CN218336620U - Reflow soldering device for SMT (surface mount technology) chip processing - Google Patents
Reflow soldering device for SMT (surface mount technology) chip processing Download PDFInfo
- Publication number
- CN218336620U CN218336620U CN202221504848.4U CN202221504848U CN218336620U CN 218336620 U CN218336620 U CN 218336620U CN 202221504848 U CN202221504848 U CN 202221504848U CN 218336620 U CN218336620 U CN 218336620U
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- Prior art keywords
- reflow soldering
- air
- chamber
- refrigerating unit
- processing
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- 238000005476 soldering Methods 0.000 title claims abstract description 43
- 238000005516 engineering process Methods 0.000 title description 2
- 238000001816 cooling Methods 0.000 claims abstract description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000000746 purification Methods 0.000 claims abstract description 24
- 238000001179 sorption measurement Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 10
- 229910052799 carbon Inorganic materials 0.000 abstract description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 238000003466 welding Methods 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 206010053615 Thermal burn Diseases 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a SMT paster processing reflow soldering device, the device comprises a device case, device incasement one side is provided with the reflow soldering process chamber, a side end face in reflow soldering process chamber is provided with a plurality of air inlets, and is a plurality of the tail end of air inlet combination of meeting is provided with the air intake fill, the outside of air intake fill and the lateral part in the reflow soldering process chamber are provided with the purification cooling chamber, terminal surface combination is provided with the active carbon adsorption board about the purification cooling intracavity, keep away from the terminal surface of air intake fill on the active carbon adsorption board and be provided with the air exhauster at purification cooling intracavity wall, the end of giving vent to anger of air exhauster is provided with the connecting pipe, the end of connecting pipe is provided with refrigerating unit, refrigerating unit's output is provided with defeated pipe, the end of defeated pipe meets and is provided with a plurality of gas outlets. The utility model discloses carry out quick cooling treatment to the SMT paster that has processed, adsorb the processing to harmful gas in the heat air in the course of working simultaneously.
Description
Technical Field
The utility model relates to a relevant welding set technical field of SMT paster processing specifically is a SMT paster processing reflow soldering device.
Background
At present, "CN 213694346U" discloses "an apply to two paster hybrid reflow soldering device of SMT of cell-phone, including nitrogen cylinder and nitrogen cylinder valve, nitrogen cylinder bottom installation nitrogen valve, nitrogen cylinder valve have the nitrogen gas heating cabin through nitrogen gas union coupling, the welding cabin is installed to nitrogen gas heating cabin bottom, nitrogen gas heating cabin internally mounted has nitrogen gas heating resistance wire", it adopts two nitrogen gas injection valve designs from top to bottom, the nitrogen gas injection valve is all equipped with at both ends about the SMT paster, once weld and accomplish SMT paster both ends circuit welding simultaneously, need not secondary welding, promote welding efficiency, promote welding quality.
However, generally do not have cooling body in the above-mentioned practicality, the SMT paster temperature after reflow soldering stove welding is too high, can scald one's hand when taking, causes the staff injury, and in the reflow soldering in-process, harmful gas can directly be discharged in the hot air of production, pollutes the atmospheric environment, unsatisfied environmental protection's emission requirement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a SMT paster processing reflow soldering device to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a SMT paster processing reflow soldering device, includes the device case, device incasement one side is provided with the reflow soldering process chamber, a side end face in reflow soldering process chamber is provided with a plurality of air inlets, and is a plurality of the tail end of air inlet meets the combination and is provided with the air intake fill, the outside of air intake fill and be provided with the purification cooling chamber at the lateral part in reflow soldering process chamber, the terminal surface combination is provided with activated carbon adsorption plate about the purification cooling intracavity, keep away from the terminal surface of air intake fill on the activated carbon adsorption plate and be provided with the air exhauster at purification cooling intracavity wall, the end of giving vent to anger of air exhauster is provided with the connecting pipe, the end of connecting pipe is provided with refrigerating unit, refrigerating unit's output is provided with defeated pipe, the chamber wall that the one end of defeated pipe runs through the purification cooling chamber extends to the outside of device case and communicates with each other with the inside in reflow soldering process chamber, the end looks of nearly defeated pipe in reflow soldering process chamber is provided with a plurality of gas outlets.
Preferably, the refrigerating unit comprises a compressor, a condenser, an expansion valve and an evaporator.
Preferably, the outer part of the refrigerating unit and the outer end face of the device box are provided with radiating fins.
Preferably, a section of the delivery pipe close to the refrigerating unit is provided with a control valve.
Preferably, the upper and lower ends of the activated carbon adsorption plate are provided with chutes, the chutes are internally provided with two sliders, and the two sliders are respectively arranged on the upper and lower end faces in the purification and cooling cavity.
Preferably, a first box door and a second box door are respectively arranged outside the purification cooling cavity and the reflow soldering processing cavity and on the outer end face of the device box.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model is provided with the exhaust fan in the purifying and cooling cavity and the sliding combined active carbon adsorption plate, under the action of the exhaust fan, the heat air generated by the processing treatment in the reflow soldering processing cavity can be directly sucked into the purifying and cooling cavity, and then under the action of the sliding combined active carbon adsorption plate, the harmful gas in the heat air is filtered, so that the exhausted air meets the environmental protection emission requirement;
2. the utility model discloses still set up the refrigerating unit of installing in purifying and cooling cavity simultaneously, under the cooperation of air exhauster, refrigerating unit and defeated pipe, can send into the heat air that filtration was handled to reflow soldering processing intracavity through defeated pipe, in time cools off the SMT paster after the butt welding, avoids SMT paster high temperature, prevents to scald the staff when taking.
Drawings
FIG. 1 is a sectional view of the whole main view of the present invention;
FIG. 2 is a view of the overall appearance of the present invention;
fig. 3 is an enlarged view of a structure a in fig. 1 according to the present invention.
In the figure: 1. a device case; 2. reflow soldering the processing chamber; 3. an air inlet; 4. an air inlet hopper; 5. a purification cooling chamber; 6. an activated carbon adsorption plate; 7. an exhaust fan; 8. connecting pipes; 9. a refrigeration unit; 10. conveying the pipe; 11. an air outlet; 12. a heat dissipating fin; 13. a control valve; 14. a chute; 15. a slider; 16. a first door; 17. a second door.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a SMT paster processing reflow soldering device, including device case 1, one side is equipped with reflow soldering processing chamber 2 in the device case 1, a plurality of air inlets 3 are installed to reflow soldering processing chamber 2's a side end face fluting, the tail end of a plurality of air inlets 3 meets the composite set and installs air intake hopper 4, air intake hopper 4's outside and be equipped with purification cooling chamber 5 at reflow soldering processing chamber 2's lateral part, terminal surface composite slidable mounting has active carbon adsorption plate 6 about in the purification cooling chamber 5, keep away from the terminal surface of air intake hopper 4 on the active carbon adsorption plate 6 and install air exhauster 7 at purification cooling chamber 5 inner wall screw, air outlet end grafting fixed mounting of air exhauster 7 has connecting pipe 8, refrigerating unit 9 is installed in the terminal grafting of connecting pipe 8, defeated tub 10 is installed in the grafting of output of refrigerating unit 9, the chamber wall that the one end of defeated tub 10 runs through purification cooling chamber 5 extends to the outside of device case 1 and communicates with each other with the inside of reflow soldering processing chamber 2, a plurality of gas outlets 11 are installed to the terminal of nearly defeated tub 10 in reflow soldering processing chamber 2.
The refrigerating unit 9 comprises a compressor, a condenser, an expansion valve and an evaporator; a heat radiating fin 12 is detachably mounted outside the refrigerating unit 9 and on the outer end face of the device box 1 through screws; a section of the delivery pipe 10 close to the refrigerating unit 9 is provided with a control valve 13; the upper end and the lower end of the activated carbon adsorption plate 6 are provided with sliding chutes 14, the sliding chutes 14 are internally provided with two sliding blocks 15, and the two sliding blocks 15 are respectively welded and arranged on the upper end surface and the lower end surface in the purification cooling cavity 5; a first box door 16 and a second box door 17 are respectively and rotatably arranged outside the purifying and cooling cavity 5 and the reflow soldering processing cavity 2 on the outer end face of the device box 1.
The working principle is as follows: the utility model discloses a when using, through carrying out normal SMT paster reflow soldering operation in-process in reflow soldering processing chamber 2, the hot air of production can be under the effect of air exhauster 7, let in the purification cooling chamber 5 with hot air via a plurality of air inlets 3 and air intake fill 4, switch-on refrigerating unit 9 power this moment, the hot air that gets into in the purification cooling chamber 5 can filter the absorption under the effect of active carbon adsorption plate 6, later can continue to let in another cavity of the spaced of active carbon adsorption plate 6, under the effect of refrigerating unit 9, refrigerate fast, and open the control valve 13 of defeated pipe 10, the air after with cooling purification lets in the SMT paster that has already processed in reflow soldering processing chamber 2 via a plurality of gas outlets 11 that meet and carries out cooling treatment, and has the operation is simple, high durability and convenient use, the advantage of excellent in use effect.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a SMT paster processing reflow soldering device, includes device case (1), its characterized in that: one side is provided with reflow soldering processing chamber (2) in device case (1), a side end face of reflow soldering processing chamber (2) is provided with a plurality of air inlets (3), and is a plurality of the tail end of air inlet (3) meets the combination and is provided with air intake fill (4), air intake fill (4) outside and be provided with purification cooling chamber (5) at the lateral part of reflow soldering processing chamber (2), the terminal surface combination is provided with activated carbon adsorption board (6) about in purification cooling chamber (5), keep away from air intake fill (4) terminal surface on activated carbon adsorption board (6) and be provided with air exhauster (7) at purification cooling chamber (5) inner wall, the end of giving vent to anger of air exhauster (7) is provided with even pipe (8), the end of even pipe (8) is provided with refrigerating unit (9), the output of refrigerating unit (9) is provided with defeated pipe (10), the one end of defeated pipe (10) runs through the chamber wall that purification cooling chamber (5) and extends to the outside of device case (1) and communicates with each other with the inside of reflow soldering processing chamber (2), the gas outlet that nearly defeated pipe (10) meets in reflow soldering processing chamber (2).
2. An SMT chip processing reflow soldering apparatus according to claim 1, wherein: the refrigerating unit (9) comprises a compressor, a condenser, an expansion valve and an evaporator.
3. An SMT chip processing reflow soldering apparatus according to claim 1, wherein: and heat radiating fins (12) are arranged outside the refrigerating unit (9) and on the outer end face of the device box (1).
4. An SMT chip processing reflow soldering apparatus according to claim 1, wherein: and a section of the delivery pipe (10) close to the refrigerating unit (9) is provided with a control valve (13).
5. An SMT chip processing reflow soldering apparatus according to claim 1, wherein: the upper and lower ends of the activated carbon adsorption plate (6) are provided with sliding grooves (14), sliding blocks (15) are arranged in the sliding grooves (14), the number of the sliding blocks (15) is two, and the sliding blocks (15) are arranged on the upper and lower end faces in the purification and cooling cavity (5) respectively.
6. An SMT chip processing reflow soldering apparatus according to claim 1, wherein: and a first box door (16) and a second box door (17) are respectively arranged outside the purification cooling cavity (5) and the reflow soldering processing cavity (2) and on the outer end face of the device box (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221504848.4U CN218336620U (en) | 2022-06-15 | 2022-06-15 | Reflow soldering device for SMT (surface mount technology) chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221504848.4U CN218336620U (en) | 2022-06-15 | 2022-06-15 | Reflow soldering device for SMT (surface mount technology) chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336620U true CN218336620U (en) | 2023-01-17 |
Family
ID=84867489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221504848.4U Expired - Fee Related CN218336620U (en) | 2022-06-15 | 2022-06-15 | Reflow soldering device for SMT (surface mount technology) chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336620U (en) |
-
2022
- 2022-06-15 CN CN202221504848.4U patent/CN218336620U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230117 |