CN218241806U - Wafer processing equipment - Google Patents
Wafer processing equipment Download PDFInfo
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- CN218241806U CN218241806U CN202222398327.1U CN202222398327U CN218241806U CN 218241806 U CN218241806 U CN 218241806U CN 202222398327 U CN202222398327 U CN 202222398327U CN 218241806 U CN218241806 U CN 218241806U
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Abstract
The utility model discloses a wafer processing equipment, include: a base; the placing platform is arranged on the base and used for placing the wafer, and the placing platform is provided with a yielding part which is positioned below the wafer; the adsorption plate is positioned below the wafer, and when the adsorption plate is positioned to the first position, the adsorption plate is positioned in the abdicating part and attached to the lower surface of the wafer; the adsorption device is arranged on the base, and the adsorption plate can be communicated with the adsorption device, so that the adsorption device can provide a vacuum source for the adsorption plate; the adsorption devices are distributed at different positions along the circumferential direction of the vertical axis; the adsorption plate can rotate around the axis in the vertical direction to be communicated with one adsorption device; the processing device is arranged on the base and is positioned below the placing platform; the device can reduce the abrasion of the vacuum pipeline and reduce the possibility of vacuum adsorption failure.
Description
Technical Field
The utility model relates to a chip manufacturing field especially relates to a wafer processing equipment.
Background
The front surface of the existing wafer is mainly a circuit surface, the back surface of the wafer is a supporting surface, and in a processing process or a carrying process, the circuit surface cannot be contacted to cause the circuit surface to be polluted, so that the front surface circuit surface faces upwards for positioning, the supporting surface faces downwards for laser marking, and the processed table surface needs to expose the back surface of the wafer, so that the middle of the wafer can be sunken after the wafer is placed on the processed table surface, and the processing precision is influenced.
Therefore, the prior art provides a wafer leveling method, which adopts a vacuum adsorption plate to abut against the lower surface of a wafer to support the wafer and reduce the recess of the middle part of the wafer; when adjusting the vacuum adsorption board position, the vacuum tube that the vacuum adsorption board is connected needs along with vacuum adsorption board simultaneous movement, causes the pipeline wearing and tearing easily and leads to the vacuum adsorption inefficacy.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a wafer processing equipment can reduce the possibility that vacuum adsorption became invalid by less vacuum line's wearing and tearing.
The utility model discloses a wafer processing equipment, include: a base; the placing platform is arranged on the base and used for placing a wafer, and the placing platform is provided with a yielding part which is positioned below the wafer; the adsorption plate is positioned below the wafer, and when the adsorption plate is positioned to the first position, the adsorption plate is positioned in the abdicating part and attached to the lower surface of the wafer; the adsorption device is arranged on the base, and the adsorption plate can be communicated with the adsorption device, so that the adsorption device can provide a vacuum source for the adsorption plate; the adsorption devices are distributed at different positions along the circumferential direction of the vertical axis; the adsorption plate can rotate around a vertical axis to be communicated with one adsorption device; and the processing device is arranged on the base and is positioned below the adsorption plate.
According to some embodiments of the utility model, the outline of adsorption plate is semi-circular or arch, adsorption equipment has two, two adsorption equipment follows the circumference equipartition of vertical direction axis.
According to some embodiments of the utility model, seted up a plurality of portions of dodging on the adsorption plate, it is a plurality of dodge a interval and set up.
According to some embodiments of the utility model, the wafer processing equipment still includes: the first lifting device is arranged on the base; the first lifting device can drive the adsorption plate to ascend to a first position, so that the adsorption plate is positioned in the abdicating part and attached to the lower surface of the wafer; the first lifting device can drive the adsorption plate to descend to a second position, so that the adsorption plate is separated from the lower surface of the wafer.
According to some embodiments of the utility model, wafer processing equipment is still including setting up rotating disc on the first elevating gear, be provided with the supporting part on the rotating disc, the supporting part is used for supporting the adsorption plate, elevating gear is through control the rotating disc goes up and down to drive the adsorption plate goes up and down.
According to some embodiments of the utility model, wafer processing equipment is still including setting up rotating device on the first elevating gear, first elevating gear can drive rotating device with the rolling disc is together gone up and down, rotating device can drive the rolling disc rotates.
According to some embodiments of the invention, the supporting portion is a plurality of, a plurality of the supporting portion is along the circumferential distribution of the rotating disc.
According to some embodiments of the utility model, wafer processing equipment is still including setting up pressure rising and dropping board on the base, pressure rising and dropping board below is provided with the clamping ring, pressure rising and dropping board can drive the clamping ring pushes down, makes the clamping ring will the edge pressure of wafer is in place the platform is last.
According to the utility model discloses a some embodiments, wafer processing equipment is still including setting up second elevating gear on the base, second elevating gear is used for driving the lift clamp plate goes up and down.
According to some embodiments of the utility model, wafer processing equipment is still including setting up moving platform on the base, place the platform with adsorption equipment all sets up moving platform is last.
By applying the wafer processing equipment, in the processing process, the adsorption device can provide vacuum for the adsorption plate, so that the adsorption plate is tightly attached to the lower surface of the wafer in a vacuum adsorption mode, the support is provided for the wafer, and the recess of the wafer is reduced; when the adsorption plate rotates, the adsorption device at the corresponding position can provide a vacuum source for the adsorption plate, so that the adsorption plate can be tightly attached to the lower surface of the wafer in a vacuum adsorption mode at the current position, support is provided for the wafer, and the recess of the wafer is reduced; in the position adjustment process of the adsorption plate, the vacuum pipeline does not need to move along with the adsorption plate, and the possibility of vacuum adsorption failure caused by pipeline abrasion is effectively reduced.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a first wafer processing apparatus according to an embodiment of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
FIG. 3 is a schematic view of the combination of the rotating disc and the absorption plate in the embodiment of the present invention;
FIG. 4 is a schematic view of the rotating disk of FIG. 3;
fig. 5 is a schematic view of a first adsorption plate according to an embodiment of the present invention;
fig. 6 is a schematic view of a second adsorption plate according to an embodiment of the present invention;
fig. 7 is a schematic view of a second wafer processing apparatus according to an embodiment of the present invention;
FIG. 8 is an enlarged view at B of FIG. 7;
the above figures contain the following reference numerals.
| Reference numerals | Name(s) | Reference numerals | Name (R) |
| 110 | |
250 | |
| 120 | |
260 | |
| 130 | Image capturing |
270 | Voltage rising and falling |
| 210 | |
271 | |
| 220 | |
272 | |
| 221 | |
280 | |
| 230 | |
290 | |
| 240 | Supporting part |
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the directional descriptions, such as the directions or positional relationships indicated by upper, lower, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but not for indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the present number, and the terms greater than, less than, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 and 2, the wafer processing apparatus according to the first aspect of the present embodiment includes: a base; a placing platform 280 disposed on the base, wherein the placing platform 280 is used for placing a wafer, that is, the wafer body 260 shown in fig. 2, and the placing platform 280 is provided with a yield part located below the wafer; a first lifting device 210 disposed on the base; the adsorption plate 250 is positioned below the wafer, and the first lifting device 210 can drive the adsorption plate 250 to ascend to a first position, so that the adsorption plate 250 is positioned in the abdicating part and attached to the lower surface of the wafer; the first lifting device 210 can drive the adsorption plate 250 to descend to a second position, so that the adsorption plate 250 is separated from the lower surface of the wafer; and a processing device 120 disposed on the base, wherein the processing device 120 is located below the adsorption plate 250.
By applying the wafer processing device, in the wafer production process, when the position of the adsorption plate 250 needs to be adjusted, the first lifting device 210 can be controlled to drive the adsorption plate 250 to descend to the second position, so that the lower surface of the wafer is separated from the adsorption plate 250; then, adjusting the position of the adsorption plate 250, controlling the first lifting device 210 to drive the adsorption plate 250 to ascend so that the first lifting plate returns to the first position attached to the lower surface of the wafer, providing vacuum for the adsorption plate 250 so that the adsorption plate 250 can adsorb the lower surface of the wafer, and then processing the part of the wafer newly exposed out of the adsorption plate 250 by the processing device 120; the position of the adsorption plate 250 can be adjusted without lifting the wafer in the whole adjusting process, so that the displacement caused by the movement of the wafer is effectively reduced, and the processing precision of the wafer is improved.
As shown in fig. 3 to 6, the adsorption plate 250 is a plate with a plurality of adsorption mechanisms, when the adsorption plate 250 is tightly attached to the lower end surface of the wafer and adsorbs the lower end surface of the wafer through vacuum adsorption, the adsorption plate 250 avoids a portion of the lower surface of the wafer, at this time, the processing device 120 can process the lower surface of the wafer from below, after the portion is processed, the vacuum source of the adsorption plate 250 can be disconnected, the adsorption plate 250 is driven by the first lifting device 210 to descend to the second position, then the position of the adsorption plate 250 is adjusted to drive the adsorption plate 250 to ascend to the first position, then a vacuum source is provided for the adsorption plate 250, at this time, the other portion of the lower surface of the wafer, which needs to be processed, is exposed out of the adsorption plate 250, and the processing device 120 can process the portion; in the adjusting process of the adsorption plate 250, the adsorption plate 250 is separated from the lower surface of the wafer, so that the condition that the lower surface of the wafer is damaged due to the fact that the adsorption plate 250 moves relative to the surface of the wafer is effectively avoided; meanwhile, the wafer is fixed, and the adsorption plate 250 moves, so that the position error caused by the movement of the wafer can be effectively reduced; when the adsorption plate 250 is located at the first position, the upper surface of the adsorption plate 250 is flush with the upper surface of the placing platform 280.
The first aspect of this embodiment further provides a wafer processing method, which applies the wafer processing apparatus of the first aspect of this embodiment, including the following steps: s100, placing the wafer at a specified position of the placing platform 280 above the yielding part; s200, controlling the first lifting device 210 to drive the adsorption plate 250 to ascend to a first position, and then providing a vacuum source for the adsorption plate 250; s300, controlling the processing device 120 to process the portion of the wafer exposed out of the suction plate 250; s400, controlling the first lifting device 210 to drive the adsorption plate 250 to descend to a second position, and then rotating the adsorption plate 250 by a specified angle; s500, controlling the first lifting device 210 to drive the adsorption plate 250 to ascend to a first position, and then providing a vacuum source for the adsorption plate 250; s600, the processing device 120 is controlled to process the portion of the wafer exposed from the suction plate 250.
As shown in fig. 1, 3 and 4, the wafer processing apparatus further includes a rotating disc 221 rotatably disposed on the first lifting device 210, a support 240 is disposed on the rotating disc 221, the support 240 is used for supporting the adsorption plate 250, and the lifting device drives the adsorption plate 250 to lift by controlling the rotating disc 221 to lift; at this time, in each step, the first lifting device 210 drives the adsorption plate 250 to switch between the first position and the second position by controlling the rotating disc 221 to move up and down, and in step S400, the adsorption plate 250 may be driven to rotate by adjusting the rotating angle of the rotating disc 221, so as to adjust the position of the adsorption plate 250.
In this embodiment, the first lifting device 210 can drive the adsorption plate 250 to lift in various ways, for example, the adsorption plate 250 is driven to lift by a screw motor mechanism or a linear motor module, or the adsorption plate 250 is driven to lift by an air cylinder.
It should be noted that in the present embodiment, the rising refers to moving along the positive direction of the Z axis in fig. 1; the first position and the second position are only vertical positions of the adsorption plate 250, that is, in step S400, when the adsorption plate 250 is rotated by the rotating disc 221, the vertical position of the adsorption plate 250 is not changed, and it is still located at the second position.
Specifically, as shown in fig. 4, there are a plurality of the supporting portions 240, and the plurality of the supporting portions 240 are spaced apart from each other in the circumferential direction of the rotating disc 221; the plurality of supporting portions 240 can support the adsorption plate 250 at multiple points, so that the stability of the adsorption plate 250 is improved; the distribution of the supporting portions 240 may be flexibly determined according to the shape of the suction plate 250; for example, a plurality of support portions 240 and the like are provided at intervals in the circumferential direction of the rotating disk 221.
As shown in fig. 1, the wafer processing apparatus further includes a rotating device 220 disposed on the first lifting device 210, the first lifting device 210 can drive the rotating device 220 and the rotating disc 221 to lift together, and the rotating device 220 can drive the rotating disc 221 to rotate; in step S400, after the adsorption plate 250 descends to the second position, the rotating device 220 may drive the rotating disc 221 to rotate, so that the adsorption plate 250 correspondingly rotates to a specified angle, and the precise control of the rotation position of the adsorption plate 250 is realized; in this embodiment, the rotating device 220 may drive the rotating disc 221 to rotate in various ways, such as driving the rotating disc 221 to rotate by a motor driving gear set, or driving the rotating disc 221 to rotate by a motor driving belt drive or a chain drive, etc.
As shown in fig. 5, the outer contour of the suction plate 250 is semicircular or arched, wherein the semicircular contour refers to a contour surrounded by semicircular side lines and straight lines, and the arched contour refers to a contour surrounded by circular arcs and straight lines with a central angle less than 180 °; wherein, the area of the absorption plate 250 is less than half of the area of the wafer; in step S300, the wafer can be exposed to a portion with a surface area more than half, and the processing device 120 can process a portion with a surface area half of the wafer in the exposed portion; in step S400, the rotating device 220 drives the absorption plate 250 to rotate 180 °, and then in step S500, the absorption plate 250 rises and vacuum-absorbs with the lower surface of the wafer; at this time, the other half of the lower surface of the wafer is exposed to the suction plate 250, and the processing device 120 may process the part in step S600; the two processes can process all the areas of the lower surface of the wafer.
Specifically, as shown in fig. 6, on the basis of the semicircular or dome-shaped outer contour, the adsorption plate 250 is provided with a plurality of avoidance portions, and the avoidance portions are arranged at intervals; after the wafer is processed, ceramic fingers can be inserted into the avoiding part from the side to take out the wafer, so that the wafer can be taken out after being lifted; in the preferred scheme, two avoidance parts are provided, so that two fingertips of the ceramic fingers can enter conveniently.
As shown in fig. 1, the vacuum cleaner further comprises a suction device 230 disposed on the first lifting device 210, the first lifting device 210 can drive the suction device 230 and the suction plate 250 to lift and lower together, the suction plate 250 can communicate with the suction device 230, so that the suction device 230 can provide a vacuum source for the suction plate 250; in steps S300 and S500, the suction device 230 is responsible for providing a vacuum source for the suction plate 250, so that the suction plate 250 can be attached to the lower surface of the wafer by vacuum suction to provide a support for the lower surface of the wafer; in step S400, before the first lifting device 210 drives the absorption plate 250 to descend, the absorption device 230 may be controlled to stop providing a vacuum source for the absorption plate 250, so as to prevent the absorption plate 250 from descending and pulling the wafer to damage the wafer.
As shown in fig. 1 and fig. 2, the wafer processing apparatus further includes a pressure rising and reducing plate 270 disposed on the base, a pressing ring 271 is disposed below the pressure rising and reducing plate 270, and the pressure rising and reducing plate 270 can drive the pressing ring 271 to press down, so that the pressing ring 271 presses the edge of the wafer on the placing platform 280; in step S100, after the wafer is mounted in place, the edge of the wafer is placed on the position of the placing platform 280 around the relief portion, and the pressure-increasing/reducing plate 270 is controlled to be pressed downward, so that the edge of the wafer is pressed onto the placing platform 280 by the pressing ring 271, and the wafer is fixed on the placing platform 280; after the wafer is processed, the pressure rising and lowering plate 270 may be controlled to rise to a safe height, and the adsorption plate 250 may be controlled to fall to a second position, and then the wafer may be taken out; here, the lifting and lowering of the lifting and lowering pressure plate 270 may be automatically controlled by a driving device, or the lifting and lowering pressure plate 270 may be controlled by a manual adjustment.
Specifically, the wafer processing device further comprises a second lifting device arranged on the base, the second lifting device is used for driving the lifting and lowering plate 270 to lift and lower, and in the whole wafer processing process, the control center controls the lifting and lowering plate 270 to lift and lower by controlling the second lifting device; the second lifting device may control the lifting of the pressure rising and reducing plate 270 in various ways, for example, the motor drives a linear mechanism such as a rack-and-pinion mechanism or a lead screw-nut mechanism to drive the pressure rising and reducing plate 270 to lift, or the linear motor directly drives the pressure rising and reducing plate 270 to lift, or the air cylinder or the hydraulic cylinder drives the pressure rising and reducing plate 270 to lift.
In this embodiment, a plurality of suction devices 230 may be provided, and the wafer processing device, i.e. the wafer processing apparatus of the first aspect of this embodiment includes: a base; a placing platform 280 disposed on the base, wherein the placing platform 280 is used for placing a wafer, and the placing platform 280 is provided with a yield part located below the wafer; the adsorption plate 250 is positioned below the wafer, and when the adsorption plate 250 is positioned at the first position, the adsorption plate 250 is positioned in the abdicating part and attached to the lower surface of the wafer; a suction device 230 disposed on the base, the suction plate 250 being capable of communicating with the suction device 230 such that the suction device 230 is capable of providing a vacuum source for the suction plate 250; the adsorption device 230 is provided in plurality, and the adsorption devices 230 are distributed at different positions along the circumferential direction of the vertical direction axis; the adsorption plate 250 can rotate around a vertical axis to communicate with one of the adsorption devices 230; and a processing device 120 disposed on the base, wherein the processing device 120 is located below the adsorption plate 250.
By applying the wafer processing device, in the processing process, the adsorption device 230 can provide vacuum for the adsorption plate 250, so that the adsorption plate 250 is tightly attached to the lower surface of the wafer in a vacuum adsorption manner, so as to provide support for the wafer and reduce the wafer recess; when the adsorption plate 250 rotates, the adsorption device 230 at the corresponding position can provide a vacuum source for the adsorption plate 250, so that the adsorption plate 250 can be tightly attached to the lower surface of the wafer in a vacuum adsorption manner at the current position, support is provided for the wafer, and the recess of the wafer is reduced; in the position adjustment process of the adsorption plate 250, the vacuum pipeline does not need to move along with the adsorption plate 250, and the possibility of vacuum adsorption failure caused by pipeline abrasion is effectively reduced.
Specifically, in step S500, the rotated suction plate 250 is lifted to the first position, and the suction device 230 disposed at the rotation angle provides a vacuum source for the suction plate 250.
Specifically, there are two adsorption devices 230, and the two adsorption devices 230 are uniformly distributed along the circumferential direction of the vertical axis; since the rotation angle of the suction plate 250 is 180 ° in step S400, two suction devices 230 need to be uniformly arranged along the circumferential direction of the vertical axis, that is, the distribution angle of the two suction devices 230 is also 180 °, so that the suction plate 250 has one suction device 230 at a corresponding position in step S200 and step S500 to provide a vacuum source for the suction plate 250.
As shown in fig. 1, the wafer further includes a moving platform 110 disposed on the base, and the placing platform 280 and the adsorption device 230 are disposed on the moving platform 110; specifically, many components including the placement platform 280, the lifting platen 270, the first lifting device 210, and the second lifting device are all disposed on the mobile platform 110, and the mobile platform 110 can drive the above components to integrally translate and adjust the position.
Fig. 7 and 8 show a wafer processing apparatus according to a second aspect of the present embodiment, which includes: a base; a placing platform 280 disposed on the base, wherein the placing platform 280 is used for placing a wafer, and the placing platform 280 is provided with an abdicating portion located below the wafer; the pressure increasing and reducing plate 270 is arranged on the base in a lifting manner, a pressing ring 271 is arranged below the pressure increasing and reducing plate 270, and the pressure increasing and reducing plate 270 can drive the pressing ring 271 to press downwards, so that the pressing ring 271 presses the wafer, namely the edge of the wafer body 260 shown in fig. 8, on the placing platform 280; a fixing member disposed on the pressure rising and lowering plate 270, the fixing member being capable of detachably fixing the wafer; and the processing device 120 is arranged on the base, and the processing device 120 is positioned below the yielding part.
By applying the wafer processing device of the second aspect of the present embodiment, in the process of processing, the pressing ring 271 on the lifting pressing plate 270 can press the edge of the wafer on the placing platform 280, the stability of the position of the wafer is ensured when the processing device 120 processes the lower surface of the wafer, when the wafer needs to be lifted, the fixing component can be fixed with the wafer, and then the pressing plate is controlled to ascend, so that the wafer is lifted, when the wafer needs to be reset, only the pressing plate needs to be controlled to descend, after the wafer descends back to the placing platform 280, the fixing component and the wafer can be released, two functions of fixing the edge of the wafer and lifting the wafer can be realized simultaneously through one set of pressing plate lifting mechanism, compared with the prior art, the number of the lifting mechanisms can be effectively reduced, and the equipment cost is reduced.
The fixing component can detachably fix the wafer in various ways, for example, the wafer side is clamped by the clamping device capable of translating, or the wafer is adsorbed by the suction nozzle; on the other hand, the lifting and lowering of the lifting and lowering pressure plate 270 may be automatically controlled by providing a driving member, or the lifting and lowering pressure plate 270 may be controlled by manual adjustment.
Specifically, the wafer processing device further comprises a second lifting device arranged on the base, and the second lifting device is used for driving the lifting and lowering plate 270 to lift and lower; after the wafer is mounted in place, the edge of the wafer is placed on the position of the placing platform 280, which is located at the periphery of the yielding portion, and the pressure rising and lowering plate 270 is controlled to press down through the second lifting device, so that the edge of the wafer is pressed on the placing platform 280 by the pressing ring 271, and the wafer is fixed on the placing platform 280; after the wafer is processed, the pressure rising and lowering plate 270 can be controlled to rise to a safe height, and then the wafer is taken out; in the processing process, when the wafer needs to be lifted, the fixing component can be controlled to fix the wafer; then, controlling the second lifting device to drive the lifting and lowering plate 270 to lift; the second lifting device may control the lifting of the pressure rising and reducing plate 270 in various ways, for example, the motor drives a linear mechanism such as a rack-and-pinion mechanism or a lead screw-nut mechanism to drive the pressure rising and reducing plate 270 to lift, or the linear motor directly drives the pressure rising and reducing plate 270 to lift, or the air cylinder or the hydraulic cylinder drives the pressure rising and reducing plate 270 to lift.
As shown in fig. 8, in order to reduce damage to the edge of the wafer during the wafer lifting process, the wafer lift apparatus further includes a jig assembly 290 disposed above the placing platform 280, the wafer is placed above the jig assembly 290, and the fixing assembly is capable of detachably fixing the jig assembly 290; specifically, the jig assembly 290 is arranged above the placing table, and the middle of the jig assembly is hollow, so that the processing device 120 can process the lower surface of the wafer through the hollow part of the jig assembly; when the wafer needs to be lifted, the fixing assembly fixing jig assembly 290 may be controlled, and then the second lifting device is controlled to drive the lifting/lowering plate 270 to lift.
Specifically, as shown in fig. 8, the fixing component includes a lifting buckle 272 disposed on the lifting and lowering plate 270, a boss is disposed on the jig component 290, and the lifting buckle 272 can translate relative to the lifting and lowering plate 270 to clamp the boss; when the wafer assembly needs to be lifted, the lifting buckle 272 can be moved, so that the lifting buckle 272 is clamped on the column boss, and then the second lifting device drives the lifting and reducing plate 270 to be lifted, so that the wafer is lifted; in the wafer replacing process, the second lifting device drives the lifting plate 270 to descend, so that the jig assembly 290 falls back to the original position on the placing platform 280, and then the lifting buckle 272 is translated to enable the lifting buckle 272 to release the clamping of the boss; the translation of the lifting buckle 272 can be controlled manually or automatically by a translation driving device arranged on the lifting and lowering plate 270.
As shown in fig. 7 and 8, the wafer processing apparatus further includes: the adsorption plate 250 is positioned below the wafer, when the wafer is lowered to a first position, the adsorption plate 250 is attached to the lower surface of the wafer, when the wafer is raised to a second position, the adsorption plate 250 is separated from the lower surface of the wafer, and the adsorption plate 250 can rotate around an axis in the vertical direction; a suction device 230 disposed on the base, wherein the suction plate 250 can communicate with the suction device 230, so that the suction device 230 can provide a vacuum source for the suction plate 250; as shown in fig. 3 to 6, when the jig element 290 is located on the placing platform 280, the upper surface of the jig element 290 is flush with the upper surface of the absorption plate 250, the absorption plate 250 is located in the hollow portion of the jig element 290, and the processing device 120 can process the portion of the lower surface of the wafer which is not covered by the absorption plate 250; after the exposed part is processed, the lifting buckle 272 can be moved, so that the lifting buckle 272 clamps the column boss, then the second lifting device drives the lifting and lowering plate 270 to lift, the wafer is lifted, then the adsorption plate 250 rotates 180 degrees, then the jig assembly 290 is lowered to the original position, and the adsorption plate 250 and the lower surface of the wafer are subjected to vacuum adsorption; at this time, the other half of the lower surface of the wafer is exposed to the adsorption plate 250, and the processing device 120 can process the part; during the processing, the function of the adsorption plate 250 can be referred to the above embodiment; when the adsorption plate 250 rotates, the wafer is lifted, so that the lower surface of the wafer can be separated from the adsorption plate 250, and the adsorption plate 250 cannot be scratched with the lower surface of the wafer in the rotating process.
Specifically, there are a plurality of the adsorption devices 230, and the plurality of the adsorption devices 230 are distributed at different positions in the circumferential direction along the vertical direction axis; the adsorption plate 250 can rotate to communicate with one of the adsorption devices 230; specifically, there are two adsorption devices 230, and the two adsorption devices 230 are uniformly distributed along the circumferential direction of the vertical axis; since the rotation angle of the suction plate 250 is 180 ° in step S400, two suction devices 230 need to be uniformly arranged along the circumferential direction of the vertical axis, that is, the distribution angle of the two suction devices 230 is also 180 °, so that the suction plate 250 has one suction device 230 at a corresponding position in step S200 and step S500 to provide a vacuum source for the suction plate 250.
As shown in fig. 3 and 4, the wafer processing apparatus further includes a rotating disc 221 disposed on the base, a support 240 is disposed on the rotating disc 221, the support 240 is used for supporting the adsorption plate 250, and the rotating device 220 is used for driving the rotating device 220 to rotate; there are a plurality of the supporting portions 240, and a plurality of the supporting portions 240 are distributed along the circumferential direction of the rotating disk 221.
With the wafer processing apparatus according to the second aspect of the present embodiment, the wafer processing process includes: firstly, placing the wafer on a specified position of the placing platform 280, secondly, controlling the second lifting device to drive the pressure rising and lowering plate 270 to descend, so that the edge of the wafer is pressed by the pressing ring 271, and controlling the adsorption device 230 to provide a vacuum source for the adsorption plate 250, so that the adsorption plate 250 is adsorbed on the lower surface of the wafer; thirdly, controlling the processing device 120 to process a half of the lower surface of the wafer exposed out of the adsorption plate 250; fourthly, controlling the lifting buckle 272 to translate to clamp the boss, then controlling the second lifting device to drive the lifting plate 270 to lift, and then driving the rotating disc 221 to rotate by the rotating device 220, so that the adsorption plate 250 rotates 180 degrees; fifthly, controlling the second lifting device to drive the lifting plate 270 to descend, enabling the jig platform to drive the wafer to return to the original position, then translating the lifting buckle 272 to enable the lifting buckle 272 to be separated from the boss, and enabling the pressing ring 271 to press the edge of the wafer; sixthly, controlling the adsorption device 230 to provide a vacuum source for the adsorption plate 250, and then controlling the processing device 120 to process another part of the lower surface of the wafer; seventhly, after the processing is finished, the second lifting device drives the lifting/lowering plate 270 to be lifted to a safe position, the adsorption device 230 stops supplying the vacuum source, and then the processed wafer is taken out.
As shown in fig. 1 and 7, the wafer processing apparatus of the present embodiment is provided with a shooting system 130 and a control center, and is used for shooting the position of the wafer and assisting the positioning of the wafer; and the control center is used for controlling the operation of each part, and ensuring the stable operation of the wafer production process.
It should be noted that, in the art, the wafer processing apparatus can absorb the features of the wafer processing apparatus in various aspects of the present embodiment, and has the above-mentioned features; in this embodiment, the two schemes of controlling the suction plate 250 to rotate after the wafer rises and controlling the suction plate 250 to rotate after the wafer falls are two schemes for solving the problem that the wafer is scratched when the suction plate 250 rotates, and the two schemes are not mutually exclusive in nature.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. A wafer processing apparatus, comprising:
a base;
the placing platform (280) is arranged on the base, the placing platform (280) is used for placing a wafer, and the placing platform (280) is provided with a yielding part which is positioned below the wafer;
the adsorption plate (250) is positioned below the wafer, and when the adsorption plate (250) is positioned at the first position, the adsorption plate (250) is positioned in the abdicating part and attached to the lower surface of the wafer;
a suction device (230) disposed on the base, the suction plate (250) being communicable with the suction device (230) such that the suction device (230) can provide a vacuum source for the suction plate (250);
the adsorption devices (230) are multiple, and the adsorption devices (230) are distributed at different positions along the circumferential direction of the vertical direction axis; the adsorption plate (250) can rotate around a vertical axis to be communicated with one adsorption device (230);
and the processing device (120) is arranged on the base, and the processing device (120) is positioned below the adsorption plate (250).
2. The wafer processing apparatus according to claim 1, wherein the outer contour of the adsorption plate (250) is semicircular or arched, and there are two adsorption devices (230), and the two adsorption devices (230) are uniformly distributed along the circumferential direction of the vertical axis.
3. The wafer processing apparatus according to claim 2, wherein a plurality of avoiding portions are formed on the adsorption plate (250), and the avoiding portions are arranged at intervals.
4. The wafer processing apparatus of claim 1, further comprising:
a first lifting device (210) arranged on the base;
the first lifting device (210) can drive the adsorption plate (250) to ascend to a first position, so that the adsorption plate (250) is located in the abdicating part and attached to the lower surface of the wafer;
the first lifting device (210) can drive the adsorption plate (250) to descend to a second position, so that the adsorption plate (250) is separated from the lower surface of the wafer.
5. The wafer processing apparatus according to claim 4, further comprising a rotating disc (221) disposed on the first lifting device (210), wherein a support portion (240) is disposed on the rotating disc (221), the support portion (240) is configured to support the adsorption plate (250), and the lifting device drives the adsorption plate (250) to lift by controlling the rotating disc (221) to lift.
6. The wafer processing apparatus according to claim 5, further comprising a rotating device (220) disposed on the first lifting device (210), wherein the first lifting device (210) can drive the rotating device (220) and the rotating disk (221) to lift together, and the rotating device (220) can drive the rotating disk (221) to rotate.
7. The wafer processing apparatus according to claim 5, wherein the supporting portion (240) is plural, and the plural supporting portions (240) are distributed along a circumferential direction of the rotating disk (221).
8. The wafer processing equipment as claimed in claim 1, further comprising a pressure rising and reducing plate (270) arranged on the pedestal, wherein a pressing ring (271) is arranged below the pressure rising and reducing plate (270), and the pressure rising and reducing plate (270) can drive the pressing ring (271) to press down, so that the pressing ring (271) presses the edge of the wafer on the placing platform (280).
9. The wafer processing apparatus as recited in claim 8, further comprising a second lifting device disposed on the pedestal, the second lifting device configured to lift the pressure lifting plate (270).
10. The wafer processing apparatus of claim 1, further comprising a moving platform (110) disposed on the base, wherein the placement platform (280) and the suction device (230) are both disposed on the moving platform (110).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222398327.1U CN218241806U (en) | 2022-09-09 | 2022-09-09 | Wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222398327.1U CN218241806U (en) | 2022-09-09 | 2022-09-09 | Wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218241806U true CN218241806U (en) | 2023-01-06 |
Family
ID=84664531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222398327.1U Active CN218241806U (en) | 2022-09-09 | 2022-09-09 | Wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218241806U (en) |
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2022
- 2022-09-09 CN CN202222398327.1U patent/CN218241806U/en active Active
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