CN218399189U - Bury nail type high strength notebook shell forming die in mould - Google Patents

Abstract

The utility model relates to a notebook casing injection moulding field, concretely relates to bury nail type high strength notebook shell forming die in mould. The method comprises the following steps: movable mould benevolence and cover half benevolence, be equipped with the molding chamber between movable mould benevolence and the cover half benevolence, the molding chamber suits with notebook shell shape, still includes the movable mould lagging, movable mould benevolence is installed on the movable mould lagging, still includes a set of nail contact pin that buries, it runs through on movable mould lagging and movable mould benevolence to bury the nail contact pin, it is equipped with and buries the nail fixed head to bury nail contact pin tip, it sets up in the molding chamber to bury the nail fixed head, it is equipped with and buries the nail spare to bury the cover on the nail fixed head. Need not to bury the nail after the shaping, consequently promoted production efficiency. And, can guarantee to bury the degree of consistency of injection molding material around the nail spare, promote the structural strength and the product quality who buries nail department.

Description

Bury nail type high strength notebook shell forming die in mould

Technical Field

The utility model relates to a notebook casing injection moulding field, concretely relates to bury nail type high strength notebook shell forming die in mould.

Background

In the production process of the notebook computer shell, the nut needs to be embedded into the notebook computer shell, so that the subsequent installation of the notebook computer shell is facilitated. This operation of embedding the nut is called a nail embedding process. The existing nail burying device mostly adopts a hot-pressing nail burying method, for example, the positioning type notebook computer shell nail burying device disclosed by the application number CN202020128915.1 is symmetrically provided with arc-shaped pressing pieces matched with positioning pressing plates, so that the positioning operation can be effectively realized, and a hot-pressing nail burying machine can be started in real time during positioning, so that the precision and the efficiency of the nail burying operation can be improved, the use is stable and reliable, the applicability is strong, and the practicability is good. However, the hot-pressing nail embedding method has the following defects: 1. because the nail embedding process is additionally arranged on the formed part after the injection molding is finished, the production efficiency is not high; 2. bury the nail through carrying out local heating to the formed part again, bury the degree of consistency of the heat altered shape of nail department and be difficult to guarantee, produce the substandard product easily, influence and bury structural strength and the product quality of nail department correspondingly.

SUMMERY OF THE UTILITY MODEL

For overcoming the not enough of above-mentioned prior art, the utility model provides a bury nail type high strength notebook shell forming die in mould need not to establish in addition and buries the nail process, promotes production efficiency, product quality.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides an in-mold buries nail type high strength notebook shell forming die, includes: movable mould benevolence and fixed mould benevolence, be equipped with the die cavity between movable mould benevolence and the fixed mould benevolence, the die cavity suits with notebook shell shape, still includes the movable mould lagging, movable mould benevolence is installed on the movable mould lagging, still includes a set of nail contact pin that buries, it runs through on movable mould lagging and movable mould benevolence to bury the nail contact pin, it is equipped with and buries the nail fixed head to bury nail contact pin tip, it sets up in the die cavity to bury the nail fixed head, it is equipped with and buries the nail spare to bury the overhead cover of nail fixed.

In the above-mentioned device, an bury nail type high strength notebook shell forming die in mould, its principle is, bury the nail contact pin through setting up in movable mould benevolence one side, will bury the nail fixed head and stretch into the shaping intracavity, before the compound die, bury the nail fixed head department cover and establish and bury the nail spare. And after the die is closed, the embedded nail piece is arranged in the forming cavity, and injection molding is performed at the moment, so that the embedded nail piece is directly integrated with the formed piece of the notebook shell, and the in-die embedded nail is completed. Need not to bury the nail after the shaping, consequently promoted production efficiency. And, can guarantee to bury the degree of consistency of injection molding material around the nail spare, promote the structural strength and the product quality who buries nail department. Wherein, an bury nail type high strength notebook shell forming die in mould, still include the cover half lagging, cover half mould benevolence is fixed on the cover half lagging, during the compound die, cover half lagging and movable mould lagging laminate mutually.

Further, the mould of burying nail type high strength notebook shell forming die in, bury nail spare and include the cylinder, wear to be equipped with the screw hole on the cylinder, the cylinder is prismatic. As the utility model discloses a preferred scheme, bury the nail wholly for prismatic, can guarantee to bury the circumference location of nail.

Further, an in-mould buries nail type high strength notebook shell forming die, bury the nail still including a set of spacing protruding, a set of spacing protruding setting is in the cylinder side. As the utility model discloses an optimal scheme sets up the axial positioning that nail spare was buried in spacing protruding assurance, buries the nail fixed head and buries the unable separation of nail spare when preventing the drawing of patterns. Meanwhile, the firmness of connection of the notebook shell and the nail-embedded part is improved.

Further, an bury nail type high strength notebook shell forming die in mould, still include thimble portion, thimble portion sets up and keeps away from cover half benevolence one side at the movable mould lagging, thimble portion includes a set of thimble, the thimble runs through in movable mould lagging and movable mould benevolence, the thimble top sets up on the terminal surface of the nearly thimble portion one side of shaping chamber.

Further, an mould bury nail type high strength notebook shell forming die in, its characterized in that: the thimble portion still includes a pair of thimble board of laminating mutually, the thimble board sets up and keeps away from movable mould lagging at the thimble one side.

Furthermore, a mould bury nail type high strength notebook shell forming die in, the thimble corresponds thimble board one end and is equipped with first spacing boss, a pair of thimble board includes locating plate and push pedal, the locating plate is worn to locate by the thimble, the locating plate is equipped with the first spacing groove that suits with first spacing boss shape, thimble one end is kept away from at the locating plate in the push pedal setting.

Further, an bury nail type high strength notebook shell forming die in mould, the nearly thimble portion one side of movable mould lagging is equipped with a pair of slide way board, the thimble board sets up between a pair of slide way board, the slide way board is kept away from movable mould lagging one end and is equipped with limit flange.

Further, a mould in bury nail type high strength notebook shell forming die, thimble portion still includes the spring, the spring housing is established on the thimble, the spring setting is kept away from push pedal one side at the locating plate.

Based on the structure, the ejector pin is used for ejecting the notebook shell out of the forming cavity when the mold is opened. Wherein, the thimble board is used for being connected with drive unit to drive thimble axial displacement. The slide way plate and the limiting flange play a role in limiting the ejector plate. The spring plays a role of resetting.

Further, an bury nail type high strength notebook shell forming die in mould, still include the contact pin limiting plate, the contact pin limiting plate sets up in the nearly thimble portion one side of movable mould lagging, the spring pushes up the contact pin limiting plate to laminating with movable mould lagging terminal surface, bury the nail contact pin and keep away from to bury nail fixed head one end and laminate mutually with contact pin limiting plate terminal surface.

Further, an bury nail type high strength notebook shell forming die in mould, it keeps away from to bury the nail contact pin and buries nail fixed head one end and be equipped with the spacing boss of second, be equipped with the second spacing groove on the terminal surface of the nearly contact pin limiting plate one side of movable mould lagging, the spacing boss shape of second spacing groove and second suits.

Based on above-mentioned structure, contact pin limiting plate and second spacing groove are used for carrying out axial and radial ascending spacing to burying the nail contact pin to carry out axial positioning, simple structure, the convenience is dismantled the change burying the nail contact pin through the spring to the contact pin limiting plate.

Above-mentioned technical scheme can find out, the utility model discloses following beneficial effect has:

1. the utility model provides a bury nail type high strength notebook shell forming die in mould buries the nail contact pin through setting up in movable mould benevolence one side, will bury the nail fixed head and stretch into the shaping intracavity, before the compound die, buries nail fixed head department cover and establishes and bury the nail piece. And after the die is closed, the embedded nail piece is arranged in the forming cavity, and injection molding is performed at the moment, so that the embedded nail piece is directly integrated with the formed piece of the notebook shell, and the in-die embedded nail is completed. Need not to bury the nail after the shaping, consequently promoted production efficiency. And, can guarantee to bury the degree of consistency of injection molding material around the nail spare, promote the structural strength and the product quality who buries nail department. Wherein, an bury nail type high strength notebook shell forming die in mould, still include the cover half lagging, cover half mould benevolence is fixed on the cover half lagging, during the compound die, cover half lagging and movable mould lagging laminate mutually.

2. The utility model provides an bury nail type high strength notebook shell forming die in mould, it still includes a set of spacing protruding still to bury the nail piece, and is a set of spacing protruding setting is in the cylinder side. Set up spacing protruding axial positioning who guarantees to bury the nail piece, bury the fixed head of nail and bury the unable separation of nail piece when preventing the drawing of patterns. Meanwhile, the firmness of connection of the notebook shell and the nail-embedded part is improved.

Drawings

Fig. 1 is an exploded view of a forming mold for a high-strength notebook computer case with embedded nails in the mold according to the present invention;

fig. 2 is a schematic structural diagram of a notebook computer case manufactured by the in-mold nail-embedded high-strength notebook computer case forming mold according to the present invention;

fig. 3 is a schematic structural view of the nail-embedded member in the in-mold nail-embedded high-strength notebook shell forming mold of the present invention;

fig. 4 is a top view of the in-mold nail-embedded high-strength notebook shell forming mold according to the present invention;

FIG. 5 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 4;

fig. 6 is a sectional view taken in the direction B-B in fig. 4.

In the figure: 1-moving mould core; 10-a molding cavity; 2-fixing the mold core; 3-notebook shell; 4-moving the die sleeve plate; 41-pin limiting plate; 42-a second limit groove; 5-embedding a nail and inserting a pin; 51-embedding nail fixing head; 52-a second limit boss; 6-embedding a nail; 61-a cylinder; 62-limit convex; 7-a thimble portion; 71-a thimble; 711-a first limit boss; 72-an ejector plate; 721-positioning plate; 7211-a first retaining groove; 722-push plate; 73-a spring; 8-a slide plate; 81-a position-limiting flange; and 9, fixing the die sleeve plate.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Combine a mould that buries nail type high strength notebook shell forming die that fig. 1 and fig. 2 show, a mould buries nail type high strength notebook shell forming die in, including movable mould benevolence 1 and cover half benevolence 2, be equipped with between movable mould benevolence 1 and the cover half benevolence 2 and become die cavity 10, become die cavity 10 and 3 shapes of notebook shell and suit, still include movable mould lagging 4, movable mould benevolence 1 is installed on movable mould lagging 4, still includes a set of nail contact pin 5 that buries, it runs through on movable mould lagging 4 and movable mould benevolence 1 to bury nail contact pin 5 tip, it is equipped with buries nail fixed head 51 to bury nail contact pin 5 tip, it sets up in forming cavity 10 to bury nail fixed head 51, it is equipped with on the nail fixed head 51 and buries nail spare 6 to overlap.

Based on the above structure, the principle of the forming mold for the in-mold nail-embedded high-strength notebook computer shell according to the embodiment is that the nail-embedded inserting needle 5 is arranged on one side of the movable mold core 1, the nail-embedded fixing head 51 extends into the forming cavity 10, and the nail-embedded piece 6 is sleeved at the nail-embedded fixing head 51 before mold closing. After the die assembly, the nail burying piece 6 is arranged in the forming cavity 10, and at the moment, the injection molding is carried out, so that the nail burying piece 6 is directly integrated with the forming part of the notebook shell 3, and the in-die nail burying is completed. Need not to bury the nail after the shaping, consequently promoted production efficiency. Moreover, the uniformity of injection molding materials around the embedded nail part 6 can be ensured, and the structural strength of the embedded nail part is improved. Wherein, this embodiment an bury nail type high strength notebook shell forming die in mould, still include cover half lagging 9, cover half mould benevolence 2 is fixed on cover half lagging 9, during the compound die, cover half lagging 9 and movable mould lagging 4 are laminated mutually.

Referring to fig. 3, in the present embodiment, the nail embedding member 6 includes a cylinder 61, a threaded hole is formed in the cylinder 61, and the cylinder 61 is prism-shaped. The embedded nail pieces 6 are integrally prismatic, and circumferential positioning of the embedded nail pieces 6 can be guaranteed. In addition, the nail embedding part 6 further comprises a group of limiting protrusions 62, and the group of limiting protrusions 62 are arranged on the side face of the column body 61. Set up spacing protruding 62 and guarantee to bury the axial positioning of nail 6, bury nail fixed head 51 and bury the unable separation of nail 6 when preventing the drawing of patterns. Meanwhile, the firmness of connection of the notebook shell 3 and the nail embedding piece 6 is improved.

As shown in fig. 4 and fig. 5, in this embodiment, the molding apparatus further includes a thimble portion 7, the thimble portion 7 is disposed on a side of the movable mold sleeve 4 away from the fixed mold core 2, the thimble portion 7 includes a group of thimbles 71, the thimbles 71 penetrate through the movable mold sleeve 4 and the movable mold core 1, and tops of the thimbles 71 are disposed on an end surface of the molding cavity 10 close to the thimble portion 7. The thimble portion 7 further includes a pair of thimble plates 72 attached to each other, and the thimble plates 72 are provided on the side of the thimble 71 away from the movable die sleeve 4. The thimble 71 is provided with a first limit boss 711 corresponding to one end of the thimble plate 72, the thimble plate 72 comprises a positioning plate 721 and a push plate 722, the thimble 71 penetrates through the positioning plate 721, the positioning plate 721 is provided with a first limit groove 7211 adapted to the shape of the first limit boss 711, and the push plate 722 is arranged at one end of the positioning plate 721 away from the thimble 71. In addition, a pair of slide way plates 8 are arranged on one side of the movable die sleeve plate 4 close to the thimble portion 7, the thimble plate 72 is arranged between the pair of slide way plates 8, and one end of the slide way plate 8 far away from the movable die sleeve plate 4 is provided with a limit flange 81. In this embodiment, the thimble portion 7 further includes a spring 73, the spring 73 is sleeved on the thimble 71, and the spring 73 is disposed on one side of the positioning plate 721 away from the push plate 722.

Based on the above structure, the ejector pin 71 is used for ejecting the notebook shell 3 out of the molding cavity 10 when the mold is opened. Wherein the ejector plate 72 is used for connecting with a driving part and driving the ejector 71 to axially move. The slide plate 8 and the limit flange 81 serve as a limit for the ejector plate 72. The spring 73 serves as a return.

As shown in fig. 6, in this embodiment, the pin fixing device further includes a pin limiting plate 41, the pin limiting plate 41 is disposed on one side of the movable mold sleeve 4 near the pin ejecting portion 7, the spring 73 pushes the pin limiting plate 41 to be attached to the end surface of the movable mold sleeve 4, and one end of the nail embedding pin 5, which is far from the nail embedding fixing head 51, is attached to the end surface of the pin limiting plate 41. And, the end of the nail embedding pin 5 far away from the nail embedding fixing head 51 is provided with a second limiting boss 52, the end surface of the movable die sleeve plate 4 near the pin limiting plate 41 is provided with a second limiting groove 42, and the shape of the second limiting groove 42 is matched with that of the second limiting boss 52.

Based on the structure, the pin limiting plate 41 and the second limiting groove 42 are used for limiting the embedded nail pin 5 in the axial direction and the radial direction, and the pin limiting plate 41 is axially positioned through the spring 73, so that the structure is simple, and the embedded nail pin 5 is conveniently detached and replaced.

The technical principles of the present invention have been described above in connection with specific embodiments, which are intended to explain the principles of the invention and should not be interpreted as limiting the scope of the invention in any way. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive step, and these embodiments are all intended to fall within the scope of the present invention.

Claims (10)

1. The utility model provides an bury nail type high strength notebook shell forming die in mould which characterized in that: including movable mould benevolence (1) and cover half benevolence (2), be equipped with between movable mould benevolence (1) and the cover half benevolence (2) and become die cavity (10), become die cavity (10) and adapt to with notebook shell (3) shape, still include movable mould lagging (4), install on movable mould lagging (4) movable mould benevolence (1), still include a set of nail contact pin (5) of burying, bury nail contact pin (5) and run through on movable mould lagging (4) and movable mould benevolence (1), it is equipped with and buries nail fixed head (51) to bury nail contact pin (5) tip, it sets up in shaping cavity (10) to bury nail fixed head (51), it is equipped with on nail fixed head (51) to bury and buries nail spare (6).

2. The mold for forming high-strength notebook computer case according to claim 1, wherein: the nail embedding piece (6) comprises a cylinder (61), a threaded hole penetrates through the cylinder (61), and the cylinder (61) is prismatic.

3. The mold for forming high-strength notebook computer case according to claim 2, wherein: the nail embedding part (6) further comprises a group of limiting protrusions (62), and the limiting protrusions (62) are arranged on the side face of the column body (61).

4. The in-mold nail-embedded high-strength notebook computer shell forming mold according to claim 1, characterized in that: still include thimble portion (7), thimble portion (7) set up and keep away from die core (2) one side in movable mould lagging (4), thimble portion (7) include a set of thimble (71), thimble (71) run through in movable mould lagging (4) and movable mould benevolence (1), thimble (71) top sets up on the terminal surface of forming cavity (10) nearly thimble portion (7) one side.

5. The in-mold nail-embedded high-strength notebook computer shell forming mold according to claim 4, characterized in that: the thimble portion (7) further comprises a pair of thimble plates (72) which are attached to each other, and the thimble plates (72) are arranged on one sides, far away from the movable mould sleeve plate (4), of the thimbles (71).

6. The in-mold nail-embedded high-strength notebook computer shell forming mold according to claim 5, characterized in that: thimble (71) correspond thimble board (72) one end and are equipped with first spacing boss (711), and a pair of thimble board (72) is including locating plate (721) and push pedal (722), locating plate (721) are worn to locate by thimble (71), locating plate (721) are equipped with first spacing groove (7211) that suits with first spacing boss (711) shape, push pedal (722) set up and keep away from thimble (71) one end in locating plate (721).

7. The mold for forming high-strength notebook computer case according to claim 6, wherein: one side of the movable die sleeve plate (4) close to the thimble part (7) is provided with a pair of slide way plates (8), the thimble plate (72) is arranged between the pair of slide way plates (8), and one end of the slide way plate (8) far away from the movable die sleeve plate (4) is provided with a limit flange (81).

8. The mold for forming high-strength notebook computer case according to claim 7, wherein: the thimble portion (7) further comprises a spring (73), the spring (73) is sleeved on the thimble (71), and the spring (73) is arranged on one side, far away from the push plate (722), of the positioning plate (721).

9. The mold for forming high-strength notebook computer case according to claim 8, wherein: still include contact pin limiting plate (41), contact pin limiting plate (41) set up in nearly thimble portion (7) one side of movable mould lagging (4), spring (73) push up contact pin limiting plate (41) to laminating with movable mould lagging (4) terminal surface, bury nail contact pin (5) and keep away from to bury nail fixed head (51) one end and laminate mutually with contact pin limiting plate (41) terminal surface.

10. The mold for forming high-strength notebook computer case with embedded nails in mold according to claim 9, wherein: bury nail contact pin (5) and keep away from and bury nail fixed head (51) one end and be equipped with spacing boss of second (52), be equipped with second spacing groove (42) on the terminal surface of nearly contact pin limiting plate (41) one side of movable mould lagging (4), spacing boss (52) shape of second spacing groove (42) and second suits.

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