CN218256497U

CN218256497U - Liquid silica gel mould with improved glue feeding function

Info

Publication number: CN218256497U
Application number: CN202122870147.4U
Authority: CN
Inventors: 高瑞三; 李军; 郑旭智
Original assignee: Chung Ting Alfa Electronic Technology Shenzhen Co ltd
Current assignee: Chung Ting Alfa Electronic Technology Shenzhen Co ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2023-01-10
Anticipated expiration: 2031-11-22

Abstract

The utility model relates to a liquid silica gel mould technical field specifically is a improve liquid silica gel mould that advances glue, including an upper fixing plate and a lower fixed plate, go up mould fixed plate's lower part fixedly connected with mould, the upper portion fixedly connected with lower mould of lower fixed plate, be provided with a plurality of die cavitys in the lower mould, still include the intervalve, the intervalve runs through out go up the upper end fixedly connected with injection head behind the mould, the injection head with an upper fixing plate fixed connection, the first minute pipe of lower extreme fixedly connected with of intervalve, a plurality of seconds of fixedly connected with are managed on the first minute pipe, and the equal fixedly connected with ox horn pipe of one end that every second was managed, ox horn pipe with the die cavity intercommunication. The utility model discloses a ox horn pipe advances to glue from the edge, and the incomplete problem of edge coverage when advancing to glue can be improved, improves the yields.

Description

Liquid silica gel mould with improved glue feeding function

Technical Field

The utility model relates to a liquid silica gel mould technical field specifically is a liquid silica gel mould that advances to glue is improved.

Background

The liquid silica gel raw material has the advantages of non-toxic, heat-resistant, acid-base-resistant, weather-resistant and high-resilience flexible thermosetting material, extremely low shrinkage after vulcanization, easy molding, excellent electrical insulation performance, no generation of toxic substances during combustion and the like, and the silicone rubber is tasteless and odorless. This kind of mould is when using, can once only make a plurality of products, consequently need flow to each die cavity after liquid silica gel pours into, but the mould among the prior art, there is glue at the incomplete problem of die cavity edge coverage, therefore increases the probability that the substandard product appears, in view of this, the utility model provides an improve the liquid silica gel mould of advancing glue.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an improve into liquid silica gel mould of gluing to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an improve into liquid silica gel mould of gluing, includes an upper fixing plate and a lower fixing plate, go up the mould on an upper fixing plate's lower part fixedly connected with, the upper portion fixedly connected with lower mould of lower mould fixed plate, be provided with a plurality of die cavitys in the lower mould, still include the intervalve, the intervalve runs through out go up the upper end fixedly connected with behind the mould and pour into the head, pour into the head with an upper fixing plate fixed connection, the first branch pipe that divides of lower extreme fixedly connected with of intervalve, a plurality of seconds of fixedly connected with divide the pipe on the first branch pipe, and every second divides the equal fixedly connected with ox horn pipe of one end of pipe, ox horn pipe with the die cavity intercommunication.

Optionally, the lower part of the lower die fixing plate is fixedly connected with a heat insulation plate, the lower part of the heat insulation plate is fixedly connected with a base, and a cooling device is arranged between the heat insulation plate and the lower die fixing plate.

Optionally, the cooling device includes a cooling pipe, a groove for accommodating the cooling pipe is provided on the opposite surface of the insulation board and the lower mold fixing plate, and the cooling pipe is communicated with a finned radiator, a circulating pump and a refrigeration box.

Optionally, a heat dissipation fan is fixedly connected to the finned heat sink.

Optionally, a semiconductor refrigeration piece is fixedly connected in the refrigeration box.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. the utility model discloses, adopt ox horn pipe to advance to glue from the edge, edge coverage incomplete problem improves the yields when can improving into gluing.

2. The utility model discloses, the cooling tube that adopts circuitous setting is favorable to the even cooling of cooling down, improves the demolding speed of product to improve the productivity.

Drawings

Fig. 1 is a schematic structural diagram of a top view of the present invention;

FIG. 2 isbase:Sub>A schematic structural view taken along A-A of FIG. 1;

FIG. 3 is a schematic structural view taken along the line B-B in FIG. 2;

FIG. 4 is a schematic structural view taken along the line C-C in FIG. 2;

fig. 5 is a schematic structural view of the injection head of the present invention;

FIG. 6 is a schematic structural view of the first branch pipe and the second branch pipe of the present invention;

fig. 7 is a schematic structural view of the ox horn tube of the present invention;

fig. 8 is a schematic structural diagram of the cooling device of the present invention.

In the figure: 1. an upper die fixing plate; 2. a lower die fixing plate; 3. an upper die; 4. a lower die; 5. a mold cavity; 6. an intermediate pipe; 7. an injection head; 8. a first branch pipe; 9. a second branch pipe; 10. a bull horn tube; 11. a thermal insulation board; 12. a base; 13. a cooling device; 14. a cooling tube; 15. a groove; 16. a finned heat sink; 17. a refrigeration case; 18. a heat-dissipating fan; 19. a semiconductor refrigeration sheet; 20. and a circulating pump.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example (b): referring to fig. 1 to 8, the utility model provides an improve liquid silica gel mould that advances glue, including upper die fixing plate 1 and lower die fixing plate 2, the lower part fixedly connected with of upper die fixing plate 1 goes up the mould 3, the upper portion fixedly connected with lower mould 4 of lower die fixing plate 2, be provided with a plurality of die cavities 5 in the lower mould 4, still include middle tube 6, the upper end fixedly connected with injection head 7 after middle tube 6 runs through upper mould 3, injection head 7 and upper die fixing plate 1 are fixedly connected, the lower extreme fixedly connected with first branch pipe 8 of middle tube 6, fixedly connected with a plurality of second branch pipes 9 on first branch pipe 8, one end of every second branch pipe 9 all fixedly connected with ox horn pipe 10, ox horn pipe 10 communicates with die cavity 5; the ox horn pipe 10 is adopted to feed glue from the edge, so that the problem of incomplete coverage of the edge of the die cavity 5 during glue feeding can be solved, and the yield is improved.

The lower part fixedly connected with heated board 11 of lower mould fixed plate 2, the lower part fixedly connected with base 12 of heated board 11 are provided with cooling device 13 between heated board 11 and lower mould fixed plate 2.

Specifically, the cooling device 13 includes a cooling pipe 14, a cooling liquid is provided in the cooling pipe 14, a groove 15 for accommodating the cooling pipe 14 is formed in the opposite surface of the heat-insulating board 11 and the lower mold fixing plate 2, the cooling pipe 14 is arranged in a roundabout manner, so that the contact area can be increased, similarly, the groove 15 is also designed, the cooling pipe 14 is communicated with a finned radiator 16, a circulating pump 20 and a refrigerating box 17, the finned radiator 16 can preliminarily cool the cooling liquid after absorbing heat in the mold cavity 5, the refrigerating box 17 can further cool the cooling liquid after absorbing heat in the mold cavity 5, and the finned radiator 16, the circulating pump 20 and the refrigerating box are matched to quickly cool the cooling liquid, so that the cooling liquid circularly flows in the cooling pipe 14, thereby continuously cooling the mold, improving the mold discharging rate of the product, and improving the productivity; the finned radiator 16, the circulation pump 20 and the refrigeration tank 17 are in this case arranged outside the mould, not shown in fig. 1.

The finned radiator 16 is fixedly connected with a radiating fan 18, so that the cooling rate is improved.

The semiconductor refrigerating sheet 19 is fixedly connected in the refrigerating box 17, so that the refrigerating effect is better.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an improve liquid silica gel mould that advances to glue, includes upper fixing plate (1) and lower fixed plate (2), mould (3) on the lower part fixedly connected with of upper fixing plate (1), upper portion fixedly connected with lower mould (4) of lower fixed plate (2), be provided with a plurality of die cavities (5) in lower mould (4), its characterized in that: still include middle tube (6), middle tube (6) run through out go up upper end fixedly connected with injection head (7) behind mould (3), injection head (7) with go up fixed die plate (1) fixed connection, the first minute of lower extreme fixedly connected with (8) of middle tube (6), a plurality of second minute pipes of fixedly connected with (9) are gone up in first minute pipe (8), and the equal fixedly connected with ox horn pipe (10) of one end of every second minute pipe (9), ox horn pipe (10) with die cavity (5) intercommunication.

2. The liquid silicone rubber mold with improved rubber feeding function as claimed in claim 1, wherein: the lower part of the lower die fixing plate (2) is fixedly connected with an insulation board (11), the lower part of the insulation board (11) is fixedly connected with a base (12), and a cooling device (13) is arranged between the insulation board (11) and the lower die fixing plate (2).

3. The liquid silicone rubber mold with improved rubber inlet function as claimed in claim 2, wherein: the cooling device (13) comprises a cooling pipe (14), a groove (15) used for containing the cooling pipe (14) is formed in the opposite surface of the heat insulation plate (11) and the lower die fixing plate (2), and the cooling pipe (14) is communicated with a finned radiator (16), a circulating pump (20) and a refrigerating box (17).

4. The liquid silicone rubber mold with improved rubber feeding function as claimed in claim 3, wherein: the finned radiator (16) is fixedly connected with a radiating fan (18).

5. The liquid silicone rubber mold with improved rubber inlet function as claimed in claim 3, wherein: and a semiconductor refrigerating sheet (19) is fixedly connected in the refrigerating box (17).