CN218362666U - Cleaver for bonding of bonding wire - Google Patents
Cleaver for bonding of bonding wire Download PDFInfo
- Publication number
- CN218362666U CN218362666U CN202222735919.8U CN202222735919U CN218362666U CN 218362666 U CN218362666 U CN 218362666U CN 202222735919 U CN202222735919 U CN 202222735919U CN 218362666 U CN218362666 U CN 218362666U
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- bonding
- bonding wire
- passageway
- wedge
- chopper
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Abstract
The utility model relates to a bonded silk bonding is with chopper solves the bonding silk easy slip when current bonded silk bonding is with chopper bonding, and the not good problem of ultrasonic conduction effect simultaneously. Including the cutter arbor, locate the wedge main part of cutter arbor bottom, and locate the passageway that is used for pushing down the bonding wire of wedge main part bottom, the passageway is the V-arrangement groove, the bottom in V-arrangement groove is equipped with the arcwall face, be equipped with the recess of perpendicular to passageway in the passageway, the V-arrangement groove can let the bonding wire fix a position fast, the recess of the perpendicular to passageway of the bottom in V-arrangement groove can increase the frictional force between chopper and the bonding wire, can make ultrasonic energy conduct the surface of bonding wire and electric or electronic parts better simultaneously, under the same circumstances of welding parameter, increase the adhesive force of bonding wire, promote the tensile strength and the reliability of solder joint.
Description
Technical Field
The utility model relates to a bonded wire bonds and uses chopper.
Background
The wedge-shaped chopper is a wedge-shaped chopper, a bonding wire can be bonded on a contact surface of an electric or electronic component through ultrasonic excitation so as to generate certain electric connection between the bonding wire and the contact surface, the bottom of the existing wedge-shaped chopper is provided with a channel for pressing the bonding wire, ultrasonic is transmitted to the bonding wire through the chopper for bonding, the existing chopper only presses the bonding wire through a smooth channel so that the bonding wire is easy to move, in addition, the ultrasonic transmission effect is poor, and poor welding between the bonding wire and the bonding surface is caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problem that when the existing bonding wire is bonded, the bonding wire is easy to slide and the ultrasonic conduction effect is not good.
For solving the problem of the utility model, the technical proposal adopted is that: the utility model discloses a cleaver is used in bonding wire bonding is including the cutter arbor, locates the wedge main part of cutter arbor bottom to and locate the passageway that is used for pushing down the bonding wire of wedge main part bottom, the passageway be the V-arrangement groove, the bottom in V-arrangement groove is equipped with the arcwall face, the passageway in be equipped with the recess of perpendicular to passageway.
Right the utility model discloses do further limited technical scheme and include:
the cross section of the groove is an arc chamfer.
The bottom end of the wedge-shaped main body is provided with planes corresponding to two sides of the V-shaped groove respectively.
And two ends of the channel are provided with semicircular chamfers, and the range of the semicircular chamfers is between R0.025 mm and R0.559mm.
The outer surface of the wedge-shaped main body is coated with a polycrystalline diamond coating, and the thickness of the coating is 5um to 8 um.
The side surface inclination angle of the wedge-shaped main body is 5-15 degrees.
The cutter bar is a tungsten steel cutter bar, and the length of the cutter bar is 63.5-70mm.
Through the technical scheme, the beneficial effects of the utility model are that: the utility model discloses a chopper for bonding wire bonding is including the cutter arbor, locate the wedge main part of cutter arbor bottom, and locate the passageway that is used for pushing down the bonding wire of wedge main part bottom, the passageway is the V-arrangement groove, the bottom in V-arrangement groove is equipped with the arcwall face, be equipped with the recess of perpendicular to passageway in the passageway, the V-arrangement groove can let the bonding wire fix a position fast, the recess of the perpendicular to passageway of the bottom in V-arrangement groove can increase the frictional force between chopper and the bonding wire, can make ultrasonic energy can conduct the surface of bonding wire and electric or electronic parts better simultaneously, under the condition that welding parameter is the same, increase the adhesive force of bonding wire, promote the tensile strength and the reliability of solder joint.
Drawings
Fig. 1 is a schematic view of a three-dimensional structure of a cleaver for bonding a bonding wire according to the present invention.
Fig. 2 is a schematic view of a three-dimensional structure of a cleaver for bonding a bonding wire according to the present invention.
Detailed Description
The structure of the present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1 and 2, the utility model discloses a chopper for bonding wire bonding is including cutter arbor 1, locates the wedge main part 2 of cutter arbor bottom to and locate the passageway 3 that is used for pushing down the bonding wire of wedge main part bottom, the passageway is the V-arrangement groove, the bottom in V-arrangement groove is equipped with the arcwall face, the passageway in be equipped with the recess 4 of perpendicular to passageway. The bonding wire can be a copper wire or an aluminum wire. The V-shaped groove can enable a bonding wire to be positioned quickly, the groove perpendicular to the channel at the bottom of the V-shaped groove can increase the friction force between the riving knife and the bonding wire, meanwhile, the energy of ultrasonic waves can be better conducted to the surfaces of the bonding wire and an electric or electronic component, the adhesive force of a bonding wire is increased under the condition that welding parameters are the same, and the tensile strength and the reliability of a welding spot are improved.
In this embodiment, the cross-section of the groove is an arc chamfer. The energy of the ultrasonic wave can be better conducted to the surfaces of the bonding wire and the electric or electronic component.
In this embodiment, the bottom end of the wedge-shaped main body 2 is provided with a plane 5 corresponding to two sides of the V-shaped groove respectively. The positioning of the riving knife is convenient, and the clamping is also convenient.
In this embodiment, the channel 3 is provided with semicircular chamfers 31 at both ends, and the semicircular chamfers range from R0.025 mm to R0.559mm. A semicircular transition zone is formed in front of and behind the welding point, so that the strength of the welding point is ensured, and meanwhile, the broken line treatment at the welding point is facilitated.
In the embodiment, the outer surface of the wedge-shaped main body is coated with the polycrystalline diamond coating, the thickness of the coating ranges from 5um to 8um, and the service life of a product can be prolonged by 20% -30%.
In this embodiment, the wedge-shaped body 2 has a side inclination 21 of 5 to 15 degrees. Is convenient for observing the condition of the processing surface and is beneficial to the enhancement of the ultrasonic energy at the tool tip
In the embodiment, the cutter bar is a tungsten steel cutter bar, the length of the cutter bar is 63.5-70mm, the diameter of the cutter bar is matched with the frequency of most ultrasonic waves used in bonding, and the cutter bar has proper strength.
While the present invention has been described in detail and with reference to the accompanying drawings, it is not to be understood as limited by the scope of the invention. Various modifications and changes may be made by those skilled in the art without inventive work within the scope of the present invention as described in the claims.
Claims (7)
1. The utility model provides a bonded wire is cleaver for bonding, includes the cutter arbor, locates the wedge main part of cutter arbor bottom to and locate the passageway that is used for pushing down the bonded wire of wedge main part bottom, its characterized in that: the channel is a V-shaped groove, an arc-shaped surface is arranged at the bottom of the V-shaped groove, and a groove perpendicular to the channel is arranged in the channel.
2. A bond wire bonding riving knife as claimed in claim 1 wherein: the cross section of the groove is an arc chamfer.
3. A bond wire bonding riving knife as claimed in claim 1 wherein: the bottom end of the wedge-shaped main body is provided with planes corresponding to two sides of the V-shaped groove respectively.
4. A bond wire bonding riving knife as claimed in claim 1 wherein: and semicircular chamfers are arranged at two ends of the channel, and the range of the semicircular chamfers is between R0.025 mm and R0.559mm.
5. A bond wire bonding riving knife as claimed in claim 1 wherein: the outer surface of the wedge-shaped main body is coated with a polycrystalline diamond coating, and the thickness of the coating is 5um to 8 um.
6. A bond wire bonding riving knife as claimed in claim 1 wherein: the side surface inclination angle of the wedge-shaped main body is 5-15 degrees.
7. A bond wire bonding riving knife as claimed in claim 1 wherein: the cutter bar is a tungsten steel cutter bar, and the length of the cutter bar is 63.5-70mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222735919.8U CN218362666U (en) | 2022-10-18 | 2022-10-18 | Cleaver for bonding of bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222735919.8U CN218362666U (en) | 2022-10-18 | 2022-10-18 | Cleaver for bonding of bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218362666U true CN218362666U (en) | 2023-01-24 |
Family
ID=84931201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222735919.8U Active CN218362666U (en) | 2022-10-18 | 2022-10-18 | Cleaver for bonding of bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218362666U (en) |
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2022
- 2022-10-18 CN CN202222735919.8U patent/CN218362666U/en active Active
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