CN218336424U - Bone voiceprint vibration sensor - Google Patents
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- CN218336424U CN218336424U CN202222695544.7U CN202222695544U CN218336424U CN 218336424 U CN218336424 U CN 218336424U CN 202222695544 U CN202222695544 U CN 202222695544U CN 218336424 U CN218336424 U CN 218336424U
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Abstract
The utility model discloses a bone voiceprint vibration sensor, include: the adapter plate is arranged on the first surface of the substrate, and an adapter circuit is arranged on the adapter plate; the vibrating diaphragm is arranged on one side of the adapter plate, which is far away from the substrate, and comprises an edge area and a central area; the vibrating diaphragm comprises a flexible insulating layer, a first connecting circuit and a first capacitor polar plate, wherein the first connecting circuit and the first capacitor polar plate are arranged in the flexible insulating layer; the ASIC chip arranged on the first surface of the substrate is provided with a second capacitor plate on the surface far away from the substrate, the vertical projection of the first capacitor plate on the ASIC chip is overlapped with the second capacitor plate, and a set distance is reserved between the two capacitor plates; the second capacitor plate is electrically connected with the ASIC chip, and the ASIC chip is electrically connected with the second connecting pin. The utility model discloses a sensor can reduce the size of encapsulation chip, reduces material cost.
Description
Technical Field
The utility model relates to a sensor technology field especially relates to a bone voiceprint vibration sensor.
Background
The traditional MEMS microphone adopts a conduction mode that an MEMS chip vibrating diaphragm receives airborne voice, and a sound pressure signal is sensed by a high-sensitivity vibrating film of the MEMS chip through a sound inlet hole to convert the sound signal into an electric signal. And the ASIC chip electrically connected with the MEMS chip is used for operating and amplifying the signal and then outputting the signal.
The sensor of the traditional MEMS microphone receives the voice transmitted through the air, and includes the voice of the speaker and the noise from the surroundings, and when the noise is large, the microphone is interfered by the noise, such as the surrounding people, mechanical equipment, wind noise, etc., which seriously affects the quality of the call.
The bone voiceprint sensor on the market at present utilizes the packaging structure of the traditional MEMS microphone, and a vibration module is added into the structure of the traditional MEMS microphone: the sound is transmitted to the sensor along the human skeleton, the film inside the sensor drives the MEMS vibrating diaphragm to vibrate under the action of sound wave vibration, and the capacitance change generated by the MEMS chip is read by the ASIC chip and is operated and amplified. Due to the addition of the vibration module, the chip size becomes larger, which is not favorable for the application of the increasingly miniaturized chip requirements.
SUMMERY OF THE UTILITY MODEL
The utility model provides a bone voiceprint vibration sensor to reduce the size of encapsulation chip, reduce material cost.
According to the utility model discloses an aspect provides a bone voiceprint vibration sensor, include:
the circuit board comprises a substrate, wherein a first surface of the substrate is provided with a first connecting pin and a second connecting pin;
an interposer disposed on the first surface of the substrate; the adapter plate is provided with an adapter circuit;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the vibrating diaphragm comprises a flexible insulating layer, a first connecting circuit and a first capacitor polar plate, wherein the first connecting circuit and the first capacitor polar plate are arranged in the flexible insulating layer;
the ASIC chip is arranged on the first surface of the substrate, the surface, far away from the substrate, of the ASIC chip is provided with a second capacitor polar plate, the vertical projection of the first capacitor polar plate on the ASIC chip is overlapped with the second capacitor polar plate, and a set distance is reserved between the second capacitor polar plate and the first capacitor polar plate; the second capacitor plate is electrically connected with the ASIC chip, and the ASIC chip is electrically connected with the second connecting pin.
Optionally, the bone voiceprint vibration sensor further comprises:
the balancing weight is arranged on one side of the vibrating diaphragm, which is far away from the substrate.
Optionally, the ASIC chip is electrically connected to the second connection pins through solder balls.
According to the utility model discloses an on the other hand provides a bone voiceprint vibration sensor, include:
the first surface of the substrate is provided with a second capacitor plate and a first connecting pin;
the adapter plate is arranged on one side of the first surface of the substrate; the adapter plate is provided with an adapter circuit;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer and a second connecting circuit arranged in the flexible insulating layer;
an ASIC chip is arranged on the surface of the vibrating diaphragm, which is close to the substrate, and the ASIC chip is arranged in the central area of the vibrating diaphragm; the surface of the ASIC chip, which is adjacent to the substrate, is provided with a first capacitor plate, the vertical projection of the first capacitor plate on the substrate is overlapped with a second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate;
the first capacitor plate is electrically connected with the ASIC chip, the ASIC chip is electrically connected with a second connecting circuit on the vibrating diaphragm, and the second connecting circuit is electrically connected with the first connecting pin on the substrate through the transfer circuit.
Optionally, the ASIC chip is electrically connected to the second connection circuit through a solder ball.
According to the utility model discloses an on the other hand provides a bone voiceprint vibration sensor, include:
the first surface of the substrate is provided with a second capacitor plate and a first connecting pin;
the adapter plate is arranged on the first surface of the substrate; the adapter plate is provided with an adapter circuit;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer, a second connecting circuit, a third connecting circuit and a first capacitor plate, wherein the second connecting circuit, the third connecting circuit and the first capacitor plate are arranged in the flexible insulating layer; the vertical projection of the first capacitor plate on the substrate is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the first capacitor plate is electrically connected with the third connecting circuit;
one side that the base plate was kept away from to the vibrating diaphragm is provided with the ASIC chip, and the ASIC chip is connected with second interconnecting link and third interconnecting link on the vibrating diaphragm respectively, and second interconnecting link passes through the switching circuit to be connected with the first connection pin electricity on the base plate.
Optionally, the ASIC chip is electrically connected to the third connection line through a wire.
Optionally, the sensor according to any embodiment of the present invention further comprises:
and the adhesive layer is arranged on one side of the second capacitor polar plate, which is adjacent to the first capacitor polar plate, and is used for adjusting the dielectric constant of a medium between the first capacitor polar plate and the second capacitor polar plate.
Optionally, according to the sensor of any embodiment of the present invention, the thickness of the diaphragm is 5 to 50 micrometers;
the material of the flexible insulating layer includes polyimide.
Optionally, the sensor according to any embodiment of the present invention further includes:
the metal casing, the metal casing is connected with the first surface fixed of base plate, and vibrating diaphragm, keysets and ASIC chip all set up in the accommodation space that base plate and metal casing formed.
The utility model discloses when technical scheme vibration signal transmitted the sensor, the vibration of inside vibrating diaphragm drove the vibration of first electric capacity polar plate, and electric capacity between first electric capacity polar plate and the second electric capacity polar plate changes thereupon to make vibration signal change and be called the signal of telecommunication, through detecting the signal of telecommunication, realize the detection to vibration signal. The embodiment of the utility model provides an adopt parallel plate electric capacity structure to replace traditional MEMS chip, reduced material cost to the inside ASIC chip that only has of sensor has reduced the off-the-shelf size of encapsulation by a wide margin.
It should be understood that the statements in this section are not intended to identify key or critical features of the embodiments of the present invention, nor are they intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a bone acoustic pattern vibration sensor according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another bone voiceprint vibration sensor provided in the second embodiment of the present invention;
fig. 3 is a schematic structural diagram of another bone voiceprint vibration sensor provided by a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of another bone voiceprint vibration sensor provided in the fourth embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example one
The embodiment of the utility model provides a bone voiceprint vibration sensor, figure 1 is the utility model discloses the embodiment a structure schematic diagram of a bone voiceprint vibration sensor who provides refers to figure 1, and bone voiceprint vibration sensor includes:
a substrate 100, a first surface of the substrate 100 being provided with a first connection pin 101 and a second connection pin 102; an interposer 200 disposed on the first surface of the substrate 100; the patch panel 200 is provided with a patch cord 201.
The vibrating diaphragm is arranged on one side, far away from the substrate, of the transfer plate 200 and comprises an edge area and a central area, the edge area surrounds the central area, and the transfer plate 200 is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer 300, and a first connecting circuit 301 and a first capacitor plate 700 which are arranged in the flexible insulating layer 300, wherein the first capacitor plate 700 is located in the central area, the first capacitor plate 700 is electrically connected with the first connecting circuit 301, and the first connecting circuit 301 is electrically connected with a first connecting pin 101 on the substrate 100 through a switching circuit 201.
The ASIC chip 500 is arranged on the first surface of the substrate 100, the surface of the ASIC chip 500 far away from the substrate 100 is provided with a second capacitor plate 800, the vertical projection of the first capacitor plate 700 on the ASIC chip 500 is overlapped with the second capacitor plate 800, and a set distance is reserved between the second capacitor plate 800 and the first capacitor plate 700; the second capacitor plate 800 is electrically connected to the ASIC chip 500, and the ASIC chip 500 is electrically connected to the second connection pin 102.
The substrate 100 is provided with a first connection pin 101 and a second connection pin 102, the first connection pin 101 may connect the first capacitor plate 700 with an external power source for charging, and the second connection pin 102 is used to enable the ASIC chip 500 to perform signal interaction with the external power source or a signal terminal. The patch cord 201 inside the patch panel 200 may be used to connect the first capacitor plate 700 and the first connection pin 101 inside the diaphragm, and the patch panel 200 may also function to support the diaphragm. The vibrating diaphragm adopts the FPC flexible board production technology, and the insulating layer, the first connecting circuit 301 and the capacitor plate are bonded together by using the adhesive to form the vibrating diaphragm. The insulating layer is used for forming the flexible insulating layer 300, the flexible insulating layer 300 can play a role in insulation protection, and the flexible insulating layer 300 can be made of polyimide materials or other flexible insulating materials. The first connection line 301 and the first capacitor plate 700 may be made of a conductive material such as metal, and the metal material may be copper, that is, copper foil may be used to form the first connection line 301 and the first capacitor plate 700.
The surface of the ASIC chip 500 far from the substrate 100 is further provided with a second capacitor plate 800, the ASIC chip 500 is processed with a layer of capacitor material on the back side to form the second capacitor plate 800 during tape-out, and a set distance is provided between the second capacitor plate 800 and the first capacitor plate 700, so that the first capacitor plate 700 and the second capacitor plate 800 form a capacitor with an air medium therebetween, and the distance between the first capacitor plate 700 and the second capacitor plate 800 can be adjusted by changing the height of the adapter plate 200, thereby adjusting the capacitance of the capacitor.
Specifically, vibration signals such as sound are transmitted to the sensor along human bones or other solid materials, the sensor vibrates integrally, the vibrating diaphragm inside the sensor vibrates accordingly, the first capacitor plate 700 vibrates accordingly when the vibrating diaphragm vibrates, the distance between the capacitor plates changes, capacitance changes are caused, and the sound signals are converted into capacitance signals. The ASIC chip 500 is used to output the electrical signals on the first capacitor plate 700 and the second capacitor plate 800 through the connection pins of the substrate 100 after operational amplification. In addition, the larger the vibration amplitude of the diaphragm is, the larger the change of the capacitance is, that is, the larger the deformation amount of the diaphragm during vibration is, the larger the change of the capacitance is, and the deformation amount of the diaphragm can be adjusted by changing the thickness of the diaphragm, so that the capacitance change rate of the device can be adjusted.
The utility model discloses when technical scheme vibration signal transmitted the sensor, the vibration of inside vibrating diaphragm drove first electric capacity polar plate 700 vibration, and the electric capacity between first electric capacity polar plate 700 and the second electric capacity polar plate 800 changes thereupon to make the vibration signal change and be called the signal of telecommunication, through detecting the signal of telecommunication, realize the detection to vibration signal. The embodiment of the utility model provides an adopt parallel plate electric capacity structure to replace traditional MEMS chip, reduced material cost to the inside ASIC chip 500 that only has reduced the off-the-shelf size of encapsulation by a wide margin of sensor.
Optionally, the bone voiceprint vibration sensor further comprises: the weight 600 is disposed on one side of the diaphragm away from the substrate 100.
Wherein, balancing weight 600 can play the effect of counter weight, can adjust the size of vibrating diaphragm deformation volume, when there is the noise in the environment, balancing weight 600 can be so that the more difficult noise of vibrating diaphragm produces the vibration, avoids the interference of noise.
Optionally, the ASIC chip 500 is electrically connected to the second connection pins 102 through solder balls 502.
The solder ball 502 is implanted on the front surface of the ASIC chip 500 during tape-out, and the solder ball 502 can be used as a pin of the ASIC chip 500 to electrically connect with the second connecting pin 102.
Optionally, the bone voiceprint vibration sensor further comprises: the metal shell 400, the metal shell 400 and the first surface of the substrate 100 are fixedly connected, and the vibrating diaphragm, the interposer 200 and the ASIC chip 500 are all disposed in the accommodating space formed by the substrate 100 and the metal shell 400.
Among other things, the metal case 400 may function as a protection device.
Specifically, the bone voiceprint vibration sensor of the present embodiment is manufactured by the following steps:
s110, processing a layer of capacitance material on the back surface of the ASIC chip 500 during chip flowing to form a second capacitance plate 800, and implanting solder balls 502 on the front surface.
S120, pressing and welding the vibrating diaphragm and the adapter plate 200;
s130, soldering the solder balls 502 of the ASIC chip 500 on the substrate 100;
s140, cutting the assembled adapter plate 200 into single pieces, attaching the single pieces to the substrate 100, and performing reflow soldering;
s150, dispensing and pasting a balancing weight 600 on the vibrating diaphragm, and baking and curing;
s160, scribing solder paste and adhering the metal shell 400, and performing reflow soldering;
and S170, cutting the substrate 100.
Example two
The embodiment of the utility model provides a vocal print vibration sensor is provided on the basis of above-mentioned embodiment, fig. 2 is the utility model discloses a second structural schematic diagram of a further vocal print vibration sensor who provides refers to fig. 2, and vocal print vibration sensor includes: a substrate 100, a first surface of the substrate 100 being provided with a second capacitor plate 800 and a first connection pin 101; an interposer 200 disposed on one side of the first surface of the substrate 100; the adapter plate 200 is provided with an adapter circuit 201; the vibrating diaphragm is arranged on one side, far away from the substrate 100, of the adapter plate 200 and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate 200 is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm includes a flexible insulating layer 300 and a second connection line 302 disposed in the flexible insulating layer 300.
The surface of the diaphragm adjacent to the substrate 100 is provided with an ASIC chip 500, and the ASIC chip 500 is arranged in the central area of the diaphragm; the surface of the ASIC chip 500 adjacent to the substrate is provided with a first capacitor plate 700, a vertical projection of the first capacitor plate 700 on the substrate 100 overlaps with a second capacitor plate 800, and a set distance is provided between the second capacitor plate 800 and the first capacitor plate 700; the first capacitor plate 700 is electrically connected to the ASIC chip 500, the ASIC chip 500 is electrically connected to the second connection line 302 on the diaphragm, and the second connection line 302 is electrically connected to the first connection pin 101 on the substrate 100 through the transfer line 201.
The difference between the embodiment and the above embodiment is that the ASIC chip 500 is inversely attached to the diaphragm, and the chip itself plays a role of a weight counterbalance, and no additional weight counterbalance needs to be provided, thereby reducing the process steps and reducing the material cost. A layer of capacitance material is processed on the first surface of the substrate 100 to form a second capacitance plate 800, and the second capacitance plate 800 is electrically connected to the third connection pin 103 of the substrate 100, and performs signal interaction with the outside through the third connection pin 103. The ASIC chip 500 is provided with a first capacitor plate 700 on a surface adjacent to the substrate 100, the first capacitor plate 700 and the second capacitor plate 800 form a capacitor with an air medium therebetween, and the capacitance of the capacitor can be adjusted by changing the height of the interposer 200.
Specifically, vibration signals such as sound are transmitted to the sensor along the solid bodies such as human bones, the sensor vibrates integrally, and the vibrating diaphragm inside the sensor vibrates accordingly to drive the distance between the first capacitor plate 700 and the second capacitor plate 800 to change the capacitance, so that the vibration signals are converted into electric signals. After the electrical signal is arithmetically amplified by the ASIC chip 500, the amplified electrical signal is transmitted to the substrate 100 through the second connection line 302 in the flexible insulation layer 300, and the electrical signal is transmitted to the outside through the substrate 100.
Optionally, the ASIC chip 500 is electrically connected to the second connection line 302 through solder balls 502.
The solder balls 502 can be used as pins of the ASIC chip 500, so as to electrically interconnect with the second connection lines 302. And the ASIC chip 500 can be directly fixed on the surface of the vibrating diaphragm by adopting the solder balls 502 without adopting materials such as glue and the like for fixing, so that the material cost is reduced.
Specifically, the bone voiceprint vibration sensor of the present embodiment is manufactured by the following steps:
s210, processing a layer of capacitance material on the back surface of the ASIC chip 500 during tape-out to form a first capacitance plate 700, and implanting solder balls 502 on the front surface.
S220, processing a layer of capacitance material on the first surface of the substrate 100 to form a second capacitance plate 800;
s230, pressing and welding the vibrating diaphragm and the adapter plate 200;
s240, the ASIC chip 500 is inversely pasted on the vibrating diaphragm and is subjected to reflow soldering;
s250, cutting the assembled adapter plate 200 into single pieces, attaching the single pieces to the substrate 100, and performing reflow soldering;
s260, scribing solder paste, attaching a metal shell 400, and performing reflow soldering;
s270, cutting the substrate 100.
The utility model discloses when technical scheme vibration signal transmitted the sensor, the vibration of inside vibrating diaphragm drove first electric capacity polar plate 700 vibration, and the electric capacity between first electric capacity polar plate 700 and the second electric capacity polar plate 800 changes thereupon to make the vibration signal change and be called the signal of telecommunication, detect the signal of telecommunication through ASIC chip 500, realize the detection to vibration signal. The embodiment of the utility model provides an adopt parallel plate electric capacity structure to replace traditional MEMS chip to through the counter weight effect that ASIC chip 500 itself played, reduced technology preparation step, reduced material cost, and only ASIC chip in the sensor inside has reduced the off-the-shelf size of encapsulation by a wide margin.
EXAMPLE III
The embodiment of the utility model provides a provide a bone vocal print vibration sensor on the basis of above-mentioned embodiment, fig. 3 is the utility model discloses a third structural schematic diagram who provides a bone vocal print vibration sensor still further refers to fig. 3, a bone vocal print vibration sensor includes: a substrate 100, a first surface of the substrate 100 being provided with a second capacitor plate 800 and a first connection pin 101; an interposer 200 disposed on the first surface of the substrate 100; the patch panel 200 is provided with a patch cord 201.
The vibrating diaphragm is arranged on one side, far away from the substrate 100, of the adapter plate 200 and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate 200 is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer 300, and a second connecting line 302, a third connecting line 303 and a first capacitor plate 700 which are arranged in the flexible insulating layer, wherein the first capacitor plate 700 is positioned in the central area; the vertical projection of the first capacitor plate 700 on the substrate 100 overlaps the second capacitor plate 800, and a set distance is provided between the second capacitor plate 800 and the first capacitor plate 700; the first capacitor plate 700 is electrically connected to the third connection line 303.
The side of the diaphragm far away from the substrate 100 is provided with an ASIC chip 500, the ASIC chip 500 is respectively connected with a second connection line 302 and a third connection line 303 on the diaphragm, and the second connection line is electrically connected with the first connection pin 101 on the substrate 100 through a transfer line 201.
The difference between the present embodiment and the above embodiments is that the ASIC chip 500 is attached to a side of the diaphragm away from the substrate 100, and the ASIC chip 500 itself also plays a role of a weight. The second capacitor substrate 800 disposed on the substrate 100, the first capacitor plate 700 in the flexible insulating layer 300 and the air medium therebetween form a capacitor, and the capacitance of the capacitor can be adjusted by changing the height of the interposer 200.
Specifically, vibration signals such as sound are transmitted to the sensor along the solid bodies such as human bones, the sensor vibrates integrally, the vibrating diaphragm inside the sensor vibrates accordingly, the distance between the electrode plates can be driven to change, capacitance changes are caused, and the vibration signals are converted into electric signals. The electrical signals on the first capacitor plate 700 and the second capacitor plate 800 are transmitted to the ASIC chip 500 through the third connection line 303 in the flexible insulation layer 300, and the ASIC chip 500 amplifies the electrical signals and transmits the amplified electrical signals to the first connection pin 101 of the substrate 100 through the second connection line 302 for output. Alternatively, the ASIC chip 500 is electrically connected to the third connection line 303 by a wire.
The ASIC chip 500 and the third connection line 303 can be electrically connected by a wire bonding process, and the ball mounting of the ASIC chip 500 is not required.
Specifically, the bone voiceprint vibration sensor of the present embodiment is manufactured by the following steps:
s310, processing a layer of capacitance material on the first surface of the substrate 100 to form a second capacitance plate 800;
s320, pressing and welding the vibrating diaphragm and the adapter plate 200;
s330, cutting the assembled adapter plate 200 into single pieces, attaching the single pieces to the substrate 100, and performing reflow soldering;
s340, welding the ASIC chip 500 on the vibrating diaphragm, and then bonding by a lead;
s350, scribing solder paste and adhering the metal shell 400, and performing reflow soldering;
and S360, cutting the substrate 100.
The embodiment of the utility model provides a technical scheme ASIC chip 500 adopts the pressure welding to replace the tin ball when flowing the piece on the basis of above-mentioned embodiment, need not to do the ball-planting process, can reduce the off-the-shelf size of encapsulation. In addition, when the vibration signal is transmitted to the sensor according to the technical scheme of this embodiment, the vibration of the internal diaphragm drives the first capacitor plate 700 to vibrate, and the capacitance between the first capacitor plate 700 and the second capacitor plate 800 changes accordingly, so that the vibration signal is converted into an electrical signal, and the electrical signal is detected through the ASIC chip 500, thereby detecting the vibration signal. The embodiment of the utility model provides an adopt parallel plate electric capacity structure to replace traditional chip to the counter weight effect of playing through chip itself has reduced technology preparation step, has reduced material cost, and only ASIC chip 500 inside the sensor has reduced the off-the-shelf size of encapsulation by a wide margin.
Example four
The embodiment of the utility model provides a bone voiceprint vibration sensor is provided on the basis of above-mentioned embodiment, and is optional, and bone voiceprint vibration sensor still includes: and the glue layer 900 is arranged on one side of the second capacitor plate adjacent to the first capacitor plate, and the glue layer 900 is used for adjusting the dielectric constant of a medium between the first capacitor plate 700 and the second capacitor plate 800.
Glue is coated on the second capacitor plate 800 to form a glue layer 900, the dielectric constant of the parallel plate capacitor intermediate medium is changed, and therefore the size of the capacitor is adjusted, after vibration signals are converted into electric signals, the converted electric signals are large, and detection is easy.
In addition, the glue can be doped with ions, can be doped with metal ions and other materials capable of adjusting dielectric constant, and can be matched with capacitors with different areas by adjusting process parameters such as ion doping concentration, glue amount and the like. For example, fig. 4 is a schematic structural diagram of another bone acoustic wave vibration sensor according to the fourth embodiment of the present invention, and referring to fig. 4, fig. 4 is a diagram that a layer of glue is added on an ASIC chip 500 based on fig. 1, and the dielectric constant of the parallel plate capacitor intermediate medium can be changed by adjusting ion doping in the glue.
Optionally, the thickness of the diaphragm is 5 to 50 micrometers; the material of the flexible insulating layer includes polyimide.
If the thickness of the diaphragm is less than 5 micrometers, the strength of the diaphragm is too poor and the diaphragm is easily damaged, and if the thickness of the diaphragm is more than 50 micrometers, the deformation of the diaphragm is small, so that the thickness of the diaphragm is selected to be in the range of 5-50 micrometers.
The embodiment of the utility model provides a technical scheme is on the basis of above-mentioned embodiment, through increase one deck glue film 900 between first electric capacity polar plate 700 and second electric capacity polar plate 800, can adjust the dielectric constant of electric capacity to change the size of electric capacity, the detection of the electric capacity signal of being convenient for. And on the premise of ensuring that the vibrating diaphragm has enough structural strength by setting the thickness of the vibrating diaphragm, the vibrating diaphragm can have larger deformation.
It should be understood that various forms of the flows shown above may be used, with steps reordered, added, or deleted. For example, the steps described in the present invention may be executed in parallel, may be executed sequentially, or may be executed in different orders, as long as the desired result of the technical solution of the present invention can be achieved, and the present invention is not limited thereto.
The above detailed description does not limit the scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A bone voiceprint vibration sensor comprising:
the circuit board comprises a substrate, wherein a first surface of the substrate is provided with a first connecting pin and a second connecting pin;
an interposer disposed on the first surface of the substrate; a switching circuit is arranged on the switching plate;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer, and a first connecting circuit and a first capacitor polar plate which are arranged in the flexible insulating layer, wherein the first capacitor polar plate is positioned in the central area, the first capacitor polar plate is electrically connected with the first connecting circuit, and the first connecting circuit is electrically connected with a first connecting pin on the substrate through the switching circuit;
the ASIC chip is arranged on the first surface of the substrate, a second capacitor plate is arranged on the surface, far away from the substrate, of the ASIC chip, the vertical projection of the first capacitor plate on the ASIC chip is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the second capacitor plate is electrically connected with the ASIC chip, and the ASIC chip is electrically connected with the second connecting pin.
2. The sensor of claim 1, further comprising:
the balancing weight is arranged on one side, far away from the substrate, of the vibrating diaphragm.
3. The sensor of claim 1, wherein:
the ASIC chip is electrically connected with the second connecting pin through a solder ball.
4. A bone voiceprint vibration sensor comprising:
the first surface of the substrate is provided with a second capacitor polar plate and a first connecting pin;
the adapter plate is arranged on one side of the first surface of the substrate; a switching circuit is arranged on the switching plate;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer and a second connecting circuit arranged in the flexible insulating layer;
an ASIC chip is arranged on the surface of the vibrating diaphragm, which is close to the substrate, and the ASIC chip is arranged in the central area of the vibrating diaphragm; the surface of the ASIC chip, which is close to the substrate, is provided with a first capacitor plate, the vertical projection of the first capacitor plate on the substrate is overlapped with a second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate;
the first capacitor plate is electrically connected with the ASIC chip, the ASIC chip is electrically connected with a second connecting circuit on the vibrating diaphragm, and the second connecting circuit is electrically connected with a first connecting pin on the substrate through the adapter circuit.
5. The sensor of claim 4, wherein:
the ASIC chip is electrically connected with the second connecting circuit through a solder ball.
6. A bone voiceprint vibration sensor comprising:
the first surface of the substrate is provided with a second capacitor plate and a first connecting pin;
the adapter plate is arranged on the first surface of the substrate; a switching circuit is arranged on the switching plate;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer, and a second connecting circuit, a third connecting circuit and a first capacitor polar plate which are arranged in the flexible insulating layer, wherein the first capacitor polar plate is positioned in the central area; the vertical projection of the first capacitor plate on the substrate is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the first capacitor plate is electrically connected with the third connecting line;
the side of the vibrating diaphragm, which is far away from the substrate, is provided with an ASIC chip, the ASIC chip is respectively connected with a second connecting circuit and a third connecting circuit on the vibrating diaphragm, and the second connecting circuit is electrically connected with a first connecting pin on the substrate through the switching circuit.
7. The sensor of claim 6, wherein:
the ASIC chip is electrically connected with the third connecting line through a lead.
8. The sensor of any one of claims 1-7, further comprising:
and the adhesive layer is arranged on one side of the second capacitor plate, which is adjacent to the first capacitor plate, and is used for adjusting the dielectric constant of a medium between the first capacitor plate and the second capacitor plate.
9. The sensor of any one of claims 1-7, wherein:
the thickness of the diaphragm is 5-50 microns;
the material of the flexible insulating layer comprises polyimide.
10. The sensor of any one of claims 1-7, further comprising:
the metal shell is fixedly connected with the first surface of the substrate, and the vibrating diaphragm, the adapter plate and the ASIC chip are all arranged in an accommodating space formed by the substrate and the metal shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222695544.7U CN218336424U (en) | 2022-10-13 | 2022-10-13 | Bone voiceprint vibration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222695544.7U CN218336424U (en) | 2022-10-13 | 2022-10-13 | Bone voiceprint vibration sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336424U true CN218336424U (en) | 2023-01-17 |
Family
ID=84822857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222695544.7U Active CN218336424U (en) | 2022-10-13 | 2022-10-13 | Bone voiceprint vibration sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336424U (en) |
-
2022
- 2022-10-13 CN CN202222695544.7U patent/CN218336424U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20240510 Address after: 214135 China Sensor Network International Innovation Park F2, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: SV SENSTECH (WUXI) CO.,LTD. Country or region after: China Address before: 214131 F2, China Sensor Network International Innovation Park, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Huajing Technology Wuxi Co.,Ltd. Country or region before: China |
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