CN218301752U

CN218301752U - Thick copper circuit board

Info

Publication number: CN218301752U
Application number: CN202222483370.8U
Authority: CN
Inventors: 刘玲; 何小虎
Original assignee: Juxin Electronic Technology Meizhou Co ltd
Current assignee: Juxin Electronic Technology Meizhou Co ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2023-01-13
Anticipated expiration: 2032-09-20

Abstract

The utility model discloses a thick copper circuit board, including steel base plate, connecting block, the bottom of steel base plate is installed the second copper circuit board, and the bottom of second copper circuit board is installed the second resin base plate, and is provided with a plurality of heat conduction wing columns that run through the second resin base plate on the second copper circuit board, the bottom of heat conduction wing column is provided with insulating backing plate, still includes firm mechanism, and firm mechanism includes the part of injecing and stabilizes the part; the limiting component comprises an inserting block and an inserting groove, the inserting block is arranged at the top of the insulating base plate, the inserting groove is formed in the bottom of the heat conduction fin column, the notches of the inserting groove are provided with symmetrically distributed stop blocks, and the inserting block is inserted into the inserting groove and abuts against the stop blocks; the insert block and the insulating base plate are of an integrated structure, and the stop block is of a cuboid structure; the utility model has the advantages that: through the stabilizing mechanism of design, realized the dismouting of insulating backing plate and heat conduction wing post, when insulating backing plate damaged, the quick replacement was carried out to the convenient to detach insulating backing plate.

Description

Thick copper circuit board

Technical Field

The utility model belongs to the technical field of the circuit board, concretely relates to thick copper circuit board.

Background

Printed circuit boards made with thick copper foils and ultra-thick copper foils may be referred to as "thick copper printed circuit boards"; the copper foil and the substrate material which are used as conductive materials, the production process and the application field are different from those of the conventional PCB, so that the PCB belongs to a special type PCB; the application field and the demand of the thick copper PCB are rapidly expanded in recent years, and the thick copper PCB becomes a hot PCB variety with good market development prospect.

The application number is CN 202121651521.5's thick copper circuit board of a high heat conductivity, and this patent discloses that the bottom of second resin substrate is equipped with equidistant heat conduction wing post, because of the heat conduction wing post has good heat conductivility, reaches high-efficient radiating purpose, and insulating backing plate is installed to the bottom of heat conduction wing post to strengthen the insulating properties of thick copper circuit board.

Insulating backing plate and heat conduction wing post fixed mounting, when insulating backing plate damages when influencing insulating properties, it is comparatively loaded down with trivial details to dismantle the insulating backing plate of damage and change.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a thick copper circuit board has improved the efficiency of insulating backing plate and the dismouting of heat conduction wing post.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a thick copper circuit board, includes steel base plate, connecting block, the second copper circuit board is installed to the bottom of steel base plate, and second resin base plate is installed to the bottom of second copper circuit board, and is provided with a plurality of heat conduction wing columns that run through second resin base plate on the second copper circuit board, the bottom of heat conduction wing column is provided with insulating backing plate, still includes stabilizing mean, and stabilizing mean is including injecing part and stabilizing part.

Preferably, the limiting part comprises an inserting block and a slot, the inserting block is arranged at the top of the insulating base plate, the slot is arranged at the bottom of the heat-conducting finned column, symmetrically-distributed stop blocks are arranged on the notches of the slot, and the inserting block is inserted into the slot and abuts against the stop blocks.

Preferably, the insert block and the insulating base plate are of an integrated structure, and the stop block is of a cuboid structure.

Preferably, the stabilizing part comprises a limiting groove, a spring and a pull rod, the limiting groove is formed in the side surface of the inserting block, a fixing hole for the pull rod to penetrate through is formed in the heat-conducting finned column, one end of the pull rod can be inserted into the limiting groove, a convex plate is arranged at the other end of the pull rod, the spring is symmetrically fixed on the side surface of the heat-conducting finned column, and one end of the spring is connected with the convex plate.

Preferably, the end of the convex plate is provided with a convex ring.

Preferably, a first copper circuit board is installed at the top of the steel base plate, a first resin base plate is installed at the top of the first copper circuit board, and cylindrical through holes are formed in the steel base plate, the first copper circuit board, the first resin base plate, the second copper circuit board and the second resin base plate.

Preferably, the steel substrate is provided with a heat conduction groove therein.

Preferably, the bottom of the second resin substrate is provided with a positioning frame, the positioning frame is sleeved on the outer side of the connecting block, and the inner side surface of the positioning frame is provided with symmetrically distributed reinforcing blocks which abut against the connecting block.

Compared with the prior art, the beneficial effects of the utility model are that:

through the stabilizing mechanism of design, realized the dismouting of insulating backing plate and heat conduction wing post, when insulating backing plate damaged, the quick replacement was carried out to the convenient to detach insulating backing plate.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is an enlarged schematic structural view of the P region in fig. 1 according to the present invention;

fig. 3 is an enlarged schematic structural view of the region a in fig. 1 according to the present invention;

in the figure: 1. a steel substrate; 2. a first copper circuit board; 3. a cylindrical through hole; 4. a first resin substrate; 5. a heat conduction groove; 6. a second copper circuit board; 7. a second resin substrate; 8. an insulating base plate; 81. inserting a block; 82. defining a slot; 83. a spring; 84. a convex plate; 85. a convex ring; 86. a pull rod; 9. a heat-conducting fin column; 91. a slot; 92. a stopper; 10. a positioning frame; 11. a reinforcing block; 12. and (7) connecting the block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Please refer to fig. 1, fig. 3, for the utility model discloses a first embodiment, this embodiment provides a thick copper circuit board, including steel base plate 1, connecting block 12, second copper circuit board 6 is installed to the bottom of steel base plate 1, the installation of second copper circuit board 6 has been realized, second resin substrate 7 is installed to the bottom of second copper circuit board 6, the installation of second resin substrate 7 has been realized, and be provided with a plurality of heat conduction finned columns 9 that run through second resin substrate 7 on the second copper circuit board 6, the adduction of heat conduction finned column 9 has been realized, heat conduction finned column 9 has good heat conductivility, make it derive the heat energy of second copper circuit board 6 position department to the outside, and then reach high-efficient radiating purpose, the bottom of heat conduction finned column 9 is provided with insulating backing plate 8, increase insulating properties through insulating backing plate 8, still include firm mechanism, and firm mechanism is including injecing part and firm part.

In this embodiment, preferably, the limiting component includes an insertion block 81 and a slot 91, the insertion block 81 is disposed at the top of the insulating base plate 8, the insertion block 81 is added, the slot 91 is disposed at the bottom of the heat-conducting fin column 9, the slot 91 is disposed, the notches of the slot 91 are provided with symmetrically distributed stoppers 92, the stoppers 92 are mounted, the insertion block 81 is inserted into the slot 91 and abuts against the stoppers 92, and the inserted insertion block 81 is stabilized.

In this embodiment, preferably, the insert block 81 and the insulating pad 8 are of an integral structure, so that the strength of the insert block 81 and the insulating pad 8 is better, and the stopper 92 is of a rectangular parallelepiped structure.

In this embodiment, preferably, the stabilizing member includes a limiting groove 82, a spring 83, and a pull rod 86, the limiting groove 82 is opened on a side surface of the insertion block 81, the opening of the limiting groove 82 is realized, a fixing hole for the pull rod 86 to pass through is opened in the heat-conducting finned column 9, the opening of the fixing hole is realized, one end of the pull rod 86 can be inserted into the limiting groove 82, a convex plate 84 is arranged at the other end of the pull rod 86, the convex plate 84 is added, the spring 83 is symmetrically fixed on the side surface of the heat-conducting finned column 9, one end of the spring 83 is connected with the convex plate 84, and the addition of the spring 83 is realized.

In this embodiment, it is preferable that the end of the protruding plate 84 is provided with a protruding ring 85, and it is more convenient to pull the protruding plate 84 by the protruding ring 85.

In this embodiment, preferably, the first copper circuit board 2 is mounted on the top of the steel substrate 1, so that the first copper circuit board 2 is mounted, the first resin substrate 4 is mounted on the top of the first copper circuit board 2, so that the first resin substrate 4 is mounted, and the steel substrate 1, the first copper circuit board 2, the first resin substrate 4, the second copper circuit board 6, and the second resin substrate 7 are provided with the cylindrical through hole 3, so as to connect an external element or a screw.

In this embodiment, preferably, the steel substrate 1 is provided with a heat conduction groove 5 inside, and the heat conduction groove 5 sets the first copper circuit board 2 and the second copper circuit board 6 to be in a communication structure, so that the heat energy of the first copper circuit board 2 flows to the second copper circuit board 6 through the heat conduction groove 5.

The operation process comprises the following steps: when insulating backing plate 8 damages and needs to be dismantled, pulling bulge loop 85 drives bulge 84 and moves about, bulge 84 activity drives pull rod 86 and moves about, and make pull rod 86 break away from in injecing the groove 82, thereby can outwards extract the insulating backing plate 8 that damages, the efficiency of insulating backing plate 8 dismantlement has been improved, when changing new insulating backing plate 8, pulling bulge loop 85 drives bulge 84 and moves about, when bulge 84 activity drives pull rod 86 and moves about, and drive spring 83 and be stretched, place the fixed orifices in until the one end of pull rod 86, insert in slot 91 along dog 92 with inserted block 81 on insulating backing plate 8, stop pulling bulge loop 85, by tensile spring 83 reset, drive bulge 84 activity, and make pull rod 86 on the bulge 84 insert in the injecing the groove 82 of inserted block 81, make insulating backing plate 8 firm in installation.

Example 2

Referring to fig. 1-3, a second embodiment of the present invention is shown, which is based on the previous embodiment, except that:

the bottom of the second resin substrate 7 is provided with the positioning frame 10, so that the positioning frame 10 is installed, the positioning frame 10 is sleeved outside the connecting block 12, the inner side surface of the positioning frame 10 is provided with the reinforcing blocks 11 which are symmetrically distributed, the addition of the reinforcing blocks 11 is realized, and the reinforcing blocks 11 abut against the connecting block 12.

The operation process comprises the following steps: the positioning frame 10 is arranged outside the outer connecting block 12, and the fixing firmness of the positioning frame 10 and the connecting block 12 is increased under the cooperation of the reinforcing block 11.

Although embodiments of the present invention have been shown and described, and in particular with reference to the above detailed description, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a thick copper circuit board, includes steel base plate (1), connecting block (12), second copper circuit board (6) are installed to the bottom of steel base plate (1), and second resin base plate (7) are installed to the bottom of second copper circuit board (6), and are provided with a plurality of heat conduction wing columns (9) that run through second resin base plate (7) on second copper circuit board (6), the bottom of heat conduction wing column (9) is provided with insulating backing plate (8), its characterized in that: a securing mechanism is also included and includes a limiting member and a securing member.

2. A thick copper circuit board according to claim 1, wherein: the limiting component comprises an inserting block (81) and a slot (91), the inserting block (81) is arranged at the top of the insulating base plate (8), the slot (91) is arranged at the bottom of the heat-conducting finned column (9), the notches of the slot (91) are provided with symmetrically distributed stop blocks (92), and the inserting block (81) is inserted into the slot (91) and supports against the stop blocks (92).

3. A thick copper circuit board according to claim 2, wherein: the insert block (81) and the insulating backing plate (8) are of an integrated structure, and the stop block (92) is of a cuboid structure.

4. A thick copper circuit board according to claim 2, wherein: the stabilizing part comprises a limiting groove (82), a spring (83) and a pull rod (86), the limiting groove (82) is arranged on the side surface of the inserting block (81), a fixing hole for the pull rod (86) to pass through is formed in the heat-conducting finned column (9), one end of the pull rod (86) can be inserted into the limiting groove (82), a convex plate (84) is arranged at the other end of the pull rod (86), the spring (83) is symmetrically fixed on the side surface of the heat-conducting finned column (9), and one end of the spring (83) is connected with the convex plate (84).

5. The thick copper circuit board of claim 4, wherein: the end of the convex plate (84) is provided with a convex ring (85).

6. A thick copper circuit board according to claim 1, characterized in that: first copper circuit board (2) are installed at the top of steel base plate (1), and first resin base plate (4) are installed at the top of first copper circuit board (2), cylindricality through-hole (3) have been seted up on steel base plate (1), first copper circuit board (2), first resin base plate (4), second copper circuit board (6), second resin base plate (7).

7. A thick copper circuit board according to claim 1, characterized in that: the steel substrate (1) is internally provided with a heat conduction groove (5).

8. A thick copper circuit board according to claim 1, wherein: the bottom of second resin base plate (7) is installed locating frame (10), and the outside of connecting block (12) is located in locating frame (10) cover, the medial surface of locating frame (10) is provided with reinforcing block (11) of symmetric distribution, and reinforcing block (11) support on connecting block (12).