CN218308946U - Dispensing device for electronic element - Google Patents
Dispensing device for electronic element Download PDFInfo
- Publication number
- CN218308946U CN218308946U CN202222211886.7U CN202222211886U CN218308946U CN 218308946 U CN218308946 U CN 218308946U CN 202222211886 U CN202222211886 U CN 202222211886U CN 218308946 U CN218308946 U CN 218308946U
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- Prior art keywords
- dispensing
- head
- slider
- electronic components
- brush
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- 239000000428 dust Substances 0.000 claims abstract description 61
- 239000003292 glue Substances 0.000 claims abstract description 56
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 10
- 238000004026 adhesive bonding Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
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Abstract
The utility model discloses an electronic component's adhesive deposite device, include: the positioning mechanism is provided with a base and a storage table arranged on the base, the top of the storage table is provided with a positioning groove, and the positioning groove is used for accommodating an electronic element; the dispensing mechanism is used for dispensing the electronic element, is arranged on the base, and is provided with a first support and a dispensing head arranged on the first support, and the dispensing head is positioned above the positioning groove; the cleaning mechanism is used for cleaning dust of electronic components before dispensing, is arranged on one side of the dispensing head, is provided with a brush, a dust suction head arranged on one side of the brush and a negative pressure device for providing negative pressure airflow, and is communicated with the negative pressure device through a dust suction pipe, and the dust suction head is used for sucking away the dust raised by the brush. The utility model discloses can clear up the dust on the electronic component automatically, guarantee to glue the quality.
Description
Technical Field
The utility model relates to an equipment technical field is glued to the point, in particular to electronic component's adhesive deposite device.
Background
Electronic components are basic elements of electronic circuits, and are usually packaged individually, and have two or more leads or metal contacts, the electronic components must be connected to each other to form an electronic circuit with specific functions, and in order to maintain the stability of the operation of the electronic components, a dispensing device is required to be used for dispensing during the processing of the electronic components to improve the insulation and protect the electronic components from the environment.
However, some dust is adhered to the electronic components before dispensing, the dust may corrode the electronic components, and even may cause short-circuit and other phenomena to the electronic components.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides an electronic component's adhesive deposite device can clear up the dust on the electronic component automatically, guarantees the quality of point gluing, improves electronic component's performance.
According to the utility model discloses electronic component's adhesive deposite device, include: the positioning mechanism is provided with a base and a storage table arranged on the base, the top of the storage table is provided with a positioning groove, and the positioning groove is used for accommodating an electronic element; the dispensing mechanism is used for dispensing the electronic element, is arranged on the base, and is provided with a first support and a dispensing head arranged on the first support, and the dispensing head is positioned above the positioning groove; the cleaning mechanism is used for cleaning dust of electronic components before dispensing, is arranged on one side of the dispensing head, is provided with a brush, a dust suction head arranged on one side of the brush and a negative pressure device for providing negative pressure airflow, and is communicated with the negative pressure device through a dust suction pipe, and the dust suction head is used for sucking away the dust raised by the brush.
According to the utility model discloses electronic component's adhesive deposite device has following beneficial effect at least:
1. this embodiment puts the thing platform through setting up, puts thing bench top and is provided with the constant head tank, and electronic component can fix electronic component on putting the constant head tank to, realize electronic component's accurate location, improve equipment's stability.
2. This embodiment makes clean mechanism have negative pressure device, dust absorption head and brush through setting up clean mechanism, and before the point was glued, the dust that the brush that sets up on one side of the head of gluing was raised the electronic component, and then negative pressure device provides the negative pressure air current, and the dust absorption head that communicates with negative pressure device siphons away the dust that raises to, can clear up the dust on the electronic component automatically, guarantee to glue the quality, improve electronic component's performance.
According to some embodiments of the utility model, the mechanism is glued to point has horizontal translation subassembly, horizontal translation subassembly sets up first support, horizontal translation subassembly has first guide rail, sliding connection is in first slider, drive on the first guide rail the drive assembly that first slider removed, the head setting is glued to the point is in first slider.
The beneficial results are: through setting up horizontal translation subassembly, the first slider of drive assembly drive removes at first guide rail to, realize the lateral shifting of dispensing head, and then, can glue the point to electronic component's different positions.
According to some embodiments of the utility model, the drive assembly has first lead screw, drive first lead screw pivoted first motor, first slider be provided with the first screw hole that first lead screw closes soon.
The beneficial results are: through setting up first lead screw and first motor, first slider is provided with the first screw hole of closing soon with first lead screw, and first motor drive first lead screw rotates, then drives first slider and removes to, can improve the transmission precision of horizontal translation subassembly, the transmission is steady, simple structure.
According to some embodiments of the utility model, the mechanism of gluing still has lifting unit, lifting unit sets up first slider, lifting unit has the second support, sets up second guide rail, the sliding connection of second support are in second slider, the drive on the second guide rail the first cylinder that the second slider reciprocated, the head setting of gluing is in the second slider.
The beneficial results are: through setting up lifting unit, first cylinder drives the second slider and reciprocates along the second guide rail, then drives the dispensing head and reciprocates, and during the point was glued, the dispensing head downstream made the dispensing head be close to electronic component, and the back is glued to the point, and the dispensing head rebound makes the dispensing head keep away from electronic component to, can prevent that the dispensing head from touching electronic component when horizontal translation, and then, can prevent dispensing head or electronic component's damage.
According to some embodiments of the utility model, the base with it is provided with vertical translation subassembly to put between the thing platform, vertical translation subassembly has third guide rail, second lead screw, drive second lead screw pivoted second motor, it is in to put thing platform sliding connection the third guide rail, put the thing platform be provided with the second screw hole that the second lead screw closes soon.
The beneficial results are: through setting up vertical translation subassembly, second motor drive second lead screw rotates, and the second lead screw drives puts the thing platform and vertically translates along the third guide rail, makes to put the electronic component on the thing platform and can vertically translate, through mutually supporting of horizontal translation subassembly, lifting unit and vertical translation subassembly to, can realize that the omnidirectional point of electronic component is glued, improved the point and glued the accuracy.
According to some embodiments of the utility model, the dispensing head has the storage and glues jar, sets up the storage is glued the dispensing pump of tank bottoms end, is set up the glue dispensing needle tubing of dispensing pump bottom end, the storage is glued the jar and is used for storing glue, the dispensing pump passes through glue and is glued the needle tubing and carry.
The beneficial results are: glue jar, point glue pump and point glue needle tubing through setting up storage, glue is stored in storage glue jar, and the pump is glued to point can be carried a certain amount of glue through a little glue needle tubing, accomplishes the point and glues work to, realize automatic point glue, it is even to go out to glue, and it is efficient to glue.
According to some embodiments of the present invention, the bottom of the dispensing needle tube is a bevel.
The beneficial results are: the bottom of the dispensing needle tube is provided with the bevel opening, so that the back pressure generated by the dispensing needle tube can be reduced, and the glue can flow smoothly.
According to some embodiments of the utility model, store up gluey jar inner wall and be provided with the heater.
The beneficial results are: through setting up the heater, the heater can be heated the glue of storage in gluing the jar, makes glue keep at the molten state to, prevent that glue from appearing the phenomenon of condensing in long-time storage.
According to some embodiments of the utility model, the brush is the annular, the dust absorption head is tubaeform, the brush cup joints the syringe is glued to the point, the dust absorption head cup joints the brush.
The beneficial results are: through making the brush be the annular, the dust absorption head is loudspeaker form, and during the point was glued, the point was glued the head and is removed electronic component's optional position, and the dust around the point was glued the head and can be raised by the brush, and the dust that raises passes through the dust absorption head and inhales the dust absorption pipe to, can clear up the dust in each position around the point was glued the head, improve dust absorption effect.
According to some embodiments of the utility model, the dust absorption head is inside to be provided with the annular channel, the annular channel with the dust absorption pipe intercommunication, the inward flange of annular channel is higher than the outward flange of annular channel.
The beneficial results are: through setting up annular passage, annular passage's inward flange is higher than the outward flange, prevents the dust diffusion around the dispensing head, makes the dust around the dispensing head gather to annular passage to, further improve dust collection effect.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a dispensing apparatus for electronic components according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;
fig. 3 is a schematic structural diagram of the dispensing head in fig. 1.
Reference numerals: 100-a positioning mechanism, 110-a base, 120-a placing table, 130-a positioning groove, 140-a glue dispensing mechanism, 150-a first support, 160-a glue dispensing head, 170-a cleaning mechanism, 180-a negative pressure device, 190-a dust suction head, 200-a brush, 210-a transverse translation component, 220-a first guide rail, 230-a first sliding block, 240-a driving component, 250-a first screw rod, 260-a first motor, 270-a lifting component, 280-a second support, 290-a second guide rail, 300-a second sliding block, 310-a first cylinder, 320-a longitudinal translation component, 330-a third guide rail, 340-a second screw rod, 350-a second motor, 360-a glue storage tank, 370-a glue dispensing pump, 380-a glue dispensing needle tube, 390-a heater and 400-an annular channel.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The following describes an electronic component's adhesive deposite device according to the embodiment of the present invention with reference to the drawings.
Referring to fig. 1 and fig. 2, an electronic component dispensing device according to an embodiment of the present invention includes a positioning mechanism 100, a dispensing mechanism 140, and a cleaning mechanism 170.
The positioning mechanism 100 has a base 110 and a platform 120 disposed on the base 110, wherein a positioning groove 130 is disposed on the top of the platform 120, and the positioning groove 130 accommodates an electronic component.
Structurally, the dispensing mechanism 140 is disposed on the base 110, and has a first bracket 150 and a dispensing head 160 disposed on the first bracket 150, the dispensing head 160 is located above the positioning slot 130, and the dispensing head 160 is used for dispensing the electronic component.
Further, the cleaning mechanism 170 is disposed at one side of the dispensing head 160, and has a brush 200, a dust suction head 190 disposed at one side of the brush 200, and a negative pressure device 180 for providing a negative pressure airflow, wherein the dust suction head 190 is communicated with the negative pressure device 180 through a dust suction pipe, and the dust suction head 190 is used for sucking away dust raised by the brush 200.
Specifically, the electronic component is placed on the positioning groove 130, the electronic component can be fixed, then, the brush 200 disposed on one side of the dispensing head 160 lifts up dust on the electronic component, then, the negative pressure device 180 provides a negative pressure airflow, the dust suction head 190 communicated with the negative pressure device 180 sucks up the lifted dust, and finally, the dispensing head 160 dispenses the electronic component.
Therefore, the embodiment can automatically clean dust on the electronic element, ensure the dispensing quality and improve the performance of the electronic element.
In order to reduce the moving time of the electronic components, the positioning grooves 130 are provided in plural, so that a plurality of electronic components can be placed on the object placing table 120, and the dispensing head 160 can dispense the plurality of electronic components, thereby improving the dispensing efficiency.
In some preferred embodiments, the dispensing mechanism 140 has a lateral translation assembly 210, the lateral translation assembly 210 is disposed on the first frame 150, the lateral translation assembly 210 has a first guide rail 220, a first slider 230 slidably connected to the first guide rail 220, a driving assembly 240 for driving the first slider 230 to move, and the dispensing head 160 is disposed on the first slider 230.
It can be understood that, by providing the lateral translation assembly 210, the driving assembly 240 drives the first slider 230 to move on the first guide rail 220, thereby achieving lateral movement of the dispensing head 160, and further, dispensing of different positions of the electronic component can be performed.
Specifically, the driving assembly 240 has a first screw rod 250 and a first motor 260 for driving the first screw rod 250 to rotate, the first slider 230 is provided with a first threaded hole screwed with the first screw rod 250, the first motor 260 drives the first screw rod 250 to rotate, and then the first slider 230 is driven to move, so that the transmission precision of the transverse translation assembly 210 can be improved, the transmission is stable, and the structure is simple.
In some preferred embodiments, the dispensing mechanism 140 further has a lifting assembly 270, the lifting assembly 270 is disposed on the first slider 230, the lifting assembly 270 has a second bracket 280, a second rail 290 disposed on the second bracket 280, a second slider 300 slidably connected to the second rail 290, a first cylinder 310 driving the second slider 300 to move up and down, and the dispensing head 160 is disposed on the second slider 300.
It can be understood that, through setting up lifting unit 270, first cylinder 310 drives second slider 300 and reciprocates along second guide rail 290, then it reciprocates to drive dispensing head 160, during the point is glued, dispensing head 160 moves down, make dispensing head 160 be close to electronic component, the back of gluing, dispensing head 160 rebound, make dispensing head 160 keep away from electronic component, thereby, can prevent that dispensing head 160 from touching electronic component when horizontal translation, and then, can prevent dispensing head 160 or electronic component's damage.
In some preferred embodiments, a longitudinal translation assembly 320 is disposed between the base 110 and the object placing table 120, the longitudinal translation assembly 320 has a third guide rail 330, a second lead screw 340, and a second motor 350 for driving the second lead screw 340 to rotate, the object placing table 120 is slidably connected to the third guide rail 330, and the object placing table 120 is provided with a second threaded hole screwed with the second lead screw 340.
It can be understood that, through setting up vertical translation subassembly 320, second motor 350 drive second lead screw 340 rotates, and second lead screw 340 drives and puts thing platform 120 along the vertical translation of third guide rail 330, makes the electronic component on putting thing platform 120 can vertical translation, through horizontal translation subassembly 210, lifting unit 270 and vertical translation subassembly 320 mutually supporting, thereby, can realize that the omnidirectional point of electronic component is glued, improved the point accuracy of gluing.
Referring to fig. 3, in some preferred embodiments, the dispensing head 160 has a glue storage tank 360, a dispensing pump 370 disposed at a bottom end of the glue storage tank 360, and a dispensing needle tube 380 disposed at a bottom end of the dispensing pump 370, the glue storage tank 360 is used for storing glue, and the dispensing pump 370 transports the glue through the dispensing needle tube 380.
It can be understood that, through setting up storage glue jar 360, point and glue pump 370 and some glue syringe 380, glue is stored in storage glue jar 360, and point and glue pump 370 can carry a certain amount of glue through some glue syringe 380, accomplishes some glue work to, realize automatic point and glue, it is even to go out to glue, and it is efficient to glue.
In some preferred embodiments, the bottom of the dispensing needle 380 is beveled.
It can be understood that the back pressure generated by the dispensing needle tube 380 can be reduced by making the bottom of the dispensing needle tube 380 an inclined opening, so that the glue can flow smoothly.
In some preferred embodiments, the inner wall of the glue tank 360 is provided with a heater 390.
It can be understood that, by providing the heater 390, the heater 390 can heat the glue stored in the glue storage tank 360 to keep the glue in a molten state, thereby preventing the glue from being coagulated during long-term storage.
In some preferred embodiments, the brush 200 is annular, the cleaning head 190 is flared, the brush 200 is sleeved on the dispensing needle tube 380, and the cleaning head 190 is sleeved on the brush 200.
It can be understood that, by making the brush 200 be annular, the dust collection head 190 be horn-shaped, when dispensing, the dispensing head 160 moves to any position of the electronic component, and the dust around the dispensing head 160 can be lifted by the brush 200, and the lifted dust is sucked into the dust collection pipe through the dust collection head 190, so that the dust around the dispensing head 160 in all directions can be cleaned, and the dust collection effect is improved.
In some preferred embodiments, an annular channel 400 is provided inside the cleaning head 190, the annular channel 400 communicating with the cleaning tube, an inner edge of the annular channel 400 being higher than an outer edge of the annular channel 400.
It can be understood that, by providing the annular passage 400 such that the inner edge of the annular passage 400 is higher than the outer edge, the dust around the dispensing head 160 is prevented from being scattered, and the dust around the dispensing head 160 is gathered toward the annular passage 400, thereby further improving the dust suction effect.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. An electronic component dispensing device, comprising:
the positioning mechanism (100) is provided with a base (110) and an object placing table (120) arranged on the base (110), a positioning groove (130) is arranged at the top of the object placing table (120), and the positioning groove (130) is used for accommodating an electronic component;
the dispensing mechanism (140) is used for dispensing the electronic components, is arranged on the base (110), and is provided with a first bracket (150) and a dispensing head (160) arranged on the first bracket (150), and the dispensing head (160) is positioned above the positioning groove (130);
the cleaning mechanism (170) is used for cleaning dust of electronic components before dispensing, is arranged on one side of the dispensing head (160), is provided with a brush (200), a dust suction head (190) arranged on one side of the brush (200) and a negative pressure device (180) for providing negative pressure airflow, the dust suction head (190) is communicated with the negative pressure device (180) through a dust suction pipe, and the dust suction head (190) is used for sucking away the dust raised by the brush (200).
2. The dispensing apparatus of an electronic component according to claim 1, wherein the dispensing mechanism (140) has a lateral translation assembly (210), the lateral translation assembly (210) is disposed on the first bracket (150), the lateral translation assembly (210) has a first guide rail (220), a first slider (230) slidably connected to the first guide rail (220), and a driving assembly (240) for driving the first slider (230) to move, and the dispensing head (160) is disposed on the first slider (230).
3. The dispensing apparatus of electronic components as claimed in claim 2, wherein the driving assembly (240) has a first screw (250), a first motor (260) for driving the first screw (250) to rotate, and the first slider (230) is provided with a first threaded hole screwed with the first screw (250).
4. The dispensing apparatus of electronic components according to claim 2, wherein the dispensing mechanism (140) further comprises a lifting assembly (270), the lifting assembly (270) is disposed on the first slider (230), the lifting assembly (270) comprises a second bracket (280), a second guide rail (290) disposed on the second bracket (280), a second slider (300) slidably connected to the second guide rail (290), and a first cylinder (310) for driving the second slider (300) to move up and down, and the dispensing head (160) is disposed on the second slider (300).
5. The dispensing apparatus of electronic components according to claim 1, wherein a longitudinal translation assembly (320) is disposed between the base (110) and the object stage (120), the longitudinal translation assembly (320) has a third guide rail (330), a second lead screw (340), and a second motor (350) for driving the second lead screw (340) to rotate, the object stage (120) is slidably connected to the third guide rail (330), and the object stage (120) has a second threaded hole screwed with the second lead screw (340).
6. The dispensing apparatus of electronic components according to claim 1, wherein the dispensing head (160) has a glue storage tank (360), a dispensing pump (370) disposed at a bottom end of the glue storage tank (360), and a dispensing needle tube (380) disposed at a bottom end of the dispensing pump (370), the glue storage tank (360) is used for storing glue, and the dispensing pump (370) delivers the glue through the dispensing needle tube (380).
7. The dispensing apparatus of electronic components as claimed in claim 6, wherein the bottom of the dispensing needle tube (380) is beveled.
8. The dispensing apparatus of electronic components as claimed in claim 6, wherein the inner wall of the glue storage tank (360) is provided with a heater (390).
9. The dispensing apparatus of electronic components as claimed in claim 6, wherein the brush (200) is annular, the suction head (190) is flared, the brush (200) is sleeved on the dispensing needle tube (380), and the suction head (190) is sleeved on the brush (200).
10. The dispensing device for electronic components of claim 9, wherein an annular channel (400) is arranged inside the dust suction head (190), the annular channel (400) is communicated with the dust suction pipe, and an inner edge of the annular channel (400) is higher than an outer edge of the annular channel (400).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222211886.7U CN218308946U (en) | 2022-08-22 | 2022-08-22 | Dispensing device for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222211886.7U CN218308946U (en) | 2022-08-22 | 2022-08-22 | Dispensing device for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218308946U true CN218308946U (en) | 2023-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222211886.7U Active CN218308946U (en) | 2022-08-22 | 2022-08-22 | Dispensing device for electronic element |
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| Country | Link |
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| CN (1) | CN218308946U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650085A (en) * | 2024-01-29 | 2024-03-05 | 凯瑞电子(诸城)有限公司 | Semiconductor chip packaging device |
-
2022
- 2022-08-22 CN CN202222211886.7U patent/CN218308946U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650085A (en) * | 2024-01-29 | 2024-03-05 | 凯瑞电子(诸城)有限公司 | Semiconductor chip packaging device |
| CN117650085B (en) * | 2024-01-29 | 2024-04-16 | 凯瑞电子(诸城)有限公司 | Semiconductor chip packaging device |
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Effective date of registration: 20240521 Address after: Room 205, No. 8 Shengyi Road, Yuhang Street, Yuhang District, Hangzhou City, Zhejiang Province, 311121 Patentee after: HANGZHOU AIXIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 526000 Room 302, 3rd floor, office building of Dongling Leather Co., Ltd., Dawang District, High-tech Zone, Zhaoqing City, Guangdong Province (only for business office purposes) Patentee before: Zhaoqing Hi-tech Zone Zhifeng Technology Co.,Ltd. Country or region before: China |