CN218330148U - Ultrasonic liquid level device - Google Patents
Ultrasonic liquid level device Download PDFInfo
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- CN218330148U CN218330148U CN202221834623.5U CN202221834623U CN218330148U CN 218330148 U CN218330148 U CN 218330148U CN 202221834623 U CN202221834623 U CN 202221834623U CN 218330148 U CN218330148 U CN 218330148U
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Abstract
The utility model belongs to the technical field of liquid level meters, in particular to an ultrasonic liquid level device, which comprises an ultrasonic transmitting module, an ultrasonic receiving module and a microprocessor; the ultrasonic transmitting module comprises a first conduction circuit and an ultrasonic transmitting circuit; the ultrasonic receiving module is used for receiving the reflected ultrasonic signals; the microprocessor is used for judging whether the object to be measured is liquid or not according to the reflected ultrasonic signal. The ultrasonic wave transmitting module and the ultrasonic wave receiving module in the ultrasonic wave liquid level device are simple in circuit structure and low in power consumption, and can be used in various scenes only by supplying power through the power supply voltage end with the voltage value of 3V.
Description
Technical Field
The application relates to the technical field of liquid level meters, in particular to an ultrasonic liquid level device.
Background
The ultrasonic liquid level device is a digital liquid level meter controlled by a microprocessor. The speed of the ultrasonic wave is much smaller than the speed of light, the propagation time is easy to detect, directional emission is easy, the directivity is good, the strength is good to control, the problems of winding, leakage, medium contact, expensive maintenance and the like caused by measurement modes such as a pressure transmitter, a capacitance type, a floater type and the like are solved, the ultrasonic wave height measuring device has obvious advantages and wide development prospect, and can be widely used for measuring the heights of various liquid and solid materials.
The existing ultrasonic liquid level device has complex circuit and poor anti-interference capability, and the ultrasonic wave propagation has attenuation, so that higher transmitting power is required, and the working current requirement is high.
Therefore, it is urgently needed to invent an ultrasonic liquid level device with simple circuit structure and low power consumption.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
SUMMERY OF THE UTILITY MODEL
In view of at least one of above technical problem, the application provides an ultrasonic liquid level device, has solved current ultrasonic liquid level device circuit complicacy, and the interference killing feature is poor, and ultrasonic wave propagation has the decay, therefore needs higher transmitting power, and its operating current requires big problem.
The embodiment of the first aspect of the application provides an ultrasonic liquid level device, which comprises an ultrasonic transmitting module, an ultrasonic receiving module and a microprocessor;
the ultrasonic transmitting module comprises a first conduction circuit and an ultrasonic transmitting circuit;
the first conduction circuit comprises a field effect transistor Q9 and a diode D9, the drain of the field effect transistor Q9 is connected with a power voltage end, the source of the field effect transistor Q9 is connected with the anode of the diode D9, the cathode of the diode D9 is connected with the ultrasonic emission circuit, and the cathode of the diode D9 is connected with the ultrasonic receiving module;
the ultrasonic transmitting circuit comprises an inductor L5 and a transmitting piece Y1, wherein the first end of the inductor L5 is connected with the first end of the transmitting piece Y1, the first ends of the inductor L5 and the transmitting piece Y1 are connected with the negative electrode of the diode D9, and the second end of the inductor L5 and the second end of the transmitting piece Y1 are respectively grounded;
the ultrasonic receiving module is used for receiving the reflected ultrasonic signals;
the microprocessor is used for judging whether the object to be measured is liquid or not according to the reflected ultrasonic signal.
The embodiment of the application has the following technical effects: the ultrasonic wave transmitting module and the ultrasonic wave receiving module in the ultrasonic wave liquid level device are simple in circuit structure and low in power consumption, and can be used in various scenes only by supplying power through the power supply voltage end with the voltage value of 3V.
In one implementation, the emitter Y1 is an ultrasonic sensor.
In one implementation manner, the ultrasonic receiving module includes a second conducting circuit, a first shaping filter circuit, a second shaping filter circuit, and a third shaping circuit, the second conducting circuit is connected to the first shaping filter circuit, the second shaping filter circuit, and the third shaping circuit, the first shaping filter circuit, the second shaping filter circuit, and the first shaping circuit are connected in sequence, the first shaping filter circuit is connected to the ultrasonic transmitting circuit, and the first shaping circuit is connected to the microprocessor.
In an implementation manner, the second conduction circuit includes a field effect transistor Q8, a drain of the field effect transistor Q8 is connected to the power supply voltage terminal, and a source of the field effect transistor Q8 is connected to the first shaping filter circuit, the second shaping filter circuit, and the third shaping circuit, respectively.
In one implementation manner, the first shaping filter circuit includes a level shifter Q3 and a first filter unit, the first end of the level shifter Q3 is connected to the ultrasonic transmitting circuit, the third end, the fourth end, and the fifth end of the level shifter Q3 are connected to the second conducting circuit, the fifth end of the level shifter Q3 is further connected to the second shaping filter circuit, and the first filter unit is connected to the sixth end of the level shifter Q3.
In one implementation manner, the first filtering unit includes a capacitor C9, a resistor R19, and a resistor R20, one end of the capacitor C9 and one end of the resistor R19 are respectively connected to the sixth end of the level shifter Q3, the other end of the capacitor C9 is connected to one end of the resistor R20, and the other end of the resistor R20 is connected to the other end of the resistor R19 and grounded.
In one implementation manner, the second shaping filter circuit includes a level shifter Q2 and a second filter unit, the first terminal of the level shifter Q2 is connected to the fifth terminal of the level shifter Q3, the third terminal, the fourth terminal, and the fifth terminal of the level shifter Q2 are connected to the second conducting circuit, the fifth terminal of the level shifter Q2 is further connected to the third shaping circuit, and the sixth terminal of the level shifter Q2 is connected to the second filter unit.
In one implementation manner, the second filtering unit includes a capacitor C5, a resistor R17, and a resistor R18, one end of the capacitor C5 and one end of the resistor R17 are connected to the sixth end of the level shifter Q2, one end of the capacitor C5 is connected to one end of the resistor R18, and the other end of the resistor R17 is connected to the other end of the resistor R18 and grounded.
In one implementation, the third shaping circuit includes a level shifter Q1, a third terminal and a fourth terminal of the level shifter Q1 are connected to the second shaping filter circuit, and a fifth terminal of the level shifter Q1 is connected to the microprocessor.
The present invention will be further explained with reference to the drawings and the embodiments.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a circuit diagram of an ultrasonic transmission module;
fig. 2 is a circuit diagram of an ultrasonic receiving module;
FIG. 3 is a circuit diagram of a microprocessor;
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the embodiments of the present application, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
The conventional ultrasonic liquid level device has high power consumption, can calculate a result by combining a temperature compensation circuit and a complex algorithm, has complex circuit, poor anti-interference capability, high manufacturing cost and large volume, is generally only suitable for industrial measurement, and cannot meet the requirements of industry and daily household use. The ultrasonic liquid level device in the embodiment of the application has the advantages of simple circuit structure and low circuit power consumption, and can meet the requirements of industry and daily household.
As shown in fig. 1 to 3, an embodiment of a first aspect of the present application provides an ultrasonic liquid level apparatus, which includes an ultrasonic transmitting module, an ultrasonic receiving module, and a microprocessor;
the ultrasonic wave transmitting module 100 includes a first conducting circuit 110 and an ultrasonic wave transmitting circuit 120;
the first conduction circuit 110 includes a field effect transistor Q9 and a diode D9, a drain of the field effect transistor Q9 is connected to a power supply voltage terminal, a source of the field effect transistor Q9 is connected to an anode of the diode D9, a cathode of the diode D9 is connected to the ultrasonic transmission circuit 120, and a cathode of the diode D9 is connected to the ultrasonic receiving module;
the ultrasonic transmitting circuit 120 comprises an inductor L5 and a transmitting element Y1, a first end of the inductor L5 is connected with a first end of the transmitting element Y1, a first end of the inductor L5 and a first end of the transmitting element Y1 are connected with a negative electrode of the diode D9, and a second end of the inductor L5 and a second end of the transmitting element Y1 are respectively grounded;
the ultrasonic receiving module 200 is configured to receive a reflected ultrasonic signal;
the microprocessor is used for judging whether the object to be measured is liquid or not according to the reflected ultrasonic signal.
In the first conducting circuit 110, the diode D9 has a directional blocking function, and ensures that the energy of the ultrasonic wave transmitting circuit 120 is not reversely lost. The voltage value of the power voltage terminal is 3V, and the voltage of the power voltage terminal is provided by two 3A batteries, so that the operation of the ultrasonic wave transmitting module 100 can be controlled by low voltage.
In the ultrasonic wave transmitting circuit 120, the transmitter Y1 has a capacitive effect, and the inductor L5 and the transmitter Y1 together form a capacitive-inductive oscillating unit for transmitting ultrasonic waves and receiving reflected ultrasonic waves. When the fet Q9 is turned on and provides an excitation voltage for 2.5 microseconds, the ultrasonic transmitter circuit 120 operates. The inductor L5 in the ultrasonic transmitting circuit 120 oscillates with the transmitter Y1 and then continuously operates for about 100 microseconds to continuously transmit ultrasonic waves with a frequency of 1.5MHz to 2MHz.
And (4) enabling the ultrasonic liquid level device to be close to the object to be detected and starting working. The field effect transistor Q9 in the first conduction circuit 110 is turned on, so that the first conduction circuit 110 supplies power to the ultrasonic wave transmitting circuit 120. The ultrasonic wave transmitting circuit 120 starts transmitting the ultrasonic wave. When the transmitter Y1 receives the transmitted ultrasonic wave, the ultrasonic wave is converted into an electrical signal and transmitted to the ultrasonic wave receiving module 200. The ultrasonic receiving module 200 transmits the electrical signal to the microprocessor for processing after shaping and filtering. The microprocessor captures the rising edge signal in the electric signal and judges the characteristics of the signal so as to judge whether the ultrasonic wave propagates in the liquid or not.
The propagation speed of the ultrasonic wave in the liquid is different from that in the air, and particularly, the propagation speed of the ultrasonic wave in the liquid is higher than that in the air. Therefore, if the multiple reflected waves are received within the operating time of the ultrasonic wave receiving module 200, it can be determined that the object to be measured has liquid therein.
The ultrasonic wave transmitting module 100 and the ultrasonic wave receiving module 200 in the ultrasonic wave liquid level device have simple circuit structures and low power consumption, and can be used in various scenes only by supplying power through a power supply voltage end with a voltage value of 3V.
As shown in fig. 1 to 3, the emitter Y1 is an ultrasonic sensor.
The ultrasonic sensor is illustratively a piezoelectric ceramic plate that can function as both an ultrasonic transmitter and an ultrasonic receiver. The basic characteristics of the piezoceramic wafer are that it has "piezoelectric effect", namely: when the piezoelectric ceramic plate is subjected to external pressure from the vertical direction, voltage is generated on two electrode surfaces of the piezoelectric ceramic plate along with the bending deformation (change of the geometric shape) of the plate, and the magnitude of the voltage is in direct proportion to the change of the pressure. Conversely, if a dc voltage is applied to the two electrode surfaces of the piezoceramic wafer, a corresponding mechanical deformation of the wafer occurs (i.e., the "inverse piezoelectric effect").
As shown in fig. 1 to 3, the ultrasonic receiving module 200 includes a second conducting circuit 210, a first shaping filter circuit 220, a second shaping filter circuit 230, and a third shaping circuit 240, the second conducting circuit 210 is connected to the first shaping filter circuit 220, the second shaping filter circuit 230, and the third shaping circuit 240, respectively, the first shaping filter circuit 220, the second shaping filter circuit 230, and the first shaping circuit are connected in sequence, the first shaping filter circuit 220 is connected to the ultrasonic transmitting circuit 120, and the first shaping circuit is connected to the microprocessor.
Illustratively, the second turn-on circuit 210 begins to turn on at the same time as the first turn-on circuit 110.
The first shaping filter circuit 220, the second shaping filter circuit 230, and the third shaping filter circuit 240 mainly shape and filter the electric signal of the reflected ultrasonic wave, thereby preventing unnecessary noise from being affected.
As shown in fig. 1 to 3, the second on circuit 210 includes a field effect transistor Q8, a drain of the field effect transistor Q8 is connected to the power supply voltage terminal, and a source of the field effect transistor Q8 is connected to the first shaping filter circuit 220, the second shaping filter circuit 230, and the third shaping circuit 240, respectively.
Illustratively, the source of the fet Q8 is the output of the second pass circuit 210, i.e., the VREC terminal. The source of the field effect transistor Q8 is connected to the first shaping filter circuit 220, the second shaping filter circuit 230 and the third shaping filter circuit 240, respectively, to supply power to each circuit.
As shown in fig. 1 to 3, the first shaping filter circuit 220 includes a level shifter Q3 and a first filter unit, a first terminal of the level shifter Q3 is connected to the ultrasonic transmitter circuit 120, a third terminal, a fourth terminal and a fifth terminal of the level shifter Q3 are connected to the second conducting circuit 210, a fifth terminal of the level shifter Q3 is further connected to the second shaping filter circuit 230, and the first filter unit is connected to a sixth terminal of the level shifter Q3.
Illustratively, the level shifter Q3 is a transistor matching pipe, namely two identical transistors are arranged in one device, the transistor cores of the transistors belong to the same silicon wafer, the manufacturing processes are completely the same, and the formation parameters of the transistors in the transistors are ensured to be consistent.
As shown in fig. 1 to 3, the first filtering unit includes a capacitor C9, a resistor R19, and a resistor R20, one end of the capacitor C9 and one end of the resistor R19 are respectively connected to the sixth end of the level shifter Q3, the other end of the capacitor C9 is connected to one end of the resistor R20, and the other end of the resistor R20 is connected to the other end of the resistor R19 and grounded.
Illustratively, the first filtering unit is a pi-type RC filtering circuit.
The capacitance of the capacitor C9 is 560PF. The resistance of the resistor R19 is 1K Ω. The resistance of the resistor R20 is 150 Ω.
As shown in fig. 1 to 3, the second shaping filter circuit 230 includes a level shifter Q2 and a second filter unit, a first terminal of the level shifter Q2 is connected to a fifth terminal of the level shifter Q3, a third terminal, a fourth terminal and a fifth terminal of the level shifter Q2 are connected to the second conducting circuit 210, a fifth terminal of the level shifter Q2 is further connected to the third shaping circuit 240, and a sixth terminal of the level shifter Q2 is connected to the second filter unit.
Illustratively, the level converter Q2 is a transistor matching pipe, namely two identical transistors are arranged in one device, the transistor cores of the transistors belong to the same silicon wafer, the manufacturing processes are completely the same, and the formation parameters of the transistors in the transistors are ensured to be consistent.
As shown in fig. 1 to 3, the second filtering unit includes a capacitor C5, a resistor R17, and a resistor R18, one end of the capacitor C5 and one end of the resistor R17 are connected to the sixth end of the level shifter Q2, one end of the capacitor C5 is connected to one end of the resistor R18, and the other end of the resistor R17 is connected to the other end of the resistor R18 and grounded.
Illustratively, the second filtering unit is a pi-type RC filtering circuit.
The capacitance of the capacitor C5 is 560PF. The resistance of the resistor R17 is 1K Ω. The resistance of the resistor R18 is 150 Ω.
As shown in fig. 1 to 3, the third shaping circuit 240 includes a level shifter Q1, a third terminal and a fourth terminal of the level shifter Q1 are connected to the second shaping filter circuit 230, and a fifth terminal of the level shifter Q1 is connected to the microprocessor.
Illustratively, the level shifter Q1 is a transistor matching pipe, namely two identical transistors are arranged in one device, the transistor cores of the transistors belong to the same silicon wafer, the manufacturing processes are completely the same, and the formation parameters of the transistors in the transistors are ensured to be consistent.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application in any way. Those skilled in the art can make numerous possible variations and modifications to the disclosed solution, or modify it to equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the claimed solution. Therefore, all equivalent changes in shape, structure and principle according to the present application should be covered by the protection scope of the present application without departing from the technical scheme of the present application.
Claims (9)
1. An ultrasonic liquid level device is characterized by comprising an ultrasonic transmitting module, an ultrasonic receiving module and a microprocessor;
the ultrasonic transmitting module comprises a first conduction circuit and an ultrasonic transmitting circuit;
the first conduction circuit comprises a field effect transistor Q9 and a diode D9, the drain of the field effect transistor Q9 is connected with a power voltage end, the source of the field effect transistor Q9 is connected with the anode of the diode D9, the cathode of the diode D9 is connected with the ultrasonic emission circuit, and the cathode of the diode D9 is connected with the ultrasonic receiving module;
the ultrasonic transmitting circuit comprises an inductor L5 and a transmitting piece Y1, wherein the first end of the inductor L5 is connected with the first end of the transmitting piece Y1, the first ends of the inductor L5 and the transmitting piece Y1 are connected with the negative electrode of the diode D9, and the second end of the inductor L5 and the second end of the transmitting piece Y1 are respectively grounded;
the ultrasonic receiving module is used for receiving the reflected ultrasonic signals;
the microprocessor is used for judging whether the object to be measured is liquid or not according to the reflected ultrasonic signal.
2. The ultrasonic level device of claim 1, wherein the emitter Y1 is an ultrasonic transducer.
3. The ultrasonic liquid level device according to claim 1, wherein the ultrasonic receiving module comprises a second conducting circuit, a first shaping filter circuit, a second shaping filter circuit and a third shaping circuit, the second conducting circuit is connected with the first shaping filter circuit, the second shaping filter circuit and the third shaping circuit respectively, the first shaping filter circuit, the second shaping filter circuit and the first shaping circuit are connected in sequence, the first shaping filter circuit is connected with the ultrasonic transmitting circuit, and the first shaping circuit is connected with the microprocessor.
4. The ultrasonic liquid level device according to claim 3, wherein the second conducting circuit comprises a field effect transistor Q8, a drain of the field effect transistor Q8 is connected with the power supply voltage terminal, and a source of the field effect transistor Q8 is respectively connected with the first shaping filter circuit, the second shaping filter circuit and the third shaping filter circuit.
5. The ultrasonic liquid level device according to claim 3, wherein said first shaping filter circuit comprises a level shifter Q3 and a first filter unit, a first terminal of said level shifter Q3 is connected to said ultrasonic transmitting circuit, a third terminal, a fourth terminal and a fifth terminal of said level shifter Q3 are connected to said second conducting circuit, a fifth terminal of said level shifter Q3 is further connected to said second shaping filter circuit, and said first filter unit is connected to a sixth terminal of said level shifter Q3.
6. The ultrasonic liquid level apparatus according to claim 5, wherein the first filtering unit comprises a capacitor C9, a resistor R19 and a resistor R20, one end of the capacitor C9 and one end of the resistor R19 are respectively connected to the sixth end of the level shifter Q3, the other end of the capacitor C9 is connected to one end of the resistor R20, and the other end of the resistor R20 is connected to the other end of the resistor R19 and grounded.
7. The ultrasonic liquid level apparatus according to claim 3, wherein the second shaping filter circuit comprises a level shifter Q2 and a second filter unit, the first terminal of the level shifter Q2 is connected to the fifth terminal of the level shifter Q3, the third terminal, the fourth terminal and the fifth terminal of the level shifter Q2 are connected to the second conducting circuit, the fifth terminal of the level shifter Q2 is further connected to the third shaping circuit, and the sixth terminal of the level shifter Q2 is connected to the second filter unit.
8. The ultrasonic liquid level apparatus according to claim 7, wherein the second filtering unit comprises a capacitor C5, a resistor R17 and a resistor R18, one end of the capacitor C5 and one end of the resistor R17 are connected to the sixth end of the level shifter Q2, one end of the capacitor C5 is connected to one end of the resistor R18, and the other end of the resistor R17 is connected to the other end of the resistor R18 and grounded.
9. The ultrasonic liquid level device according to claim 3, wherein said third shaping circuit comprises a level shifter Q1, a third terminal and a fourth terminal of said level shifter Q1 are connected to said second shaping filter circuit, and a fifth terminal of said level shifter Q1 is connected to said microprocessor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221834623.5U CN218330148U (en) | 2022-07-15 | 2022-07-15 | Ultrasonic liquid level device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221834623.5U CN218330148U (en) | 2022-07-15 | 2022-07-15 | Ultrasonic liquid level device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218330148U true CN218330148U (en) | 2023-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221834623.5U Active CN218330148U (en) | 2022-07-15 | 2022-07-15 | Ultrasonic liquid level device |
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|---|---|
| CN (1) | CN218330148U (en) |
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2022
- 2022-07-15 CN CN202221834623.5U patent/CN218330148U/en active Active
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