CN218388419U - Transistor chip performance testing mechanism - Google Patents
Transistor chip performance testing mechanism Download PDFInfo
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- CN218388419U CN218388419U CN202222226245.9U CN202222226245U CN218388419U CN 218388419 U CN218388419 U CN 218388419U CN 202222226245 U CN202222226245 U CN 202222226245U CN 218388419 U CN218388419 U CN 218388419U
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- guide pipe
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- air guide
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Abstract
The utility model discloses a transistor chip capability test mechanism, including casing, detection electroplax, probe and radiator unit, detect the electroplax set up in the casing, probe one end with detect the electroplax electricity and connect, the probe other end runs through the casing, radiator unit includes fan and guide duct, the fan sets up in the air intake of guide duct, just detect the electroplax towards in the casing is located to the air outlet of guide duct, when detecting the electroplax temperature rise, through radiator unit is to detecting the electroplax forced air cooling. The problem of current chip accredited testing organization detect that the electroplax is in high temperature state for a long time, influences chip test accuracy is solved.
Description
Technical Field
The utility model relates to an electronic components field, concretely relates to transistor chip capability test mechanism.
Background
When the traditional transistor chip performance testing mechanism is used for testing, the required pressure measurement force is higher due to the fact that the test needle is high in hardness and long in length, and the transistor pins are prone to being damaged.
CN207908630U discloses a transistor chip capability test mechanism, which comprises a mounting base, support and test needle subassembly, support and mount pad fixed connection, the test needle subassembly sets up in the support and keeps away from mount pad one side, the mount pad is used for fixed chip that awaits measuring, the test needle subassembly includes the probe needle, detect electroplax and holding down, the probe needle has elasticity, and length is 20mm ~ 50mm, the probe core is used for detecting the chip capability with detecting the electroplax, and its test needle has certain elasticity, and through its length of reasonable control, thereby can reduce the pressure measuring power, avoid the transistor pin to damage.
However, when the testing mechanism is used for a long time, the temperature of the detection electroplate rises, and the detection electroplate is in a high-temperature state for a long time, so that the accuracy of chip testing can be influenced.
Disclosure of Invention
The utility model aims at providing a transistor chip capability test mechanism has solved current chip test mechanism and has detected the electroplax and be in high temperature state for a long time, influences the problem of chip testing accuracy.
In order to achieve the above object, the utility model provides a transistor chip capability test mechanism, including casing, detection electroplax, probe and radiator unit, detect the electroplax set up in the casing, probe one end with detect the electroplax electricity and connect, the probe other end runs through the casing, radiator unit includes fan and guide duct, the fan sets up in the air intake of guide duct, the air outlet of guide duct is located in the casing and is towards detecting the electroplax, when detecting the electroplax temperature rise, through radiator unit is to detecting the air-cooled cooling of electroplax.
Furthermore, the air inlet of the air guide pipe penetrates through the shell, and a dust cover used for shielding the air inlet is detachably connected outside the shell.
Further, the dust cover includes link and dust screen, the link is close to one side of air intake and can dismantle with the casing and be connected, the dust screen deviates from one side fixed connection of air intake with the link.
Further, the link includes support and magnet, the support axial is equipped with the passageway, and this passageway is close to the opening of air intake one end and passes through magnet and be connected with the casing, and this passageway deviates from opening and the dust screen fixed connection of air intake one end.
Further, the air outlet of the air guide pipe is connected with the air outlet assembly, the air outlet assembly comprises a flow guide cover and an air outlet nozzle, the flow guide cover is fixedly connected with the shell and is communicated with the air outlet of the air guide pipe through a middle opening, one side, away from the air outlet of the air guide pipe, of the flow guide cover is connected with the air outlet nozzle, the air outlet nozzle is communicated with an inner cavity of the flow guide cover, and the air outlet of the air outlet nozzle faces the detection electric plate.
Further, still include fixed subassembly, fixed subassembly sets up in the casing with between the guide duct.
Further, the fixed assembly comprises a plurality of fixed rods, one end of each fixed rod is fixedly connected with the shell, and the other end of each fixed rod is fixedly connected with the air guide pipe.
Furthermore, a plurality of fixed rods are uniformly arranged along the radial periphery of the air guide pipe.
Furthermore, one end of the fixed rod, which is fixedly connected with the air guide pipe, is connected with a shock pad, and the working surface of the shock pad is matched with the outer surface of the air guide pipe.
Further, still include mount pad and stand, stand lower extreme and mount pad fixed connection, casing and stand upper portion fixed connection.
The casing is right detect the electroplax with the probe needle provides the installation condition, the probe needle with it is used for detecting the chip performance to detect the electroplax, when detecting the electroplax temperature and rising, through radiator unit is to its forced air cooling, prevents detect the electroplax and keep the high temperature state always. Specifically, the fan of the heat dissipation assembly blows towards the air guide pipe, and the air guide pipe uniformly blows air to the detection electric plate, so that the quick heat dissipation and cooling of the detection electric plate are realized, and the problem that the chip testing accuracy is influenced by the fact that the detection electric plate of the existing chip testing mechanism is in a high-temperature state for a long time is solved.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the transistor chip performance testing mechanism according to the present invention.
Fig. 2 is a cross-sectional view of a first embodiment of the transistor chip performance testing mechanism of the present invention along the direction of the dust cover.
Fig. 3 is a cross-sectional view of a second embodiment of the transistor chip performance testing mechanism of the present invention along the direction of the dust cover.
In the figure, 101-shell, 102-detection electric plate, 103-probe needle, 104-heat dissipation component, 105-fan, 106-air guide pipe, 107-air outlet component, 108-dust cover, 109-air guide cover, 110-air outlet nozzle, 111-connecting frame, 112-dust screen, 113-bracket, 114-magnet, 201-fixing component, 202-fixing rod, 203-shock pad, 301-mounting seat, 302-upright post.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following description will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
First embodiment, referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of the present invention, and fig. 2 is a cross-sectional view of the present invention along a dust cover direction, and includes a housing 101, a detection circuit board 102, a probe 103, a heat dissipation assembly 104, a mounting seat 301, and a stud 302, where a lower end of the stud 302 is fixedly connected to the mounting seat 301, and the housing 101 is fixedly connected to an upper portion of the stud 302. The heat dissipation assembly 104 comprises a fan 105, an air guide pipe 106, an air outlet assembly 107 and a dust cover 108, the air outlet assembly 107 further comprises an air guide sleeve 109 and an air outlet nozzle 110, the dust cover 108 comprises a connecting frame 111 and a dust screen 112, and the connecting frame 111 comprises a bracket 113 and a magnet 114.
For the present embodiment, the detecting electric board 102 is disposed in the housing 101, one end of the detecting pin 103 is electrically connected to the detecting electric board 102, the other end of the detecting pin 103 penetrates through the housing 101, the housing 101 provides a mounting condition for the detecting electric board 102 and the detecting pin 103, and the detecting pin 103 and the detecting electric board 102 are used for detecting chip performance.
The fan 105 of the heat dissipation assembly 104 is disposed at an air inlet of the air guide pipe 106, an air outlet of the air guide pipe 106 is connected with the air outlet assembly 107, the air guide sleeve 109 of the air outlet assembly 107 is fixedly connected with the casing 101, the air guide sleeve 109 is communicated with the air outlet of the air guide pipe 106 through a middle opening, one side of the air guide sleeve 109, which is away from the air outlet of the air guide pipe 106, is connected with the air outlet nozzles 110, the air outlet nozzles 110 are communicated with an inner cavity of the air guide sleeve 109, an air outlet of the air outlet nozzle 110 faces the detection electric plate 102, and when the temperature of the detection electric plate 102 rises, the detection electric plate 102 is cooled by air through the heat dissipation assembly 104, so that the detection electric plate 102 is prevented from being kept at a high temperature state all the time. Specifically, the fan 105 of the heat dissipation assembly 104 blows air into the air guide pipe 106, the air is guided into the air guide sleeve 109 through the air guide pipe 106, and the air guide sleeve 109 uniformly blows the air to the detection electric plate 102 through the air outlet nozzle 110, so that the detection electric plate 102 can quickly dissipate heat and cool, and the problem that the detection electric plate of the existing chip testing mechanism is in a high-temperature state for a long time, and the accuracy of chip testing is affected is solved.
Secondly, an air inlet of the air duct 106 penetrates through the casing 101, and a dust cover 108 for shielding the air inlet is detachably connected to the outside of the casing 101, so that dust in the outside air is prevented from being sucked into the casing 101 by the fan 105, and the aging of the detection circuit board 102 is accelerated. The dust cover 108 is detached and replaced after being used for a period of time, so that the dust cover 108 is prevented from being blocked by dust, and the heat dissipation effect on the detection electric plate 102 is prevented from being influenced.
One side of the connecting frame 111 of the dust cover 108 close to the air inlet is detachably connected with the housing 101, one side of the dust cover 112 and the connecting frame 111 departing from the air inlet are fixedly connected, and the connecting frame 111 is used for installing the dust cover 112 on one side of the housing 101.
The bracket 113 of the connecting frame 111 is axially provided with a channel, an opening of the channel near one end of the air inlet is adsorbed on the housing 101 through a magnet 114, and an opening of the channel far away from one end of the air inlet is fixedly connected with the dust screen 112. The bracket 113 provides a mounting condition for the dust screen 112, and the magnet 114 is attached to the housing 101, which facilitates the mounting and dismounting of the bracket 113 and the housing 101.
When the detection electric plate 102 is used, the fan 105 blows air into the air guide pipe 106, the air is guided into the air guide sleeve 109 through the air guide pipe 106, the air guide sleeve 109 quickly guides the air into the air outlet nozzle 110, and the air outlet nozzle 110 uniformly blows the air to the detection electric plate 102, so that the detection electric plate 102 quickly dissipates heat and cools.
In a second embodiment, referring to fig. 3, fig. 3 is a schematic structural diagram of the present invention, and based on the first embodiment, the transistor chip performance testing mechanism of the present embodiment further includes a fixing component 201, where the fixing component 201 includes a fixing rod 202 and a shock pad 203.
For the present embodiment, the fixing component 201 is disposed between the casing 101 and the air guiding pipe 106, and the fixing component 201 is configured to fix the air guiding pipe 106, so as to prevent the air guiding pipe 106 from shaking when the fan 105 blows air into the air guiding pipe 106.
The fixing rod 202 is fixedly connected with the shell 101 and located in the shell 101, the shock absorption pad 203 is fixedly connected with the fixing rod 202 and located on one side close to the air guide pipe 106, the fixing rod 202 is used for clamping and fixing the air guide pipe 106, the shock absorption pad 203 is a rubber pad, and the shock absorption pad 203 is arranged to prevent the side wall of the air guide pipe 106 from colliding with the fixing rod 202 when the air guide pipe 106 conducts air, so that the side wall of the air guide pipe 106 is damaged.
When the fan is used, the shock absorption pad 203 is abutted to the outer wall of the air guide pipe 106 through the fixing rod 202, so that the air guide pipe 106 is clamped and fixed, and the air guide pipe 106 is prevented from shaking when the fan 105 blows air into the air guide pipe 106.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.
Claims (10)
1. A transistor chip capability test mechanism, includes casing (101), detects electroplax (102) and probe pin (103), detect electroplax (102) set up in casing (101), probe pin (103) one end with detect electroplax (102) electricity and be connected, probe pin (103) other end runs through casing (101), its characterized in that: the detection device is characterized by further comprising a heat dissipation assembly (104), wherein the heat dissipation assembly (104) comprises a fan (105) and an air guide pipe (106), the fan (105) is arranged at an air inlet of the air guide pipe (106), an air outlet of the air guide pipe (106) is arranged in the shell (101) and faces towards the detection electric plate (102), and when the temperature of the detection electric plate (102) rises, the detection electric plate (102) is cooled through air cooling of the heat dissipation assembly (104).
2. The transistor chip performance testing mechanism of claim 1, wherein: an air inlet of the air guide pipe (106) penetrates through the shell (101), and a dust cover (108) used for shielding the air inlet is detachably connected to the outside of the shell (101).
3. The transistor chip performance testing mechanism of claim 2, wherein: dust cover (108) are including link (111) and dust screen (112), link (111) are close to one side of air intake and can dismantle with casing (101) and be connected, dust screen (112) and link (111) deviate from one side fixed connection of air intake.
4. The transistor chip performance testing mechanism of claim 3, wherein: the connecting frame (111) comprises a support (113) and a magnet (114), a channel is axially arranged on the support (113), an opening of the channel, which is close to one end of the air inlet, is connected with the shell (101) through the magnet (114), and an opening of the channel, which is far away from one end of the air inlet, is fixedly connected with the dust screen (112).
5. The transistor chip performance testing mechanism of claim 1 or 2, wherein: the air outlet of the air guide pipe (106) is connected with the air outlet assembly (107), the air outlet assembly (107) comprises a flow guide cover (109) and an air outlet nozzle (110), the flow guide cover (109) is fixedly connected with the shell (101), the flow guide cover (109) is communicated with the air outlet of the air guide pipe (106) through a middle opening, one side, away from the air outlet of the air guide pipe, of the flow guide cover (109) is connected with the air outlet nozzle (110), the air outlet nozzle (110) is communicated with an inner cavity of the flow guide cover (109), and an air outlet of the air outlet nozzle (110) faces towards the detection electric plate (102).
6. The transistor chip performance testing mechanism of claim 1 or 2, wherein: the air guide pipe (106) is arranged in the shell (101), and the air guide pipe (106) is arranged in the shell (101).
7. The transistor chip performance testing mechanism of claim 6, wherein: the fixing assembly (201) comprises a plurality of fixing rods (202), one ends of the fixing rods (202) are fixedly connected with the shell (101), and the other ends of the fixing rods (202) are fixedly connected with the air guide pipe (106).
8. The transistor chip performance testing mechanism of claim 7, wherein: the plurality of fixing rods (202) are uniformly arranged along the radial periphery of the air guide pipe (106).
9. The transistor chip performance testing mechanism of claim 7, wherein: one end of the fixed rod (202) fixedly connected with the air guide pipe (106) is connected with a damping pad (203), and the working surface of the damping pad (203) is matched with the outer surface of the air guide pipe (106).
10. The transistor chip performance testing mechanism of claim 1 or 2, wherein: still include mount pad (301) and stand (302), stand (302) lower extreme and mount pad (301) fixed connection, casing (101) and stand (302) upper portion fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222226245.9U CN218388419U (en) | 2022-08-24 | 2022-08-24 | Transistor chip performance testing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222226245.9U CN218388419U (en) | 2022-08-24 | 2022-08-24 | Transistor chip performance testing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388419U true CN218388419U (en) | 2023-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222226245.9U Active CN218388419U (en) | 2022-08-24 | 2022-08-24 | Transistor chip performance testing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218388419U (en) |
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- 2022-08-24 CN CN202222226245.9U patent/CN218388419U/en active Active
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Address after: 401133 room 208, 2 house, 39 Yonghe Road, Yu Zui Town, Jiangbei District, Chongqing Patentee after: Deep Blue Automotive Technology Co.,Ltd. Address before: 401133 room 208, 2 house, 39 Yonghe Road, Yu Zui Town, Jiangbei District, Chongqing Patentee before: CHONGQING CHANGAN NEW ENERGY AUTOMOBILE TECHNOLOGY Co.,Ltd. |