CN218302044U - High-efficiency radiator of handheld depilating instrument - Google Patents

High-efficiency radiator of handheld depilating instrument Download PDF

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Publication number
CN218302044U
CN218302044U CN202222414789.8U CN202222414789U CN218302044U CN 218302044 U CN218302044 U CN 218302044U CN 202222414789 U CN202222414789 U CN 202222414789U CN 218302044 U CN218302044 U CN 218302044U
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heat
seat
conducting seat
handheld
heat conducting
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CN202222414789.8U
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徐奎
邹智泉
赖成
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Dongguan Qinshi Metal Technology Co ltd
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Dongguan Qinshi Metal Technology Co ltd
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Abstract

The utility model relates to a handheld appearance high-efficient radiator that moults, include: a set of fins; the first heat dissipation assembly is connected with the fin group; the first heat dissipation assembly comprises a first heat conduction seat, a plurality of heat pipes and a fan; the opposite ends of the heat pipe, which are far away from the first heat conducting seat, are used for connecting the fin group; and a second heat dissipation assembly connected with the fin group; the second heat dissipation assembly comprises a micro water pump, a cold water pipe, a second heat conduction seat and a semiconductor refrigeration sheet; the second heat conducting seat is connected with the first heat conducting seat, and the semiconductor refrigerating sheet is clamped between the second heat conducting seat and the first heat conducting seat; the refrigerating surface of the semiconductor refrigerating sheet is abutted to the first heat conducting seat, and the heating surface of the semiconductor refrigerating sheet is abutted to the second heat conducting seat. Above-mentioned handheld appearance high-efficient radiator that moults, simple structure, convenient to use has increased the second radiator unit on first radiator unit's basis, utilizes semiconductor refrigeration piece collocation micro water pump and cold water pipe, has improved the radiating efficiency greatly, has also effectively prolonged laser generator's life.

Description

High-efficiency radiator of handheld depilating instrument
Technical Field
The utility model relates to an appearance heat dissipation technical field that moults especially relates to a handheld appearance high-efficient radiator that moults.
Background
The laser hair removal device is a device for treating redundant hair by selecting proper power, energy density and light spots according to different characteristics of patients by using a selective thermodynamic principle, and the main principle is as follows: the laser with a certain wavelength penetrates through the epidermis and enters the dermis, is selectively absorbed by the hair and melanin particles in the hair follicle to generate a photothermal effect, and the heat energy in the hair is conducted to the periphery to thoroughly destroy the hair follicle, stem cells and other hair roots to generate permanent depilation.
In the existing handheld pulse light depilator, a laser generating device can generate more heat when in use, and the heat accumulation can cause the device to be overheated, thereby reducing the service life of the device. The handheld pulse light depilating instrument mostly adopts a natural air cooling mode to dissipate heat, and the volume and heat dissipation capacity of the heat dissipater are limited due to the small volume, so that the heat dissipation effect is not ideal.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model provides a handheld appearance high-efficient radiator that moults, simple structure, convenient to use has increased the semiconductor refrigeration piece, and the miniature pump of collocation and cold water pipe have improved the radiating efficiency greatly, have also effectively prolonged laser generating device's life.
In order to realize the utility model discloses a purpose, the utility model discloses a following technical scheme:
a handheld epilator high efficiency heat sink comprising:
a set of fins;
the first heat dissipation assembly is connected with the fin group; the first heat dissipation assembly comprises a first heat conduction seat, a plurality of heat pipes uniformly arranged on the first heat conduction seat at intervals and a fan arranged on one side of the fin group; the opposite ends of the heat pipe, which are far away from the first heat conducting seat, are used for connecting the fin group; the first heat conducting seat is used for being attached and abutted with the laser generating device; and
the second heat dissipation assembly is connected with the fin group; the second heat dissipation assembly comprises a micro water pump arranged at the top of the fin group, a cold water pipe connected with the micro water pump, a second heat conduction seat wrapping the cold water pipe, and a semiconductor refrigeration sheet arranged on one surface of the second heat conduction seat; the second heat conducting seat is connected with the first heat conducting seat, and the semiconductor refrigeration sheet is clamped between the second heat conducting seat and the first heat conducting seat; the refrigerating surface of the semiconductor refrigerating piece is abutted to the first heat-conducting seat, and the heating surface of the semiconductor refrigerating piece is abutted to the second heat-conducting seat.
Above-mentioned handheld appearance high-efficient radiator that moults, simple structure, convenient to use has increased the second radiator unit on first radiator unit's basis, utilizes semiconductor refrigeration piece collocation micro-water pump and cold water pipe, has improved the radiating efficiency greatly, has also effectively prolonged laser generator's life.
In one embodiment, the second heat conduction seat is internally provided with a passage which is arranged in a zigzag manner; the cold water pipe comprises a heat conduction section and a connection section, wherein the heat conduction section is arranged in a winding way, and the connection section is connected with the heat conduction section; the heat conduction section is accommodated in the passageway, and the connection sections are respectively connected with the miniature water pump after penetrating through the second heat conduction seats.
In one embodiment, the semiconductor refrigerating plate is connected with a control circuit board of the handheld depilating device through a temperature control switch.
In one embodiment, a plurality of first through holes are uniformly arranged at two opposite ends of the fin group at intervals, the axial direction of the first through holes is consistent with the length direction of the fin group, and the first through holes are used for the heat pipe to penetrate through.
In one embodiment, the two opposite sides of the fin group are respectively provided with a second through hole, the axial direction of the second through hole is consistent with the length direction of the fin group, and the second through hole is used for the cold water pipe to penetrate through.
In one embodiment, the top of the fin group is further provided with a positioning recess for accommodating and mounting the miniature water pump.
In one embodiment, the first heat conducting seat is a copper heat conducting seat.
Drawings
Fig. 1 is a schematic perspective view of a high-efficiency heat sink of a handheld depilating apparatus according to an embodiment of the present invention;
FIG. 2 is an exploded view of the high efficiency heat sink of the hand-held epilator shown in FIG. 1;
FIG. 3 is an exploded view of the high efficiency heat sink of the handheld epilating apparatus shown in FIG. 2 from another perspective;
fig. 4 is a schematic diagram showing the cooling water pipe and the internal structure of the cooling seat of the efficient radiator of the handheld depilating apparatus shown in fig. 2.
Reference is made to the accompanying drawings in which:
10-a fin group, 11-a second through hole and 12-a positioning recess;
20-a first heat dissipation assembly, 21-a first heat conduction seat, 22-a heat pipe;
30-a second heat dissipation assembly, 31-a micro water pump, 32-a cold water pipe, 321-a heat conduction section, 322-a connection section, 33-a second heat conduction seat, 330-a passageway, 34-a semiconductor refrigeration sheet and 340-a wire.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.
Referring to fig. 1 to 4, a high-efficiency heat sink for a handheld depilating device according to an embodiment of the present invention includes a fin set 10, a first heat dissipation assembly 20 connected to the fin set 10, and a second heat dissipation assembly 30 connected to the fin set 10.
A plurality of first through holes (not shown) are uniformly arranged at two opposite ends of the fin group 10 at intervals, the axial direction of the first through holes is consistent with the length direction of the fin group 10, and the first through holes are used for parts of the first heat dissipation assembly 20 to penetrate through.
The opposite two sides of the fin group 10 are respectively provided with a second through hole 11, the axial direction of the second through hole 11 is consistent with the length direction of the fin group 10, and the second through hole 11 is used for allowing a part of the second heat dissipation assembly 30 to penetrate through. Further, the top of the fin set 10 is also provided with a positioning recess 12.
The first heat dissipation assembly 20 includes a first heat conduction seat 21, a plurality of heat pipes 22 uniformly installed on the first heat conduction seat 21 at intervals, and a fan (not shown) installed on one side of the fin group 10; opposite ends of the heat pipe 22 away from the first heat conducting base 21 are used for connecting the fin group 10. The first heat conducting seat 21 is used for being attached to and abutted against the laser generating device to absorb heat generated by the laser generating device, the heat is transferred to the fin group 10 through the heat pipe 22, air is radiated outwards through the fin group 10 and the fan, and the radiating efficiency is effectively improved.
In the present embodiment, the first heat conducting seat 21 is a copper heat conducting seat, and has good heat conducting performance.
In this embodiment, the heat pipe 22 is substantially U-shaped, the bent end of the heat pipe 22 is used for connecting the first heat conducting seat 21, and the two opposite ends of the heat pipe 22 away from the first heat conducting seat 21 are respectively provided with the first through hole in a penetrating manner, so as to realize the connection and installation of the heat pipe 22 and the fin group 10.
The second heat dissipation assembly 30 includes a micro water pump 31 installed on the top of the fin group 10, a cold water pipe 32 connected to the micro water pump 31, a second heat conduction seat 33 wrapping the cold water pipe 32, and a semiconductor refrigeration sheet 34 installed on one surface of the second heat conduction seat 33. Specifically, the micro water pump 31 is installed in the positioning recess 12 at the top of the fin set 10, and the cold water pipe 32 penetrates through the second through hole 11. The micro-pump 31 drives the cooling water to circulate in the cold water pipe 32 to absorb heat of the second heat conducting seat 33 for heat dissipation.
As shown in fig. 4, the cold water pipe 32 includes a heat conducting section 321 which is arranged in a meandering manner, and a connecting section 322 which is connected to the heat conducting section 321. The heat conducting section 321 is installed inside the second heat conducting seat 33, and the meandering structure of the heat conducting section 321 can effectively increase the contact area between the heat conducting section 321 and the second heat conducting seat 33, so as to improve the heat conducting efficiency; the connection sections 322 are respectively connected to the micro-pump 31 after passing through the second heat conduction seats 33. The inside of the second heat conduction seat 33 is provided with a passage 330 in a zigzag arrangement, and the passage 330 is used for accommodating the heat conduction pipe 321 of the cold water pipe 32.
The second heat conducting seat 33 is connected with the first heat conducting seat 21, and the semiconductor refrigerating sheet 34 is sandwiched between the second heat conducting seat 33 and the first heat conducting seat 21. The refrigerating surface of the semiconductor refrigerating sheet 34 abuts against the first heat conducting seat 21, and the heating surface of the semiconductor refrigerating sheet 34 abuts against the second heat conducting seat 33. During operation, the first heat-conducting seat 21 of the cooling surface of the semiconductor cooling plate 34 can be directly cooled, and then the laser generating device is cooled, and the heat generated by the heating surface of the semiconductor cooling plate 34 is transferred to the second heat-conducting seat 33 and taken away by the cooling water circulating in the cold water pipe 32, so as to dissipate the heat of the semiconductor cooling plate 34.
In the present embodiment, the cold water pipe 32 is a metal cold water pipe, such as a copper cold water pipe or an aluminum cold water pipe, which facilitates the cold water pipe 32 to absorb heat on the second heat conducting seat 33.
Further, in the present embodiment, the wire 340 of the semiconductor cooling plate 34 is connected to the control circuit board of the handheld epilating apparatus through a temperature-controlled switch (not shown), and the temperature-controlled switch is used to turn on or off the semiconductor cooling plate 34.
In operation, when the temperature of laser generating device reached first temperature default, the fan started, and temperature detect switch keeps closing, and only first radiator unit 20 worked this moment, and the air-cooled cooling promptly. After the work of a certain time, the heat that laser generator produced piles up gradually and makes the temperature rise to the second temperature when default, the fan keeps work, temperature detect switch opens, semiconductor refrigeration piece 34 gets the electricity and refrigerates, the refrigeration of semiconductor refrigeration piece 34 cools off to first heat conduction seat 21, increase first heat conduction seat 21 and laser generator's the difference in temperature, the heat that laser generator produced is absorbed fast to first heat conduction seat 21 of being convenient for, also improve the radiating efficiency to laser generator, make laser generator's temperature reduce fast. By analogy, when the temperature of the laser generating device is reduced to the first temperature preset value, the fan keeps working, the temperature control switch is turned off, the semiconductor refrigerating sheet 34 is powered off to stop working so as to save energy, the laser generating device is guaranteed to work at an adaptive working temperature, and the service life can be effectively prolonged. Compare with handheld appearance's of mouling forced air cooling structure of tradition, the utility model discloses have high-efficient radiating efficiency, increased second radiating component 30 on first radiating component 20's basis, increased semiconductor refrigeration piece 34 on original forced air cooling structure promptly, increased semiconductor refrigeration piece 34 on the basis that does not increase the volume, improved the radiating efficiency greatly, also effectively prolonged laser generator's life.
Above-mentioned handheld appearance high-efficient radiator that moults, simple structure, convenient to use has increased second radiator unit 30 on first radiator unit 20's basis, utilizes semiconductor refrigeration piece 34 collocation micro-water pump 31 and cold water pipe 32, has improved the radiating efficiency greatly, has also effectively prolonged laser generating device's life.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (7)

1. A handheld appearance high efficiency radiator that moults, its characterized in that includes:
a set of fins;
the first heat dissipation assembly is connected with the fin group; the first heat dissipation assembly comprises a first heat conduction seat, a plurality of heat pipes uniformly arranged on the first heat conduction seat at intervals and a fan arranged on one side of the fin group; the opposite ends of the heat pipe, which are far away from the first heat conducting seat, are used for connecting the fin group; the first heat conducting seat is used for being attached and abutted with the laser generating device; and
the second heat dissipation assembly is connected with the fin group; the second heat dissipation assembly comprises a micro water pump arranged at the top of the fin group, a cold water pipe connected with the micro water pump, a second heat conduction seat wrapping the cold water pipe, and a semiconductor refrigeration sheet arranged on one surface of the second heat conduction seat; the second heat conducting seat is connected with the first heat conducting seat, and the semiconductor refrigerating sheet is clamped between the second heat conducting seat and the first heat conducting seat; the refrigerating surface of the semiconductor refrigerating piece is abutted to the first heat-conducting seat, and the heating surface of the semiconductor refrigerating piece is abutted to the second heat-conducting seat.
2. The efficient heat sink for a handheld hair removal device as recited in claim 1, wherein said second heat conducting base has a serpentine passageway formed therein; the cold water pipe comprises a heat conduction section and a connection section, wherein the heat conduction section is arranged in a winding way, and the connection section is connected with the heat conduction section; the heat conduction section is accommodated in the passageway, and the connecting sections are respectively connected with the micro water pump after penetrating through the second heat conduction seats.
3. The handheld epilator high-efficiency heat radiator as claimed in claim 1, wherein the semiconductor chilling plate is connected with a control circuit board of the handheld epilator through a temperature control switch.
4. The efficient heat sink for a handheld epilator as claimed in claim 1, wherein a plurality of first through holes are uniformly arranged at two opposite ends of the fin set at intervals, the axial direction of the first through holes is consistent with the length direction of the fin set, and the first through holes are used for the heat pipes to penetrate through.
5. The efficient heat radiator for the handheld depilating instrument as claimed in claim 1, wherein the two opposite sides of the fin set are respectively provided with a second through hole, the axial direction of the second through hole is consistent with the length direction of the fin set, and the second through hole is used for the cold water pipe to penetrate through.
6. The handheld epilator high-efficiency heat sink as claimed in claim 1, wherein the top of the fin set is further provided with a positioning recess for accommodating and mounting the micro-water pump.
7. The handheld epilator highly efficient heat sink as claimed in claim 1, wherein the first heat conduction base is a copper heat conduction base.
CN202222414789.8U 2022-09-13 2022-09-13 High-efficiency radiator of handheld depilating instrument Active CN218302044U (en)

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CN202222414789.8U CN218302044U (en) 2022-09-13 2022-09-13 High-efficiency radiator of handheld depilating instrument

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Application Number Priority Date Filing Date Title
CN202222414789.8U CN218302044U (en) 2022-09-13 2022-09-13 High-efficiency radiator of handheld depilating instrument

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118139390A (en) * 2024-05-06 2024-06-04 深圳市柠檬光子科技有限公司 Handheld heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118139390A (en) * 2024-05-06 2024-06-04 深圳市柠檬光子科技有限公司 Handheld heat dissipation device

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