CN218254504U

CN218254504U - Aluminum wafer polishing machine

Info

Publication number: CN218254504U
Application number: CN202222874485.XU
Authority: CN
Inventors: 杨金来; 韩克武; 王金宝; 王凌燕; 张敏
Original assignee: Shandong Jinlai Aluminum Co ltd
Current assignee: Shandong Jinlai Aluminum Co ltd
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-01-10
Anticipated expiration: 2032-10-28

Abstract

The utility model relates to the technical field of aluminum wafer polishing, in particular to an aluminum wafer polishing machine, which comprises a base, a rotating disc, a motor I and a polishing assembly, wherein the rotating disc is rotatably arranged on the upper surface of the base; the motor is connected with the rotating disc; a plurality of placing grooves are uniformly formed in the rotating disc along the circumferential direction, aluminum wafers are placed in the placing grooves, polishing assemblies are arranged at the edge of the base in a matched mode with the aluminum wafers, and an included angle is formed between the plane where the rotating disc is located and the horizontal plane; the upper surface of the base is provided with a coaming in a matching way with the rotating disc; the coaming is provided with a polishing opening; the grinding component is matched with the grinding port; the placing groove is formed in the lower surface of the rotating disc and is arranged on the edge of the rotating disc. Compared with the prior art, the plane where the rotating disc is located and the horizontal plane form the included angle and the surrounding plate, so that feeding and discharging operations during polishing of the aluminum wafer are facilitated, and production efficiency is improved.

Description

Aluminum wafer polishing machine

Technical Field

The utility model relates to an aluminium disk polishing technical field specifically discloses an aluminium disk burnishing machine.

Background

The aluminum wafer is widely applied to electronics, daily chemicals, medicines, culture and education and automobile accessories. Electrical appliance, heat preservation, mechanical manufacturing, automobile, aerospace, military industry, mould, building, printing and other industries. For example, kitchen ware articles such as non-stick pans, pressure cookers and the like, and hardware articles such as lampshades, water heater shells, stretching tank bodies and the like are one of the deep processing products of aluminum alloy plate strips with the largest use amount. Most of the aluminum wafers are cut and formed by a punch press, so the outer circumferential wall of the aluminum wafer needs to be polished.

Notice No. CN210139293U discloses an aluminium disk excircle polishing machine, including base and rolling disc, the rolling disc rotates the upper surface that sets up at the base, a plurality of standing grooves have been seted up to the lateral wall of rolling disc, the inside aluminium disk that needs the polishing of placing groove, the below coaxial coupling of rolling disc has driven gear, driven gear's side has the second motor at the last fixed surface of base, the coaxial fixedly connected with discontinuous fluted wheel of output shaft of second motor, discontinuous fluted wheel and driven gear meshing, the radial position of rolling disc rotates and is provided with the drive wheel, the upper surface radial position of rolling disc rotates and is provided with a plurality of handles, the bottom of handle is connected with the fastener, the last fixed surface of base installs first motor, the output shaft coaxial coupling of first motor has the wheel of polishing. The unloading of aluminium disk is comparatively inconvenient among the above-mentioned scheme, influences production efficiency.

SUMMERY OF THE UTILITY MODEL

Not enough to the above-mentioned of prior art, the utility model provides an aluminium disk burnishing machine to go up the inconvenient problem that influences production efficiency of material when solving the aluminium disk polishing.

In order to achieve the above purpose, the technical scheme of the utility model is that:

an aluminum wafer polishing machine comprises a base, a rotating disc, a motor I and a polishing assembly, wherein the rotating disc is rotatably arranged on the upper surface of the base; the motor is connected with the rotating disc; a plurality of placing grooves are uniformly formed in the rotating disc along the circumferential direction, aluminum wafers are placed in the placing grooves, polishing assemblies are arranged at the edge of the base in a matched mode with the aluminum wafers, and an included angle is formed between the plane where the rotating disc is located and the horizontal plane; the upper surface of the base is provided with a coaming in a matching way with the rotating disc; the coaming is provided with a polishing opening; the grinding assembly is matched with the grinding port; the placing groove is formed in the lower surface of the rotating disc and is arranged on the edge of the rotating disc. During the use, can once only pour the rolling disc upper surface into with the aluminium disk of a certain amount, because the setting of contained angle is personally submitted with the level in the plane of rolling disc place, under blockking of bounding wall, the aluminium disk falls into the standing groove in, then the subassembly of polishing is polished the aluminium disk, has made things convenient for the material loading operation when aluminium disk polishing handles, has improved production efficiency.

Preferably, the grinding opening is formed in the higher side of the rotating disc, and keeps a distance from an accumulation area after the aluminum wafer is fed, namely the lower side of the rotating disc, so that mutual interference is avoided, and smooth polishing is guaranteed.

Preferably, a discharge port is formed in the enclosing plate; the drain hole is arranged on the lower side of the rotating disc. After polishing, the aluminum wafer is discharged from a discharge hole formed in the lower side of the rotating disc, and the aluminum wafer is poured out from the placing groove under the action of gravity, so that discharging operation is facilitated.

Preferably, the door plate is hinged to the discharging hole, the door plate is closed during feeding, the door plate is opened during discharging, and the operation of feeding and discharging of the aluminum wafer is guaranteed.

Preferably, the coaming is provided with an arc plate; the arc plate is arranged on one side of the discharge hole. The space when the aluminum wafer is loaded and accumulated is ensured, and the leakage is avoided.

Preferably, the coaming is matched with the grinding opening to fixedly arrange a material baffle plate to limit the movement of the aluminum wafer during polishing; and the aluminum wafer is prevented from directly falling into the placing groove at the grinding opening to interfere the polishing operation.

Preferably, the grinding assembly comprises a grinding wheel and a motor II; the polishing wheel is matched with the polishing port; and the output shaft of the second motor is connected with a grinding wheel.

Preferably, a rotating shaft is arranged on the rotating disc in a matching manner with the placing groove; an output shaft of the motor is provided with an intermittent gear wheel; the discontinuous gear comprises a discontinuous tooth part and a smooth part; the discontinuous tooth part of the discontinuous gear is meshed with the gear; the gear is arranged on a rotating shaft of the rotating disc; the smooth portion of the interrupted pattern wheel contacts the runner; the rotating wheel is arranged at the shaft end of the rotating shaft. The motor drives the intermittent gear to rotate, so that the rotating disc is driven to rotate intermittently, and meanwhile, the smooth part of the intermittent gear drives the rotating shaft to rotate, so that the rotation of the aluminum wafer during polishing is ensured, and the polishing of the polishing wheel to the aluminum wafer is ensured.

The utility model has the advantages that: the plane where the rotating disc is located and the horizontal plane form an included angle and the surrounding plate is arranged, so that feeding and discharging operations during polishing of the aluminum wafer are facilitated, and production efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of an embodiment of the present invention;

fig. 3 is a schematic view of a partially cut-away structure of the embodiment of the present invention without the base and the surrounding plate;

fig. 4 is a schematic structural diagram of a rotating disk according to an embodiment of the present invention;

description of reference numerals:

1-base, 2-rotating disc, 3-motor I, 4-coaming, 5-grinding wheel, 6-motor II, 7-rotating shaft, 8-discontinuous-toothed wheel, 9-gear and 10-rotating wheel;

201-a placing groove, 202-a rotating shaft, 401-a grinding opening, 402-a discharging opening, 403-a door plate, 404-an arc plate and 405-a material baffle plate.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

As shown in fig. 1 and 4, the aluminum wafer polishing machine comprises a base 1, a rotating disc 2, a first motor 3 and a polishing assembly, wherein the rotating disc 2 is rotatably arranged on the upper surface of the base 1; the first motor 3 is connected with the rotating disc 2; a plurality of placing grooves 201 are uniformly formed in the rotating disc 2 along the circumferential direction, aluminum wafers are placed in the placing grooves 201, polishing assemblies are arranged at the edge of the base 1 in a matched mode with the aluminum wafers, and the plane where the rotating disc 2 is located and the horizontal plane form an acute included angle; the upper surface of the base 1 is matched with the rotating disc 2 to be provided with a coaming 4; the coaming 4 is provided with a grinding opening 401; the grinding assembly is arranged in cooperation with the grinding port 401; the placement groove 201 is provided downward from the upper surface of the rotating disk 2, and the placement groove 201 is provided at the edge of the rotating disk 2. During the use, can once only pour into 2 upper surfaces of rolling disc with the aluminium disk of a certain amount, because the setting of contained angle is personally submitted with the level in the plane of rolling disc 2 place, under the stopping of bounding wall 4, the aluminium disk falls into standing groove 201 in, then the subassembly of polishing is polished the aluminium disk, has made things convenient for the material loading operation when aluminium disk polishing handles, has improved production efficiency.

In the above arrangement, the polishing port 401 is arranged on the higher side of the rotating disc 2, and keeps a distance from the stacking area after the aluminum wafer is fed, namely the lower side of the rotating disc 2, so that mutual interference is avoided, and smooth polishing is ensured. A discharge hole 402 is arranged on the coaming 4; a discharge port 402 is provided at a lower side of the rotary disk 2. After polishing, discharging is carried out through a discharging hole 402 arranged on the lower side of the rotating disc 2, and the aluminum wafer is poured out from the placing groove 201 under the action of gravity, so that discharging operation is facilitated. The discharging hole 402 is hinged with a door plate 403, the door plate 403 is closed during feeding, and the door plate 403 is opened during discharging, so that the feeding and discharging operations of the aluminum wafer are guaranteed. The coaming 4 is provided with an arc plate 404; the arc plate 404 is arranged on one side of the discharging port 402, so that the space of the aluminum wafer during feeding and accumulation is ensured, and leakage is avoided. The coaming 4 is fixedly provided with a material baffle 405 in cooperation with the grinding port 401 to limit the movement of the aluminum wafer during polishing; and the aluminum wafer is prevented from directly falling into the placing groove 201 at the grinding opening to interfere with the polishing operation. Both ends border department of striker plate 405 sets up the turn-up, can block the aluminium disk, guarantees that the aluminium disk falls into standing groove 201.

As shown in fig. 2-4, the grinding assembly includes a grinding wheel 5 and a second motor 6; the polishing wheel 5 is arranged in cooperation with the polishing port 401; an output shaft of the second motor 6 is connected with a grinding wheel 5. The rotating disc 2 is provided with a rotating shaft 7 matched with the placing groove 201; an output shaft of the first motor 3 is provided with an intermittent gear 8; the interrupted gear 8 comprises an interrupted tooth part and a smooth part; the discontinuous teeth part of the discontinuous gear 8 is meshed with the gear 9; the gear 9 is arranged on the rotating shaft 202 of the rotating disc 2; the smooth portion of the interrupted cog 8 contacts the runner 10; the wheel 10 is arranged at the axial end of the rotating shaft 7. The motor I3 drives the intermittent gear 8 to rotate, so that the rotating disc 2 is driven to rotate intermittently, and meanwhile, the smooth part of the intermittent gear 8 drives the rotating shaft 7 to rotate, so that the rotation of an aluminum wafer during polishing is guaranteed, and the polishing of the aluminum wafer by the polishing wheel 5 is guaranteed.

Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An aluminum wafer polishing machine comprises a base (1), a rotating disc (2), a motor I (3) and a polishing assembly, wherein the rotating disc (2) is rotatably arranged on the upper surface of the base (1); the first motor (3) is connected with the rotating disc (2); a plurality of placing grooves (201) are uniformly formed in the rotating disc (2) along the circumferential direction, aluminum wafers are placed in the placing grooves (201), and the edge of the base (1) is matched with the aluminum wafers to form a polishing assembly, wherein the plane where the rotating disc (2) is located and the horizontal plane form an included angle; the upper surface of the base (1) is matched with the rotating disc (2) to be provided with a coaming (4); a grinding opening (401) is formed in the coaming (4); the grinding assembly is arranged in a matching way with the grinding port (401); the placing groove (201) is formed by downwards arranging the upper surface of the rotating disc (2), and the placing groove (201) is formed in the edge of the rotating disc (2).

2. Aluminum wafer polishing machine according to claim 1, characterized in that the polishing mouth (401) is arranged at the upper side of the rotating disc (2).

3. The aluminum wafer polishing machine as recited in claim 2, characterized in that a discharge opening (402) is provided on the enclosure plate (4); the discharging hole (402) is formed in the lower side of the rotating disc (2).

4. The aluminum wafer polishing machine as recited in claim 3, wherein a door panel (403) is hinged to the discharge port (402).

5. The aluminum wafer polishing machine as recited in claim 4, characterized in that the shroud plate (4) is provided with a circular arc plate (404); the arc plate (404) is arranged on one side of the discharging hole (402).

6. The aluminum wafer polishing machine as recited in claim 5, characterized in that the baffle plate (405) is fixedly arranged on the baffle plate (4) in cooperation with the polishing port (401).

7. The aluminum wafer polisher of claim 1, wherein the grinding assembly comprises a grinding wheel (5) and a motor two (6); the grinding wheel (5) is arranged in a matching way with the grinding opening (401); and an output shaft of the second motor (6) is connected with a grinding wheel (5).

8. The aluminum wafer polishing machine as claimed in claim 1, wherein the rotating disc (2) is provided with a rotating shaft (7) matched with the placing groove (201); an output shaft of the first motor (3) is provided with an interrupted gear (8); the discontinuous gear (8) comprises discontinuous tooth parts and smooth parts; the discontinuous teeth of the discontinuous gear (8) are meshed with a gear (9); the gear (9) is arranged on a rotating shaft (202) of the rotating disc (2); the smooth part of the interrupted gear (8) contacts the runner (10); the rotating wheel (10) is arranged at the shaft end of the rotating shaft (7).