CN218352997U - Fin structure - Google Patents

Abstract

The utility model provides a fin structure, set up inside a shell of an electron device, and set up in a heating element top. The fin structure comprises a body and a through hole. The body has a long plate-shaped structure and extends along a first direction. The through hole penetrates through the body and has a substantially trapezoidal profile. The through hole and the heating element do not overlap when viewed along a second direction perpendicular to the first direction.

Description

Fin structure

[ technical field ] A method for producing a semiconductor device

The present invention relates to a fin structure, and more particularly to a fin structure with a through hole.

[ background ] A method for producing a semiconductor device

With the development of technology, electronic devices (e.g., notebook computers) are becoming thinner and lighter. In addition to the thinning of the solid body, in order to further achieve the thinning of the visual appearance, the design of the bevel angle is often selected at the edge of the shape. However, setting the bevel angle means that the arrangement space of the internal element is compressed. In order to meet safety regulations (prevent foreign materials from falling into the system) and maintain the design of the appearance, it is often selected to reduce the size of the fan and to extend the length of the heat dissipation fins in response to the compression of the arrangement space. Longer fins have a greater fluid impedance to the fluid (e.g., airflow) passing through them, resulting in a reduced heat dissipation efficiency. Therefore, how to improve the longer fins to achieve better heat dissipation efficiency has become an important issue.

[ Utility model ] A method for manufacturing a semiconductor device

The utility model provides a fin structure, set up inside a shell of an electron device, and set up in a heating element top. The fin structure comprises a body and a through hole. The body has a long plate-shaped structure and extends along a first direction. The through hole penetrates through the body and has a substantially trapezoidal outline. The through hole and the heating element do not overlap when viewed along a second direction perpendicular to the first direction.

In some embodiments, the body has: an upper surface, a lower surface, an air outlet surface and an inclined side surface. The lower surface is located on an opposite side of the upper surface. The air outlet surface is connected with the upper surface and the lower surface. The inclined side surface is connected with the upper surface and the lower surface and is positioned on the opposite side of the air outlet surface. The upper surface is parallel to an upper inner surface of the casing, and the lower surface is parallel to a lower inner surface of the casing.

In some embodiments, the upper surface extends in a horizontal direction, and the lower surface of the body partially extends obliquely with respect to the horizontal direction.

In some embodiments, other portions of the lower surface of the body extend in a horizontal direction.

In some embodiments, the air exit surface is perpendicular to the upper surface.

In some embodiments, the angled side surfaces are neither parallel nor perpendicular to the upper or lower surfaces.

In some embodiments, the via has: an upper edge, a lower edge, an air outlet edge and an inclined side edge. The upper edge corresponds to the upper surface. The lower edge corresponds to the lower surface and is located on the opposite side of the upper edge. The air outlet edge corresponds to the air outlet surface and is connected with the upper edge and the lower edge. The inclined side edge corresponds to the inclined side surface, connects the upper edge and the lower edge, and is located on the opposite side of the air outlet edge. The upper edge extends parallel to the upper surface.

In some embodiments, the upper edge and the lower edge both extend in a horizontal direction.

In some embodiments, the wind outlet edge extends parallel to the wind outlet surface and perpendicular to the upper edge and the lower edge.

In some embodiments, the beveled edge extends parallel to the beveled surface, neither parallel nor perpendicular to the upper edge or the lower edge.

[ description of the drawings ]

The various aspects of the invention are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that the various features are not necessarily drawn to scale in accordance with standard practice in the industry. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of presentation.

Fig. 1 is a top view of an electronic device, according to some embodiments of the present invention.

Fig. 2 isbase:Sub>A cross-sectional view of an electronic device along linebase:Sub>A-base:Sub>A of fig. 1 according to some embodiments of the invention.

Fig. 3 illustrates an enlarged cross-sectional view of a fin structure, according to some embodiments of the present invention.

Fig. 4A illustrates a cross-sectional view of a fin structure, according to some alternative embodiments of the present invention.

Fig. 4B illustrates a cross-sectional view of a fin structure according to further alternative embodiments of the present invention.

Fig. 4C illustrates a cross-sectional view of a fin structure according to yet other alternative embodiments of the present invention.

Fig. 4D illustrates a cross-sectional view of a fin structure, according to some embodiments of the present invention.

Fig. 5 illustrates temperature results measured on electronic devices configured with different fin structures according to some embodiments of the present invention.

[ notation ] to show

1000 electronic device

1100 casing

1101 upper inner surface

1102 lower inner surface

1103 point of upper measurement

1104 lower measurement Point

1110: air outlet

1200 fin structure

1210 main body

1211 upper surface

1212 lower surface

1213 air-out surface

1214-inclined side surface

1214' side surface

1260,1260': via hole

1261 upper edge

1262 lower edge

1263 air outlet edge

1264 oblique side edges

1300 heating element

1400 parts of fan

1450 gas flow

1500: circuit component

1600: battery

A-A is line segment

D1 first direction

D2 the second direction

D3 third Direction

[ detailed description ] embodiments

The following disclosure provides many different embodiments, or examples, and describes specific examples of various components and arrangements to implement various features of the present invention. For example, if the specification states a first feature formed "on" or "over" a second feature, that embodiment may include the first feature in direct contact with the second feature, or that embodiment may include additional features formed between the first and second features, such that the first and second features are not in direct contact. In addition, in different examples of the present invention, repeated symbols or letters may be used.

Spatially related terms of relativity may be used in embodiments, such as: the terms "below" and "above" are used for convenience in describing the relationship between elements or features and other elements or features in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be oriented in different orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Please refer to fig. 1 first. Fig. 1 illustrates a top view of an electronic device 1000, according to some embodiments of the present invention. The electronic device 1000 mainly includes a housing 1100, a fin structure 1200, a plurality of heat generating elements 1300, a fan 1400, a circuit member 1500, and a battery 1600. In fig. 1, the casing 1100 covering the upper part is omitted for clarity of the arrangement inside the electronic device 1000. In some embodiments, the electronic device 1000 may be a notebook computer, particularly a slim notebook computer.

Please refer to fig. 1 and fig. 2 together. Fig. 2 illustratesbase:Sub>A cross-sectional view of an electronic device 1000 along linebase:Sub>A-base:Sub>A of fig. 1, according to some embodiments of the invention. The housing 1100 has an upper and a lower pieces, and the fin structure 1200, the heating element 1300, the fan 1400, the circuit member 1500 and the battery 1600 are disposed between the two pieces of the housing 1100. The fan 1400 sends an airflow 1450 to dissipate heat generated by the heating element 1300, and the airflow 1450 passes through the fin structure 1200 to further improve the heat dissipation efficiency. The circuit member 1500 and the battery 1600 are used to supply power and/or control signals to the overall electronic device 1000. In the embodiment shown in fig. 1 and 2, the arrangement of the circuit member 1500 and the battery 1600 is only for example, is not limited to the arrangement position disclosed in the drawings, and can be adjusted according to the user's needs.

In the embodiment shown in fig. 1 and fig. 2, the casing 1100 of the electronic device 1000 has an air outlet 1110, and the air outlet 1110 is located at a position close to the outer side of the casing 1100. The airflow 1450 supplied by the fan 1400 is discharged to the outside of the cabinet 1100 through the outlet 1110. In order to improve the overall heat dissipation efficiency of the electronic device 1000, the fin structure 1200 is disposed inside the casing 1100 and located between the fan 1400 and the air outlet 1110, so that the air flow 1450 sent by the fan 1400 can pass through the fin structure 1200 and then exit through the air outlet 1110. In an embodiment according to the present invention, the fin structure 1200 is disposed above at least a portion of the heat generating element 1300.

As shown in fig. 2, in order to further reduce the thickness of the electronic device 1000, the housing 1100 near the outlet 1110 has a bevel shape, for example: the lower cabinet 1100 is extended obliquely upward with respect to the horizontal direction (third direction D3). In such an embodiment, the heat generating elements 1300 may be disposed in the region where the casing 1100 has not started to tilt upward, and the fin structures 1200 may be disposed above the heat generating elements 1300 and extend into the space between the fan 1400 and the air outlet 1110 in the casing 1100. In order to prevent foreign matters or dust from entering the electronic device 1000, the fin structure 1200 has a corresponding shape according to the shape change of the casing 1100, and is filled in the space between the fan 1400 and the air outlet 1110. The configuration of the fin structure 1200 will be described in detail below with reference to fig. 3.

Please refer to fig. 3. Fig. 3 illustrates an enlarged cross-sectional view of a fin structure 1200, according to some embodiments of the present invention. The fin structure 1200 includes a body 1210 and a through hole 1260. The body 1210 has a long plate-like structure extending along a first direction D1 (see fig. 1). In some embodiments, the length of the body 1210 extending along the first direction D1 is only slightly less than the length of the casing 1100 extending along the first direction D1 for achieving the optimal heat dissipation effect. The through hole 1260 penetrates the body 1210, i.e., the through hole 1260 extends along the first direction D1 by a length equal to a length of the body 1210 along the first direction D1. In the embodiment of the present invention, the through hole 1260 does not overlap with any of the heat generating elements 1300 when viewed along the second direction D2.

The main body 1210 has an upper surface 1211, a lower surface 1212, an air outlet surface 1213, and an inclined side surface 1214. The upper surface 1211 is parallel to an upper inner surface 1101 of the casing 1100, i.e., the upper surface 1211 extends substantially along the horizontal direction (the third direction D3). The lower surface 1212 is located on the opposite side of the upper surface 1211 and is parallel to a lower inner surface 1102 of the casing 1100. In detail, the lower surface 1212 has a corresponding shape according to the shape change of the lower inner surface 1102. As shown in fig. 3, in a portion corresponding to the lower inner surface 1102 extending obliquely upward with respect to the horizontal direction (the third direction D3), the lower surface 1212 of the body 1210 also extends obliquely upward, and in a portion corresponding to the lower inner surface 1102 still extending parallel to the horizontal direction (a portion located below the heat generating element 1300), the lower surface 1212 of the body 1210 extends parallel to the horizontal direction. That is, the lower surface 1212 of the body 1210 partially extends obliquely with respect to the horizontal direction and partially extends in the horizontal direction.

The air outlet surface 1213 is connected to the upper surface 1211 and the lower surface 1212, corresponds to the air outlet 1110, and substantially extends along the second direction D2. Thus, as shown in fig. 3, air outlet surface 1213 is perpendicular to upper surface 1211. The inclined side surface 1214 connects the upper surface 1211 and the lower surface 1212, faces the fan 1400, and is located on the opposite side of the air outlet surface 1213. As shown in fig. 3, the inclined side surface 1214 is not parallel nor perpendicular to the upper surface 1211 or the lower surface 1212, but extends obliquely with respect to the horizontal direction (the third direction D3), but the inclination of the inclined side surface 1214 is different from the inclination of a portion of the lower surface 1212. In some other embodiments, the slope of the sloped side surface 1214 and the portion of the lower surface 1212 may be the same. By providing the sloped side surfaces 1214, the heat dissipation efficiency of the fin structure 1200 can be enhanced, as will be discussed below with reference to fig. 5.

The through hole 1260 has a substantially trapezoidal profile. The bore 1260 has an upper edge 1261, a lower edge 1262, a venting edge 1263, and a sloped side edge 1264. The upper edge 1261 corresponds to the upper surface 1211 of the body 1210, is parallel to the upper surface 1211, and extends in the horizontal direction (the third direction D3) like the upper surface 1211. Lower edge 1262 corresponds to lower surface 1212 of body 1210 and is located on the opposite side of upper edge 1261. However, the lower edge 1262 does not vary in slope with the lower surface 1212, but rather extends in a horizontal direction (third direction D3), parallel to the upper edge 1261.

The air outlet edge 1263 corresponds to the air outlet surface 1213 of the main body 1210 and connects the upper edge 1261 and the lower edge 1262. In some embodiments, the wind outlet edge 1263 extends parallel to the wind outlet surface 1213, i.e., in the second direction D2. Thus, the outlet edge 1263 is perpendicular to the upper edge 1261 and the lower edge 1262. The inclined side edge 1264 corresponds to the inclined side surface 1214 of the body 1210, connects the upper edge 1261 and the lower edge 1262, and is located at the opposite side of the air outlet edge 1263. In some embodiments, the sloped side edge 1264 extends parallel to the sloped side surface 1214, i.e., obliquely with respect to the horizontal direction (third direction D3), non-parallel and non-perpendicular to the upper edge 1261 or the lower edge 1262.

As described above, the through hole 1260 does not overlap with the heat generating element 1300 as viewed along the second direction D2. In other words, in the third direction D3, the joint point of the lower edge 1262 and the inclined side edge 1264 does not exceed the projected position of the heat generating element 1300. It should be noted that the dimensions of the through-hole 1260 illustrated in FIG. 3 are merely examples and do not represent actual relative sizes of the through-hole 1260. Instead, the vias 1260 in the fin structure 1200 may be larger and better. Under the condition that the through hole 1260 and the heat generating element 1300 do not overlap in the second direction D2, the closer the upper edge 1261 is to the upper surface 1211, the closer the lower edge 1262 is to the lower surface 1212, the closer the air outlet edge 1263 is to the air outlet surface 1213, and the closer the inclined side edge 1264 is to the inclined side surface 1214, the better the heat dissipation efficiency of the fin structure 1200 is.

Please refer to fig. 4A to 4D and fig. 5. Fig. 4A-4D illustrate cross-sectional views of fin structures according to various alternative embodiments of the present invention. Fig. 5 illustrates temperature measurements taken on an electronic device 1000 configured with different fin structures of fig. 4A-4D, according to some embodiments of the present invention. Embodiment 1 in fig. 5 corresponds to fig. 4A, embodiment 2 corresponds to fig. 4B, embodiment 3 corresponds to fig. 4C, and embodiment 4 corresponds to fig. 4D. The case temperature 1 in fig. 5 refers to the temperature measured at the upper measurement point 1103 shown in fig. 3, and the case temperature 2 refers to the temperature measured at the lower measurement point 1104 shown in fig. 3.

Fig. 4A illustrates an embodiment 1 of a fin structure having a body 1210 with sloped side surfaces 1214 but without a through hole 1260. The lack of the vias 1260 results in a higher system impedance of the fin structure, compared to other embodiments, in which embodiment 1 is the highest in either processor temperature or chassis temperature.

Fig. 4B shows the fin structure embodiment 2, in which the body 1210 has through holes 1260', but does not have the inclined side surface 1214, but has only the side surface 1214' parallel to the air outlet 1110 and the fan 1400. It should be noted that in this embodiment, the through hole 1260 'also does not have a sloped side edge, but only a vertical edge parallel to the side surface 1214'. Embodiment 2 with the through holes 1260' performed well at the case temperature, but the processor temperature was still high.

Figure 4C illustrates an embodiment of a fin structure 3 having a body 1210 with angled side surfaces 1214 but without a through hole 1260. The inclined-side surface 1214 of embodiment 3 has a different slope from the inclined-side surface 1214 of embodiment 1. The sloped side surface 1214 of example 3 has a larger slope, i.e., more fin volume is reduced, thereby reducing the system impedance. However, in this embodiment, since the volume of the fins above the heating element 1300 is too small, the temperature of the processor is greatly increased, and only the temperature of the case is better than that of embodiment 1.

Fin structure embodiment 4 illustrated in fig. 4D is the same as fin structure 1200 illustrated in fig. 3, with the body having a sloped side surface 1214 with a through hole 1260 including a sloped side edge 1264. As is apparent from the test results of fig. 5, example 4 performed best at either processor temperature or case temperature. It can be seen that the arrangement of the inclined side surface 1214 and the through hole 1260 has a significant effect on improving heat dissipation efficiency, and in addition to reducing the temperature of the components in the electronic device 1000, the temperature of the surface of the casing 1100 can also be reduced.

In summary, by disposing the inclined side surface 1214 of the body 1210 and the through hole 1260 on the fin structure 1200, the fluid impedance of the air flow 1450 when passing through the fin structure 1200 can be reduced, and the heat in the electronic device 1000 can be effectively transferred to the outside, so as to improve the heat dissipation efficiency, and reduce the temperature of the components inside the electronic device 1000 and the temperature of the surface of the external casing 1100.

Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather, the process, machine, manufacture, composition of matter, means, methods and steps described in connection with the embodiment illustrated herein will be understood to one skilled in the art from the disclosure to which this invention pertains. Accordingly, the scope of the present invention includes the processes, machines, manufacture, compositions of matter, means, methods, or steps described above. Moreover, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of embodiments and individual claims.

Claims (10)

1. A fin structure, which is disposed inside a housing of an electronic device and above a heat generating element, includes:

a body having a long plate-like structure extending along a first direction; and

a through hole penetrating the body and having a substantially trapezoidal profile;

wherein, observing along a second direction perpendicular to the first direction, the through hole is not overlapped with the heating element.

2. The fin structure of claim 1, wherein the body has:

an upper surface;

a lower surface located on an opposite side of the upper surface;

an air outlet surface connecting the upper surface and the lower surface; and

the inclined side surface is connected with the upper surface and the lower surface and is positioned on the opposite side of the air outlet surface;

the upper surface is parallel to an upper inner surface of the casing, and the lower surface is parallel to a lower inner surface of the casing.

3. The fin structure of claim 2, wherein the upper surface extends along a horizontal direction, and the lower surface of the body partially extends obliquely relative to the horizontal direction.

4. The fin structure of claim 3, wherein other portions of the lower surface of the body extend along the horizontal direction.

5. The fin structure of claim 2, wherein the air outlet surface is perpendicular to the upper surface.

6. The fin structure of claim 2, wherein the angled side surfaces are neither parallel nor perpendicular to the upper surface or the lower surface.

7. The fin structure of claim 2, wherein the via has:

an upper edge corresponding to the upper surface;

a lower edge corresponding to the lower surface and located on an opposite side of the upper edge;

an air outlet edge corresponding to the air outlet surface and connecting the upper edge and the lower edge; and

the inclined side edge corresponds to the inclined side surface, is connected with the upper edge and the lower edge and is positioned on the opposite side of the air outlet edge;

wherein the upper edge extends parallel to the upper surface.

8. The fin structure of claim 7, wherein the upper edge and the lower edge both extend along a horizontal direction.

9. The fin structure of claim 7, wherein the outlet edge extends parallel to the outlet surface and perpendicular to the upper edge and the lower edge.

10. The fin structure of claim 7, wherein the angled side edge extends parallel to the angled side surface, non-parallel and non-perpendicular to the upper edge or the lower edge.

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