CN218277303U

CN218277303U - Anti-shaking FPGA chip

Info

Publication number: CN218277303U
Application number: CN202222003824.7U
Authority: CN
Inventors: 郑川; 周康成; 殷科军; 罗钿凯
Original assignee: Jiangsu Fanteng Electronic Technology Co ltd
Current assignee: Jiangsu Fanteng Electronic Technology Co ltd
Priority date: 2022-08-01
Filing date: 2022-08-01
Publication date: 2023-01-10
Anticipated expiration: 2032-08-01

Abstract

The utility model provides a prevent FPGA chip that rocks, which comprises a fixing plate and i, adjusting screw, chip body and circuit board, chip body sets up in the circuit board upside, the circuit board upside is provided with the bracing piece, the bracing piece upside is provided with the fixed plate, this design has solved original FPGA chip and has adopted tin soldering fixed knot structure usually, this kind of mode installation is fixed convenient, but resistance to compression shock resistance is relatively poor, when FPGA chip receives long-time or violent vibration, the condition of ftractureing probably appears in FPGA chip pin junction, lead to FPGA chip mounting unstable, influence the problem of FPGA chip's normal operating, the utility model discloses rational in infrastructure, adopt top card to press and bottom sprag structure, can carry out the chucking from upper and lower both sides simultaneously and fix to the chip, improved the resistance to compression shock resistance of chip, receive the not hard up condition can not appear in the vibration for a long time, can prevent effectively that the chip from producing and rock not hard up.

Description

Anti-shaking FPGA chip

Technical Field

The utility model relates to a prevent FPGA chip that rocks belongs to FPGA chip technical field.

Background

FPGAs are products of further development based on programmable devices such as PAL (programmable array logic) and GAL (general array logic).

When an existing FPGA chip is installed, a tin soldering fixing structure is usually adopted, the mode is convenient to install and fix, but the compression resistance and the vibration resistance are poor, when the FPGA chip is subjected to long-time or violent vibration, the welding position of pins of the FPGA chip is prone to cracking, the FPGA chip is unstable to install, the normal operation of the FPGA chip is affected, and the problem of the occurrence is solved by an anti-shaking FPGA chip urgently needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a prevent FPGA chip that rocks to solve the problem that proposes in the above-mentioned background art, the utility model discloses rational in infrastructure adopts the top card to press and bottom sprag structure, can carry out the chucking simultaneously from upper and lower both sides to the chip and fix, has improved the resistance to compression shock resistance of chip, receives the vibration not hard up condition can not appear for a long time, can prevent effectively that the chip from producing to rock not hard up.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides an anti-rock FPGA chip, includes fixed plate, adjusting screw, chip body and circuit board, the chip body sets up in the circuit board upside, the circuit board upside is provided with the bracing piece, the bracing piece upside is provided with the fixed plate, the vertical adjusting screw that runs through of fixed plate, the adjusting screw downside is provided with the roof pressure apron, the vertical side baffle that is provided with in roof pressure apron side, the terminal surface is provided with the locating lever under the roof pressure apron.

Furthermore, the support rods are provided with four groups, the four groups of support rods are of rectangular structures, screws are arranged in the fixing plates, and the screws penetrate through the fixing plates and are fixedly connected with the support rods through threads.

Furthermore, a threaded through hole is formed in the fixing plate, and the specification of the threaded through hole is matched with that of the adjusting screw rod.

Furthermore, a heat-conducting silica gel gasket is arranged between the bottom of the chip body and the circuit board, and the upper surface and the lower surface of the heat-conducting silica gel gasket are in contact with the chip body and the circuit board in a laminating manner.

Furthermore, a positioning groove is formed in the inner portion of the upper end face of the chip body, and the depth of the positioning groove is 0.5mm.

Furthermore, four groups of side baffles are arranged on the four side faces of the top pressure cover plate, four groups of positioning rods are arranged on the four side faces of the top pressure cover plate, and the four groups of positioning rods are arranged on the lower end face of the top pressure cover plate and are close to the four corner parts.

By adopting the technical scheme, the beneficial effects of the utility model are that: the utility model discloses a prevent FPGA chip that rocks, fixed plate through setting up, adjusting screw, the bracing piece, the roof pressure apron, side baffle, locating lever and positioning groove, this design adopts top card to press and bottom sprag structure, can carry out the chucking simultaneously from upper and lower both sides to the chip and fix, the resistance to compression shock resistance of chip has been improved, receive the vibration not hard up condition can not appear for a long time, can prevent effectively that the chip from producing and rocking not hard up, it adopts soldering fixed knot to have solved original FPGA chip generally, this kind of mode installation is fixed convenient, but resistance to compression shock resistance is relatively poor, when FPGA chip receives long-time or violent vibration, the condition of ftracturing probably appears in FPGA chip pin welding department, lead to FPGA chip installation unstable, influence the problem of the normal operating of FPGA chip, the utility model discloses an installation steadiness is improved.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of an anti-shaking FPGA chip of the present invention;

fig. 2 is a front sectional view of an anti-shaking FPGA chip of the present invention;

FIG. 3 is a schematic diagram of a chip body of an anti-sway FPGA chip according to the present invention;

in the figure: 1-fixing plate, 2-adjusting screw, 3-supporting rod, 4-chip body, 5-circuit board, 6-heat conducting silica gel gasket, 7-top pressing cover plate, 8-side baffle, 9-positioning rod, 10-positioning groove, 21-threaded through hole and 31-screw.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an anti-sway's FPGA chip, which comprises a fixing plate 1, adjusting screw 2, chip body 4 and circuit board 5, chip body 4 sets up in circuit board 5 upside, circuit board 5 upside is provided with

bracing piece

3, 3 upsides of bracing piece are provided with fixed plate 1, 1 vertical running through of fixed plate is provided with adjusting

screw

2, 2 downside of adjusting screw are provided with roof pressure apron 7, the vertical side shield 8 that is provided with in roof pressure apron 7 side, the terminal surface is provided with locating lever 9 under the roof pressure apron 7, this design has solved original FPGA chip and has adopted soldering fixed knot structure usually, this kind of mode installation is fixed convenient, but resistance to compression and vibration ability is relatively poor, when the FPGA chip receives long-time or violent vibration, the condition of ftractureing probably appears in FPGA chip pin junction, lead to the FPGA chip mounting unstable, influence the problem of the normal operating of FPGA chip.

The bracing piece 3 is provided with four groups, and four group's bracing pieces 3 are the rectangle structure, can carry out the outrigger to fixed plate 1 through four group's bracing pieces 3 that set up, and fixed plate 1 is inside to be provided with screw 31, and screw 31 runs through fixed plate 1 and bracing piece 3 and passes through screw thread fixed connection, and screw 31 through setting up is convenient for install fixed plate 1, and then has improved the installation steadiness to fixed plate 1.

The threaded through hole 21 is formed in the fixing plate 1, the specification of the threaded through hole 21 is matched with that of the adjusting screw rod 2, and the adjusting screw rod 2 is connected with the fixing plate 1 in a rotating mode through the arranged threaded through hole 21.

Heat conduction silica gel gasket 6 sets up in chip body 4 bottom and circuit board 5, and two surfaces about heat conduction silica gel gasket 6 and chip body 4 and the laminating contact of circuit board 5 can be followed the bottom and supported chip body 4 through the heat conduction silica gel gasket 6 that sets up, can dispel the heat fast chip body 4 simultaneously.

Inside positioning groove 10 seted up the chip body 4 up end, the positioning groove 10 degree of depth was 0.5mm, and positioning groove 10 through setting up can carry out the chucking spacing to locating lever 9, and then fixes chip body 4.

Four sets of side baffles 8 are arranged, the four sets of side baffles 8 are fixedly arranged on four sides of the top pressure cover plate 7, the chip body 4 can be limited and fixed from the periphery through the four sets of side baffles 8, the positioning rods 9 are provided with four sets of positioning rods 9, the four sets of positioning rods 9 are arranged on the lower end face of the top pressure cover plate 7 and are close to four corner parts, and fixing stability of the chip body 4 is improved through the four sets of positioning rods 9.

As an embodiment of the present invention: paste heat conduction silica gel gasket 6 in 4 bottoms of chip body at first, then be fixed in on circuit board 5 with chip body 4 through the soldering, be fixed in bracing piece 3 through the installation of screw 31 with fixed plate 1 again, rotate adjusting screw 2, drive roof pressure apron 7 downstream through adjusting screw 2's rotation, make 9 lower extreme cards of locating lever go into in the inside positioning groove 10 of chip body 4, and make 8 cards of side baffle paste in chip body 4 side all around, adjust adjusting screw 2 to appropriate elasticity degree, and then carry out the chucking through locating lever 9 and adjusting screw 2 to chip body 4 and fix, can prevent effectively that the chip from producing to rock not hard up.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.

Claims

1. The utility model provides an anti-rock FPGA chip, includes fixed plate, adjusting screw, chip body and circuit board, its characterized in that: the chip body sets up in the circuit board upside, the circuit board upside is provided with the bracing piece, the bracing piece upside is provided with the fixed plate, the vertical adjusting screw that runs through of fixed plate is provided with, the adjusting screw downside is provided with the roof pressure apron, the vertical side baffle that is provided with in roof pressure apron side, the terminal surface is provided with the locating lever under the roof pressure apron.

2. The anti-shaking FPGA chip according to claim 1, wherein: the support rods are provided with four groups, the four groups of support rods are of rectangular structures, screws are arranged in the fixing plates, and the screws penetrate through the fixing plates and are fixedly connected with the support rods through threads.

3. The anti-shaking FPGA chip according to claim 1, wherein: the fixed plate is internally provided with a threaded through hole, and the specification of the threaded through hole is matched with that of the adjusting screw rod.

4. The anti-shaking FPGA chip according to claim 1, wherein: and a heat-conducting silica gel gasket is arranged between the bottom of the chip body and the circuit board, and the upper surface and the lower surface of the heat-conducting silica gel gasket are in contact with the chip body and the circuit board in a laminating manner.

5. The anti-shaking FPGA chip according to claim 1, wherein: positioning grooves are formed in the upper end face of the chip body, and the depth of each positioning groove is 0.5mm.

6. The anti-shaking FPGA chip according to claim 1, wherein: the four groups of side baffles are fixedly arranged on four side faces of the top pressure cover plate, and the four groups of positioning rods are arranged on the lower end face of the top pressure cover plate and close to four corner parts.