CN218228264U - Stripping device for wafer-level two-dimensional layered thin film material - Google Patents
Stripping device for wafer-level two-dimensional layered thin film material Download PDFInfo
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- CN218228264U CN218228264U CN202222720024.7U CN202222720024U CN218228264U CN 218228264 U CN218228264 U CN 218228264U CN 202222720024 U CN202222720024 U CN 202222720024U CN 218228264 U CN218228264 U CN 218228264U
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Abstract
The utility model belongs to the technical field of peel off the equipment, especially, be a stripping off device of wafer level two dimension laminar film material, only lean on the sucking disc to the location of slide glass to adsorb among the stripping off device to current wafer level two dimension laminar film material, relatively poor to the location effect of slide glass, lead to the relatively poor problem of its stability when using, the scheme that now proposes, it includes the base, and the top fixed mounting of base has the hollow platform of peeling off, and the slide glass is placed in the top activity of the hollow platform of peeling off, rotate on the left and right sides inner wall of the hollow platform of peeling off and install same two-way threaded rod. The utility model has the advantages of reasonable design, through the screw drive of two-way threaded rod and movable plate and the cooperation of worm and worm wheel for the rotation of carousel drives two grip blocks and is close to each other, realizes the location to the slide glass, and secondly the rotation of carousel can be restricted to the joint of the slot of picture peg and carousel, improves the centre gripping stability of grip block, and the reliability is high.
Description
Technical Field
The utility model relates to a peel off equipment technical field, especially relate to a wafer level two-dimensional stratiform film material's stripping off device.
Background
In recent years, research on various excellent properties of various two-dimensional layered materials has been focused, and the two-dimensional layered materials have a good application prospect in the aspects of electronic devices, energy storage materials and the like due to the huge specific surface area and the excellent carrier mobility. The micro-mechanical stripping method for preparing the two-dimensional material is mostly based on liquid phase stripping and adhesive tape stripping methods, and at present, the preparation of the high-quality two-dimensional layered material is to obtain the two-dimensional layered material with few layers by sticking two side surfaces of a base material of the two-dimensional layered material with an adhesive tape and repeatedly stripping.
The peeling device for the two-dimensional laminar film material, which aims at the Chinese patent publication with the problem publication number of CN108896374A, has the technical key points that: the peeling device consists of a peeling table, an adhesive tape tractor and a control cabinet, wherein the peeling table is arranged on the base and is in horizontal sliding connection with the base; the adhesive tape tractor is composed of a driving pulley, a driven pulley and a small pulley which are arranged on a support, the driving pulley drives the driven pulley and the small pulley to rotate, and the adhesive tape is dragged to be peeled from the surface of the silicon wafer substrate.
In the scheme, the slide glass is positioned only by being adsorbed by the sucker, so that the positioning effect on the slide glass is poor, and the stability of the slide glass in use is poor; therefore, a new solution is needed to solve this problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the positioning of the glass slide is only absorbed by the sucker in the existing stripping device for the wafer-level two-dimensional layered thin film material, and the positioning effect of the glass slide is poor, so that the defect of poor stability of the glass slide in use is caused, and the stripping device for the wafer-level two-dimensional layered thin film material is provided.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a stripping off device of wafer level two-dimentional stratiform thin film material, includes the base, the top fixed mounting of base has the hollow platform of peeling off, and slide glass is placed in the activity of the top of the hollow platform of peeling off, rotate on the left and right sides inner wall of the hollow platform of peeling off and install same two-way threaded rod, and the outside thread bush of two-way threaded rod is equipped with two movable plates, and the equal fixed mounting in one side that two movable plates kept away from each other has the U template, and the equal fixed mounting in one side that two U templates are close to each other has the grip block, the fixed cover in the outside of two-way threaded rod is equipped with the worm wheel, the front side of the hollow platform of peeling off is seted up the circular port, and the worm is installed to the circular port internal rotation, worm and worm wheel intermeshing, the fixed mounting in the outside of worm has the carousel, and a plurality of slots have been seted up in the outside of the same deflector on the left and right sides inner wall of the hollow platform of peeling off, and the equal slip cover of two movable plates is established in the outside of deflector.
Preferably, the front side fixed mounting of platform is peeled off to the hollow, and the sliding hole has been seted up to one side of fixed plate, and sliding connection has the picture peg in the sliding hole, and the picture peg activity joint is in the slot that corresponds.
Preferably, the top fixed mounting of picture peg has the mounting panel, and one side fixed mounting of mounting panel has the spring, and the one end fixed mounting of spring is in one side of fixed plate.
Preferably, a pull frame is fixedly installed on one side of the insertion plate.
Preferably, an L-shaped plate is fixedly mounted on one side of the top of the base, and an adhesive tape roller is rotatably mounted on one side of the L-shaped plate.
Preferably, the left side and the right side of the hollow stripping table are both provided with guide holes, and the two U-shaped plates are respectively connected in the corresponding guide holes in a sliding manner.
In the utility model, the pulling frame is pulled to drive the plugboard to move rightwards, the compression spring is compressed to separate the plugboard from the clamping with the slot of the turntable, the fixing of the turntable is released, then the turntable is rotated to drive the worm to rotate, so that the worm wheel is driven to rotate, the two-way threaded rod is driven to rotate, the two movable plates are driven to approach each other under the action of the guide plate, the two clamping plates are driven to approach each other under the connection of the U-shaped plate, and the slide glass can be positioned;
in the utility model, the stripping device for the wafer-level two-dimensional layered thin film material has the advantages that the pulling frame is loosened, and the reset power of the spring drives the plugboard to move leftwards, so that the plugboard can be clamped in the corresponding slot, the turntable is fixed, and the clamping stability of the clamping plate is improved;
the utility model has the advantages of reasonable design, through the screw drive of two-way threaded rod and movable plate and the cooperation of worm and worm wheel for the rotation of carousel drives two grip blocks and is close to each other, realizes the location to the slide glass, and secondly the rotation of carousel can be restricted to the joint of the slot of picture peg and carousel, improves the centre gripping stability of grip block, and the reliability is high.
Drawings
Fig. 1 is a schematic perspective view of a peeling apparatus for a wafer-level two-dimensional layered thin film material according to the present invention;
fig. 2 is a schematic cross-sectional structural diagram of a peeling apparatus for a wafer-level two-dimensional layered thin-film material according to the present invention;
fig. 3 is a partially enlarged view of a portion a in fig. 1.
In the figure: 1. a base; 2. a hollow stripping table; 3. a glass slide; 4. a bidirectional threaded rod; 5. moving the plate; 6. a guide plate; 7. a U-shaped plate; 8. a clamping plate; 9. a worm gear; 10. a worm; 11. a turntable; 12. a fixing plate; 13. inserting plates; 14. mounting a plate; 15. a spring; 16. pulling the frame; 17. an L-shaped plate; 18. an adhesive tape roller.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a stripping off device of wafer level two-dimensional laminar thin film material, including base 1, the top fixed mounting of base 1 has hollow platform 2 of peeling off, the top activity of hollow platform 2 of peeling off is placed and is had slide 3, it has same two-way threaded rod 4 to rotate on the left and right sides inner wall of hollow platform 2 of peeling off, the outside thread bush of two-way threaded rod 4 is equipped with two movable plates 5, the equal fixed U template 7 that has installed in one side that two movable plates 5 kept away from each other, the equal fixed grip block 8 that has installed in one side that two U templates 7 are close to each other, the outside fixed bush of two-way threaded rod 4 is equipped with worm wheel 9, the front side of hollow platform 2 of peeling off is seted up the circular port, worm 10 is installed to the circular port internal rotation, worm 10 and worm wheel 9 intermeshing, the fixed cover in the outside of worm 10 is equipped with carousel 11, a plurality of slots have been seted up in the outside of carousel 11, fixed mounting has same deflector 6 on the left and right sides inner wall of hollow platform 2 of peeling off, two movable plates 5 all slip covers the outside of deflector 6.
In this embodiment, a fixing plate 12 is fixedly installed at the front side of the hollow stripping table 2, a sliding hole is formed at one side of the fixing plate 12, an inserting plate 13 is connected in the sliding hole in a sliding manner, and the inserting plate 13 is movably clamped in a corresponding slot.
In this embodiment, a mounting plate 14 is fixedly mounted on the top of the insertion plate 13, a spring 15 is fixedly mounted on one side of the mounting plate 14, and one end of the spring 15 is fixedly mounted on one side of the fixing plate 12.
In this embodiment, a pull frame 16 is fixedly installed on one side of the insertion plate 13.
In this embodiment, an L-shaped plate 17 is fixedly installed on one side of the top of the base 1, and an adhesive tape roller 18 is rotatably installed on one side of the L-shaped plate 17.
In this embodiment, the guide holes have all been seted up to the left and right sides of hollow platform 2 of peeling off, and two U template 7 are sliding connection respectively in the guide hole that corresponds.
In the embodiment, when the slide positioning device is used, the pull frame 16 is pulled to drive the inserting plate 13 to move rightwards, the spring 15 is compressed, the inserting plate 13 is separated from being clamped with the slot of the rotary table 11, the rotary table 11 is released from fixing, then the rotary table 11 is rotated to drive the worm 10 to rotate, so that the worm wheel 9 is driven to rotate, the bidirectional threaded rod 4 is driven to rotate, the two moving plates 5 are driven to approach each other under the action of the guide plate 6, the two clamping plates 8 are driven to approach each other under the connection of the U-shaped plate 7, and the slide 3 can be positioned;
in this embodiment, when using, through loosening draw frame 16, the power that resets of spring 15 drives picture peg 13 and removes left for picture peg 13 can the joint in the slot that corresponds, realizes the fixed to carousel 11, improves grip block 8's centre gripping stability.
Claims (6)
1. The utility model provides a stripping off device of wafer level two-dimentional stratiform film material, a serial communication port, including base (1), the top fixed mounting of base (1) has the hollow platform (2) of peeling off, and the top activity of the hollow platform (2) of peeling off is placed and is carried slide glass (3), rotate on the left and right sides inner wall of the hollow platform (2) of peeling off and install same two-way threaded rod (4), and the outside thread bush of two-way threaded rod (4) is equipped with two movable plates (5), and the equal fixed mounting in one side that two movable plates (5) kept away from each other has U template (7), and the equal fixed mounting in one side that two U templates (7) are close to each other has grip block (8), the outside fixed cover of two-way threaded rod (4) is equipped with worm wheel (9), the front side of hollow platform (2) is opened and is equipped with the circular port, and worm (10) are installed to the circular port internal rotation, worm (10) and worm wheel (9) intermeshing, the fixed cover in the outside of worm (10) is equipped with carousel (11), and the outside of carousel (11) has been seted up a plurality ofly, and the fixed mounting has same guide block (6) is peeled off on the left and right sides inner wall of the hollow platform (2) is peeled off, and the slot all establish in the guide block (5).
2. The peeling device for the wafer-level two-dimensional layered thin-film material as claimed in claim 1, wherein a fixing plate (12) is fixedly mounted at the front side of the hollow peeling table (2), a sliding hole is formed in one side of the fixing plate (12), an inserting plate (13) is connected in the sliding hole in a sliding manner, and the inserting plate (13) is movably clamped in the corresponding slot.
3. The peeling device for wafer-level two-dimensional laminated film materials as claimed in claim 2, wherein the top of the inserting plate (13) is fixedly provided with a mounting plate (14), one side of the mounting plate (14) is fixedly provided with a spring (15), and one end of the spring (15) is fixedly arranged on one side of the fixing plate (12).
4. The peeling apparatus for wafer-level two-dimensional layered film material as claimed in claim 2, wherein a pulling frame (16) is fixedly mounted on one side of the inserting plate (13).
5. The peeling device for the wafer-level two-dimensional layered film material as claimed in claim 1, wherein an L-shaped plate (17) is fixedly mounted on one side of the top of the base (1), and an adhesive tape roller (18) is rotatably mounted on one side of the L-shaped plate (17).
6. The peeling device for the wafer-level two-dimensional layered thin-film material as claimed in claim 1, wherein the hollow peeling table (2) is provided with guide holes on both left and right sides, and the two U-shaped plates (7) are respectively connected in the corresponding guide holes in a sliding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222720024.7U CN218228264U (en) | 2022-10-17 | 2022-10-17 | Stripping device for wafer-level two-dimensional layered thin film material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222720024.7U CN218228264U (en) | 2022-10-17 | 2022-10-17 | Stripping device for wafer-level two-dimensional layered thin film material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218228264U true CN218228264U (en) | 2023-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222720024.7U Active CN218228264U (en) | 2022-10-17 | 2022-10-17 | Stripping device for wafer-level two-dimensional layered thin film material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218228264U (en) |
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2022
- 2022-10-17 CN CN202222720024.7U patent/CN218228264U/en active Active
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