CN218333840U

CN218333840U - LED substrate, display panel and display device

Info

Publication number: CN218333840U
Application number: CN202222600799.0U
Authority: CN
Inventors: 黄学勇; 李荣荣
Original assignee: HKC Co Ltd
Current assignee: HKC Co Ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-01-17
Anticipated expiration: 2032-09-29

Abstract

The invention relates to an LED substrate, a display panel and a display device. The LED substrate comprises a substrate, a first electrode and an LED chip; the number of the first electrodes is multiple, and the multiple first electrodes are arranged on the substrate; each first electrode comprises two sub-electrodes, a gap is formed between the two sub-electrodes, and first photoresist is filled in the gap; one side of the first photoresist, which is far away from the substrate, is provided with a first opening, the opening direction of which is far away from one side of the substrate; a second photoresist is formed on the first electrodes, a plurality of second openings are formed on the second photoresist between the two sub-electrodes of each first electrode, and each second opening exposes the first opening and partial areas of the two sub-electrodes; the LED chip is placed in the second opening, a protruding portion is arranged on one side, facing the substrate, of the LED chip, and the protruding portion is inserted into the first opening. The LED substrate can realize the effect of self-assembly of fluid when the LED chip is installed on the substrate.

Description

LED substrate, display panel and display device

Technical Field

The invention relates to the technical field of display, in particular to an LED substrate, a display panel and a display device.

Background

The Mini LED and Micro LED display technology is characterized in that millions to tens of millions of LED chips with the size within 100 micrometers are accurately and orderly transferred to various circuit substrates in a mass transfer mode to form high-density integrated display devices with different application types. In the bulk transfer technology of Mini LED and Micro LED, many devices are integrated together at the stage of chip form, and the products in the form of devices are not integrated on a carrier board after the final package is completed.

At present, the huge transfer technology has high difficulty and high transfer cost, and the process routes comprise different technical routes such as seal transfer, laser transfer, fluid assembly, electromagnetic force transfer and the like. The current transfer technology mainly adopts a seal mode, but a seal transfer route has low transfer efficiency and difficult mass repair, and is not an optimal mass production transfer route. Low cost, high precision, high yield bulk transfer technology is one of the major obstacles for current Mini LED and Micro LED display applications.

Disclosure of Invention

The invention provides an LED substrate, a display panel and a display device, and aims to solve the technical problems of high cost, low precision, low yield and the like in the LED chip transfer process in the prior art.

The invention provides an LED substrate, which comprises a substrate, a first electrode and an LED chip; the number of the first electrodes is multiple, and the multiple first electrodes are arranged on the substrate; each first electrode comprises two sub-electrodes, a gap is formed between the two sub-electrodes, and the gap is filled with first photoresist; the surface of one side of the first photoresist, which is far away from the substrate, is provided with a first opening with an opening direction, which is far away from one side of the substrate; a second photoresist is formed on the first electrodes, a plurality of second openings are formed on the second photoresist between the two sub-electrodes of each first electrode, and each second opening exposes the first opening and partial areas of the two sub-electrodes; the LED chip is placed in the second opening, a protruding portion is arranged on one side, facing the substrate, of the LED chip, and the protruding portion is inserted into the first opening.

And the upper surface of the first photoresist is flush with the upper surface of the sub-electrode.

In the above scheme, it should be noted that the upper surfaces of the first photoresist and the two sub-electrodes are flush, which does not mean that the upper surfaces of the first photoresist and the two sub-electrodes are smooth planes and are all completely located on one absolute plane; but rather, the upper surfaces of the first photoresist and the two sub-electrodes are approximately flush, and the first photoresist and the two sub-electrodes inevitably have surface irregularities in the manufacturing process, so long as the irregularities do not affect the assembly of the subsequent LED chip, the upper surfaces of the first photoresist and the two sub-electrodes are considered to be flush at this time.

The width of the first opening on the side far away from the substrate is larger than that of the side close to the substrate, and a width gradually-changing shape is formed between the first opening and the substrate.

In the above scheme, the width gradient of the first opening may be a continuous gradient or a discontinuous gradient, but is preferably a continuous gradient.

Wherein the first opening is in the shape of a cone, a pyramid, a truncated cone or a truncated pyramid.

Wherein the inclination angle of the first opening is 45 degrees.

The width of the second opening at the side far away from the substrate is larger than that at the side close to the substrate, and a width gradually-changing shape is formed between the second opening and the substrate.

In the above scheme, the width gradient of the second opening may be a continuous gradient or a discontinuous gradient, but is preferably a continuous gradient.

Wherein, the shape of the second opening is a truncated cone or a truncated pyramid.

The shape of the protruding part on the LED chip is a cone, a pyramid, a truncated cone or a truncated pyramid.

The width of the LED chip is a, the width of one side, far away from the substrate, of the first opening is c, the width of one side, close to the substrate, of the second opening is b, and then a is larger than b-c.

The display panel provided by the invention comprises the LED substrate.

The display device provided by the invention comprises the display panel.

Compared with the prior art, the LED substrate, the display panel and the display device provided by the invention have the following advantages:

the LED substrate provided by the invention can realize the effect of fluid self-assembly when the LED chip is mounted on the substrate in a mode of mass transfer and the like. Specifically, after the LED chip is placed on the substrate, the LED chip falls into the second opening due to the second opening formed in the second photoresist; in addition, because the first photoresist is also provided with the first opening in the second opening, the protruding part on the LED chip can be further in contraposition splicing with the first opening, thereby realizing the connection and fixation of the LED chip on the substrate; after being fixed, the anode, cathode, etc. on the LED chip may be connected to the two sub-electrodes of the first electrode correspondingly.

The display panel provided by the invention comprises the LED substrate, has all the technical characteristics of the LED substrate, certainly has the beneficial effects consistent with the LED substrate, and is not described again.

The display device provided by the invention comprises the display panel, has all the technical characteristics of the display panel, certainly has the beneficial effects consistent with the display panel, and is not described in detail.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of an LED substrate according to an embodiment of the invention;

fig. 2 is a schematic structural diagram of an LED chip in the LED substrate shown in fig. 1 in a first viewing angle direction;

FIG. 3 is a schematic structural diagram of an LED chip in the LED substrate shown in FIG. 1 in a second viewing angle direction;

FIG. 4 is a schematic view of a first opening and a second opening in the LED substrate of FIG. 1;

FIG. 5 is a schematic diagram of a dimensional relationship between a first opening and a second opening in the LED substrate shown in FIG. 1;

fig. 6 is a schematic diagram of a dimensional relationship of a protruding portion in the LED substrate shown in fig. 1.

In the figure:

10-a substrate; 11-a first electrode; 12-an LED chip; 13-a first photoresist; 14-a second photoresist;

110-sub-electrodes; 120-a protrusion; 121-a second electrode; 130-a first opening; 140-second opening.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Embodiments of an LED substrate, a display panel, and a display device according to the present invention will be described below with reference to the accompanying drawings.

In an embodiment of the LED substrate of the present invention, referring to fig. 1, the LED substrate includes a substrate 10, a first electrode 11, and an LED chip 12.

The substrate 10 may be a glass substrate, or an organic substrate, such as a Polyimide (PI) substrate.

The number of the first electrodes 11 is plural, and the plural first electrodes 11 are disposed on the substrate 10; each of the first electrodes 11 includes two sub-electrodes 110, and the two sub-electrodes 110 may be a positive electrode and a negative electrode, respectively. The two sub-electrodes 110 are used to connect with the electrodes on the LED chip 12 correspondingly, so as to supply power to the LED chip or transmit various signals.

In each electrode 11, two sub-electrodes 110 have a gap therebetween, and the gap is filled with a first photoresist 13. Specifically, a surface (may be referred to as an upper surface) of a side of the first photoresist 13 away from the substrate 10 may be flush with surfaces (may be referred to as upper surfaces) of sides of the two sub-electrodes 110 away from the substrate 10. It should be noted that the upper surfaces of the first photoresist 13 and the two sub-electrodes 110 are flush, which does not mean that the upper surfaces of the first photoresist 13 and the two sub-electrodes 110 are smooth planes and are all completely located on one absolute plane; instead, the upper surfaces of the first photoresist 13 and the two sub-electrodes 110 are substantially flush, and the first photoresist 13 and the two sub-electrodes 110 inevitably have surface irregularities during the manufacturing process, so long as the surface irregularities do not affect the assembly of the subsequent LED chip 12, the upper surfaces of the first photoresist 13 and the two sub-electrodes 110 are considered to be flush at this time.

The surface of the first photoresist 13 on the side far away from the substrate 10 has a first opening 130 on the side far away from the substrate 10. Specifically, the first opening 130 may be provided to have a width larger at a side (hereinafter, referred to as an upper side for convenience of description) distant from the substrate 10 than at a side (hereinafter, referred to as a lower side for convenience of description) close to the substrate 10 with a width-gradually-changing shape therebetween. Furthermore, the width gradient of the first opening 130 may be a continuous gradient or a discontinuous gradient, but is preferably a continuous gradient. The shape of the first opening 130 may be, for example, a cone, pyramid, truncated cone, or truncated pyramid, or other modified shapes based on the regular shape described above, or other irregular shapes.

The first electrodes 11 are formed with second photoresist 14, and a plurality of second openings 140 are formed on the second photoresist 14 between the two sub-electrodes 110 of each of the first electrodes 11. Specifically, the number of the second openings 140 may be equal to the number of the first openings 130 and the first electrodes 11, and each of the second openings 140 exposes the first openings 130 and partial regions of the two sub-electrodes 110 of the first electrodes 11. Specifically, the second opening 140 may be provided at a side (hereinafter, referred to as an upper side for convenience of description) distant from the substrate 10 with a width larger than a side (hereinafter, referred to as a lower side for convenience of description) close to the substrate 10 with a width-gradually-changing shape therebetween; furthermore, the width gradient of the second opening 140 may be a continuous gradient or a discontinuous gradient, but is preferably a continuous gradient. For example, the second opening 140 may have a truncated cone shape or a truncated pyramid shape.

The LED chip 12 may be a Mini LED chip or a Micro LED chip. The LED chip 12 is placed in the second opening 140, and a protrusion 120 is disposed on a side of the LED chip 12 facing the substrate 10, and the protrusion 120 is inserted into the first opening 130. In addition, the LED chip 12 further has a second electrode 121, and the second electrode 121 may specifically include a positive electrode and a negative electrode, and the positive electrode and the negative electrode are respectively used for being connected to the two sub-electrodes 110 of the first electrode 11.

In this embodiment, when the LED chip 12 is mounted on the substrate 10 in a manner such as bulk transfer, the LED chip 12 can achieve the effect of fluid self-assembly. Specifically, after the LED chip 12 is placed on the substrate 10, since the second opening 140 is provided on the second photoresist 14, the LED chip 12 falls into the second opening 140; moreover, because the second opening 140 is provided with the first opening 130 on the first photoresist 13, the protrusion 120 on the LED chip 12 is further inserted into the first opening 130 in an aligned manner, so as to realize the connection and fixation of the LED chip 12 on the substrate 10; after being fixed, the anode, cathode, etc. on the LED chip 12 may be connected to the two sub-electrodes 110 of the first electrode 11 correspondingly.

In one embodiment of the LED substrate, the first opening 130 has an inclination angle of 45 degrees. At this angle, the protrusions 120 on the LED chip 12 can be easily aligned with the first opening 130 with a high success rate and be accurately and quickly inserted into the first opening 130.

In one embodiment of the LED substrate, the shape of the protrusion 120 on the LED chip 12 is conical, pyramidal, truncated circular, or truncated pyramidal.

Also, in this embodiment, the shape of the protrusion 120 on the LED chip 12 may completely coincide with the shape of the first opening 130. For example, when the shape of the first opening 130 is a cone, the shape of the protrusion 120 on the LED chip 12 may also be a cone, and the cones of both may have the same bottom and height. For example, when the first opening 130 has a truncated pyramid shape, the protrusion 120 of the LED chip 12 may have a truncated pyramid shape, and the truncated pyramid shapes may have the same parameters such as bottom, height, and top.

Of course, in practical implementation of the solution of the present invention, the shape of the first opening 130 is not limited to completely fit the shape of the protrusion 120 on the LED chip 12. For example, when the shape of the first opening 130 is a cone shape, the shape of the protrusion 120 on the LED chip 12 may be a truncated cone shape; when the shape of the first opening 130 is a pyramid, the shape of the protrusion 120 on the LED chip 12 may be a frustum of a pyramid.

In this embodiment, when the shape of the first opening 130 and the shape of the protrusion 120 on the LED chip 12 are both conical or truncated cone, the LED chip 12 can be more easily aligned onto the first opening 130. Whereas, when the shape of the first opening 130 and the shape of the protrusion 120 on the LED chip 12 are both pyramid or frustum pyramid, the LED chip 12 can be mounted in place in a defined specific posture after being aligned to the first opening 130.

In an embodiment of the LED substrate, the width of the LED chip 12 is a, the width of the upper side of the first opening 130 is c, and the width of the bottom side of the second opening 140 is b, and the width a of the LED chip 12, the width b of the bottom side of the second opening 140, and the width c of the upper side of the first opening 130 have the following relationship:

a＞b－c

under the dimensional relationship, when the LED chip 12 falls into the second opening 140, the LED chip 12 will not be stably stopped in the region between the upper edge of the first opening 130 and the lower edge of the second opening 140, and the protrusion on the LED chip 12 will be aligned and inserted into the first opening 130 by the oblique side of the second photoresist 14, thereby further facilitating the mounting and fixing of the LED chip 12 on the substrate 10.

As described above, in the LED substrate according to the above embodiment of the present invention, when the LED chip 12 is mounted on the substrate 10 by, for example, bulk transfer, the LED chip 12 can achieve the effect of self-assembly of the fluid. Specifically, after the LED chip 12 is placed on the substrate 10, since the second opening 140 is disposed on the second photoresist 14, the LED chip 12 may fall into the second opening 140; moreover, because the second opening 140 is provided with the first opening 130 on the first photoresist 13, the protrusion 120 on the LED chip 12 is further inserted into the first opening 130 in an aligned manner, so as to realize the connection and fixation of the LED chip 12 on the substrate 10; after being fixed, the anode, cathode, etc. on the LED chip 12 may be connected to the two sub-electrodes 110 of the first electrode 11 correspondingly.

In one embodiment of the display panel of the present invention, the display panel includes the LED substrate described in the above embodiments.

In this embodiment, the display panel may be a liquid crystal display panel (LCD) in which the LED substrate serves as a backlight, the LED chips 12 serve as light emitting devices in the backlight, and the LED chips 12 may be Mini LED chips or Micro LED chips.

In addition, the display panel may also be a Micro LED display panel, and at this time, the LED chip 12 selects a Micro LED chip, and each Micro LED chip is used as a single sub-pixel.

The display panel provided by the invention comprises the LED substrate, and when the LED chip 12 is mounted on the substrate 10 in a mode of mass transfer or the like, the LED chip 12 can realize the effect of fluid self-assembly. Specifically, after the LED chip 12 is placed on the substrate 10, since the second opening 140 is disposed on the second photoresist 14, the LED chip 12 may fall into the second opening 140; moreover, because the second opening 140 is provided with the first opening 130 on the first photoresist 13, the protrusion 120 on the LED chip 12 is further inserted into the first opening 130 in an aligned manner, so as to realize the connection and fixation of the LED chip 12 on the substrate 10; after being fixed, the anode, cathode, etc. on the LED chip 12 may be connected to the two sub-electrodes 110 of the first electrode 11 correspondingly.

In one embodiment of the display device of the present invention, the display device includes the display panel described in the above embodiment.

In this embodiment, the display device may be various types of display products such as a mobile phone, a tablet computer, a display, a television, and a vehicle-mounted display screen.

The display device of the present invention includes the display panel described above, and when the LED chip 12 is mounted on the substrate 10 by, for example, bulk transfer, the LED chip 12 can achieve the effect of fluid self-assembly. Specifically, after the LED chip 12 is placed on the substrate 10, since the second opening 140 is disposed on the second photoresist 14, the LED chip 12 may fall into the second opening 140; moreover, because the second opening 140 is provided with the first opening 130 on the first photoresist 13, the protrusion 120 on the LED chip 12 is further inserted into the first opening 130 in an aligned manner, so as to realize the connection and fixation of the LED chip 12 on the substrate 10; after being fixed, the anode, cathode, etc. on the LED chip 12 may be connected to the two sub-electrodes 110 of the first electrode 11 correspondingly.

It should be noted that, in the above description, the first electrode, the first photoresist and the second photoresist belong to a layer structure, which may refer to a material portion including a region having a certain thickness. The layer structure may extend over the entire underlying or overlying structure or may have a smaller extent than the underlying or overlying structure. Furthermore, the layer structure may be a region of a continuous structure, homogeneous or inhomogeneous, having a thickness smaller than the thickness of the continuous structure. For example, a layer structure may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layer structure may extend laterally, vertically and/or along a tapered surface. The substrate base may be a layer, may include one or more layers therein, and/or may have one or more layers located thereon, above and/or below. The layer may comprise a plurality of layers. For example, the interconnect layer may include one or more conductors and contact layers (within which contacts, interconnect lines, and/or vias are formed) and one or more dielectric layers.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

It should be readily understood that "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest manner such that "on … …" means not only "directly on something", but also "on something" with the meaning of intermediate features or layers therebetween, and "above … …" or "above … …" includes not only the meaning of "above" or "above" something, but also the meaning of "above" or "above" without intermediate features or layers therebetween (i.e., directly on something).

Furthermore, spatially relative terms, such as "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or feature's illustrated relationship to another element or feature. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly as well.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The LED substrate is characterized by comprising a substrate, a first electrode and an LED chip;

the number of the first electrodes is multiple, and the multiple first electrodes are arranged on the substrate; each first electrode comprises two sub-electrodes, a gap is formed between the two sub-electrodes, and the gap is filled with first photoresist; the surface of one side of the first photoresist, which is far away from the substrate, is provided with a first opening with an opening direction, which is far away from one side of the substrate;

a second photoresist is formed on the first electrodes, a plurality of second openings are formed on the second photoresist between the two sub-electrodes of each first electrode, and each second opening exposes the first opening and partial areas of the two sub-electrodes;

the LED chip is placed in the second opening, a protruding portion is arranged on one side, facing the substrate, of the LED chip, and the protruding portion is inserted into the first opening.

2. The LED substrate according to claim 1, wherein the first opening has a width larger on a side away from the substrate than on a side close to the substrate, and has a width-changing shape therebetween.

3. The LED substrate according to claim 2, wherein the first opening has a shape of a cone, a pyramid, a truncated cone, or a truncated pyramid.

4. The LED substrate according to claim 3, wherein the first opening has an inclination of 45 degrees.

5. The LED substrate according to claim 1, wherein the second opening has a width larger on a side away from the substrate than on a side close to the substrate, and has a width-changing shape therebetween.

6. The LED substrate according to claim 4, wherein the second opening has a truncated cone shape or a truncated pyramid shape.

7. The LED substrate according to claim 1, wherein the shape of the protruding portion on the LED chip is a cone, a pyramid, a truncated cone, or a truncated pyramid.

8. The LED substrate according to claim 1, wherein the width of the LED chip is a, the width of the side of the first opening away from the substrate is c, and the width of the side of the second opening close to the substrate is b, and a > b-c.

9. The LED substrate according to claim 1, wherein the upper surface of the first photoresist is flush with the upper surface of the sub-electrode.

10. A display panel comprising the LED substrate according to any one of claims 1 to 9.

11. A display device characterized by comprising the display panel according to claim 10.