CN218314491U

CN218314491U - Crystal bar slicing machine for semiconductor processing

Info

Publication number: CN218314491U
Application number: CN202222498600.8U
Authority: CN
Inventors: 沈华; 刘喜荣
Original assignee: Hongyi Semiconductor Nantong Co ltd
Current assignee: Hongyi Semiconductor Nantong Co ltd
Priority date: 2022-09-21
Filing date: 2022-09-21
Publication date: 2023-01-17
Anticipated expiration: 2032-09-21

Abstract

The utility model discloses a crystal bar slicer is used in semiconductor processing, this crystal bar slicer is used in semiconductor processing aim at solving prior art and be not convenient for carry out the section simultaneously to the multiunit crystal bar down, and the lower technical problem of section efficiency. The crystal bar slicing machine comprises a workbench; the utility model discloses a push plate, including workstation, extension board, push plate, baffle, push plate and cylinder, the upper end fixed mounting of workstation has the baffle, the outside of workstation is provided with the extension board, the outside of extension board is provided with pushes away the material subassembly, the outside that pushes away the material subassembly is provided with the push pedal, the push pedal with baffle sliding connection, the upper end fixed mounting of workstation has the mount, the upper end of mount is provided with the cylinder. This crystal bar slicer for semiconductor processing only needs to drive the push pedal through pushing away the material subassembly and removes, promotes the crystal bar through the push pedal, promotes the section subassembly through the cylinder and moves down, cuts the crystal bar in step through the section subassembly to realized slicing simultaneously the multistation of crystal bar and handled, improved the work efficiency of crystal bar slicer.

Description

Crystal bar slicing machine for semiconductor processing

Technical Field

The utility model belongs to the technical field of semiconductor processing, concretely relates to crystal bar slicer for semiconductor processing.

Background

Nowadays, semiconductors are common electronic components used in electronic devices, and are materials having electrical conductivity between a conductor and an insulator at normal temperature.

At present, the utility model patent of patent number CN202122071222.0 discloses a crystal bar slicer for semiconductor processing, and is relatively poor to current crystal bar slicer stability when the section, the easy problem that appears the skew when the section, now proposes following scheme, and it includes processing platform, two erects board, two lift adjustment seats, slicer body, elevating system, slicer seat and two clamping control mechanism, two erect the equal fixed mounting of board at the top of processing platform, two the adjustment tank has all been seted up to one side that the erects the board and is close to each other, lift adjustment seat slidable mounting is in the adjustment tank that corresponds, slicer body fixed mounting is between two lift adjustment seats, elevating system sets up on erectting the board, elevating system is connected with the lift adjustment seat. The utility model discloses a crystal bar slicer stability is better when the section, and the difficult emergence skew of crystal bar when the section, section efficiency is higher. What its adopted is the skew when preventing to cut into slices through elevating system, but this crystal bar slicer is in the use, is not convenient for carry out the while section to multiunit crystal bar, and section efficiency is lower, inconvenient use.

Therefore, in order to solve the problems that the conventional ingot slicing machine for semiconductor processing is inconvenient for multi-station slicing after being used and has low slicing efficiency, the practicability of the slicing machine needs to be improved.

SUMMERY OF THE UTILITY MODEL

(1) Technical problem to be solved

An insufficient to prior art, the utility model aims to provide a crystal bar slicer for semiconductor processing, this crystal bar slicer for semiconductor processing aims at solving prior art and is not convenient for carry out the section simultaneously to the multiunit crystal bar down, and the lower technical problem of section efficiency.

(2) Technical scheme

In order to solve the technical problem, the utility model provides a crystal bar slicing machine for semiconductor processing, which comprises a workbench; the utility model discloses a cutting tool, including workstation, extension board, push pedal, baffle, mount, cylinder, the upper end fixed mounting of workstation has the baffle, the outside of workstation is provided with the extension board, the outside of extension board is provided with pushes away the material subassembly, the outside that pushes away the material subassembly is provided with the push pedal, the push pedal with baffle sliding connection, the upper end fixed mounting of workstation has the mount, the upper end of mount is provided with the cylinder, the output of cylinder is provided with the mounting panel, the bottom of mounting panel is provided with the section subassembly.

When the crystal bar slicing machine for semiconductor processing is used, a crystal bar is arranged between the partition plates, the pushing assembly drives the push plate to move, the crystal bar is pushed by the push plate, the mounting plate is pushed by the air cylinder to move downwards, the mounting plate drives the slicing assembly to move downwards, and the crystal bar is synchronously cut by the slicing assembly, so that multi-station simultaneous slicing processing of the crystal bar is realized, and the working efficiency of the crystal bar slicing machine is improved.

Preferably, the inside of pushing away the material subassembly is including the motor, the motor set up in the outside of extension board, the output of motor is provided with the threaded rod, the outside of threaded rod is provided with a screw thread section of thick bamboo, the one end of a screw thread section of thick bamboo with the outside interconnect of push pedal, a screw thread section of thick bamboo with the threaded rod lead screw is connected, and starter motor drives the threaded rod and rotates, is connected the push pedal that drives through the threaded rod and the lead screw of a screw thread section of thick bamboo and removes.

Furthermore, the inside of pushing away the material subassembly includes a gag lever post, the gag lever post set up in the outside of extension board, the outside of gag lever post is provided with spacing section of thick bamboo, the one end of a spacing section of thick bamboo with the outside interconnect of push pedal, the gag lever post with spacing section of thick bamboo sliding connection removes spacing processing to the push pedal through the sliding connection of gag lever post and a spacing section of thick bamboo.

Preferably, the slicing assembly's inside is including a spacing axle, spacing axle set up in the inboard of mounting panel, spacing axle with mounting panel sliding connection, the outside of spacing axle is provided with the spring, compresses spacing processing through the sliding connection of spacing axle and mounting panel to the spring.

Furthermore, the slicing assembly is internally provided with a bottom plate, the bottom plate is arranged at the bottom end of the limiting shaft, the upper end of the bottom plate is connected with the bottom end of the spring, and when the scraping groove is folded, the bottom plate is reset by the elasticity of the spring.

Still further, the inside of section subassembly is including scraping the silo, scrape the silo set up in the bottom of mounting panel, it is provided with the multiunit to scrape the silo, the blade has been seted up to the inboard of bottom plate, the blade with scrape silo sliding connection, scrape the silo through the multiunit and cut the crystal bar, prevent the card material through the blade with the sliding connection who scrapes the silo.

(3) Advantageous effects

Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model discloses a bar crystal slicer for semiconductor processing utilizes and arranges the bar crystal in between the baffle, the starter motor drives the threaded rod and rotates, it removes to be connected the drive push pedal through the threaded rod with the lead screw of screw thread section of thick bamboo, sliding connection through gag lever post and spacing section of thick bamboo removes spacing processing to the push pedal, promote the bar crystal through the push pedal, promote the mounting panel lapse through the cylinder, it removes downwards to scrape the silo through the mounting panel drive, scrape the silo through the multiunit and cut the bar crystal, when scraping the silo and receive, the bottom plate receives the elasticity of spring and resets, sliding connection through spacing axle and mounting panel compresses spacing processing to the spring, sliding connection through blade and scraping the silo prevents the card material, thereby realized slicing simultaneously the multistation to the bar crystal and handling, the work efficiency of bar slicer is improved.

Drawings

In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the descriptions in the prior art will be briefly described below, it is obvious that the drawings in the following description are only one embodiment of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic diagram of a three-dimensional structure according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of a front view section according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a side view section according to an embodiment of the present invention.

The labels in the figures are: 1. a work table; 2. a partition plate; 3. an extension plate; 4. a material pushing assembly; 5. pushing a plate; 6. a fixed mount; 7. a cylinder; 8. mounting a plate; 9. a slicing assembly; 10. a motor; 11. a threaded rod; 12. a threaded barrel; 13. a limiting rod; 14. a limiting cylinder; 15. a limiting shaft; 16. a spring; 17. a base plate; 18. a material scraping groove; 19. a blade.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the following description is made for the technical solution of the present invention in the embodiments to explain the present invention clearly and completely, obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments.

Examples

The crystal bar slicing machine for semiconductor processing comprises a worktable 1, a slicing table and a slicing machine, wherein the slicing table is provided with a vertical structure and a horizontal structure; the upper end fixed mounting of workstation 1 has baffle 2, and the outside of workstation 1 is provided with extension board 3, and the outside of extension board 3 is provided with pushes away material subassembly 4, and the outside that pushes away material subassembly 4 is provided with push pedal 5, and push pedal 5 and baffle 2 sliding connection, the upper end fixed mounting of workstation 1 has mount 6, and the upper end of mount 6 is provided with cylinder 7, and the output of cylinder 7 is provided with mounting panel 8, and the bottom of mounting panel 8 is provided with section subassembly 9.

Wherein, the inside of pushing away material subassembly 4 is including motor 10, motor 10 sets up in the outside of extending board 3, the output of motor 10 is provided with threaded rod 11, the outside of threaded rod 11 is provided with a screw thread section of thick bamboo 12, the one end of screw thread section of thick bamboo 12 and the outside interconnect of push pedal 5, screw thread section of thick bamboo 12 is connected with the 11 lead screws of threaded rod, starter motor 10 drives threaded rod 11 and rotates, it drives push pedal 5 and removes to be connected with the lead screw of screw thread section of thick bamboo 12 through threaded rod 11, the inside of pushing away material subassembly 4 includes a gag lever post 13, gag lever post 13 sets up in the outside of extending board 3, the outside of gag lever post 13 is provided with spacing section of thick bamboo 14, the one end of spacing section of thick bamboo 14 and the outside interconnect of push pedal 5,

gag lever post

13 and 14 sliding connection of spacing section of thick bamboo move spacing processing to push pedal 5.

The embodiment is used for a crystal bar slicing machine for semiconductor processing, a schematic side view section structure thereof is shown in fig. 3, the slicing assembly 9 comprises a limiting shaft 15 inside, the limiting shaft 15 is arranged on the inner side of a mounting plate 8, the limiting shaft 15 is connected with the mounting plate 8 in a sliding manner, a spring 16 is arranged on the outer side of the limiting shaft 15, the spring 16 is compressed and limited through the sliding connection of the limiting shaft 15 and the mounting plate 8, the slicing assembly 9 comprises a bottom plate 17 inside, the bottom plate 17 is arranged at the bottom end of the limiting shaft 15, the upper end of the bottom plate 17 is connected with the bottom end of the spring 16, and when the scraping groove 18 is retracted, the bottom plate 17 is reset by the elastic force of the spring 16.

Simultaneously, section subassembly 9's inside is including scraping silo 18, scrapes silo 18 and sets up in the bottom of mounting panel 8, scrapes silo 18 and is provided with the multiunit, and blade 19 has been seted up to bottom plate 17's inboard, and blade 19 with scrape 18 sliding connection in silo, scrape silo 18 through the multiunit and cut the crystal bar, prevent the card material through blade 19 and the sliding connection who scrapes silo 18.

When using this technical scheme's crystal bar slicer for semiconductor processing, arrange the crystal bar between baffle 2 in, starter motor 10 drives threaded rod 11 and rotates, it moves to drive push pedal 5 through the lead screw connection of threaded rod 11 and screw cylinder 12, sliding connection through gag lever post 13 and spacing section of thick bamboo 14 removes spacing processing to push pedal 5, promote the crystal bar through push pedal 5, promote mounting panel 8 downstream through cylinder 7, scrape silo 18 downstream through the drive of mounting panel 8, scrape silo 18 through the multiunit and cut the crystal bar, when scraping silo 18 and pack up, bottom plate 17 receives the elasticity of spring 16 and resets, compress spacing processing to spring 16 through the sliding connection of spacing axle 15 and mounting panel 8, prevent the card material through blade 19 and the sliding connection who scrapes silo 18, thereby realized the multistation simultaneous slicing processing to the crystal bar, the work efficiency of crystal bar slicer has been improved.

Having thus described the principal technical features and basic principles of the invention, and the advantages thereof, it will be apparent to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other embodiments without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description describes embodiments, not every embodiment includes only a single embodiment, and such descriptions are provided for clarity only, and those skilled in the art will recognize that the embodiments described herein may be combined as a whole to form other embodiments as would be understood by those skilled in the art.

Claims

1. A crystal bar slicing machine for semiconductor processing comprises a worktable (1); its characterized in that, the upper end fixed mounting of workstation (1) has baffle (2), the outside of workstation (1) is provided with extension board (3), the outside of extension board (3) is provided with pushes away material subassembly (4), the outside that pushes away material subassembly (4) is provided with push pedal (5), push pedal (5) with baffle (2) sliding connection, the upper end fixed mounting of workstation (1) has mount (6), the upper end of mount (6) is provided with cylinder (7), the output of cylinder (7) is provided with mounting panel (8), the bottom of mounting panel (8) is provided with section subassembly (9).

2. The crystal bar slicing machine for semiconductor processing according to claim 1, wherein the pushing assembly (4) comprises a motor (10) inside, the motor (10) is arranged outside the extending plate (3), a threaded rod (11) is arranged at an output end of the motor (10), a threaded cylinder (12) is arranged outside the threaded rod (11), one end of the threaded cylinder (12) is connected with the outside of the pushing plate (5) in a screw manner, and the threaded cylinder (12) is connected with the threaded rod (11) in a screw manner.

3. The slicing machine for the crystal bar for processing the semiconductor according to claim 2, wherein the pushing assembly (4) comprises a limiting rod (13) inside, the limiting rod (13) is arranged outside the extending plate (3), a limiting cylinder (14) is arranged outside the limiting rod (13), one end of the limiting cylinder (14) is connected with the outside of the pushing plate (5) in a sliding mode, and the limiting rod (13) is connected with the limiting cylinder (14) in a sliding mode.

4. The slicing machine for the crystal bar for the semiconductor processing is characterized in that the slicing assembly (9) comprises a limiting shaft (15) inside, the limiting shaft (15) is arranged on the inner side of the mounting plate (8), the limiting shaft (15) is connected with the mounting plate (8) in a sliding mode, and a spring (16) is arranged on the outer side of the limiting shaft (15).

5. The slicing machine for the crystal bar used in the semiconductor process according to claim 4, wherein the inside of the slicing assembly (9) comprises a bottom plate (17), the bottom plate (17) is arranged at the bottom end of the limiting shaft (15), and the upper end of the bottom plate (17) is connected with the bottom end of the spring (16).

6. The crystal bar slicing machine for processing the semiconductor as claimed in claim 5, wherein the slicing assembly (9) comprises a scraping groove (18) inside, the scraping groove (18) is arranged at the bottom end of the mounting plate (8), the scraping grooves (18) are provided with a plurality of groups, a blade (19) is arranged on the inner side of the bottom plate (17), and the blade (19) is connected with the scraping groove (18) in a sliding manner.