CN218443114U - Oven for packaging integrated circuit - Google Patents

Abstract

The utility model discloses an oven for integrated circuit encapsulation relates to integrated circuit's stoving technical field, including the stoving case, the one end of stoving case is rotated through connecting the pivot and is connected with the chamber door, the inner wall of stoving case is rotated and is connected with the rotary drum that is hollow structure, the both ends integrated into one piece of rotary drum have with stoving incasement chamber rotates the dwang of connecting, a plurality of standing grooves have all been seted up on the both sides of rotary drum, a plurality of stoving holes have been seted up on the circular outer wall of rotary drum. The utility model discloses a set up the rotary drum, make the even contact of hot gas flow when drying that integrated circuit can be abundant when drying for when drying, integrated circuit possess higher stoving effect, can make drying efficiency improve greatly, and after the stoving finishes, is the standing groove that the tilt state set up, can derive integrated circuit board automatically.

Description

Oven for packaging integrated circuit

Technical Field

The utility model relates to a stoving technical field of integrated circuit encapsulation specifically is an oven for integrated circuit encapsulation.

Background

An integrated circuit board is a carrier on which an integrated circuit is mounted. But often the integrated circuit board is also brought on. The integrated circuit board is mainly made of silica gel, so the integrated circuit board is generally green.

Drying refers to a process of removing the solvent in some way to retain the solid content, and generally refers to a process of introducing hot air to evaporate and take away the water in the material.

However, the current drying device generally adopts a hot air form for drying, and although hot air is adopted for drying, hot air and wind force are required to act on two surfaces of the integrated circuit board in the drying process, so that the device is required to be matched with a fan for use, and the device cannot be further simplified.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an oven for integrated circuit encapsulation to propose the problem that integrated circuit can not evenly dry in solving above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides an oven for integrated circuit encapsulation, includes the stoving case, the one end of stoving case is rotated through connecting the pivot and is connected with the chamber door, the inner wall of stoving case is rotated and is connected with the rotary drum that is hollow structure, the both ends integrated into one piece of rotary drum have with stoving incasement chamber rotates the dwang of connecting, a plurality of standing grooves have all been seted up on the both sides of rotary drum, a plurality of stoving holes have been seted up on the circular outer wall of rotary drum.

As a further aspect of the present invention: an external plug is installed at one end of the drying box and is rotationally connected with the heating wire through a controller, a porous partition plate is installed on the inner wall of the drying box, an interlayer is formed between the porous partition plate and the inner wall of the drying box, and the heating wire is located in an interlayer inner cavity.

As a further aspect of the present invention: the one end of chamber door is equipped with the handle, the non-rotation end of chamber door with stoving case passes through hasp fixed connection, chamber door with stoving case hookup location department is provided with the sealing washer.

As a further aspect of the present invention: the external plug facial make-up is equipped with the filter screen, driving motor is installed to one side of stoving case, driving motor's one end and one the dwang passes through the coupling joint, the heating wire with the coupling joint dislocation.

As a further aspect of the present invention: the hollow structure of the rotary drum is positioned on the inner side of the placing groove, a wall thickness exists between the placing groove and the hollow structure, and another group of drying holes are uniformly formed in the wall thickness.

As the utility model discloses further scheme again: an adhesive tape is bonded at the opening position of the placing groove, and the other end of the placing groove is in a closed state.

As the utility model discloses further scheme again: the inside of stoving case is installed with temperature sensor, temperature sensor with the heating wire passes through controller electric connection.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through setting up the rotary drum, make the even contact of hot gas flow when drying that integrated circuit can be abundant when drying for when drying, integrated circuit possess higher stoving effect, can make drying efficiency improve greatly, and after the stoving, is the standing groove that the tilt state set up, can derive integrated circuit board automatically.

Drawings

FIG. 1 is a schematic diagram of an oven for integrated circuit packaging;

FIG. 2 is a schematic diagram of a backside structure of an oven for integrated circuit packaging;

fig. 3 is a schematic view of a drum structure of an oven for integrated circuit packaging.

In the figure: 1. drying box; 2. a drum; 3. a box door; 101. an external plug; 102. a porous separator; 201. rotating the rod; 202. a placement groove; 203. drying the holes; 301. connecting the rotating shaft; 302. a handle.

Detailed Description

Please refer to fig. 1-3, in the embodiment of the present invention, a drying device for packaging integrated circuits includes a drying box 1, one end of the drying box 1 is connected to a box door 3 through a connecting shaft 301, an inner wall of the drying box 1 is connected to a rotary drum 2 having a hollow structure, two ends of the rotary drum 2 are integrally formed with a rotating rod 201 connected to the rotation of an inner cavity of the drying box 1, a plurality of placing grooves 202 are provided on two sides of the rotary drum 2, and a plurality of drying holes 203 are provided on a circular outer wall of the rotary drum 2.

The oven for packaging the integrated circuit is characterized in that an operator places a plurality of integrated circuit boards to be dried in a placing groove 202, after the integrated circuit boards are placed in the placing groove 202, the open end of the placing groove 202 can be sealed by using an adhesive tape to prevent the integrated circuit boards from sliding out in the drying process, then the door 3 is closed, the operator switches on the device to ensure that the device normally operates, at the moment, a driving motor drives a rotating rod 201 to rotate through a coupler, a rotating drum 2 integrally formed with the rotating rod 201 rotates along with the rotating rod, at the moment, an electric heating wire is switched on to operate to generate heat to heat air in a drying box 1, when the rotating drum 2 rotates, the air in the drying box 1 is stirred by the rotating drum 2, so that the air in the drying box 1 is uniformly heated relatively quickly, the heated air uniformly dries the integrated circuit boards placed in the inner cavity of the placing groove 202 through a drying hole 203, when the integrated circuit board is dried, the integrated circuit board has an upper drying temperature limit, when the temperature in the drying box 1 reaches the upper maximum temperature limit, the temperature sensor sends an electric signal to the controller, the controller controls the electric heating wire to stop heating, the temperature in the drying box 1 is gradually reduced at the moment, when the temperature reaches the lowest temperature preset by the temperature sensor, the temperature sensor sends an electric signal to the controller again, the controller controls the electric heating wire to operate again, so that the temperature in the drying box 1 is always kept in a drying temperature area, the problem that the integrated circuit board is damaged due to overhigh temperature or the drying speed is slow due to low temperature is solved, meanwhile, the integrated circuit board is driven to rotate and dry by matching with the rotation of the rotary drum 2, the drying efficiency can be further improved, after the drying is finished, an operator opens the lock catch, and opens the box door 3 by rotating the handle 302, take out integrated circuit to tear the sticky tape of standing groove 202 opening part can, because the inner chamber bottom of standing groove 202 is the tilt state, the integrated circuit board that is accomplished by drying this moment can be at the guide effect on inclined plane roll-off down.

In fig. 1 to 3: an external plug 101 is installed at one end of the drying box 1, the external plug 101 is rotationally connected with an electric heating wire through a controller, a porous partition plate 102 is installed on the inner wall of the drying box 1, an interlayer is formed between the porous partition plate 102 and the inner wall of the drying box 1, and the electric heating wire is located in an inner cavity of the interlayer; the internally mounted of stoving case 1 has temperature sensor, and temperature sensor passes through controller electric connection with the heating wire.

This kind of an oven for integrated circuit encapsulation, integrated circuit board is when carrying out the stoving operation, the stoving temperature upper limit has, when the temperature in stoving case 1 reaches the maximum temperature upper limit, temperature sensor signals to the controller of giving out electricity, controller control heating wire stop heating, the temperature in stoving case 1 reduces gradually this moment, when the temperature reaches the temperature sensor predetermined minimum temperature, temperature sensor signals to the controller again this moment, controller control heating wire moves once more, make the inside temperature of stoving case 1 remain throughout in the stoving temperature region, prevent the damage that causes integrated circuit board that the high temperature caused, or the temperature is lower, the slow problem of the stoving speed that causes.

In fig. 1 to 3: one end of the box door 3 is provided with a handle 302, the non-rotating end of the box door 3 is fixedly connected with the drying box 1 through a lock catch, and a sealing ring is arranged at the connecting position of the box door 3 and the drying box 1.

This kind of oven for integrated circuit encapsulation drives opening or closing of chamber door 3 through handle 302, and when closing, sealing washer atress deformation fills up the gap department of chamber door 3 and stoving case 1 one end to realize the effective sealing of device, fix chamber door 3 in preset position through the hasp afterwards, prevent to take place from the phenomenon of opening.

In FIGS. 1 to 3: a driving motor is installed on one side of the drying box 1, one end of the driving motor is connected with a rotating rod 201 through a coupler, and the heating wires are staggered with the coupler.

This kind of oven for integrated circuit encapsulation, in the use, driving motor drives stoving case 1 and carries out at the uniform velocity rotation, and the heating wire can prevent the interference phenomenon that the shaft coupling caused the heating wire with the shaft coupling dislocation to make device normal operating.

In fig. 1 to 3: the hollow structure of the rotary drum 2 is located at the inner side of the placing groove 202, and a wall thickness exists between the placing groove 202 and the hollow structure, and another group of drying holes 203 are uniformly formed in the wall thickness.

This kind of oven for integrated circuit encapsulation, when rotary drum 2 rotated, two sets of stoving hole 203 can form airflow channel for hot-air can circulate in stoving hole 203, accomplishes the purpose of high-efficient stoving.

In fig. 1 to 3: an adhesive tape is bonded to an opening of the placement groove 202, the other end of the placement groove 202 is closed, and the placement groove 202 is disposed in an inclined state.

This kind of oven for integrated circuit encapsulation, the stoving is accomplished the back, and after operating personnel opened the hasp, opened chamber door 3 through rotating handle 302, took out integrated circuit to with the sticky tape of standing groove 202 opening part tear can, because the inner chamber bottom of standing groove 202 is the tilt state, the integrated circuit board of accomplishing by the stoving this moment can be under the guide effect roll-off on inclined plane.

The utility model discloses a theory of operation is: an operator places a plurality of integrated circuit boards to be dried in a placing groove 202, after the integrated circuit boards are placed in the placing groove 202, the open end of the placing groove 202 can be sealed by using an adhesive tape to prevent the integrated circuit boards from sliding out in the drying process, then after a box door 3 is closed, the operator switches on the device to enable the device to normally operate, at the moment, a driving motor drives a rotating rod 201 to rotate through a coupler, a rotating cylinder 2 integrally formed with the rotating rod 201 rotates along with the rotating rod, at the moment, an electric heating wire is electrified to operate to generate heat to heat air in a drying box 1, when the rotating cylinder 2 rotates, the air in the drying box 1 is stirred by the rotating motor to enable the air in the drying box 1 to be uniformly heated relatively quickly, the heated air uniformly dries the integrated circuit boards arranged in an inner cavity of the placing groove 202 through a drying hole 203, and when the integrated circuit boards are dried, the integrated circuit drying device has the upper limit of drying temperature, when the temperature in the drying box 1 reaches the upper limit of the highest temperature, the temperature sensor sends an electric signal to the controller, the controller controls the electric heating wire to stop heating, the temperature in the drying box 1 is gradually reduced at the moment, when the temperature reaches the lowest temperature preset by the temperature sensor, the temperature sensor sends an electric signal to the controller again, the controller controls the electric heating wire to operate again, so that the temperature in the drying box 1 is always kept in a drying temperature area, the problem that the integrated circuit board is damaged due to overhigh temperature or the drying speed is slow due to low temperature is solved, meanwhile, the integrated circuit board is driven to rotate and dry by matching with the rotation of the rotary drum 2, the drying efficiency can be further improved, after the drying is finished, an operator opens the lock catch, opens the box door 3 by rotating the handle 302 to take out the integrated circuit, and tear the sticky tape of standing groove 202 opening part can, because the inner chamber bottom of standing groove 202 is the tilt state, the integrated circuit board that is accomplished by the stoving this moment can be at the guide effect on inclined plane roll-off down.

The above-mentioned, only be the embodiment of the preferred of the present invention, nevertheless the utility model discloses a protection scope is not limited to this, and any technical personnel familiar with this technical field is in the technical scope of the utility model discloses an according to the utility model discloses a technical scheme and utility model design in addition the replacement of equality or change, all should be covered within the protection scope of the utility model.

Claims (7)

1. The utility model provides an oven for integrated circuit encapsulation, includes stoving case (1), the one end of stoving case (1) is rotated through connecting pivot (301) and is connected with chamber door (3), its characterized in that, the inner wall of stoving case (1) is rotated and is connected with rotary drum (2) that are hollow structure, the both ends integrated into one piece of rotary drum (2) have with dwang (201) that stoving case (1) inner chamber rotates to be connected, a plurality of standing grooves (202) have all been seted up on the both sides of rotary drum (2), a plurality of stoving holes (203) have been seted up on the circular outer wall of rotary drum (2).

2. An oven for integrated circuit packaging according to claim 1, wherein an external plug (101) is installed at one end of the drying oven (1), the external plug (101) is rotatably connected with the heating wire through a controller, a porous partition plate (102) is installed on the inner wall of the drying oven (1), an interlayer is formed between the porous partition plate (102) and the inner wall of the drying oven (1), and the heating wire is located in the interlayer inner cavity.

3. An oven for integrated circuit package according to claim 1, wherein a handle (302) is disposed at one end of the oven door (3), the non-rotating end of the oven door (3) is fixedly connected to the drying oven (1) by a lock, and a sealing ring is disposed at a connecting position of the oven door (3) and the drying oven (1).

4. An oven for integrated circuit packaging according to claim 2, wherein a driving motor is installed at one side of the drying oven (1), one end of the driving motor is connected with one of the rotating rods (201) through a coupler, and the heating wire is dislocated with the coupler.

5. Oven for integrated circuit packaging according to claim 1, characterized in that the hollow structure of the drum (2) is located inside the placement slot (202), and a wall thickness exists between the placement slot (202) and the hollow structure, said wall thickness being evenly provided with another set of drying holes (203).

6. The oven for integrated circuit packaging according to claim 1, wherein an adhesive tape is adhered to the opening of the placement groove (202), and the other end of the placement groove (202) is in a closed state.

7. Oven for integrated circuit packaging according to claim 2, characterized in that a temperature sensor is mounted inside the oven drying box (1), and the temperature sensor is electrically connected with the heating wire through a controller.

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