CN218383053U

CN218383053U - Die convenient for assisting silicon wafer resistivity test

Info

Publication number: CN218383053U
Application number: CN202222365671.0U
Authority: CN
Inventors: 栾国旗
Original assignee: Tianjin Meixin Electronic Technology Co ltd
Current assignee: Tianjin Meixin Electronic Technology Co ltd
Priority date: 2022-09-06
Filing date: 2022-09-06
Publication date: 2023-01-24
Anticipated expiration: 2032-09-06

Abstract

The utility model belongs to the technical field of the silicon chip processing technique and specifically relates to a make things convenient for mould of supplementary silicon chip resistivity test, including resistivity tester, telescopic frame and mould body, resistivity tester upper end is provided with the mould body, sliding connection has splint in the mould body upside, splint bottom middle part fixedly connected with antiskid clamp pad, antiskid clamp pad four corners all is provided with the detection clamping piece, detect clamping piece sliding connection in the splint bottom side, detect clamping piece upper end fixedly connected with third spring, third spring fixed connection is in splint, the splint left and right sides all passes the gag lever post, gag lever post fixed connection is in the mould body left and right sides, the utility model discloses make when fixing the silicon chip body, can also detect it through the five-point test method that accords with international standard, can accurately detect it, can also prevent to examine time measuring because of the silicon chip body removes the influence detection effect.

Description

Die convenient for assisting silicon wafer resistivity test

Technical Field

The utility model relates to a silicon chip processing technology field specifically is a mould of convenient supplementary silicon chip resistivity test.

Background

The silicon chip is a physical quantity which is used for representing the resistance characteristics of various substances, reflects the property of the substances on the current blocking effect, is related to the types of the substances, and is influenced by external factors such as temperature, pressure, magnetic field and the like.

Most silicon chip resistivity testing arrangement on the market, in the testing process, can not assist it through the mould and fix spacingly, can appear in the testing process, the problem of skew is rocked to the silicon chip, leads to influencing the accuracy of testing data to can not conveniently dismantle fast and install the mould, can perhaps break down or when damaged at the mould, can't play the problem of supplementary effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a make things convenient for mould of supplementary silicon chip resistivity test to propose the silicon chip that can't be to the testing process among the above-mentioned background of solution, carry out supplementary fixed problem.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a convenient mould of supplementary silicon chip resistivity test, includes resistivity tester, telescopic support frame and mould body, resistivity tester upper end is provided with the mould body, sliding connection has splint on the mould body upside, splint bottom middle part fixedly connected with antiskid clamping pad, antiskid clamping pad four corners all is provided with the detection clamping piece, detect clamping piece sliding connection in splint bottom side, detect clamping piece upper end fixedly connected with third spring, third spring fixed connection is in splint, the splint left and right sides all passes the gag lever post, gag lever post fixed connection is in the mould body left and right sides, the gag lever post upper end has cup jointed first spring, and gag lever post and first spring fixed connection, first spring fixed connection is in the splint upper end left and right sides.

Preferably, this internal fixedly connected with of mould detects the piece, it has the silicon chip body to detect the laminating of piece upper end, the laminating of silicon chip body upper end has anti-skidding clamp pad, silicon chip body four corners all slides and has the detection clamping piece.

Preferably, the middle part of the upper end of the clamping plate is fixedly connected with a pull ring.

Preferably, the equal fixedly connected with fixed plate in both ends upside about the mould body, fixed plate bottom fixedly connected with conducting block, the conducting block slides in the telescopic bracket upside, fixedly connected with antithetical couplet electric piece in the telescopic bracket upside, the laminating of antithetical couplet electric piece upper end has the conducting block, the fixed plate laminating is in the telescopic bracket upper end.

Preferably, the upper side of the telescopic support frame is sleeved with a second spring, the second spring is fixedly connected with the telescopic support frame, and the telescopic support frame is fixedly connected to the left side and the right side of the upper end of the resistivity tester.

Preferably, the middle of the bottom end of the die body is rotatably connected with a hook, the hook is arranged on the inner side of a hook ring, and the hook ring is fixedly connected to the middle of the upper end of the resistivity tester.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, through first spring, third spring, the detection clamping piece that sets up, detection piece and splint for when fixing the silicon chip body, can also detect it through the five-point test method that accords with international standard, can accurately detect it, can also prevent to detect time measuring because of the silicon chip body removes the influence detection effect.

2. The utility model discloses in, through telescopic bracket, second spring, hook and the shackle that sets up for the convenience is installed fast and is dismantled the mould body, and the convenience can in time be maintained and be changed it when mould body is inside breaks down or damages.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure at A of FIG. 1 according to the present invention;

FIG. 3 is a schematic view of the installation structure of the telescopic supporting frame of the present invention;

fig. 4 is a schematic view of the top-view installation structure of the clamping plate of the present invention.

In the figure: 1-resistivity tester, 2-telescopic support frame, 3-mould body, 4-pull ring, 5-first spring, 6-limiting rod, 7-fixing plate, 8-second spring, 9-anti-skid clamping pad, 10-clamping plate, 11-detection clamping plate, 12-hook, 13-hook ring, 14-detection piece, 15-silicon chip body, 16-conductive block, 17-electric connection piece and 18-third spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution:

a mould convenient for assisting silicon wafer resistivity test comprises a resistivity tester 1, a telescopic support frame 2 and a mould body 3, wherein the upper end of the resistivity tester 1 is provided with the mould body 3, a clamping plate 10 is slidably connected to the upper side of the mould body 3, an anti-slip clamping pad 9 is fixedly connected to the middle part of the bottom end of the clamping plate 10, four corners of the anti-slip clamping pad 9 are respectively provided with a detection clamping piece 11, the detection clamping pieces 11 are slidably connected into the bottom side of the clamping plate 10, the upper end of each detection clamping piece 11 is fixedly connected with a third spring 18, the third springs 18 are fixedly connected into the clamping plate 10, a limiting rod 6 penetrates through the left side and the right side of the clamping plate 10, the limiting rods 6 are fixedly connected into the left side and the right side of the mould body 3, the upper end of each limiting rod 6 is sleeved with a first spring 5, the limiting rods 6 are fixedly connected with the first springs 5, the first springs 5 are fixedly connected onto the left side and the right side of the upper end of the clamping plate 10, so that the detection clamping pieces 11 can detect and fix the silicon wafer body 15; the detection piece 14 is fixedly connected in the die body 3, the silicon wafer body 15 is attached to the upper end of the detection piece 14, the anti-skidding clamp pads 9 are attached to the upper end of the silicon wafer body 15, the detection clamping pieces 11 are arranged at four corners of the silicon wafer body 15 in a sliding mode, and the silicon wafer body 15 can be prevented from shaking in the detection process through the anti-skidding clamp pads 9; the middle part of the upper end of the clamping plate 10 is fixedly connected with a pull ring 4, and the clamping plate 10 can be pulled through the pull ring 4.

Specifically, as shown in fig. 1, 2 and 3, the upper sides of the left and right ends of the mold body 3 are fixedly connected with a fixing plate 7, the bottom end of the fixing plate 7 is fixedly connected with a conductive block 16, the conductive block 16 slides in the upper side of the telescopic support frame 2, the upper side of the telescopic support frame 2 is fixedly connected with a coupling piece 17, the upper end of the coupling piece 17 is attached with the conductive block 16, the fixing plate 7 is attached to the upper end of the telescopic support frame 2, and the mold body 3 and the resistivity tester 1 can be in circuit connection through the conductive block 16 and the coupling piece 17; the upper side of the telescopic support frame 2 is sleeved with a second spring 8, the second spring 8 is fixedly connected with the telescopic support frame 2, the telescopic support frame 2 is fixedly connected to the left side and the right side of the upper end of the resistivity tester 1, and the die body 3 can be supported through the telescopic support frame 2; the middle of the bottom end of the die body 3 is rotatably connected with a hook 12, the hook 12 is arranged on the inner side of a hook ring 13, the hook ring 13 is fixedly connected to the middle of the upper end of the resistivity tester 1, and the die body 3 can be fixed through the hook 12 and the hook ring 13.

The working process is as follows: the utility model discloses supply power through external power source when using, when needs use the device, stimulate pull ring 4 earlier, make pull ring 4 drive splint 10 and rise, later place silicon chip body 15 on detecting piece 14, slowly loosen pull ring 4 this moment, can make splint 10 slowly descend through first spring 5 and gag lever post 6, detection clamping piece 11 on the splint 10 can cooperate third spring 18 and silicon chip body 15 four corners to contact, rethread

antiskid clamp pad

9, 15 stability of silicon chip body after pressing from both sides tightly increases, just this moment can be through detecting clamping piece 11 and detecting piece 14, carry out five-point test to silicon chip body 15, when needs maintain clearance to mould body 3, can press mould body 3 earlier, rotate hook 12 again, make hook 12 and shackle 13 separation, later pulling mould body 3, make in conductive block 16 leave telescopic support frame 2, the dismantlement to mould body 3 has just been accomplished this moment, when needs install mould body 3, can insert telescopic support frame 2 earlier with conductive block 16, later press down mould body 3, reach behind hook 12, the hook 13 rotates hook 12, this moment the hook 13, make the hook 12 rotate hook 13, this moment the cooperation of fixing support frame with second mould body, this moment, the cooperation of second flexible spring 3.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a make things convenient for mould of supplementary silicon chip resistivity test, includes resistivity tester (1), telescopic bracket (2) and mould body (3), its characterized in that: resistivity tester (1) upper end is provided with mould body (3), sliding connection has splint (10) in mould body (3) upside, splint (10) bottom middle part fixedly connected with antiskid clamp pad (9), antiskid clamp pad (9) four corners all is provided with detects clamping piece (11), detect clamping piece (11) sliding connection in splint (10) bottom side, detect clamping piece (11) upper end fixedly connected with third spring (18), third spring (18) fixed connection is in splint (10), splint (10) are controlled both sides and are all passed gag lever post (6), gag lever post (6) fixed connection is in mould body (3) left and right sides, first spring (5) have been cup jointed to gag lever post (6) upper end, and gag lever post (6) and first spring (5) fixed connection, first spring (5) fixed connection is in splint (10) upper end left and right sides.

2. The die for facilitating auxiliary silicon wafer resistivity test according to claim 1, wherein: fixedly connected with detects piece (14) in mould body (3), it has silicon chip body (15) to detect piece (14) upper end laminating, the laminating of silicon chip body (15) upper end has anti-skidding clamp pad (9), silicon chip body (15) four corners all slides and has detects clamping piece (11).

3. The die of claim 1 for facilitating assisted silicon wafer resistivity testing, wherein: the middle part of the upper end of the clamping plate (10) is fixedly connected with a pull ring (4).

4. The die of claim 1 for facilitating assisted silicon wafer resistivity testing, wherein: the utility model discloses a mould, including mould body (3), fixed plate (7) bottom fixedly connected with conducting block (16), conducting block (16) slide in telescopic bracket (2) upside, fixedly connected with allies oneself with electric piece (17) in telescopic bracket (2) upside, it has conducting block (16) to laminate on allies oneself with electric piece (17), fixed plate (7) laminate is in telescopic bracket (2) upper end.

5. The die of claim 1 for facilitating assisted silicon wafer resistivity testing, wherein: the upper side of the telescopic support frame (2) is sleeved with a second spring (8), the second spring (8) is fixedly connected with the telescopic support frame (2), and the telescopic support frame (2) is fixedly connected to the left side and the right side of the upper end of the resistivity tester (1).

6. The die for facilitating auxiliary silicon wafer resistivity test according to claim 1, wherein: the mould body (3) bottom middle part rotates and is connected with hook (12), hook (12) set up at shackle (13) inboard, shackle (13) fixed connection is in resistivity tester (1) upper end middle part.