CN218383946U - Temperature control device and equipment with same - Google Patents

Abstract

The present disclosure relates to a temperature control device, comprising: a first high level source and a first low level source; a first output terminal connected to a first control terminal for the semiconductor thermostat; a first relay selectively providing a first high level or a first low level to the first output terminal; a second high level source and a second low level source; a second output terminal connected to a second control terminal of the semiconductor thermostat; a second relay selectively providing a second high level or a second low level to the second output terminal; a drive circuit module for the first relay and a drive circuit module for the second relay; and a control unit for controlling the driving circuit module for the first relay and the driving circuit module for the second relay according to the temperature measurement value. Furthermore, the present disclosure relates to an apparatus having a temperature control device by which the temperature adjustment performance of the apparatus can be improved, allowing the apparatus to operate stably and reliably.

Description

Temperature control device and equipment with same

Technical Field

The present disclosure relates generally to the field of temperature control technology, and more particularly, to a temperature control device and an apparatus, such as a kiosk, having the temperature control device.

Background

At present, with the popularization of networks and the popularization of electronic payment methods, in industries such as retail and catering, a plurality of self-service terminals which can be operated by customers themselves without assistance of staff, for example, self-service terminals which can be used by customers for ordering food, have been developed. These self-service terminals reduce the expenditure of labor costs, while providing convenience and time savings to the customer.

Kiosks may be placed at a variety of locations. In some cases, the kiosk may be placed indoors (e.g., in a store, etc.). In some cases, the kiosk may be placed outdoors (e.g., outside of a store, beside a road, at a station, etc.). Whether the kiosk is placed indoors or outdoors, stable and reliable operation of the kiosk is desirable. Particularly when the kiosk is placed outdoors, the kiosk may be exposed to more extreme weather conditions, such as rain, high temperature, cold, freezing, and the like.

SUMMERY OF THE UTILITY MODEL

It is therefore an object of the present disclosure to provide a temperature control device and an apparatus, such as a kiosk, having a temperature control device, by means of which the temperature regulation performance of the apparatus can be improved, allowing the apparatus to operate stably and reliably.

According to a first aspect of the present disclosure, there is provided a temperature control device characterized in that: the temperature control device includes: a first high level source and a first low level source; a first output terminal connected to a first control terminal for a semiconductor thermostat; a first relay selectively providing a first high level of a first high level source or a first low level of a first low level source to a first output terminal; a second high level source and a second low level source; a second output connected to a second control terminal for a semiconductor thermostat; a second relay selectively providing a second high level of a second high level source or a second low level of a second low level source to a second output terminal; a drive circuit module for the first relay and a drive circuit module for the second relay; and a control unit configured to control the driving circuit module for the first relay and the driving circuit module for the second relay.

In some embodiments, the temperature control device comprises a driver circuit module, such as a triode driver circuit module, for the fan.

In some embodiments, the temperature control apparatus includes a timing module by which activation of the fan is allowed a predetermined period of time earlier than activation of the semiconductor thermostat and deactivation of the fan is delayed a predetermined period of time than deactivation of the semiconductor thermostat.

In some embodiments, the temperature control device comprises a drive circuit module, such as a triode drive circuit module, for a thermostat of a power supply.

In some embodiments, the power source is a secondary power source in a dual power supply configuration.

In some embodiments, the driver circuit module for the first relay and the driver circuit module for the second relay are each configured as a triode driver circuit.

In some embodiments, the temperature control device comprises a temperature sensor, and the control unit is configured to control the drive circuit module for the first relay and the drive circuit module for the second relay based on a temperature measurement from the temperature sensor.

It should be understood that the corresponding driver circuit module of the present disclosure may employ any driver circuit module known in the art, and is not limited to the presently described embodiment.

It is to be understood that the control unit of the present disclosure may implement its control functions, e.g., control the respective driver circuit modules, in a manner known in the art.

According to a second aspect of the present disclosure, there is provided an apparatus having a temperature control device according to the present disclosure, characterized in that the apparatus comprises a temperature regulating assembly including the semiconductor thermostat and a fan for the semiconductor thermostat.

In some embodiments, the apparatus comprises: a first cavity configured as a first accommodation space of the device; a second cavity configured as a second accommodation space of the device; the temperature adjustment assembly disposed between the first cavity and the second cavity, the temperature adjustment assembly configured to adjust a temperature within the first cavity and/or the second cavity, and the temperature adjustment assembly configured to physically isolate the first cavity from the second cavity.

In some embodiments, the first temperature regulating surface of the semiconductor thermostat faces the first cavity and the second temperature regulating surface of the semiconductor thermostat faces the second cavity.

In some embodiments, the temperature regulating assembly is configured such that the first cavity and the second cavity are sealed with respect to each other.

In some embodiments, the temperature control device is mounted within the second cavity.

In some embodiments, a terminal control module is provided within the first cavity in communicative connection with the temperature control device.

In some embodiments, a primary power source, a secondary power source, and a temperature conditioning device for the secondary power source are provided within the second cavity.

In some embodiments, a receiving mechanism is provided within the first cavity, within which the terminal control module is received.

In some embodiments, an air guide is provided within the first cavity and configured to guide the heated or cooled airflow from the fan to a terminal control module, wherein the air guide is configured as an enclosure for the containment mechanism.

In some embodiments, the first cavity is laterally bounded by a metal plate, on the inner surface of which a thermal barrier layer and/or a reflective film is arranged in each case.

In some embodiments, the device is a kiosk.

Drawings

The present disclosure is explained in more detail below by means of specific embodiments with reference to the attached drawings. The schematic drawings are briefly described as follows:

FIG. 1 is a perspective view of a kiosk according to some embodiments of the present disclosure, wherein a portion of the cover on the back side of the kiosk is removed to expose a first cavity.

FIG. 2 is a first rear view of the kiosk of FIG. 1.

FIG. 3 is a second rear view of the kiosk of FIG. 1.

FIG. 4 is a side view of the kiosk of FIG. 1.

FIG. 5 is a partial perspective view of a kiosk according to some embodiments of the disclosure.

Fig. 6 is a perspective view of the temperature adjustment assembly of fig. 5.

FIG. 7 is a simplified schematic block diagram of a kiosk according to some embodiments of the disclosure.

Fig. 8 is an exemplary block diagram of the temperature control device in fig. 7.

Note that in the embodiments described below, the same reference numerals are used in common between different drawings to denote the same portions or portions having the same functions, and a repetitive description thereof will be omitted. In some cases, similar reference numbers and letters are used to denote similar items, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.

Detailed Description

The present disclosure will now be described with reference to the accompanying drawings, which illustrate several embodiments of the disclosure. It should be understood, however, that the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, the embodiments described below are intended to provide a more complete disclosure of the present disclosure, and to fully convey the scope of the disclosure to those skilled in the art. It is also to be understood that the embodiments disclosed herein can be combined in various ways to provide further additional embodiments.

It is understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present disclosure. All terms (including technical and scientific terms) used herein have the meaning commonly understood by one of ordinary skill in the art unless otherwise defined. Well-known functions or constructions may not be described in detail for brevity and/or clarity.

In this document, spatial relationship terms such as "upper", "lower", "left", "right", "front", "back", "high", "low", and the like may describe one feature's relationship to another feature in the drawings. It will be understood that the terms "spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, features originally described as "below" other features may be described as "above" other features when the device in the figures is inverted. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the relative spatial relationships may be interpreted accordingly.

Herein, the term "a or B" includes "a and B" and "a or B" rather than exclusively including only "a" or only "B" unless otherwise specifically stated.

In this document, the terms "schematic" or "exemplary" mean "serving as an example, instance, or illustration," and not as a "model" that is to be reproduced exactly. Any implementation exemplarily described herein is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, the disclosure is not limited by any expressed or implied theory presented in the preceding technical field, background, utility model content, or detailed description.

In this document, the term "substantially" is intended to encompass any minor variations due to design or manufacturing imperfections, tolerances of the devices or components, environmental influences and/or other factors.

In addition, "first," "second," and like terms may also be used herein for reference purposes only, and thus are not intended to be limiting. For example, the terms "first," "second," and other such numerical terms referring to structures or elements do not imply a sequence or order unless clearly indicated by the context.

The present disclosure relates to an apparatus having a temperature control device, by means of which the temperature regulation performance of the apparatus can be improved, allowing the apparatus to operate stably and reliably. In the specific embodiment, a self-service terminal is taken as an example for description. It should be understood that the devices to which the present disclosure relates may be varied, and may be any device having temperature regulation capabilities, which may include, but are not limited to: self-service terminal, storage device (in the field of thermal storage, corresponding storage device can be integrated with the temperature control device that this disclosure provided), electrical equipment etc..

The present disclosure relates to a self-service terminal which is suitable for not only indoor operation but also outdoor operation. As used herein, the term "outdoor" environment refers to an environment in which there is no housing to protect the kiosk, including, but not limited to, outside buildings such as houses, roadside, at stations, and other open air environments where there is no housing. A kiosk that is "outdoors" may be exposed to more extreme weather conditions, such as rain, high temperatures, cold, freezing, and the like. These extreme climatic conditions place higher demands on the temperature regulation performance and/or the water and dust resistance performance of the self-service terminal. The self-service terminal disclosed by the invention can keep stable and reliable operation in an outdoor environment.

It should be understood that the kiosk of the present disclosure may be used for various purposes (e.g., self-service ordering, self-checkout, self-service ticket printing, self-service registration, self-service consultation, etc.) in various industries (e.g., the retail, catering, hotel, medical, entertainment, or transportation industries). Of course, the application of the self-service terminal is not limited thereto, but may be used in various self-service occasions where no worker operates, and the equipped functional components may also vary depending on the application occasions.

Some embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a kiosk 100 according to some embodiments of the present disclosure. Fig. 2 and 3 are rear views of the kiosk 100 of fig. 1, respectively. FIG. 4 is a side view of the kiosk 100 of FIG. 1.

As shown in fig. 1, the self-service terminal 100 may include an outer housing 5 (e.g., a metal housing) and a cavity formed in the outer housing 5 as an accommodation space, in which various functional components, such as a display screen, a control board, a scanner, a power supply, a sensor, and the like, may be mounted.

The kiosk 100 may include a first housing 10 and a second housing 20 (see FIG. 3) isolated from the first housing 10. In the present embodiment, the first housing 10 may be configured as an upper space of the kiosk 100, and the second housing 20 may be configured as a lower space of the kiosk 100. In fig. 1, a cover cap (e.g., a plastic cap) as a cover is removed, exposing the first cavity 10 of the kiosk 100. It will be appreciated that in normal operation of the kiosk 100, the corresponding cover will enclose the first cavity 10 on the back side.

It should be understood that the first cavity 10 and the second cavity 20 may have other possible arrangements. In some embodiments, the first housing 10 may be configured as a lower level space of the kiosk 100, while the second housing 20 may be configured as an upper level space of the kiosk 100. In other embodiments, the first cavity 10 may be configured as the left floor space of the kiosk 100, while the second cavity 20 may be configured as the right floor space of the kiosk 100.

In order to meet the outdoor operation requirement of the self-service terminal 100, good waterproof and dustproof performance and thermal insulation performance of the corresponding cavity are ensured so as to avoid being affected by extreme weather conditions, such as rain, high temperature, cold, freezing and the like. For waterproofing purposes, the top portion 3 of the kiosk 100 may be configured with a stepped waterproofing structure and a gutter at the side to effectively prevent rainwater from penetrating into the cavity.

Further, an insulating layer (e.g., insulating cotton) and/or a radiation reflective film, such as metallic tinfoil, may be disposed on an inner surface of the outer housing 5 of the kiosk 100 facing the cavity (e.g., the first cavity 10). Thus, in the operational state of the self-service terminal 100, the respective cavity (e.g., the first cavity 10) forms a substantially enclosed insulated cavity.

The present disclosure partitions the self-service terminal 100 into at least two cavities. Different cavities may have different water and dust resistance ratings and/or different insulation ratings. To this end, each cavity may be arranged with different functional components. Typically, different functional components have respective set operating conditions, such as set operating temperature ranges. Once the temperature is outside the set operating temperature range, the corresponding functional component may not perform well or even fail. For this reason, it is desirable that the respective cavities can satisfy the set operating conditions of the respective functional components.

In the present embodiment, in the operational state of the self-service terminal 100, the first cavity 10 may be configured as a substantially closed insulated cavity. That is, the first cavity 10 may have high waterproof and dustproof performance and thermal insulation performance, thereby allowing installation of functional components critical to the operation of the self-service Terminal 100, such as a Terminal Control Module 15 (TCM) and/or a computer Module 16 (also referred to as an android box) within the first cavity 10. In some embodiments, the terminal control module 15 may be configured as or include a printed circuit board on which a control unit, a communication unit, a storage unit, and the like may be integrated. Typically, the terminal control module 15 and/or the computer module 16 have high requirements for operating temperature, and once the operating temperature exceeds a set operating temperature range (e.g., 0 to 40 degrees), the performance of the terminal is affected, thereby affecting the operation of the self-service terminal 100.

In some embodiments, the kiosk 100 may be divided into a three-tier system architecture including application-tier devices, middle-tier devices, and bottom-tier devices. By dividing the system of the self-service terminal 100 into a three-layer architecture and using the terminal control module 15 in the middle layer to perform centralized control on the peripheral devices in the bottom layer, the application layer device can control all the peripheral devices only by matching and communicating with the terminal control module 15 in the middle layer without knowing the specific configuration of the peripheral devices. Thus, the application layer device may more conveniently implement control of the entire kiosk 100. In addition, the self-service terminal 100 can easily change/upgrade the bottom peripheral devices without changing the more complex programs run by the application layer devices, thereby facilitating the operation and maintenance and hardware upgrade of the whole self-service terminal 100.

In some embodiments, terminal control module 15 may control the operation of other functional components within self-service terminal 100, such as a computer module, touch screen, scanner, printing device, microphone, camera, degaussing device, and the like. In some embodiments, the terminal control module 15 may assume the function of supplying power to some functional components. In some embodiments, the terminal control module 15 may have a temperature measurement function.

In some embodiments, in the operational state of the self-service terminal 100, the second cavity 20 may be configured to have high water and dust resistance and thermal insulation properties, allowing for installation of functional components within the second cavity 20 that are critical to the operation of the self-service terminal 100, such as the temperature control device 25, the power supply 60, and the like. In some embodiments, a heat dissipation fan 30 and an air inlet 4 meeting a specific waterproof and dustproof standard may be installed in the second chamber 20, and the second chamber 20 may be configured to be in a negative pressure state, so as to achieve a better heat dissipation effect.

Nevertheless, under some extreme weather conditions, stable and reliable operation of the kiosk 100 may not be guaranteed. For example, some functional components may not work properly in case of high temperature (e.g. outdoor temperature higher than 40 degrees or even 50 degrees) or low temperature (e.g. outdoor temperature lower than-10 degrees, 20 degrees or even 30 degrees).

To allow the kiosk 100 to operate stably and reliably under some extreme weather conditions, the kiosk 100 of the present disclosure is provided with temperature regulation capabilities.

As shown in fig. 1-4, the kiosk 100 may further include a temperature conditioning assembly 35. The temperature regulating assembly 35 may be configured to regulate the temperature within the first cavity 10 and/or the second cavity 20. As an example, when the temperature inside the first chamber 10 is higher than a predetermined temperature threshold due to outdoor hot weather, the temperature adjustment assembly 35 may perform a temperature adjustment strategy according to a preset program and may be configured to reduce the temperature inside the first chamber 10 by: the temperature adjustment assembly 35 may be configured in a cooling mode and deliver cooling air to the first chamber 10 such that the first chamber 10 is in a "refrigerator mode". As an example, when the temperature inside the first cavity 10 is lower than a predetermined temperature threshold due to outdoor low-temperature weather, the temperature adjustment assembly 35 may perform a temperature adjustment strategy according to a preset program and may be configured to increase the temperature inside the first cavity 10 by: the temperature regulating assembly 35 may be configured to heat up and deliver heated air to the first chamber 10 such that the first chamber 10 is in a "warm box mode".

In the current embodiment, the temperature adjustment assembly 35 is disposed as an intermediate layer between the first and second cavities 10 and 20. The temperature adjustment assembly 35 may be configured to physically isolate the first cavity 10 and the second cavity 20 such that the first cavity 10 and the second cavity 20 are sealed with respect to each other.

Referring to fig. 5 and 6, a temperature regulating assembly 35 of the kiosk 100 according to some embodiments of the present disclosure is described.

The temperature regulating assembly 35 may include a semiconductor thermostat 40 or a thermoelectric thermostat (TEC, also sometimes referred to as a cold plate). The semiconductor thermostat 40 is made using the peltier effect of semiconductor materials. When current flows through the TEC, the heat generated by the current is transferred from a first temperature regulated surface of the TEC to an opposing second temperature regulated surface, creating "hot" and "cold" sides on the TEC, thereby creating the heating and cooling effects of the TEC.

The temperature regulating assembly 35 may further include a first fan 31 and/or a first heat sink mounted at a first temperature regulating surface of the semiconductor thermostat 40 and a second fan 32 and/or a second heat sink mounted at a second temperature regulating surface of the semiconductor thermostat 40. In some embodiments, the respective fan 31, 32 may be configured to direct a cooling airflow or a heating airflow towards the respective cavity, accelerating the heating and cooling effect. In some embodiments, the fans 31, 32 and heat sinks on the "hot side" of the TEC may be configured to reduce the temperature of the TEC itself, avoiding damage to the TEC.

As shown in fig. 5, a first temperature-adjusting surface of the semiconductor thermostat 40 and a fan 31 installed at the first temperature-adjusting surface may be disposed toward the first chamber 10 for guiding a cooling air flow or a heating air flow toward the first chamber 10. In order to ensure that critical and temperature sensitive functional components can function properly under some extreme weather conditions, it is advantageous to locate these functional components close to the temperature regulating assembly 35. Advantageously, an air director 50 (see fig. 4) may be added so that the cooling or heating air flow may be directed to critical and temperature sensitive features.

In the current embodiment, the terminal control module 15 and the computer module 16 may be installed in a lower region of the first chamber 10 adjacent to the temperature adjusting assembly 35. As shown in fig. 5, the terminal control module 15 and the computer module 16 may be installed in one housing mechanism 45. The receiving means 45 may be formed in a dustpan shape. The accommodating mechanism 45 may include a base plate at a front side and a side wall bent backward from the base plate. The receiving means 45 may be mounted on the temperature regulating assembly 35 (e.g. the first temperature regulating surface), for example by means of a side wall. The base plate and the side wall of the accommodating mechanism 45 may define an accommodating space, a lower side of which may accommodate the first temperature adjustment surface of the temperature adjustment assembly 35 and the fan 31, and an upper side of which may accommodate the terminal control module 15 and/or the computer module 16. Thus, when the temperature is adjusted, the fan 31 can guide the cooling air flow or the heating air flow toward the terminal control module 15 and/or the computer module 16 in the accommodating mechanism 45, and the temperature adjusting efficiency and effect of the terminal control module 15 and/or the computer module 16 are improved.

It should be understood that the shape of the receiving mechanism 45 may have many possibilities of modification and should not be limited to the present embodiment. In some embodiments, a corresponding air guide 50 (see fig. 4), for example an air guide plate, may be provided at the rear side of the accommodating mechanism 45. The air guide 50 can be configured as an integral or detachable cover of the receiving means 45. The air guide 50 may be configured to stably guide the heated or cooled airflow from the fan 31 to the terminal control module 15 and/or the computer module 16, for example. The provision of the air guide 50 is advantageous in that it can guide the air flow to a predetermined height stably while preventing deterioration of the temperature adjusting effect due to premature sinking of the cool air or turbulence of the air flow. In some embodiments, the containment mechanism 45 may have a narrowing so that the airflow velocity may be accelerated.

Further, it should be understood that other functional components, such as a scanner 46, a printing device, and the like, may also be housed within the housing mechanism 45.

With continued reference to fig. 5 and 6, the thermostat assembly 35 also has a control device 55, for example a control circuit board, for controlling the operating mode of the semiconductor thermostat 40. The control device 55 may have a first control terminal 56 and a second control terminal 57 and controls the operating mode of the semiconductor thermostat 40 based on the levels applied at the first control terminal 56 and the second control terminal 57.

In some embodiments, when a high level is applied to the first control terminal 56 and a low level is applied to the second control terminal 57, the semiconductor thermostat 40 is placed in a first mode of operation, i.e., the first temperature regulating surface of the semiconductor thermostat 40 is in a cooling mode and the second temperature regulating surface of the semiconductor thermostat 40 is in a heating mode.

In some embodiments, when a low level is applied to the first control terminal 56 and a high level is applied to the second control terminal 57, the semiconductor thermostat 40 is placed in the second mode of operation, i.e., the first temperature regulating surface of the semiconductor thermostat 40 is in a heating mode and the second temperature regulating surface of the semiconductor thermostat 40 is in a cooling mode.

In some embodiments, the semiconductor thermostat 40 is placed in a sleep mode in which it is not temperature regulated when a low level is applied on the first control terminal 56 and a low level is applied on the second control terminal 57. It is also possible that the semiconductor thermostat 40 can also be placed in a sleep mode without temperature regulation when a high level is applied at the first control terminal 56 and a high level is applied at the second control terminal 57.

As shown in fig. 5, in the current embodiment, a corresponding control device 55 may be provided at the second temperature adjustment surface of the temperature adjustment assembly 35. A corresponding control means 55 may extend from the second temperature regulation surface into the second cavity 20. The temperature control assembly 35 can have a plurality of (here two) semiconductor thermostats 40 and a corresponding plurality of (here two) control devices 55.

The kiosk 100 of the present disclosure also has a temperature control device 25 (see FIG. 3), the temperature control device 25 being configured to control the operation of the temperature regulating assembly 35. That is, the temperature control device 25 may be configured to control an operation mode (a first operation mode, a second operation mode, or a sleep mode) of the temperature adjustment assembly 35 based on a current temperature value within the first cavity 10 and/or the second cavity 20.

As shown in fig. 3, the temperature control device 25 may be installed in the second chamber 20. Advantageously, the temperature control device 25 can be mounted below the second chamber 20 (as shown in fig. 3) away from the temperature adjustment assembly 35, avoiding interference from the temperature adjustment assembly 35, since the temperature adjustment assembly 35 may affect the operation of the temperature control device 25 when the second temperature adjustment surface is hot or cold.

Next, the kiosk 100 and the temperature control device 25 within the kiosk 100 according to some embodiments of the present disclosure are further described with reference to FIGS. 7 and 8.

As shown in fig. 7, the first chamber 10 is indicated by a first dashed box, and a terminal control module 15 and some exemplary functional components, such as a scanner 46, a computer module 16 and a display 48, are provided in the first chamber 10. The terminal control module 15 may be configured to communicate with these functional components and to control the operation of these functional components, e.g. to supply power to these functional components. Also provided within the first chamber 10 are one or more temperature sensors 61 configured to detect the temperature within the first chamber 10 and communicate with the terminal control module 15 to transmit the detected temperature to the terminal control module 15. In some embodiments, one or more temperature sensors are disposed adjacent to the terminal control module 15 or mounted directly on the printed circuit board of the terminal control module 15 in order to more accurately obtain an operating temperature characteristic of the terminal control module 15.

The second chamber 20 is indicated by a second dashed box, in which second chamber 20 a temperature control means 25 is provided, together with some exemplary functional components, such as a control device 55 for a temperature regulating assembly 35, fans 30, 31, 32, a power supply 60, etc. Also provided within the second cavity 20 are one or more temperature sensors 62 configured to detect a temperature within the second cavity 20 and communicate with the temperature control device 25 to communicate the detected temperature to the temperature control device 25. Furthermore, the temperature control device 25 may be communicatively connected to the terminal control module 15. The temperature control device 25 may acquire the temperature parameter in the first chamber 10 from the terminal control module 15, and may receive a control instruction from the terminal control module 15. The temperature control device 25 may control the operation of some functional components (e.g., the control device 55, the fans 30, 31, 32, the power supply 60) based on control instructions from the terminal control module 15, temperature parameters within the first chamber 10, and/or temperature parameters within the second chamber 20.

In some embodiments, one or more temperature sensors 62 are disposed adjacent to the temperature control device 25 or mounted directly on the temperature control device 25 to more accurately obtain an operating temperature representative of the temperature control device 25. In some embodiments, due to the higher operating temperature requirements of the power supply 60, one or more temperature sensors 62 are disposed adjacent to the power supply 60 to more accurately obtain a representation of the operating temperature of the power supply 60.

In some embodiments, a dual power supply configuration is provided for the kiosk 100 to allow the kiosk 100 to be capable of reliable operation over a wide temperature range. Within the second cavity 20 there may be provided a primary power supply 65, a secondary power supply 66 and a temperature conditioning means 67 assigned to the secondary power supply 66. In some embodiments, the temperature-regulating device 67 can be designed as an electrical heating device. In some embodiments, the temperature control device 67 can be designed as a semiconductor temperature control device.

The primary power source 65 may have a first upper operating temperature threshold and/or a first lower operating temperature threshold, while the secondary power source 66 may have a second upper operating temperature threshold and/or a second lower operating temperature threshold, with the first upper operating temperature threshold being higher than the second upper operating temperature threshold and/or the first lower operating temperature threshold being lower than the second lower operating temperature threshold. That is, the main power supply 65 may have a higher or lower operating temperature, and thus may have a wider operating temperature range.

Under normal operation, the secondary power source 66 may operate normally to power the kiosk 100. However, under some extreme weather conditions, such as temperatures of-30 degrees or-50 degrees, the secondary power source 66 may not operate properly. To avoid the secondary power source 66 from affecting the power supply to the self-service terminal 100, provision may be made for: during the start-up phase of the self-service terminal 100, the main power supply 65 is responsible for the powering of the temperature regulation related functional components, such as the terminal control module 15, the temperature control device 25, the temperature regulating assembly 35, the fans 30, 31, 32, the temperature regulating device 67 for the secondary power supply 66, etc. The temperature control device 25 may determine whether to activate the secondary power source 66 and the temperature regulating device 67 for the secondary power source 66 based on the temperature within the second chamber 20. When the temperature within the second chamber 20 is within the operating temperature range of the secondary power source 66, the secondary power source 66 is activated; when the temperature within the second chamber 20 is outside the operating temperature range of the secondary power source 66, the temperature control device 25 is configured to control the operation of the temperature conditioning device 67 for the secondary power source 66 so as to condition the temperature of the secondary power source 66 until it is within the operating temperature range, and then the secondary power source 66 is activated. In some embodiments, the temperature control device 25 is configured to cause the temperature regulating device 67 to function as a heater when the temperature within the second chamber 20 is below the second lower operating temperature threshold and above the first lower operating temperature threshold, and/or to cause the temperature regulating device 67 to function as a cooler when the temperature within the second chamber 20 is above the second upper operating temperature threshold and below the first upper operating temperature threshold. Thus, the dual power supply configuration in this embodiment not only allows the kiosk 100 to better adapt to outdoor operating environments, but also allows the cost of the kiosk 100 to be significantly reduced, since generally, the price of a power supply operating in a wide temperature range is much higher than that of a power supply operating in a narrow temperature range at the same power.

It should be understood that in a single power supply configuration, a corresponding thermostat 67 may also be provided for the power supply 60 so that the power supply 60 may continue to operate normally. In other embodiments, in a dual-power configuration, corresponding temperature control devices can also be associated with the two power supplies, so that both power supplies can continue to operate normally.

FIG. 8 schematically illustrates the temperature control device 25 within the kiosk 100.

As shown in fig. 8, the temperature control device 25 may comprise a control unit 70, which may be configured to receive a first temperature measurement of the first temperature sensor 61 located within the first cavity 10 and/or a second temperature measurement of the second temperature sensor 62 located within the second cavity 20, and to output a control instruction based on the first temperature measurement and/or the second temperature measurement. Additionally or alternatively, the control unit 70 may be configured to receive communication data from the terminal control module 15 based on the communication port 75, and output a control instruction based on the communication data.

The temperature control device 25 may include: a first high level source VCC providing a first high level and a first low level source GND providing a first low level; a second high level source VCC supplying a second high level and a second low level source GND supplying a second low level; a first output 71 configured to be connected (directly or indirectly) to the first control terminal 56 of the semiconductor thermostat 40; a first relay 81 configured to selectively provide a first high level or a first low level to the first output terminal 71 and in turn to the first control terminal 56 of the semiconductor thermostat 40; a second output terminal 72 configured to be connected (directly or indirectly) to the second control terminal 57 of the semiconductor thermostat 40; a second relay 82 configured to selectively provide a second high level or a second low level to the second output terminal 72 and in turn to the second control terminal 57 of the semiconductor thermostat 40. In the present embodiment, the high-low level source is provided separately for each control terminal of the semiconductor thermostat 40 and the relay is employed to selectively provide the corresponding high-low level, so that the temperature control device 25 can efficiently and reliably control the temperature adjusting component 35, and thus the self-service terminal 100, to efficiently and reliably adjust the temperature.

The temperature control device 25 may include: a first driving circuit module 91 configured to drive the operation states of the first relay 81 and the second relay 82 based on a control instruction received from the control unit 70 such that a first high level or a first low level is supplied to the first output 71 via the first relay 81 and a second high level or a second low level is supplied to the second output 72 via the second relay 82. When the first high level is supplied to the first output terminal 71 and the second low level is supplied to the second output terminal 72, the first temperature adjustment surface of the semiconductor thermostat 40 functions as a cooling surface and the second temperature adjustment surface of the semiconductor thermostat 40 functions as a heating surface, and when the first low level is supplied to the first output terminal 71 and the second high level is supplied to the second output terminal 72, the first temperature adjustment surface of the semiconductor thermostat 40 functions as a heating surface and the second temperature adjustment surface of the semiconductor thermostat 40 functions as a cooling surface.

As shown in fig. 8, the temperature control device 25 may comprise a second drive circuit module 92 configured to drive the operation of the fans 31, 32 of the temperature regulating assembly 35 based on control instructions received from the control unit 70 such that the activation of the fans 31, 32 is earlier than the activation of the semiconductor thermostat 40 by a predetermined period of time and the deactivation of the fans 31, 32 is delayed from the deactivation of the semiconductor thermostat 40 by the predetermined period of time. Thereby ensuring that the temperature regulating assembly 35 is not damaged by continued heating.

Additionally or alternatively, the temperature control device 25 may include a third driver circuit module 93 configured to control operation of the thermostat 67 for the power source (e.g., a secondary power source in a dual power supply configuration) based on control instructions received from the control unit 70, such that the thermostat 67 functions as a heater when the second temperature measurement is below a lower operating temperature threshold of the power source and/or the thermostat 67 functions as a cooler when the second temperature measurement is above an upper operating temperature threshold of the power source.

Additionally or alternatively, the temperature control device 25 may include a fourth driving circuit module 94 configured to activate the fan 30 after the kiosk 100 is powered on, and the second chamber 20 may be configured to be under negative pressure for better heat dissipation due to the greater number of outlets for the fan 30 than the inlets 4.

Although exemplary embodiments of the present disclosure have been described, those skilled in the art will appreciate that numerous changes and modifications may be made to the exemplary embodiments of the present disclosure without materially departing from the spirit and scope of the present disclosure.

Claims (18)

1. Temperature control device, its characterized in that: the temperature control device includes:

a first high level source and a first low level source;

a first output terminal connected to a first control terminal for a semiconductor thermostat;

a first relay selectively providing a first high level of a first high level source or a first low level of a first low level source to a first output terminal;

a second high level source and a second low level source;

a second output connected to a second control terminal for a semiconductor thermostat;

a second relay selectively providing a second high level of a second high level source or a second low level of a second low level source to a second output terminal;

a drive circuit module for the first relay and a drive circuit module for the second relay; and

a control unit configured to control the driving circuit module for the first relay and the driving circuit module for the second relay.

2. The temperature control apparatus according to claim 1, characterized in that: the temperature control device comprises a driving circuit module for the fan.

3. The temperature control apparatus according to claim 2, characterized in that: the temperature control device includes a timing module by which activation of the fan is allowed a predetermined period of time ahead of activation of the semiconductor thermostat and deactivation of the fan is delayed a predetermined period of time from deactivation of the semiconductor thermostat.

4. The temperature control apparatus according to claim 1, characterized in that: the temperature control device comprises a driving circuit module of a temperature adjusting device for a power supply.

5. The temperature control apparatus according to claim 4, wherein: the power supply is a secondary power supply in a dual power supply configuration.

6. The temperature control apparatus according to claim 1, characterized in that: the drive circuit module for the first relay and the drive circuit module for the second relay are each configured as a triode drive circuit.

7. The temperature control apparatus according to claim 1, characterized in that: the temperature control device includes a temperature sensor, and the control unit is configured to control a drive circuit module for a first relay and a drive circuit module for a second relay in accordance with a temperature measurement value from the temperature sensor.

8. Device with a temperature control arrangement, characterized in that the temperature control arrangement is configured as a temperature control arrangement according to one of claims 1 to 7, the device comprising a temperature regulating assembly comprising the semiconductor thermostat and a fan for the semiconductor thermostat.

9. The apparatus with temperature control device according to claim 8, characterized in that the apparatus comprises:

a first cavity configured as a first receiving space of the device;

a second cavity configured as a second receiving space of the device;

the temperature adjustment assembly disposed between the first cavity and the second cavity, the temperature adjustment assembly configured to adjust a temperature within the first cavity and/or the second cavity, and the temperature adjustment assembly configured to physically isolate the first cavity from the second cavity.

10. The apparatus having a temperature control device of claim 9, wherein the first temperature regulating surface of the semiconductor thermostat faces the first cavity and the second temperature regulating surface of the semiconductor thermostat faces the second cavity.

11. The apparatus having a temperature control device of claim 9, wherein the temperature regulation assembly is configured such that the first and second cavities are sealed with respect to each other.

12. The apparatus having a temperature control device of claim 9, wherein the temperature control device is mounted within the second cavity.

13. The apparatus having a temperature control device of claim 12, wherein a terminal control module is provided within the first cavity in communicative connection with the temperature control device.

14. Device with temperature control means according to claim 9, characterized in that a primary power source, a secondary power source and tempering means for the secondary power source are provided in the second chamber.

15. The apparatus having a temperature control device according to claim 13, wherein a housing mechanism is provided in the first cavity, the terminal control module being housed in the housing mechanism.

16. The apparatus having a temperature control device of claim 15, wherein a configuration is provided within the first cavity as an air guide configured to direct a flow of heated or cooled air from a fan to a terminal control module, wherein the air guide is configured as an enclosure of the containment mechanism.

17. Device with temperature control means according to claim 9, characterized in that the first cavity is bounded on the sides by a metal plate on the inner surface of which a heat-insulating layer and/or a reflective film is arranged in each case.

18. The device with temperature control apparatus of claim 8, wherein the device is a kiosk.

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