space that base and tube cap formed, include: a photoelectric conversion chip arranged on the base; and at least one stage of second lens arranged between the first lens and the photosensitive surface of the photoelectric conversion chip.

Description

Optical receiving module, bidirectional optical module, and communication device

Technical Field

The present application relates to the field of optical communications technologies, and in particular, to an optical receiving module, a bidirectional optical module, and a communication device.

Background

AN optical fiber communication system, in which AN access mode of AN Access Network (AN) is AN optical fiber access (FTTx), is also called AN Optical Access Network (OAN), has become a current main stream communication system. In order to implement optical fiber access, a user side needs to set a communication device such as an Optical Network Terminal (ONT) or an Optical Network Unit (ONU), where both the ONT and the ONU include a bidirectional optical sub-assembly (BOSA), and the bidirectional optical assembly is used to receive an optical signal transmitted to the user side and also send an optical signal generated by the user side. The bidirectional optical module specifically includes a receiving optical sub-assembly (ROSA) and a transmitting optical sub-assembly (TOSA).

At present, in a light receiving module, a photoelectric conversion chip is often disposed, and a light sensing surface of the photoelectric conversion chip is specifically used for receiving an optical signal transmitted to a user side. With the improvement of communication speed, the photosensitive surface of the photoelectric conversion chip is designed to be smaller, and the receiving efficiency of the optical receiving component for receiving optical signals is poor due to the smaller photosensitive surface.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical receiving assembly, a bidirectional optical assembly and a communication device.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, a light receiving assembly is provided, which includes a base and a cap packaged with the base, wherein a first lens is disposed on the cap; in the encapsulation space that base and tube cap formed, include: a photoelectric conversion chip arranged on the base; and at least one stage of second lens arranged between the first lens and the photosensitive surface of the photoelectric conversion chip. In the above light receiving assembly, the first lens on the cap receives the light signal, and the transmission direction of the received light signal is changed for the first time, so that the light signal is transmitted toward an area close to the light sensing surface of the photoelectric conversion chip on the base, and at least one stage of second lens is disposed between the first lens and the light sensing surface of the photoelectric conversion chip, so that the light signal received by the first lens is transmitted to the at least one stage of second lens, and the at least one stage of second lens respectively changes the transmission direction of the light signal for the second time, so that the light signal is continuously transmitted toward an area close to the light sensing surface of the photoelectric conversion chip, and further the light sensing surface of the photoelectric conversion chip can receive more light signals, thereby increasing the receiving efficiency of the light receiving assembly for receiving the light signal.

Optionally, in the packaging space formed by the base and the cap, the package further includes: the second lens is fixedly arranged on the support and forms an accommodating cavity with the support; the photoelectric conversion chip is accommodated in the accommodating cavity. In this alternative, in order to realize that at least one second lens is arranged between the first lens and the photosensitive surface of the photoelectric conversion chip, an embodiment of the present application provides a support for supporting the second lens, the support is arranged on the base, and the second lens is fixedly arranged on the support, so that an accommodating cavity is formed between the support and the second lens, and the photoelectric conversion chip is accommodated in the accommodating cavity.

Optionally, a filter is disposed on a side of the second lens on the support, the side being away from the photoelectric conversion chip. In this alternative, after the first lens on the cap receives the optical signal, the optical signal passes through the filter, then passes through the second lens, and then is transmitted to the photosurface of the photoelectric conversion chip, so that the filter filters the optical signal received by the first lens, filters the optical signal with other wavelengths except for the predetermined wavelength, and transmits the optical signal with the predetermined wavelength to the photosurface of the photoelectric conversion chip through the second lens.

Optionally, a filter is disposed on one side of the second lens on the support, the side being close to the photoelectric conversion chip. In this alternative, after the first lens on the cap receives the optical signal, the optical signal passes through the second lens, then passes through the filter plate, and then is transmitted to the photosensitive surface of the photoelectric conversion chip, so that the filter plate filters the optical signal received by the first lens, filters the optical signal with other wavelengths except for the predetermined wavelength, and transmits the optical signal with the predetermined wavelength to the photosensitive surface of the photoelectric conversion chip.

Optionally, the second lens includes any one of: a drop lens, a spherical lens, a non-spherical lens. The embodiment of the present application does not limit the specific form of the second lens.

Optionally, an optical axis of the first lens coincides with an optical axis of the second lens, and the optical axis of the first lens and the optical axis of the second lens pass through the photosensitive surface. In this alternative, the optical axis of the first lens coincides with the optical axis of the second lens, the first lens can transmit more received optical signals to the second lens, and the optical axis of the first lens and the optical axis of the second lens pass through the photosensitive surface, then more optical signals are transmitted to the photosensitive surface through the first lens and the second lens.

Optionally, the largest dimension of the photosensitive surface is less than or equal to 25 micrometers. In this alternative, when the size of the photosensitive surface becomes smaller, the improvement of the efficiency of the light receiving module for receiving the light signal provided by the embodiment of the present application will be more significant.

Optionally, the first lens includes any one of: water drop shaped lens, spherical lens, non-spherical lens. The embodiment of the present application does not limit the specific form of the second lens.

Optionally, a receiving circuit including a photoelectric conversion chip is further disposed on the base. In this alternative, the photoelectric conversion chip is configured to convert the received optical signal into an electrical signal, and transmit the electrical signal to a receiving circuit connected to the photoelectric conversion chip, where the receiving circuit is configured to process the electrical signal to obtain information therein.

In a second aspect, there is provided a bi-directional optical assembly comprising: a housing having a cavity; a wavelength division multiplexing membrane disposed within the cavity; the cavity is provided with a first opening, the first opening faces to the reflecting surface of the wavelength division multiplexing membrane, and an optical fiber is coupled in the first opening; a second opening is arranged on the cavity, the second opening faces the reflecting surface of the wavelength division multiplexing membrane, a preset included angle is formed between the axis of the first opening and the axis of the second opening, and the light receiving assembly is coupled in the second opening; the cavity is also provided with a third opening, the third opening faces to the transmission surface of the wavelength division multiplexing membrane, the axis of the first opening is superposed with the axis of the third opening, and the third opening is internally coupled with a light transmitting assembly.

Optionally, the predetermined included angle is 90 degrees.

Optionally, an included angle between the reflecting surface and the axis of the first opening is 45 degrees; the included angle between the reflecting surface and the axis of the second opening is 135 degrees.

Optionally, the optical transmission assembly includes an electro-optical conversion chip.

In a third aspect, a bi-directional optical assembly is provided, comprising: a housing having a cavity; a wavelength division multiplexing membrane disposed within the cavity; the cavity is provided with a first opening, the first opening faces to the reflecting surface of the wavelength division multiplexing membrane, and an optical fiber is coupled in the first opening; a second opening is arranged on the cavity, faces to the reflecting surface of the wavelength division multiplexing membrane, and is internally coupled with an optical transmitting assembly, and the axis of the first opening and the axis of the second opening form a preset included angle; the cavity is further provided with a third opening facing the transmission surface of the wavelength division multiplexing membrane, an axis of the first opening coincides with an axis of the third opening, and the light receiving module as described in any one of the above first aspect is coupled in the third opening.

Optionally, the predetermined included angle is 90 degrees.

In a fourth aspect, there is provided a communications device comprising a bi-directional optical component as described in any one of the second aspects above.

For technical effects brought by any possible implementation manner of the second aspect to the fourth aspect, reference may be made to the technical effects brought by the implementation manner of the first aspect, and details are not described here again.

Drawings

Fig. 1 is a schematic structural diagram of an optical fiber access network according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a connection line in a communication device according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a main body of a bidirectional optical component according to an embodiment of the present application;

FIG. 4 is an exploded view of a bi-directional optical assembly provided by an embodiment of the present application;

FIG. 5 is a cross-sectional view of a bi-directional optical assembly provided by an embodiment of the present application;

FIG. 6 is a first schematic diagram of a bi-directional optical assembly provided by an embodiment of the present application;

fig. 7 is a schematic diagram of a bidirectional optical module according to an embodiment of the present application;

fig. 8 is a schematic main body diagram of a light receiving assembly provided in an embodiment of the present application;

fig. 9 is a schematic structural diagram of a base in a light receiving module according to an embodiment of the present application;

fig. 10 is a cross-sectional view of a light receiving assembly provided by another embodiment of the present application;

fig. 11 is a cross-sectional view of a light receiving assembly provided by yet another embodiment of the present application;

FIG. 12 is a schematic view of a first structure of a lens in a light-receiving module according to yet another embodiment of the present application;

fig. 13 is a schematic diagram illustrating a second structure of a lens in a light receiving module according to still another embodiment of the present application;

fig. 14 is a schematic diagram illustrating a second structure of a lens in a light receiving module according to still another embodiment of the present application;

FIG. 15 is a first block diagram of a bracket in a light receiving module according to yet another embodiment of the present application;

fig. 16 is a second structural view of a bracket in a light receiving module according to still another embodiment of the present application;

fig. 17 is a cross-sectional view of a light receiving assembly provided by yet another embodiment of the present application;

fig. 18 is a cross-sectional view of a light receiving assembly provided by another embodiment of the present application;

fig. 19 is a cross-sectional view of a light receiving assembly provided by yet another embodiment of the present application;

fig. 20 is a cross-sectional view of a light receiving assembly provided by yet another embodiment of the present application;

FIG. 21 is a cross-sectional view of a bi-directional optical assembly provided by another embodiment of the present application;

fig. 22 is a cross-sectional view of a bi-directional optical assembly provided by yet another embodiment of the present application.

Detailed Description

Technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. In the present application, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. In addition, in the embodiments of the present application, the words "first", "second", and the like do not limit the number and order.

It is noted that, in the present application, words such as "exemplary" or "for example" are used to mean exemplary, illustrative, or descriptive. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

AN optical fiber communication system has become a current main stream communication system, in the optical fiber communication system, AN access mode of AN Access Network (AN) is fiber to the home (FTTx), which is also called AN Optical Access Network (OAN), and the fiber access mode of the optical fiber access network includes fiber to the cabinet (FTTCab), fiber To The Curb (FTTC), fiber To The Building (FTTB), fiber To The Home (FTTH), and the like.

Referring to fig. 1, in the FTTH, an optical access network 10 includes an Optical Line Terminal (OLT) 11, an Optical Distribution Network (ODN) 12, and a communication device at a user side, which is connected to the ODN12, for example, an Optical Network Terminal (ONT) 13. When the optical access network 100 is operating, the OLT11 receives an optical signal and transmits the received optical signal to the ODN12, the ODN12 transmits the received optical signal to the subscriber-side ONT13, and the subscriber-side ONT13 receives the optical signal and processes the received optical signal to obtain information therein.

For example, the ONT13 at the user side may also generate an optical signal to be transmitted, and when the ONT13 generates the optical signal to be transmitted, the ONT13 transmits the generated optical signal to be transmitted to the ODN12, and then the ODN12 transmits the optical signal to be transmitted to the OLT11, and the OLT11 transmits the optical signal to be transmitted.

Illustratively, in a practical optical access network 10, more ONTs may be included. When the number of ONTs increases, the ODN12 needs to transmit the received optical signal to each ONT on the subscriber side, and the ODN12 also needs to transmit the optical signal transmitted by each ONT on the subscriber side to the OLT101.

For example, in another optical fiber access network, for example, in an FTTB, a communication device located at a user side may also be an Optical Network Unit (ONU), and the ONU is used to implement the function of the ONT, and the embodiment of the present application does not limit the structure of the optical fiber access network. The bidirectional optical component provided by the embodiment of the application can be applied to communication devices such as ONTs or ONUs.

Referring to fig. 2, an embodiment of the present application provides a schematic structural diagram of a connection line in a communication device (ONU or ONT), where the connection line 20 includes two ports, that is, a port 21 and a port 22, and an optical fiber 23 connecting the port 21 and the port 22, where the port 21 is provided with a bidirectional optical sub-assembly (BOSA), specifically, the bidirectional optical sub-assembly is configured to receive an optical signal transmitted from the port 22 to a user side through the optical fiber 23, and is configured to send an optical signal generated by the user side out through the optical fiber 23 and the port 22. The bi-directional optical component includes

pins

211 and 212, where the

pins

211 and 212 are electrically connected to a Printed Circuit Board (PCB) of a communication device (ONU or ONT), so as to implement signal transmission and power supply. Port 22 is a standard optical port used to receive optical signals or transmit optical signals.

Referring to fig. 3, the embodiment of the present application provides a schematic structural diagram of a main body of the bidirectional optical module 30, referring to fig. 4, the embodiment of the present application provides an exploded view of the bidirectional optical module 30, and referring to fig. 5, the embodiment of the present application provides a cross-sectional view of the bidirectional optical module 30. Among them, in the bidirectional optical module 30, include: the optical fiber module comprises a housing 31 having a cavity, a wavelength division multiplexing membrane 38 disposed in the cavity, and a first opening disposed on the cavity, wherein the first opening is coupled with an optical fiber fixing member 36, and the optical fiber fixing member 36 is connected with an optical fiber 37, that is, the first opening is coupled with the optical fiber 37, and the first opening of the cavity faces a reflection surface of the wavelength division multiplexing membrane 38. A second opening is further disposed on the cavity, wherein a light receiving assembly (ROSA) 32 is coupled in the second opening, the second opening of the cavity also faces the reflective surface of the wavelength division multiplexing film 38, and an axis of the first opening of the cavity and an axis of the second opening of the cavity form a predetermined angle. Illustratively, the axis of the first opening of the cavity is at an angle of 90 degrees to the axis of the second opening of the cavity, wherein the angle between the reflective surface of the wavelength division multiplexing film 38 and the axis of the first opening of the cavity may be 45 degrees, and the angle between the reflective surface of the wavelength division multiplexing film 38 and the axis of the second opening of the cavity may be 135 degrees.

Then, referring to the schematic diagram of the bidirectional optical module 30 shown in fig. 6, when receiving the optical signal, the optical signal with the wavelength λ 1 is received through the optical fiber 37 in the bidirectional optical module 30, and the received optical signal with the wavelength λ 1 is transmitted to the optical receiving module 32 through the wavelength division multiplexing film 38. For example, when the optical signal with the wavelength λ 1 received by the optical fiber 37 is transmitted to the reflection surface of the wavelength division multiplexing film 38, the reflection surface of the wavelength division multiplexing film 38 reflects the received optical signal with the wavelength λ 1, so that the received optical signal with the wavelength λ 1 is reflected to the light receiving module 32, a photoelectric conversion chip is disposed in the light receiving module 32, and the photoelectric conversion chip may specifically be a chip formed by a Photodiode (PD), a chip formed by a PIN diode (PIN diode), or a chip formed by an Avalanche Photodiode (APD), converts the received optical signal with the wavelength λ 1 into an electrical signal, and transmits the electrical signal to a receiving circuit connected to the photoelectric conversion chip in the light receiving module 32, thereby implementing the function of the bidirectional light module 30 for receiving the optical signal.

In other embodiments, the optical signal received by the optical fiber 37 includes not only the optical signal with the wavelength λ 1, but also the optical signal with other wavelengths, and then a filter fixing member 34 is further disposed on one side of the cavity where the second opening is disposed, and a filter 35 is disposed in the filter fixing member 34, so that the wavelength division multiplexing film 38 is specifically configured to reflect the received optical signal to the filter 35, the filter 35 filters the received optical signal with other wavelengths, and transmits the received optical signal with the wavelength λ 1 to the optical receiving component 32, and the photoelectric conversion chip in the optical receiving component 32 is specifically configured to receive the optical signal with the wavelength λ 1, convert the optical signal with the wavelength λ 1 into an electrical signal, and transmit the electrical signal to a receiving circuit connected to the photoelectric conversion chip in the optical receiving component 32.

Reference is made to the schematic structural diagram of the main body of the bi-directional optical assembly 30 shown in fig. 3, the exploded view of the bi-directional optical assembly 30 shown in fig. 4, and the cross-sectional view of the bi-directional optical assembly 30 shown in fig. 5. In the bi-directional optical assembly 30, further comprising: a third opening is further provided on the cavity, wherein a transmitting optical sub-assembly (TOSA) 33 is coupled in the third opening, the third opening of the cavity faces the transmission surface of the wavelength division multiplexing film 38, and an axis of the first opening of the cavity coincides with an axis of the third opening of the cavity.

Then, referring to the schematic diagram of the bidirectional optical module 30 shown in fig. 6, when transmitting an optical signal, the optical transmission module 33 in the bidirectional optical module 30 generates an optical signal with a wavelength λ 2 to be transmitted, the optical signal with the wavelength λ 2 carries information to be transmitted by a user, the optical signal with the wavelength λ 2 is transmitted to the wavelength division multiplexing film 38, and the wavelength division multiplexing film 38 transmits the optical signal with the wavelength λ 2 to the optical fiber 37, so that the optical fiber 37 transmits the optical signal with the wavelength λ 2, thereby realizing the function of transmitting the optical signal by the bidirectional optical module 30.

Illustratively, the optical transmission assembly 33 includes an electro-optical conversion chip, which may be a chip formed by a Laser Diode (LD), wherein the electro-optical conversion chip receives an electrical signal carrying information that needs to be transmitted by a user, converts the electrical signal into an optical signal, generates an optical signal with a wavelength λ 2, and the optical signal with the wavelength λ 2 also carries the information that needs to be transmitted by the user. Then, the optical transmission unit 33 transmits the optical signal having the wavelength λ 2 to the transmission surface of the wavelength division multiplexing film 38, and the transmission surface of the wavelength division multiplexing film 38 transmits the optical signal having the wavelength λ 2 to the optical fiber 37.

In some embodiments, based on the bidirectional optical assembly 30, the positions of the optical transmitting assembly and the optical receiving assembly can be exchanged to form a new bidirectional optical assembly 40, and in the new bidirectional optical assembly 40, the method includes: a housing having a cavity; a wavelength division multiplexing membrane 38 disposed within the cavity; a first opening is arranged on the cavity, the first opening faces the reflecting surface of the wavelength division multiplexing membrane 38, and an optical fiber is coupled in the first opening; a second opening is arranged on the cavity, the second opening faces the reflecting surface of the wavelength division multiplexing film 38, the axis of the first opening and the axis of the second opening form a predetermined included angle, and the light transmitting assembly 33 is coupled in the second opening, illustratively, the axis of the first opening of the cavity and the axis of the second opening of the cavity form a 90-degree included angle, wherein, the reflecting surface of the wavelength division multiplexing film 38 and the axis of the first opening of the cavity form a 45-degree included angle, and the reflecting surface of the wavelength division multiplexing film 38 and the axis of the second opening of the cavity form a 135-degree included angle; the cavity is further provided with a third opening, the third opening faces to the transmission surface of the wavelength division multiplexing membrane 38, the axis of the first opening is overlapped with the axis of the third opening, and the light receiving assembly 32 is coupled in the third opening.

Then, referring to the schematic diagram of the bidirectional optical module 40 shown in fig. 7, when receiving an optical signal, the optical signal with the wavelength λ 1 is received through the optical fiber 37 in the bidirectional optical module 40, and the received optical signal with the wavelength λ 1 is transmitted to the optical receiving module 32 through the wavelength division multiplexing optical film 38. Illustratively, an optical signal with a wavelength λ 1 received by the optical fiber 37 is transmitted to the wavelength division multiplexing diaphragm 38, the wavelength division multiplexing diaphragm 38 transmits the received optical signal with the wavelength λ 1, so that the received optical signal with the wavelength λ 1 is transmitted to the light receiving module 32, a photoelectric conversion chip is disposed in the light receiving module 32, the photoelectric conversion chip converts the received optical signal with the wavelength λ 1 into an electrical signal, and transmits the electrical signal to a receiving circuit connected to the photoelectric conversion chip in the light receiving module 32, thereby implementing a function of receiving the optical signal of the bidirectional optical module 30.

At this time, if the optical signal received by the optical fiber 37 includes not only the optical signal with the wavelength λ 1 but also optical signals with other wavelengths, a filtering fixing element needs to be disposed on one side of the cavity where the third opening is disposed, and a filtering sheet is disposed in the filtering fixing element, the wavelength division multiplexing film 38 is specifically configured to transmit the received optical signal to the filtering sheet, the filtering sheet filters the received optical signal with other wavelengths, and transmits the received optical signal with the wavelength λ 1 to the optical receiving module 32, and the photoelectric conversion chip in the optical receiving module 32 is specifically configured to convert the received optical signal with the wavelength λ 1 into an electrical signal, and transmit the electrical signal to a receiving circuit connected to the photoelectric conversion chip in the optical receiving module 32.

Referring to the schematic diagram of the bidirectional optical module 40 shown in fig. 7, when transmitting an optical signal, the optical transmission module 33 in the bidirectional optical module 40 generates an optical signal with a wavelength λ 2 to be transmitted, the optical signal with the wavelength λ 2 carries information to be transmitted by a user, the optical signal with the wavelength λ 2 is transmitted to the reflection surface of the wavelength division multiplexing film 38, and the reflection surface of the wavelength division multiplexing film 38 reflects the optical signal with the wavelength λ 2 to the optical fiber 37, so that the optical fiber 37 transmits the optical signal with the wavelength λ 2, thereby realizing the function of transmitting the optical signal of the bidirectional optical module 30.

Illustratively, the optical transmission assembly 33 includes an electrical-to-optical conversion chip, which receives an electrical signal carrying information that the user needs to transmit, converts the electrical signal into an optical signal, and generates an optical signal with a wavelength λ 2, where the optical signal with the wavelength λ 2 also carries the information that the user needs to transmit. Then, the optical transmission unit 33 transmits the optical signal having the wavelength λ 2 to the reflection surface of the wavelength division multiplexing film 38, and the reflection surface of the wavelength division multiplexing film 38 reflects the optical signal having the wavelength λ 2 to the optical fiber 37.

Referring to the schematic structural diagram of the main body of the light receiving module 32 shown in fig. 8, in the light receiving module 32, a base 321 and a cap 322 packaged with the base 321 are included, wherein a photoelectric conversion chip 323 is further disposed on the base 321, and more specifically, the photoelectric conversion chip 323 is disposed on the base 321 through a supporting component 325. A lens 324 is also provided on the cap 322, wherein an optical axis of the lens 324 passes through the light-sensing surface s1 of the photoelectric conversion chip 323. Currently, in the light receiving module 32, the light sensing surface s1 of the photoelectric conversion chip 323 is specifically used for receiving the optical signal transmitted to the user side. Referring to fig. 9, after the light sensing surface s1 of the photoelectric conversion chip 323 receives an optical signal transmitted to a user side, the photoelectric conversion chip 323 converts the received optical signal into an electrical signal, and outputs the electrical signal to a receiving circuit connected to the photoelectric conversion chip 323 in the light receiving assembly 32, where the receiving circuit specifically includes a trans-impedance amplifier (TIA) 326 and a capacitor 327, where the capacitor 327 is disposed on a capacitor supporting member 328, the capacitor 327 is electrically connected to the photoelectric conversion chip 323 by a wire, the photoelectric conversion chip 323 is also electrically connected to a part of pins of the TIA326 by a wire, the TIA328 is electrically connected to a port 329a, a port 329b, and a port 329c of the light receiving assembly 32 by wires through other pins, and the receiving circuit is configured to process the electrical signal.

As the communication rate increases, the photosensitive surface s1 of the photoelectric conversion chip 323 is designed to be smaller, and the maximum size of the photosensitive surface s1 is, for example, 25 micrometers (μm) or less. Referring to a sectional view of the light receiving element 32 shown in fig. 10, in which the photoelectric conversion chip 323 and the supporting member 325 of the photoelectric conversion chip 323 shown in the sectional view coincide, the light-sensing surface s1 of the photoelectric conversion chip 323 is purposely marked for clarity. When the light receiving element 32 receives the light signal, the light signal with the wavelength λ a is received by the lens 324 first, but the light signal with the wavelength λ a is transmitted along the first side away from the optical axis of the lens 324, and although the lens 324 changes the transmission direction of the light signal with the wavelength λ a for the first time, so that the light signal with the wavelength λ a is transmitted toward the area close to the light sensing surface S1 of the photoelectric conversion chip 323, since the light sensing surface S1 is too small, the light sensing surface S1 cannot accurately receive the light signal with the wavelength λ a transmitted by the lens 324. The optical signal having the wavelength λ b is received by the lens 324 first, but the optical signal having the wavelength λ b is transmitted along the other side away from the optical axis of the lens 324, and although the lens 324 changes the transmission direction of the optical signal having the wavelength λ b for the first time so that the optical signal having the wavelength λ b is transmitted toward the area close to the photosurface S1 of the photoelectric conversion chip 323, since the photosurface S1 is too small, the photosurface S1 cannot accurately receive the optical signal having the wavelength λ b transmitted by the lens 324. The photosurface S1 can accurately receive the optical signal with the wavelength λ c transmitted by the lens 324 only if the optical signal with the wavelength λ c is transmitted along the optical axis close to the lens 324. The light receiving module 32 has poor efficiency of receiving the light signal.

In the bidirectional optical assembly 30, the optical transmitting assembly 33 and the optical fiber 37 are connected to the housing 31 having the cavity by welding, and the optical receiving assembly 32 is connected to the housing 31 having the cavity by gluing, the thermal expansion and contraction of the glue also cause the optical receiving assembly 32 to be displaced, and after the displacement, the lens 324 in the optical receiving assembly 32 will receive more optical signals transmitted along the optical axis far away from the lens 324, and the receiving efficiency of the optical receiving assembly 32 receiving the optical signals deteriorates.

Accordingly, embodiments of the present application provide a light receiving module having improved receiving efficiency of receiving a light signal, which can be applied to the bidirectional optical module shown in fig. 3 to 7. Referring to fig. 11, an embodiment of the present application provides a cross-sectional view of a light receiving assembly 50, in which the light receiving assembly 50 includes a base 321 and a cap 322 packaged with the base 321, and a lens 324 is disposed on the cap 322; in the packaging space formed by the base 321 and the cap 322, the package comprises: a photoelectric conversion chip 323 disposed on the base 321; and at least one primary lens 500 disposed between the lens 324 and the photosensitive surface s1 of the photoelectric conversion chip 323.

Specifically, the photoelectric conversion chip 323 is disposed on the base 321 through the supporting member 325, and the photoelectric conversion chip may be a chip formed of a Photodiode (PD), a chip formed of a PIN diode (PIN diode), or a chip formed of an Avalanche Photodiode (APD). Wherein the maximum size of the photosensitive surface s1 is 25 micrometers (μm) or less.

Fig. 11 illustrates a primary lens 500 as an example, in the light receiving module 50 shown in fig. 11, when the light receiving module 50 receives a light signal, the light signal with the wavelength λ a is first received by the lens 324, the lens 324 changes the transmission direction of the light signal with the wavelength λ a for the first time, so that the light signal with the wavelength λ a is transmitted to an area close to the light sensing surface s1 of the photoelectric conversion chip 323, and since the primary lens 500 is disposed between the lens 324 and the light sensing surface s1 of the photoelectric conversion chip 323, the light signal with the wavelength λ a is transmitted to the lens 500, and the lens 500 changes the transmission direction of the light signal with the wavelength λ a for the second time, so that the light signal with the wavelength λ a is transmitted to an area close to the light sensing surface s1 of the photoelectric conversion chip 323 again, so that the light sensing surface s1 of the photoelectric conversion chip 323 can receive the light signal with the wavelength λ a. When the light receiving element 50 receives a light signal, the light signal with the wavelength λ b is received by the lens 324 first, the lens 324 changes the transmission direction of the light signal with the wavelength λ b for the first time, so that the light signal with the wavelength λ b is transmitted toward a region close to the light sensing surface s1 of the photoelectric conversion chip 323, and since the primary lens 500 is disposed between the lens 324 and the light sensing surface s1 of the photoelectric conversion chip 323, the light signal with the wavelength λ b is transmitted to the lens 500, the lens 500 changes the transmission direction of the light signal with the wavelength λ b for the second time, so that the light signal with the wavelength λ b is transmitted toward a region close to the light sensing surface s1 of the photoelectric conversion chip 323 again, and the light sensing surface s1 of the photoelectric conversion chip 323 can receive the light signal with the wavelength λ b. For the optical signal with the wavelength λ c, the existence of the lens 500 does not affect the original transmission direction or has a small influence on the original propagation direction, and the light sensing surface s1 of the photoelectric conversion chip 323 can still receive the optical signal with the wavelength λ c.

The

lenses

324 and 500 are both convex lenses, and the

lenses

324 and 500 function to converge the received optical signals. Then, when more stages of lenses 500 are disposed between the lens 324 and the photosensitive surface s1 of the photoelectric conversion chip 323, the lens 500 of each stage implements the change of the transmission direction of the optical signal, so that the photosensitive surface s1 of the photoelectric conversion chip 323 can receive the optical signal.

In particular, referring to fig. 12 to 14, the lens 500 may be a drop-shaped lens as shown in fig. 12, and a support structure for the lens is also required to support the drop-shaped lens. Alternatively, the lens 500 may be a spherical lens as shown in fig. 13, and a support structure for the lens is also required to support the drop-shaped lens. Alternatively, the lens 500 may be an aspherical lens as shown in fig. 14, and a support structure for the lens is also required to support the drop-shaped lens. The embodiment of the present application does not limit the specific shape of the lens 500.

Illustratively, the lens 324 may also be a drop-shaped lens as shown in FIG. 12, which is disposed on the cap 322, and the cap 322 may be considered a support structure for the lens. Alternatively, the lens 324 may be a spherical ball lens as shown in FIG. 13, which is disposed on the cap 322, and the cap 322 may be considered as a support structure for the lens. Or the lens 324 can be an aspheric lens as shown in fig. 14 disposed on the cap 322, and the cap 322 can be considered a support structure for the lens.

It should be noted that the embodiment of the present application does not limit the specific shape of the lens 324. And the shape of the lens 324 may be the same as the lens 500 or different from the lens 500.

In the light receiving module, the first lens (i.e., the lens 324) on the cap receives a light signal, and a transmission direction of the received light signal is changed for the first time, so that the light signal is transmitted to a region close to a light-sensing surface of the photoelectric conversion chip on the base, and at least one stage of second lens (i.e., the lens 500) is disposed between the first lens and the light-sensing surface of the photoelectric conversion chip, so that the light signal received by the first lens is transmitted to the at least one stage of second lens, and the transmission directions of the light signals are changed for the second time by the at least one stage of second lens, so that the light signal is continuously transmitted to a region close to the light-sensing surface of the photoelectric conversion chip, and further, the light-sensing surface of the photoelectric conversion chip can receive more light signals, thereby enhancing a receiving efficiency of the light receiving module for receiving the light signal.

For example, referring to fig. 15 and 16, in order to dispose the lens 500 between the lens 324 and the photosensitive surface s1 of the photoelectric conversion chip 323, a support 501 needs to be disposed to support the lens 500, where the support 501 shown in fig. 15 includes two support rods and a connecting shaft contacting with the lens 500, and in the support 501 shown in fig. 16, a protruding structure is further disposed on the two support rods, and the structure of the support 501 is not limited in the embodiments of the present application.

Then, referring to fig. 17 and 18, the holder 501 shown in fig. 15 is used in fig. 17, and the holder 501 shown in fig. 16 is used in fig. 18. Specifically, the light receiving assembly 50 provided in the embodiment of the present application further includes, in the package space formed by the base 321 and the cap 322: the lens 500 is fixedly arranged on the support 501, and forms an accommodating cavity with the support 501; the photoelectric conversion chip 323 is accommodated in the accommodation chamber.

For example, in order to enable the lens 324 to transmit more received optical signals to the lens 500, the optical axis of the lens 324 and the optical axis of the lens 500 may be set to coincide, and of course, in order to meet the manufacturing error of the process, the distance between the optical axis of the lens 324 and the optical axis of the lens 500 is allowed to be less than or equal to the preset threshold. Similarly, when the optical axis of the lens 500 and the optical axis of the lens 324 pass through the photosensitive surface s1, the photosensitive surface s1 also receives more optical signals, and ideally, the optical axis of the lens 500 and the optical axis of the lens 324 pass through the center of the photosensitive surface s1, and in order to meet the process manufacturing error, the embodiment of the present application requires that the optical axis of the lens 500 and the optical axis of the lens 324 pass through the photosensitive surface s1.

The light receiving element 50 shown in fig. 17 and 18 may be directly disposed on the bidirectional light receiving element 30 shown in fig. 3 to 7, that is, the light receiving element 38 shown in fig. 3 to 7 may be replaced with the light receiving element 50 shown in fig. 14 or 15, so that the receiving efficiency of the bidirectional light receiving element for receiving the light signal is improved.

Illustratively, the filter 502 may be further provided on the support structure 501 shown in fig. 15, wherein the filter 502 is provided on the support 501 on a side of the lens 500 away from the photoelectric conversion chip 323, or the filter 502 is provided on the support 501 on a side of the lens 500 close to the photoelectric conversion chip 323. In the embodiment of the present application, the position of the filter is not limited, and with reference to the light receiving module 50 shown in fig. 19, the filter 502 is disposed on the side of the lens 500 away from the photoelectric conversion chip 323 on the support 501 for example, in the light receiving module 50, the optical signal transmitted by the lens 324 first passes through the filter 502, then passes through the lens 500, and then is received by the photosensitive surface s1 of the photoelectric conversion chip 323. The filter 502 is configured to filter out optical signals with other wavelengths from the optical signals transmitted by the lens 324, so that the optical signal with a predetermined wavelength is received by the light-sensing surface s1 of the photoelectric conversion chip 323.

Illustratively, a filter 502 may be further provided on the support structure 501 shown in fig. 16, wherein the filter 502 is provided on the support 501 on a side of the lens 500 away from the photoelectric conversion chip 323, or the filter 502 is provided on the support 501 on a side of the lens 500 close to the photoelectric conversion chip 323. The embodiment of the present application does not limit the arrangement position of the filter, and the filter 502 is arranged on the side of the lens 500 close to the photoelectric conversion chip 323 on the support 501, for example, with reference to the light receiving assembly 50 shown in fig. 20, and the convex structure on the support 501 is used for supporting the filter 502. In the light receiving module 50, the light signal transmitted by the lens 324 passes through the lens 500, then passes through the filtering wave plate 502, and is received by the photosensitive surface s1 of the photoelectric conversion chip 323. The filter 502 is used to filter out optical signals with other wavelengths from the optical signals transmitted by the lens 324 through the lens 500, so that the optical signal with a predetermined wavelength is received by the photosensitive surface s1 of the photoelectric conversion chip 323.

Then, the light receiving module 50 shown in fig. 19 or fig. 20 may be disposed in the bidirectional optical module 30 shown in fig. 3 to fig. 7, and the bidirectional optical module does not need to further dispose the filter 35, and the filter 502 in the light receiving module 50 replaces the filter 35 to filter out the optical signals of other wavelengths, and transmit the optical signals of a predetermined wavelength to the light sensing surface s1 of the photoelectric conversion chip 323. Of course, it is also possible to keep the filter 35 in the bidirectional optical component 30, and then the bidirectional optical component 30 can filter the optical signal transmitted to the user side twice, so as to enhance the filtering effect.

Illustratively, reference is made to the schematic diagram of the bi-directional light assembly 60 shown in fig. 21, wherein the bi-directional light assembly 60 is provided with the light receiving assembly 50 as shown in fig. 19, and the filter 38 is not required to be further provided in the bi-directional light assembly 60. The bidirectional optical module 60 has high receiving efficiency of receiving optical signals.

Referring to fig. 22, a schematic diagram of a bidirectional optical module 70 is shown, wherein the bidirectional optical module 70 is provided with the light receiving module 50 as shown in fig. 20, and the filter 38 is not required to be provided in the bidirectional optical module 70. The bidirectional optical module 60 has high receiving efficiency of receiving optical signals.

When the bidirectional optical module shown in fig. 21 and 22 is applied to a communication device, the receiving efficiency of the communication device for receiving optical signals can be improved.

Although the present application has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations may be made thereto without departing from the spirit and scope of the application. Accordingly, the specification and figures are merely exemplary of the present application as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the present application. It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A light receiving component is characterized by comprising a base and a pipe cap which is packaged together with the base, wherein a first lens is arranged on the pipe cap;

in the packaging space formed by the base and the tube cap, the packaging structure comprises:

the photoelectric conversion chip is arranged on the base;

and at least one stage of second lens arranged between the first lens and the photosensitive surface of the photoelectric conversion chip.

2. The light receiving module of claim 1,

in the encapsulation space that base and cap formed, still include:

the second lens is fixedly arranged on the support and forms an accommodating cavity with the support;

the photoelectric conversion chip is accommodated in the accommodating cavity.

3. The light receiving module according to claim 2, wherein a filter is provided on the side of the second lens away from the photoelectric conversion chip on the holder.

4. The light receiving module according to claim 2, wherein a filter is provided on the side of the second lens close to the photoelectric conversion chip on the holder.

5. The light receiving assembly according to any one of claims 1 to 4, wherein the second lens includes any one of: a drop lens, a spherical lens, a non-spherical lens.

6. A light receiving assembly according to any one of claims 1 to 4, wherein an optical axis of the first lens coincides with an optical axis of the second lens, the optical axes of the first lens and the second lens passing through the photosensitive surface.

7. A light receiving assembly according to any one of claims 1-4, wherein the largest dimension of the photosurface is equal to or less than 25 microns.

8. The light receiving assembly according to any one of claims 1 to 4, wherein the first lens includes any one of: a drop lens, a spherical lens, a non-spherical lens.

9. The light-receiving module as claimed in any one of claims 1 to 4, wherein a receiving circuit including the photoelectric conversion chip is further provided on the base.

10. A bi-directional optical assembly, comprising:

a housing having a cavity;

a wavelength division multiplexing membrane disposed within the cavity;

a first opening is arranged on the cavity, faces to the reflecting surface of the wavelength division multiplexing membrane, and is internally coupled with an optical fiber;

a second opening is arranged on the cavity, the second opening faces to the reflecting surface of the wavelength division multiplexing membrane, the axis of the first opening and the axis of the second opening form a preset included angle, and the light receiving assembly as claimed in any one of claims 1 to 9 is coupled in the second opening;

the cavity is further provided with a third opening, the third opening faces the transmission surface of the wavelength division multiplexing membrane, the axis of the first opening is overlapped with the axis of the third opening, and a light sending assembly is coupled in the third opening.

11. A bi-directional optical assembly, comprising:

a housing having a cavity;

a wavelength division multiplexing membrane disposed within the cavity;

a second opening is arranged on the cavity, the second opening faces to the reflecting surface of the wavelength division multiplexing membrane, a preset included angle is formed between the axis of the first opening and the axis of the second opening, and a light transmitting assembly is coupled in the second opening;

the cavity is further provided with a third opening, the third opening faces the transmission surface of the wavelength division multiplexing membrane, an axis of the first opening coincides with an axis of the third opening, and the light receiving assembly according to any one of claims 1 to 9 is coupled in the third opening.

12. The bi-directional optical assembly of claim 10 or 11, wherein the predetermined included angle is 90 degrees.

13. The bi-directional optical assembly of claim 12, wherein the reflective surface is angled at 45 degrees to an axis of the first opening; the included angle between the reflecting surface and the axis of the second opening is 135 degrees.

14. The bi-directional optical assembly of claim 10 or 11, wherein the optical transmission assembly includes an electro-optic conversion chip.

15. A communication device comprising a bi-directional optical assembly according to any one of claims 10 to 14.