CN218219268U - Flexible heat dissipation circuit structure for intelligent wearable garment - Google Patents
Flexible heat dissipation circuit structure for intelligent wearable garment Download PDFInfo
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- CN218219268U CN218219268U CN202222276218.2U CN202222276218U CN218219268U CN 218219268 U CN218219268 U CN 218219268U CN 202222276218 U CN202222276218 U CN 202222276218U CN 218219268 U CN218219268 U CN 218219268U
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- heat dissipation
- circuit structure
- flexible heat
- intelligent wearable
- flexible
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Abstract
The utility model relates to a flexible heat dissipation circuit structure for clothing is dressed to intelligence, including the basement, be equipped with heat dissipation module on the basement, heat dissipation module includes the vitex strip, and the vitex strip is crisscross each other to form the radiating heat dissipation space of being convenient for, the conductive circuit that has the level trend is being paid on the vitex strip surface, and the conductive circuit is used for the transmission of signal, and the surface of conductive circuit is equipped with the insulating layer that is used for preventing oxidation and vulcanization. The utility model has the advantages of it is following and effect: the flexible circuit structure can be prevented from being oxidized and vulcanized while the heat generated by the flexible circuit structure can be conveniently discharged to improve the heat dissipation effect.
Description
Technical Field
The utility model relates to an intelligence wearing equipment signal transmission, concretely relates to flexible heat dissipation circuit structure for clothing is dressed to intelligence.
Background
The intelligent wearable garment is an intelligent garment which acquires relevant parameters of a human body through a signal processing device arranged at a certain position of the garment and various sensors, such as a heart rate sensor and a myoelectric sensor.
The transmission of signal mainly relies on the flexible line structure of bonding in the clothing is dressed to intelligence at present, because the flexible line structure mainly bonds in the clothing, the heat of its production is not convenient for discharge to influence the performance of flexible line structure, in order to solve this problem, clothing is dressed to intelligence at present mainly adopts high ventilative fabric to make, but this sweat that has also leaded to human body to produce in the motion can invade the flexible line structure, causes the oxidation of flexible line structure easily.
Disclosure of Invention
Not enough to prior art exists, the utility model aims to provide a flexible heat dissipation circuit structure for clothing is dressed to intelligence, when the heat discharge that the flexible circuit structure of can being convenient for produced improves the radiating effect, can prevent again that the flexible circuit structure from producing oxidation and vulcanization.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a flexible heat dissipation circuit structure for clothing is dressed to intelligence, a serial communication port, includes the basement, be equipped with heat dissipation module on the basement, heat dissipation module includes the vitex strip, vitex strip is crisscross each other to form the radiating heat dissipation space of being convenient for, the conducting wire that has the level trend is being paid on the vitex strip surface, the conducting wire is used for the transmission of signal, the surface of conducting wire is equipped with the insulating layer that is used for preventing oxidation and vulcanization.
The utility model discloses further set up to: the periphery of the heat dissipation module is provided with a connecting part, and the connecting part is used for being bonded with clothes.
The utility model discloses further set up to: the connecting part is provided with a plurality of first holes penetrating through the connecting part, and the first holes are arranged at intervals.
The utility model discloses further set up to: the chaste tree is provided with a plurality of second holes penetrating through the chaste tree, and the second holes are arranged at intervals.
The utility model discloses further set up to: the conducting circuit is formed by printing stretchable conducting silver paste.
The utility model discloses further set up to: the substrate is made of TPU, pet or PU.
The utility model discloses further set up to: the actual thickness of the conductive line is 12-16 μm.
The utility model discloses further set up to: the actual thickness of the substrate is greater than 2mm.
Compared with the prior art, the beneficial effects of the utility model reside in that:
owing to set up heat dissipation module on the basement, this heat dissipation module includes the vitex strip, and the vitex strip is crisscross distribution each other, so that form the radiating heat dissipation space of being convenient for on the basement, when this circuit structure sets up in the clothing, can further be convenient for the circulation of air through mutually supporting with highly ventilative fabric, thereby be convenient for discharge the heat that this circuit structure produced in the clothing, so, effectively solved the heat that current circuit structure produced and be not convenient for discharge and the relatively poor technical problem of radiating effect, and through the insulating layer that sets up on the surface of conducting wire, can be through the radiating space of highly ventilative fabric and formation so that the circulation of air improves radiating the while, can prevent again that the sweat that produces from corroding the conducting wire when moving, thereby can prevent that the conducting wire from appearing the problem of oxidation and vulcanization.
Drawings
FIG. 1 is a schematic view of a partial detailed structure of the present invention;
FIG. 2 is a schematic view of the enlarged structure of the part A of the present invention;
fig. 3 is a schematic diagram of the transverse cross-section structure of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 to fig. 3, the utility model discloses a flexible heat dissipation circuit structure for intelligent wearable clothes, including the basement that actual thickness is greater than 2mm, this basement adopts TPU among the prior art, pet or PU material and through the tape casting shaping in high accuracy mould, because TPU's elongation at break can reach 1000%, PE's elongation at break generally is at 90% -950%, PU's elongation at break can reach 600%, can make circuit structure have good tensile fracture resistance through above-mentioned material, and through being equipped with heat dissipation module on the basement, heat dissipation module includes vitex 1, vitex 1 is crisscross each other, so as to form the heat dissipation space 2 convenient for heat dissipation, and vitex 1 surface is attached with the conducting wire 3 that has the horizontal trend, thereby when forming heat dissipation space 2, can not influence conducting wire 3 and adhere to the basement again, the conductive circuit 3 is used for signal transmission, the actual thickness is controlled to be 12-16 micrometers, the surface of the conductive circuit 3 is provided with an insulating layer for preventing oxidation and vulcanization, the insulating layer is mainly made of an insulating coating with elasticity in the prior art, so that the insulating coating is only required to be coated on the surface of the conductive circuit 3 to form the insulating layer on the surface of the conductive circuit 3, the conductive circuit 3 is printed by stretchable conductive silver paste in the prior art, the stretchable conductive silver paste is mainly refined by stretchable resin, high-conductivity silver powder and special silver powder, the manufactured conductive circuit 3 has excellent conductivity, adhesive force and stretchable performance, when the circuit structure is arranged in clothes, air circulation can be further facilitated by matching with a highly breathable fabric, and therefore heat generated by the circuit structure can be conveniently discharged from the clothes, and through the insulating layer that sets up on the surface at conducting wire 3, can be through the heat dissipation space 2 of highly ventilative fabric and formation so that the circulation of air improves radiating simultaneously, the sweat that produces when preventing again to move corrodes conducting wire 3 to can prevent that the problem of oxidation and vulcanization from appearing in conducting wire 3.
In this embodiment, the connection portion 4 is further disposed at the periphery of the heat dissipation module, and the connection portion 4 is used for bonding with clothes, so that the bonding of the circuit structure and the clothes is more convenient.
In this embodiment, the connecting portion 4 is further provided with a plurality of first holes 41 penetrating through the connecting portion 4, the first holes 41 are arranged at intervals, and the opening of the first holes 41 can facilitate air circulation at the connecting portion 4, so as to further improve the heat dissipation performance of the whole circuit structure.
In this embodiment, the second holes 11 penetrating through the chaste tree 1 are formed in the chaste tree 1, the second holes 11 are multiple and are arranged at intervals, and the second holes 11 are formed to facilitate air circulation at the chaste tree 1, so as to further improve the heat dissipation performance of the whole circuit structure, wherein the second holes 11 are specifically formed in the chaste tree 1 to which the conductive circuit 3 is not attached.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (8)
1. The utility model provides a flexible heat dissipation circuit structure for clothing is dressed to intelligence, a serial communication port, includes the basement, be equipped with heat dissipation module on the basement, heat dissipation module includes the vitex strip, vitex strip is crisscross each other to form the radiating heat dissipation space of being convenient for, the conducting wire that has the level trend is being paid on the vitex strip surface, the conducting wire is used for the transmission of signal, the surface of conducting wire is equipped with the insulating layer that is used for preventing oxidation and vulcanization.
2. The flexible heat dissipation circuit structure for the intelligent wearable garment as claimed in claim 1, wherein a connecting portion is arranged on the periphery of the heat dissipation module, and the connecting portion is used for being bonded with a garment.
3. The flexible heat dissipation circuit structure for the intelligent wearable garment according to claim 2, wherein the connecting portion is provided with a plurality of first holes penetrating through the connecting portion, and the first holes are spaced from each other.
4. The flexible heat dissipation circuit structure for the intelligent wearable garment according to claim 1, wherein the chaste tree is provided with a plurality of second holes penetrating through the chaste tree, and the second holes are arranged at intervals.
5. The flexible heat dissipation circuit structure for the intelligent wearable garment according to claim 1, wherein the conductive circuit is printed by stretchable conductive silver paste.
6. The flexible heat dissipation line structure for smart wearable garments of claim 1, wherein the substrate is made of TPU, pet, or PU.
7. The flexible heat dissipation line structure for the intelligent wearable garment as claimed in claim 1 or 5, wherein the actual thickness of the conductive line is 12-16 μm.
8. The flexible heat dissipation line structure for smart wearable garments of claims 1 or 6, wherein the actual thickness of the substrate is greater than 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222276218.2U CN218219268U (en) | 2022-08-29 | 2022-08-29 | Flexible heat dissipation circuit structure for intelligent wearable garment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222276218.2U CN218219268U (en) | 2022-08-29 | 2022-08-29 | Flexible heat dissipation circuit structure for intelligent wearable garment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218219268U true CN218219268U (en) | 2023-01-06 |
Family
ID=84684868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222276218.2U Active CN218219268U (en) | 2022-08-29 | 2022-08-29 | Flexible heat dissipation circuit structure for intelligent wearable garment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218219268U (en) |
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2022
- 2022-08-29 CN CN202222276218.2U patent/CN218219268U/en active Active
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