CN218344561U

CN218344561U - Upset extracting device

Info

Publication number: CN218344561U
Application number: CN202222776475.2U
Authority: CN
Inventors: 楚智勇; 陈滨; 姚永华
Original assignee: Shenzhen Wofute Automation Equipment Co ltd
Current assignee: Shenzhen Wofute Automation Equipment Co ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-01-20
Anticipated expiration: 2032-10-20

Abstract

The utility model discloses the application relates to the material snatchs equipment, especially relates to a upset extracting device, including frame and feeding agencies, wherein, set firmly the transport material area of conveying semiconductor part in the frame, feeding agencies connects in the frame, and feeding agencies is used for snatching the semiconductor part to the transport material area. The material taking mechanism comprises a first overturning assembly and a material taking assembly, and a rotating shaft of the material taking assembly is connected to the first overturning assembly, so that the material taking assembly can grab the semiconductor parts on the conveying material belt in an overturning mode.

Description

Upset extracting device

Technical Field

The utility model discloses the application relates to the material snatchs equipment, especially relates to a upset extracting device.

Background

At present, automatic production gradually becomes an irreplaceable existence in the manufacturing industry, wherein, in the process of producing semiconductor parts, a suction nozzle is generally adopted to adsorb the semiconductor parts for taking materials and transporting. When the semiconductor component needs to be changed in the placement state after being transported, it is difficult for the suction nozzle to stably take the semiconductor component after changing the placement state.

Aiming at the related technology, the situation that the stability of the semiconductor part in the material taking process is poor in the related technology exists.

SUMMERY OF THE UTILITY MODEL

In order to improve the stability of semiconductor part material taking process, this application provides a upset extracting device.

The utility model provides an upset extracting device, includes frame and extracting mechanism, the conveyer belt that has set firmly the conveying semiconductor part in the frame, extracting mechanism connect in the frame, extracting mechanism includes first upset subassembly and gets the material subassembly, it connects in to get material subassembly pivot in first upset subassembly.

Through adopting above-mentioned technical scheme, get the material subassembly and rotate the back through first upset subassembly, carry out the mode of transporting in laminating transport material area and transport the material to improve the stability of whole extracting device at the material of getting in-process.

Optionally, the turnover device further comprises an installation assembly, wherein the first turnover assembly penetrates through the installation assembly, and the installation assembly is connected to the rack in a sliding manner.

Through adopting above-mentioned technical scheme, first upset subassembly and feeding agencies can the adjusting position for feeding position in feeding agencies laminating transport material area is got the material.

Optionally, a guide assembly is arranged on the frame, and the mounting assembly is connected to the guide assembly.

Through adopting above-mentioned technical scheme, the direction subassembly can lead to the installation component to maintain the motion stability of installation component, and then improve the stability to semiconductor parts fortune material.

Optionally, the material taking device further comprises a limiting assembly, the limiting assembly is connected to the mounting assembly, and the material taking assembly is located within the range of the limiting assembly in the rotating process.

Through adopting above-mentioned technical scheme, get the material subassembly between spacing subassembly's interval to the work of getting the material is accurately realized.

Optionally, the limiting assembly includes a first limiting member and a second limiting member, one side of the first limiting member and one side of the second limiting member are disposed on the same plane, and a length direction of the first limiting member is perpendicular to a length direction of the second limiting member.

Through adopting above-mentioned technical scheme, mutually perpendicular between first locating part and the second locating part to make the angle of getting the upset of material subassembly at every turn be 90, thereby be convenient for get the material, moreover, the turned angle is the same at every turn, maintains good transportation stability.

Optionally, the material taking assembly comprises a first material taking part and a second material taking part, a space is formed between the first material taking part and the second material taking part, and the space is used for placing the semiconductor parts.

Through adopting above-mentioned technical scheme, when interval laminating semiconductor part set up, thereby can stably snatch the condition that semiconductor part dropped.

Optionally, the material taking assembly further comprises a material taking installation member, and the first material taking member and the second material taking member are both connected to the material taking installation member; the material taking mechanism further comprises a second overturning assembly, and the material taking mounting part is connected with the second overturning assembly in a rotating mode.

Through adopting above-mentioned technical scheme, carry out the secondary upset to getting the material installed part through second upset subassembly to make and get the accurate unloading position of placing in the transport material area of material subassembly.

Optionally, the material taking mechanism further comprises a control assembly, the control assembly is connected to the material taking mounting part, and the control assembly is used for controlling the material taking mounting part to be far away from the rack.

Through adopting above-mentioned technical scheme, the control assembly can control and get the material installed part at operating condition and non-operating condition to be convenient for maintain and inspect.

In summary, the present application includes at least one of the following beneficial technical effects:

1. after the material taking assembly rotates through the first overturning assembly, the material is conveyed in a conveying mode of attaching and conveying the material belt, so that the stability of the whole material taking device in the material taking process is improved;

2. the first overturning assembly and the material taking mechanism can adjust positions, so that the material taking mechanism is attached to the blanking position of the conveying material belt to take materials;

3. carry out the secondary upset through second upset subassembly to getting the material installed part to make and get the accurate unloading position of placing in transport material area of material subassembly.

Drawings

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application;

fig. 2 is an exploded view of the structure of the embodiment of the present application.

Description of reference numerals: 1. a frame; 11. conveying the material belt; 2. a material taking mechanism; 21. a first flipping component; 211. a first flipping drive; 212. a first flip output; 213. a first flip connector; 22. a material taking assembly; 221. taking a material from the mounting part; 222. a first material taking part; 223. a second material taking part; 23. a second flipping component; 231. a second flipping drive; 232. a second flip output; 233. a second flip connector; 3. mounting the component; 31. mounting a driving piece; 32. installing a connecting piece; 33. mounting a base; 4. a guide assembly; 41. a guide post; 42. a guide connection member; 5. a control component; 51. controlling the driving member; 52. a control output member; 53. a control connection; 6. a limiting component; 61. a first limit piece; 62. a second limiting member.

Detailed Description

The present application is described in further detail below with reference to fig. 1-2.

The application example discloses upset extracting device.

Referring to fig. 1 and 2, the turnover material taking device comprises a rack 1 and a material taking mechanism 2, wherein a conveying material belt 11 for conveying semiconductor parts is fixedly arranged on the rack 1, the material taking mechanism 2 is connected to the rack 1, and the material taking mechanism 2 is used for grabbing the semiconductor parts on the conveying material belt 11. The material taking mechanism 2 comprises a first overturning component 21 and a material taking component 22, and a rotating shaft of the material taking component 22 is connected to the first overturning component 21, so that the material taking component 22 can grab the semiconductor parts on the conveyor belt 11 in an overturning manner.

Referring to fig. 1 and fig. 2, in order to facilitate the material taking mechanism 2 to attach the semiconductor parts on the conveyor belt 11, in this embodiment, the material taking mechanism further includes an installation component 3, the installation component 3 is connected to the material taking mechanism 2, and the installation component 3 is used for driving the material taking mechanism 2 to enable the material taking mechanism 2 to be located at the discharging position of the conveyor belt 11.

Referring to fig. 1 and 2, the mounting assembly 3 includes a mounting driving member 31, a mounting connecting member 32 and a mounting base 33, wherein the mounting driving member 31 is fixedly connected to the frame 1 by bolts, an output end of the mounting driving member 31 is connected to the mounting connecting member 32, and the mounting connecting member 32 is connected to the mounting base 33 by bolts. The material extracting mechanism 2 is connected to the mounting base 33 so that the material extracting mechanism 2 is driven to move horizontally by the mounting driving member 31.

Referring to fig. 1 and 2, in order to provide the material taking mechanism 2 for guiding, in this embodiment, the material taking mechanism further includes a guiding assembly 4, the guiding assembly 4 is disposed on the frame 1, the guiding assembly 4 includes a guiding post 41 and a guiding connecting member 42, wherein the guiding post 41 is fixedly disposed on the frame 1, the guiding post 41 is disposed through the guiding connecting member 42, and the guiding connecting member 42 is connected to the mounting base 33 through a bolt.

Referring to fig. 1 and 2, the material taking mechanism 2 includes a first reversing assembly 21 and a material taking assembly 22, wherein the first reversing assembly 21 is connected to the material taking assembly 22, the first reversing assembly 21 is used for driving the material taking assembly 22 to reverse, and the first reversing assembly 21 includes a first reversing driving member 211, a first reversing output member 212 and a first reversing connecting member 213. Wherein, the first turnover driving member 211 adopts a servo motor, thereby forming an accurate turnover function. The output end of the first flip driving member 211 is connected to the first flip output member 212, the first flip output member 212 is disposed through the mounting base 33, the first flip output member 212 is pivotally connected to the first flip connecting member 213, and the first flip connecting member 213 is connected to the material taking assembly 22, so that the first flip driving member 211 drives the material taking assembly 22 to rotate.

Referring to fig. 1 and 2, in order to control the rotation range of the material taking assembly 22, in the present embodiment, the material taking assembly further includes a limiting assembly 6, the limiting assembly 6 is disposed on one side of the mounting base 33, one side of the first flip output member 212 protrudes out of one side of the mounting base 33, and the limiting assembly 6 includes a first limiting member 61 and a second limiting member 62; the first flip output element 212 is pressed against one side of the first limiting element 61 or one side of the second limiting element 62 during the rotation process. The longitudinal direction of the first stopper 61 is perpendicular to the longitudinal direction of the second stopper 62.

Referring to fig. 1 and 2, the material taking assembly 22 includes a material taking mounting member 221, a first material taking member 222 and a second material taking member 223, wherein the material taking mounting member 221 is fixedly connected to the first flip connector 213 through a bolt, the first material taking member 222 is connected to the material taking mounting member 221, the second material taking member 223 is connected to the material taking mounting member 221, one side of the first material taking member 222 and one side of the second material taking member 223 have a space, and the space is used for placing a semiconductor component.

Referring to fig. 1 and 2, in order to more precisely grasp the semiconductor component, in the present embodiment, the material taking mechanism 2 further includes a second flipping module 23, the second flipping module 23 is connected to the material taking and mounting member 221, and the second flipping module 23 is configured to rotate the material taking and mounting member 221, so as to realize flipping in a small range.

Referring to fig. 1 and 2, the second flipping module 23 includes a second flipping driving element 231, a second flipping output element 232, and a second flipping connecting element 233, wherein the second flipping driving element 231 is fixedly disposed at one side of the material taking mounting element 221, an output end of the second flipping driving element 231 is connected to the second flipping output element 232, the second flipping connecting element 233 is connected to the second flipping connecting element 233, the second flipping connecting element 233 is rotatably connected to the material taking mounting element 221, and the second flipping connecting element 233 is inserted into the material taking mounting element 221.

Referring to fig. 1 and 2, in order to further stabilize the material taking, in this embodiment, three sets of second material taking members 223 are provided, and the three sets of second material taking members 223 are fixedly connected to the second turnover connecting member 233.

Referring to fig. 1 and 2, in order to facilitate the maintenance and the division of the working state, in the present embodiment, a control assembly 5 is further included, wherein the control assembly 5 is connected to the first flipping link 213. The control assembly 5 comprises a control driving member 51, a control output member 52 and a control connecting member 53, wherein the control driving member 51 adopts an air cylinder, the output end of the control driving member 51 is connected to the control output member 52, the control output member 52 is connected to the control connecting member 53, and the control connecting member 53 is connected to the material taking mounting member 221. Also, the control drive 51 is vertically disposed so that the control drive 51 can actuate the take off mounting member 221 in a direction away from the first tumble link 213. When it is desired to operate, the control drive 51 actuates movement of the take off mounting member 221 after the control drive 51 has been flipped over by the first flip link 213.

The implementation principle of the embodiment of the application is as follows: the utility model provides an upset extracting device, includes frame 1 and extracting mechanism 2, wherein, has set firmly the conveyer belt 11 of conveying semiconductor part on the frame 1, and extracting mechanism 2 connects in frame 1, and extracting mechanism 2 is used for snatching semiconductor part to conveyer belt 11. The material taking mechanism 2 comprises a first overturning component 21 and a material taking component 22, and a rotating shaft of the material taking component 22 is connected to the first overturning component 21, so that the material taking component 22 can grab the semiconductor parts on the conveyor belt 11 in an overturning manner.

The above are preferred embodiments of the present application, and the scope of protection of the present application is not limited thereto, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides an upset extracting device, its characterized in that includes frame (1) and extracting mechanism (2), the conveyer material area (11) of conveying semiconductor part have set firmly on frame (1), extracting mechanism (2) connect in frame (1), extracting mechanism (2) include first upset subassembly (21) and get material subassembly (22), get material subassembly (22) pivot connect in first upset subassembly (21).

2. An overturned material-extracting apparatus according to claim 1, further comprising a mounting assembly (3), wherein the first overturned assembly (21) is arranged through the mounting assembly (3), and the mounting assembly (3) is slidably connected to the frame (1).

3. An inverted material extracting apparatus as claimed in claim 2, wherein the frame (1) is provided with a guide assembly (4), and the mounting assembly (3) is connected to the guide assembly (4).

4. An inverted material extracting apparatus according to claim 2, further comprising a limiting assembly (6), wherein the limiting assembly (6) is connected to the mounting assembly (3), and the material extracting assembly (22) is located within an interval range of the limiting assembly (6) during rotation.

5. The inverted material taking device according to claim 4, wherein the limiting component (6) comprises a first limiting member (61) and a second limiting member (62), one side of the first limiting member (61) and one side of the second limiting member (62) are disposed on the same plane, and the length direction of the first limiting member (61) is perpendicular to the length direction of the second limiting member (62).

6. An inverted material extracting apparatus as claimed in claim 1, wherein the material extracting assembly (22) comprises a first material extracting member (222) and a second material extracting member (223), the first material extracting member (222) and the second material extracting member (223) have a space therebetween, and the space is used for placing the semiconductor parts.

7. An inverted material extracting apparatus as claimed in claim 6, wherein the material extracting assembly (22) further comprises a material extracting mounting member (221), the first material extracting member (222) and the second material extracting member (223) are both connected to the material extracting mounting member (221); the material taking mechanism (2) further comprises a second overturning assembly (23), and the material taking mounting part (221) is connected with the second overturning assembly (23) in a rotating mode.

8. An inverted take off device as claimed in claim 7, wherein the take off mechanism (2) further comprises a control assembly (5), the control assembly (5) being connected to the take off mounting (221), the control assembly (5) being for controlling the take off mounting (221) away from the frame (1).