CN218275513U - Novel heat radiation part of semiconductor laser - Google Patents
Novel heat radiation part of semiconductor laser Download PDFInfo
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- CN218275513U CN218275513U CN202221740410.6U CN202221740410U CN218275513U CN 218275513 U CN218275513 U CN 218275513U CN 202221740410 U CN202221740410 U CN 202221740410U CN 218275513 U CN218275513 U CN 218275513U
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- heat dissipation
- fixedly connected
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- semiconductor laser
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Abstract
The utility model discloses a novel heat dissipation piece of semiconductor laser, including the heat dissipation main part, the top fixedly connected with radiator-grid of heat dissipation main part, the both sides fixedly connected with mounting bracket of heat dissipation main part, the top threaded connection of mounting bracket has the fixed screw, heat dissipation main part bottom fixedly connected with leads the cold drawing, lead the bottom fixedly connected with mounting panel of cold drawing, the mounting hole has been seted up at the top of mounting panel, the inside fixedly connected with driving motor of heat dissipation main part, driving motor's drive end fixedly connected with flabellum, the inner wall fixedly connected with semiconductor refrigeration piece of heat dissipation main part, the top fixedly connected with heat-conducting plate of semiconductor refrigeration piece. Through the arranged cold guide plate, the semiconductor refrigeration plate and the heat conduction plate, cold air made by the heat dissipation part can resist heat emitted by a source of the semiconductor laser, so that the heat dissipation effect of the heat dissipation part is improved, the semiconductor laser is prevented from being damaged due to untimely heat dissipation, and the service life of the semiconductor laser is prolonged.
Description
Technical Field
The utility model relates to a heat dissipation piece technical field specifically is a novel heat dissipation piece of semiconductor laser.
Background
The semiconductor laser module, also called as a semiconductor laser module, is a laser device which is mature earlier and has faster progress, has wide wavelength range, simple manufacture, low cost and easy mass production, and has small volume, light weight and long service life, so the semiconductor laser module has fast variety development and wide application range which is more than 300, and can be widely applied to the aspects of laser ranging, laser radar, ignition and detonation, detecting instruments and the like, thereby forming a wide market.
However, the heat dissipation effect of the heat dissipation part of the existing semiconductor laser is poor, when the heat dissipation part dissipates heat of the semiconductor laser, the heat dissipation part can only dissipate heat emitted by the semiconductor laser, and cannot resist heat emitted by a source of the semiconductor laser, so that the semiconductor laser is easily damaged due to untimely heat dissipation, and therefore a novel heat dissipation part of the semiconductor laser is provided.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a novel radiating piece of semiconductor laser to solve the problem of proposing in the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a novel heat dissipation piece of semiconductor laser, includes the heat dissipation main part, the top fixedly connected with radiator-grid of heat dissipation main part, the both sides fixedly connected with mounting bracket of heat dissipation main part, the top threaded connection of mounting bracket has the fixed screw, heat dissipation main part bottom fixedly connected with leads cold plate, lead the bottom fixedly connected with mounting panel of cold plate, the mounting hole has been seted up at the top of mounting panel, the inside fixedly connected with driving motor of heat dissipation main part, driving motor's drive end fixedly connected with flabellum, the inner wall fixedly connected with semiconductor refrigeration piece of heat dissipation main part, the top fixedly connected with heat-conducting plate of semiconductor refrigeration piece.
Further preferably, the radiator mesh is of a net structure, and a plurality of net openings with the same size are formed in the radiator mesh.
Further preferably, the number of the mounting racks is two, and the two mounting racks are symmetrically arranged through the heat dissipation main body.
Further preferably, the number of the mounting holes is four, and the four mounting holes are respectively formed in four corners of the top of the mounting plate.
Further preferably, the number of the fixing screws is four, every two fixing screws are in one group, and the two fixing screws are respectively located at the tops of the two mounting racks.
Further preferably, the cold guide plate is made of an aluminum material, the outer surface of the cold guide plate is smooth, and the cold guide plate is embedded into the top of the mounting plate.
(III) advantageous effects
The utility model provides a novel heat dissipation piece of semiconductor laser possesses following beneficial effect:
(1) This kind of novel semiconductor laser's radiating piece, lead the cold drawing through setting up, semiconductor refrigeration piece and heat-conducting plate, when using the radiating piece, the staff installs the mounting panel in one side of semiconductor laser, then fix in inserting the mounting hole to the screw and can install and accomplish, when the staff uses semiconductor laser, the semiconductor refrigeration piece will start after the switch on, and the heat that semiconductor refrigeration piece operation process produced will transmit the heat-conducting plate, driving motor drives the flabellum operation this moment, thereby go out the heat diffusion, and the semiconductor refrigeration piece is when the operation, the refrigeration end of semiconductor refrigeration piece will refrigerate, and transmit on leading the cold drawing, thereby dispel the heat on transmitting the semiconductor laser to the air conditioning of making, and the semiconductor laser who receives air conditioning will cool down fast, and the air conditioning that the radiating piece made can also resist the heat that the semiconductor laser source sent, consequently, the radiating effect of radiating piece has been improved, avoided semiconductor laser to appear damaging because of untimely heat dissipation, consequently, semiconductor laser's life has still been improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a sectional view of the heat dissipating main body of the present invention;
fig. 3 is a schematic view of a partial structure of the heat dissipating body of the present invention.
In the figure: 1. mounting holes; 2. mounting a plate; 3. a cold conducting plate; 4. a mounting frame; 5. fixing screws; 6. a heat dissipating main body; 7. a heat-dissipating mesh; 8. a drive motor; 9. a fan blade; 10. a semiconductor refrigeration sheet; 11. a heat conducting plate.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a novel heat dissipation piece of semiconductor laser, including heat dissipation main part 6, the top fixedly connected with radiator-grid 7 of heat dissipation main part 6, the both sides fixedly connected with mounting bracket 4 of heat dissipation main part 6, the top threaded connection of mounting bracket 4 has set screw 5, 6 bottom fixedly connected with of heat dissipation main part lead cold drawing 3, lead the bottom fixedly connected with mounting panel 2 of cold drawing 3, mounting hole 1 has been seted up at the top of mounting panel 2, the inside fixedly connected with driving motor 8 of heat dissipation main part 6, driving end fixedly connected with flabellum 9 of driving motor 8, the inner wall fixedly connected with semiconductor refrigeration piece 10 of heat dissipation main part 6, the top fixedly connected with heat-conducting plate 11 of semiconductor refrigeration piece 10.
In this embodiment, it is concrete, radiator net 7 is network structure, and a plurality of the net gapes that the size is the same are seted up to radiator net 7, and the bar heat that can be better through radiator net 7 discharges out.
In this embodiment, specifically, the mounting bracket 4 is provided with two, and two mounting brackets 4 are arranged symmetrically through the heat dissipation main body 6, and the heat dissipation main body 6 is convenient for the staff to install through the mounting bracket 4.
In this embodiment, specifically, four mounting holes 1 are provided, and four mounting holes 1 are respectively opened at four corners of the top of mounting plate 2, and it is convenient for the worker to install the heat dissipation member through mounting holes 1.
In this embodiment, it is concrete, set screw 5 is provided with four, and every two of four set screw 5 are a set of, and two sets of set screw 5 are located the top of two mounting brackets 4 respectively, make heat dissipation main part 6 can be more firm fix on leading cold plate 3 through mounting bracket 4 through set screw 5.
In this embodiment, specifically, the cold guide plate 3 is formed by processing an aluminum material, the outer surface of the cold guide plate 3 is smooth, the cold guide plate 3 is embedded in the top of the mounting plate 2, and the cold guide plate 3 formed by processing an aluminum material can better guide out cold air.
The working principle is as follows: the utility model discloses install the back well, at first inspect the utility model discloses an installation is fixed and safety protection, when using the radiating piece, the staff installs mounting panel 2 in one side of semiconductor laser, then insert the screw and fix in mounting hole 1 and can install the completion, when the staff uses semiconductor laser, semiconductor refrigeration piece 10 will start after the switch on, and the heat that semiconductor refrigeration piece 10 operation process produced will transmit heat-conducting plate 11, driving motor 8 drives flabellum 9 and moves this moment, thereby go out the heat diffusion, and semiconductor refrigeration piece 10 is when the operation, the refrigeration end of semiconductor refrigeration piece 10 will refrigerate, and transmit and lead on cold plate 3, thereby dispel the heat on transmitting the semiconductor laser to the air conditioning that makes, and the semiconductor laser who receives air conditioning will rapid cooling, and the air conditioning that makes can also resist the heat that the semiconductor laser radiating piece source sent, just so the utility model discloses a use process, the utility model discloses simple structure, convenience safe in utilization.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A novel heat dissipation piece of semiconductor laser, includes heat dissipation main part (6), its characterized in that: the utility model discloses a cooling structure, including heat dissipation main part (6), the top fixedly connected with radiator-grid (7) of heat dissipation main part (6), both sides fixedly connected with mounting bracket (4) of heat dissipation main part (6), the top threaded connection of mounting bracket (4) has set screw (5), cold drawing (3) are led to heat dissipation main part (6) bottom fixedly connected with, the bottom fixedly connected with mounting panel (2) of leading cold drawing (3), mounting hole (1) have been seted up at the top of mounting panel (2), the inside fixedly connected with driving motor (8) of heat dissipation main part (6), drive end fixedly connected with flabellum (9) of driving motor (8), the inner wall fixedly connected with refrigeration semiconductor piece (10) of heat dissipation main part (6), the top fixedly connected with heat-conducting plate (11) of semiconductor refrigeration piece (10).
2. A novel heat sink for semiconductor lasers as claimed in claim 1 wherein: the heat dissipation net (7) is of a net structure, and a plurality of net openings with the same size are formed in the heat dissipation net (7).
3. A novel heat sink for a semiconductor laser as claimed in claim 1, wherein: the heat dissipation device is characterized in that the number of the mounting frames (4) is two, and the two mounting frames (4) are symmetrically arranged through the heat dissipation main body (6).
4. A novel heat sink for a semiconductor laser as claimed in claim 1, wherein: the mounting holes (1) are four, and the four corners of the top of the mounting plate (2) are respectively arranged at the four mounting holes (1).
5. A novel heat sink for semiconductor lasers as claimed in claim 1 wherein: the fixing screws (5) are four, every two fixing screws (5) are a group, and the two fixing screws (5) are respectively located at the tops of the two mounting frames (4).
6. A novel heat sink for a semiconductor laser as claimed in claim 1, wherein: the cold conducting plate (3) is made of an aluminum material in a machining mode, the outer surface of the cold conducting plate (3) is smooth, and the cold conducting plate (3) is embedded into the top of the mounting plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221740410.6U CN218275513U (en) | 2022-07-06 | 2022-07-06 | Novel heat radiation part of semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221740410.6U CN218275513U (en) | 2022-07-06 | 2022-07-06 | Novel heat radiation part of semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218275513U true CN218275513U (en) | 2023-01-10 |
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ID=84759070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221740410.6U Active CN218275513U (en) | 2022-07-06 | 2022-07-06 | Novel heat radiation part of semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218275513U (en) |
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2022
- 2022-07-06 CN CN202221740410.6U patent/CN218275513U/en active Active
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