CN218416811U

CN218416811U - Electronic device with a detachable cover

Info

Publication number: CN218416811U
Application number: CN202222390103.6U
Authority: CN
Inventors: 杨鸿祥; 薛华; 盛赵伟
Original assignee: Asustek Computer Inc
Current assignee: Asustek Computer Inc
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-01-31
Anticipated expiration: 2032-09-08
Also published as: TWM638516U

Abstract

An electronic device includes a circuit board and an expansion module, wherein the expansion module is disposed on the circuit board and includes a switch card, an expansion card, and a support member. The adapter card is suitable for being inserted into the circuit board in a standing mode. The expansion card is inserted in the adapter card. The support piece is fixed on the adapter card and is suitable for being detachably arranged on the circuit board, wherein the expansion card is erected above the circuit board through the adapter card, and an accommodating space is formed between the expansion card and the circuit board. The electronic device can be provided with more components.

Description

Electronic device with a detachable cover

Technical Field

The utility model relates to an can set up electron device of more subassembly.

Background

With the development of technology, the functions of electronic devices are becoming more and more powerful, the number of electronic components fixed or inserted on a circuit board is becoming more and more, and how to arrange more components under the circuit board in a limited space is a research goal in the field.

SUMMERY OF THE UTILITY MODEL

An electronic device includes a circuit board and an expansion module, wherein the expansion module is disposed on the circuit board and includes a switch card, an expansion card, and a support member. The adapter card is suitable for being inserted into the circuit board in a standing mode. The expansion card is inserted in the adapter card. The support piece is fixed on the adapter card and is suitable for being detachably arranged on the circuit board, wherein the expansion card is erected above the circuit board through the adapter card, and an accommodating space is formed between the expansion card and the circuit board.

Based on the above, the expansion module of the electronic device in the present disclosure includes a switch card, an expansion card, and a support. The adapter card is suitable for being inserted into the circuit board in a standing mode. The expansion card is inserted in the adapter card. The expansion card is elevated above the circuit board through the adapter card, and an accommodating space is formed between the expansion card and the circuit board. In addition, the supporting piece is fixed on the adapter card and is suitable for being detachably arranged on the circuit board so as to support the adapter card and the expansion card.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the disclosure;

FIG. 2 is an exploded schematic view of the electronic device of FIG. 1;

fig. 3 is a schematic diagram of the electronic device of fig. 1 with an expansion module disposed on a circuit board.

Description of the reference numerals

H1, H2: a height;

100: an electronic device;

105: a circuit board;

106: a first connector;

107: a second connector;

110: an expansion module;

112: an expansion card;

114: a switching card;

120: a heat dissipating component;

122: a first heat sink;

124: a second heat sink;

130: a support member;

132: a first section;

134: a second section;

136: a third section;

138. 139: a bonding section;

140: a first fixing member;

142: a second fixing member;

144: a third fixing member;

150: a second expansion module;

152: a second expansion card;

154: a second riser card;

160: and a third heat sink.

Detailed Description

Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the disclosure. Fig. 2 is an exploded schematic view of the electronic device of fig. 1. Fig. 3 is a schematic diagram of an expansion module of the electronic device of fig. 1 disposed on a circuit board.

Referring to fig. 1 to 3, an electronic device 100 of the present embodiment includes a circuit board 105 and an expansion module (hereinafter, the first expansion module 110 is shown). The circuit board 105 is, for example, a motherboard, but not limited thereto, the circuit board 105 includes a first connector 106, and the first expansion module 110 is detachably disposed on the circuit board 105.

The first expansion module 110 includes an expansion card (hereinafter, the first expansion card 112), a riser card (hereinafter, the first riser card 114), and a support 130. The first expansion card 112 is electrically connected to the circuit board 105. The first expansion card 112 is, for example, a solid state disk of an m.2 interface, but the type of the first expansion card 112 is not limited thereto. The first adapter 114 is inserted into the first connector 106 of the circuit board 105, and the first expansion card 112 is inserted into the first adapter 114 to be electrically connected to the circuit board 105 through the first adapter 114.

In the embodiment, the first adapter 114 stands up from the circuit board 105, and the first expansion card 112 is horizontally inserted into the first adapter 114 to leave a lower space for other components (such as the second expansion module 150 and the first heat sink 122).

That is, the first expansion card 112 of the present embodiment is elevated above the circuit board 105 through the first adapter 114, and has a receiving space with the circuit board 105. Other electronic components (e.g., the second expansion module 150) of the electronic device 100 may be disposed between the first expansion module 110 and the circuit board 105, and more components are disposed on the circuit board 105 with limited space, so as to enhance the performance of the electronic device 100.

In order to stably dispose the first adapter 114 and the first expansion card 112 on the circuit board 105, in the embodiment, the supporting element 130 is disposed beside the first adapter 114 and fixed to the first adapter 114. The supporting member 130 may be used to improve the structural strength of the first expansion module 110 and may be used to fix to the circuit board 105, thereby providing stability to the first expansion module 110.

Specifically, the supporting member 130 may optionally include a first section 132, a second section 134, and a third section 136 connected in a bending manner, wherein the first section 132 is closest to the circuit board 105, and the third section 136 is farthest from the circuit board 105. The first fixing member 140 fixes the first section 132 to the circuit board 105.

In the present embodiment, the first section 132 and the third section 136 are parallel to the circuit board 105, and the second section 134 is perpendicular to the circuit board 105 and parallel to the first adapter card 114. The first section 132, the second section 134 and the third section 136 of the supporting member 130 are C-shaped, but the shape of the supporting member 130 is not limited thereto, and in other embodiments, the supporting member 130 may also be L-shaped or other shapes.

The first expansion module 110 optionally includes a heat dissipation assembly 120. The heat dissipation assembly 120 includes a first heat dissipation member 122, and the first heat dissipation member 122 is located between the circuit board 105 and the first expansion card 112. That is, the first heat dissipation member 122 is located in the accommodating space below the first expansion card 112. As shown in fig. 2, in the present embodiment, the first heat dissipation element 122 is in an inverted L shape, but the shape of the first heat dissipation element 122 is not limited thereto.

The first adapter 114 is located between the first heat dissipating member 122 and the second section 134, and is connected to the first heat dissipating member 122 and the second section 134, so that the first heat dissipating member 122 is fixed to the second section 134 of the support 130. Specifically, the first adapter card 114 is fixed to the first heat sink 122 by the coupling portion 139. The first heat dissipating member 122 is fixed to the joint 139 through the joint 138 and fixed to the second section 134 of the support 130.

As can be seen in fig. 3, the height H2 of the supporting member 130 is between 0.8 and 1.2 times the height H1 of the first adapter card 114. Such a design may enable the support 130 to preferably provide support for the first adapter 114 in the height direction.

In the present embodiment, the number of the combining portions 138 is, for example, two, and the two combining portions 138 are located at two corners of the second section at opposite angles. Of course, in other embodiments, the number of the combining portions 138 may be four, and four combining portions 138 are located at four corners of the second section at opposite corners. The number and arrangement positions of the engaging portions 138 are not limited thereto.

In addition, the heat dissipation assembly 120 further includes a second heat dissipation member 124, and the first expansion card 112 is located between the first heat dissipation member 122 and the second heat dissipation member 124. That is, the second heat dissipation element 124 is located above the first expansion card 112. The second heat dissipating member 124 is fixed to the first heat dissipating member 122 by the screw and stud engagement. The first expansion card 112 is sandwiched and fixed between the first heat dissipation member 122 and the second heat dissipation member 124. In addition, the second heat dissipation member 124 is fixed to the third section 136 of the support member 130.

In the embodiment, the first fixing member 140 detachably fixes the first section 132 of the supporting member 130 to the circuit board 105. The second fixing member 142 is used for fixing the relative position of the heat dissipation assembly 120 and the circuit board 105. Specifically, the electronic device 100 further includes a third fixing element 144 (e.g., a stud) fixed to the circuit board 105, and the second fixing element 142 is detachably disposed on the third fixing element 144 to fix the heat dissipation assembly 120 to the circuit board 105.

Therefore, in the embodiment, since the first expansion module 110 is elevated to make room, the electronic device 100 may further optionally include an electronic component (e.g., the second expansion module 150) disposed below the first expansion module 110 to provide more diversified and efficient functions.

In the present embodiment, the second expansion module 150 includes a second expansion card 152, a second adapter card 154 and a third heat dissipation member 160. The second expansion card 152 is, for example, a solid state disk of an m.2 interface, but the type of the first expansion card 112 is not limited thereto.

The second expansion card 152 is located between the first expansion card 112 and the circuit board 105, and the third heat dissipation member 160 is located between the second expansion card 152 and the circuit board 105. The second expansion card 152 abuts against the third fixing member 144. The second adapter 154 is inserted into the second connector 107 of the circuit board 105, and the second expansion card 152 is inserted into the second adapter 154 to electrically connect to the circuit board 105 through the second adapter 154.

In the embodiment, the second adapter 154 and the second expansion card 152 are disposed parallel to the circuit board 105, but the disposition of the second adapter 154 and the second expansion card 152 is not limited thereto. In other embodiments, the second riser card 154 may be omitted.

In summary, the expansion module of the electronic device includes a adapter card, an expansion card, and a support member. The adapter card is suitable for being inserted into the circuit board in a standing mode. The expansion card is inserted in the adapter card. The expansion card is elevated above the circuit board through the adapter card, and an accommodating space is formed between the expansion card and the circuit board. In addition, the supporting piece is fixed on the adapter card and is suitable for being detachably arranged on the circuit board so as to support the adapter card and the expansion card.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. An electronic device, comprising:

a circuit board; and

the expansion module is arranged on the circuit board and comprises:

the adapter card is suitable for being inserted into the circuit board in a standing mode;

the expansion card is inserted into the adapter card; and

the support piece is fixed on the adapter card and is suitable for being detachably arranged on the circuit board, wherein the expansion card is erected above the circuit board through the adapter card, and an accommodating space is formed between the expansion card and the circuit board.

2. The electronic device of claim 1, wherein the support is located beside the adapter card, and a height of the support on the circuit board is between 0.8 times and 1.2 times a height of the adapter card on the circuit board.

3. The electronic device of claim 1, wherein the support member comprises a first section and a second section connected in a bending manner, the first section is fixed on the circuit board, and the adapter card is fixed on the second section.

4. The electronic device of claim 3, wherein the riser card is secured to the second section by a plurality of joints located at a plurality of corners of the second section.

5. The electronic device of claim 3, wherein the expansion module further comprises a first heat dissipation member located in the receiving space and fixed to the second section of the support member.

6. The electronic device of claim 3, further comprising a second heat dissipation member, the expansion card being located between the second heat dissipation member and the circuit board, the second heat dissipation member being secured to the support member.

7. The electronic device of claim 6, wherein the support further comprises a third section that is connected to the second section at a bend, the third section being remote from the circuit board, the second heat sink being secured to the third section.

8. The electronic device of claim 7, wherein the first section and the third section are parallel to the circuit board, and the second section is perpendicular to the circuit board and parallel to the riser card.

9. The electronic device of claim 7, wherein the first, second, and third sections of the support are C-shaped.

10. The electronic device of claim 1, further comprising an electronic component disposed between the expansion module and the circuit board.