CN218215307U

CN218215307U - LED device

Info

Publication number: CN218215307U
Application number: CN202222144270.2U
Authority: CN
Inventors: 吴亮亮; 朱磊; 陈举正; 贾旭刚; 李赛
Original assignee: Nanchang Yimei Optoelectronics Technology Co ltd
Current assignee: Nanchang Yimei Optoelectronics Technology Co ltd
Priority date: 2022-08-15
Filing date: 2022-08-15
Publication date: 2023-01-03
Anticipated expiration: 2032-08-15

Abstract

The utility model provides a LED device, include the LED chip and be used for placing the support of LED chip, a serial communication port, the support includes the base and by the outside fender that encloses that extends of base, including bonding portion and the bonding portion of setting in bonding portion both sides on the base, wherein, bonding portion is including setting up the first sub bonding portion of base middle zone and the sub bonding portion of second of presetting the distance with first sub bonding portion interval, the LED chip is used for setting firmly in bonding portion, and be connected through wire and bonding portion electrically conductive, the LED device includes two LED chips at least, set firmly the second excitation portion that is provided with first excitation portion on the LED chip of first sub bonding portion and outwards extends by first excitation portion, also be provided with second excitation portion on the LED chip of the sub bonding portion of second, because excitation portion and the integrative design of LED chip, there is not the condition that the light that the LED chip sent is sheltered from, make the homogeneity of mixing light promoted.

Description

LED device

Technical Field

The utility model belongs to the technical field of the LED device encapsulation, concretely relates to LED device.

Background

A Light Emitting Diode (LED) is a semiconductor electronic component capable of Emitting Light, and attracts more and more researchers due to its characteristics of small size, high brightness, low energy consumption, etc., and it can be packaged into an LED device applied to dimmable LED lamps such as health lighting, intelligent lighting, etc.

The traditional LED device generally comprises an LED chip, only can emit light with a single color temperature, and for realizing double-color temperature dimming, the color temperature adjusting range is wider, two LED devices which emit different color temperatures can be spliced generally, namely after combination, the two LED devices can be controlled by a circuit, and independent light emission and mixed light emission are realized.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a LED device aims at solving prior art, and the LED device is formed by two sub-LED device combinations, is divided into two and sends out light zone to lead to mixing the inhomogeneous problem of light.

The utility model provides a LED device, include two at least LED chips and be used for placing the support of LED chip, the support include the base and by what the base outwards extended encloses the fender, be equipped with on the base and be used for bonding the bonding portion of LED chip with set up respectively the bonding portion of bonding portion both sides, the LED chip pass through the wire with bonding portion conductive connection, wherein, bonding portion includes first sub bonding portion and second sub bonding portion, bonding portion is including setting up the first sub bonding portion of base middle zone and with the second sub bonding portion of first sub bonding portion interval default distance sets firmly in first sub bonding portion be provided with first arouse portion on the LED chip and by the outside second arouse portion that extends of first arouse portion, set firmly in the sub bonding portion of second also be provided with on the LED chip second arouse portion, respectively set firmly in first sub bonding portion the LED chip with correspond first sub bonding portion is established ties, respectively set firmly in the sub bonding portion with the second bonding portion of second is established ties with the sub bonding portion of second bonding portion through the electrically conductive connection circuit board respectively.

Above-mentioned LED device, including LED chip and the support that is used for placing the LED chip, the support includes the base and encloses the fender by what the base outwards extended, including bonding portion and the bonding portion of setting in bonding portion both sides on the base, wherein, bonding portion is including setting up the first sub bonding portion in base middle zone and the sub bonding portion of second of presetting the distance with first sub bonding portion interval, the LED chip is used for setting firmly back on bonding portion, lay in base middle zone, make the light source more be close to the central point of whole LED device, in addition, through wire and bonding portion conductive connection, the LED device includes two LED chips at least, set firmly and be provided with first excitation portion and the second excitation portion that outwards extends by first excitation portion on the LED chip of first sub bonding portion, also be provided with the second excitation portion on the LED chip of the sub bonding portion of second, because the integrative design of excitation portion and LED chip, the condition that the light that does not have the LED chip to send is sheltered from, make the homogeneity of mixing light obtain promoting.

Further, the first excitation part and the second excitation part are both fluorescent glue.

Further, the ratio of the fluorescent powder in the first excitation part is higher than that in the second excitation part, the ratio of the fluorescent powder in the first excitation part is 60-80%, and the ratio of the fluorescent powder in the second excitation part is 30-50%.

Furthermore, the surface of the first excitation part is a spherical surface, and the surface of the second excitation part is a plane and parallel to the surface of the LED chip.

Furthermore, enclose the inner wall that keeps off with the base is an inclination, just it is close to enclose the fender the thickness of base one end is greater than it keeps away from to enclose the fender the thickness of base one end.

Further, the first sub-bonding portion and the second sub-bonding portion are arranged on the base in a central symmetry mode.

Further, the first excitation portion and the second excitation portion are respectively used for exciting white light with different color temperature ranges when light emitted by the LED chip passes through the first excitation portion and the second excitation portion.

Further, the color temperature range of the white light formed by the LED chip fixedly arranged on the first sub-bonding part passing through the first excitation part and the second excitation part in sequence is 1800K-4000K, and the color rendering index range is 60-100.

Further, the color temperature range of the white light formed by the LED chip fixedly arranged on the second sub-bonding part passing through the second excitation part is 4000K-6500K, and the color rendering index range is 60-100.

Other advantages and technical effects of a LED device according to the present invention will be described in detail in the detailed description.

Drawings

Fig. 1 is a schematic structural diagram of a certain viewing angle of an LED device according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of an LED device provided by an embodiment of the present invention at a certain viewing angle;

fig. 3 is a schematic structural diagram of an LED device provided by an embodiment of the present invention when three LED chips are provided;

fig. 4 is a schematic structural diagram of an LED device provided by an embodiment of the present invention when the number of LED chips of the LED device is four;

fig. 5 is a schematic structural diagram of an LED device provided by an embodiment of the present invention when the number of LED chips of the LED device is eight;

fig. 6 is a schematic structural diagram of another matching manner between the first excitation portion of the LED device and the LED chip according to an embodiment of the present invention.

Description of the main element symbols:

LED chip	1	A second excitation part	13
				Support frame	2	Bonding wire	14
Base seat	21	Conductive bonding pad	15
				Enclose fender	22	First sub-bonding part	213
Adhesive part	211	Second sub-bonding part	214
				Bonding part	212
First excitation part	12

The following detailed description of the invention will be further described with reference to the above drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and fig. 2, a schematic structural view of a certain viewing angle of an LED device in an embodiment of the present invention is shown, where the LED device includes an LED chip 1 and a support 2 for placing the LED chip 1, and is characterized in that the support 2 includes a base 21 and a surrounding barrier 22 extending outward from the base 21, and the base 21 includes an adhesion portion 211 and bonding portions 212 disposed on two sides of the adhesion portion 211.

Specifically, base 21 can be heat dissipation material, for example, be ceramic substrate, because base 21's area is great for LED chip 1, when LED chip 1 passes through solid brilliant silica gel solid brilliant on base 21, the heat that LED chip 1 work distributed can loop through solid brilliant silica gel and base 21 and conduct, under the better condition of thermal diffusivity, can realize bigger drive power, in addition, the inner wall that encloses fender 22 is an inclination with base 21, and the thickness that encloses fender 22 and is close to base 21 one end is greater than the thickness that encloses fender 22 and keeps away from base 21 one end, can understand, whole support 2 is a single cup bowl shape, LED chip 1 sets up in the middle zone of single cup bowl, the setting that encloses fender 22 can make the emitting light of LED chip 1 present bigger luminous angle after enclosing the reflection of fender 22 inner wall.

It should be noted that the bonding portion 211 includes a first sub-bonding portion and a second sub-bonding portion symmetrically disposed on the middle region of the base 21, the LED chips 1 are configured to be fixed on the bonding portion 211 and electrically connected to the bonding portion 212 through wires, wherein the bonding portion 212 includes a first sub-bonding portion 213 and a second sub-bonding portion 214, and each LED chip 1 fixed on the first sub-bonding portion is connected in series with the corresponding first sub-bonding portion 213, each LED chip 1 fixed on the second sub-bonding portion is connected in series with the corresponding second sub-bonding portion 214, in this embodiment, a plurality of LED chips 1 are fixed on the bonding portion 211, and a bonding wire 14, which may be a gold wire, connects the bonding portion 212 and the LED chips 1 to form different conductive circuits, i.e., a plurality of LED chips 1 are connected in series, and then the bonding portion 212 is electrically connected to the printed circuit board through the conductive pad 15, thereby achieving a shunt control function, wherein the material of the base 21 may be a ceramic pad, a conductive material, such as silver-plated, and the bonding portion 212 may be electrically connected to the printed circuit board, and the LED chips 1 may be electrically connected to the LED chips 1, and the LED chips may be electrically connected to the LED device, and the LED chips 1, wherein the LED chips may be disposed in a printed circuit board, and the LED device may be disposed in a printed circuit board, and the LED device. In addition, two LED chips 1 are fixed to the same side, which causes uneven heating and affects the heat dissipation of the LED device.

In other optional embodiments of the present invention, when the number of the LED chips 1 is three, as shown in fig. 3, when the number of the LED chips 1 is three, the structural diagram of the LED device is that the first sub-bonding portion and the second sub-bonding portion for fixing the LED chips 1 are arranged on the base 21 in a central symmetry manner, that is, the first sub-bonding portion and the second sub-bonding portion are arranged in the middle area of the base 21 in a row manner, wherein the middle position of the bonding portion 211 can be set as the first sub-bonding portion, and the second sub-bonding portion is located at two sides of the first sub-bonding portion; when the number of the LED chips 1 is four, as shown in fig. 4, it is a schematic structural diagram of the LED device when the number of the LED chips 1 is four, wherein the first sub-bonding portion and the second sub-bonding portion for fixing the LED chip 1 are axisymmetrically arranged on the base 21, that is, there are two first sub-bonding portions and two second sub-bonding portions, and the first sub-bonding portions are diagonally arranged opposite to each other, and the second sub-bonding portions are also diagonally arranged opposite to each other; when the number of the LED chips 1 is eight, as shown in fig. 5, the LED device is a schematic structural diagram when the number of the LED chips 1 is eight, wherein the first sub-bonding portions and the second sub-bonding portions for fixedly mounting the LED chips 1 are axisymmetrically arranged on the base 21, that is, there are four first sub-bonding portions and four second sub-bonding portions, the first sub-bonding portions are located in the middle region, and the second sub-bonding portions are located on two sides of the first sub-bonding portions.

Further, set firmly and be provided with first excitation portion 12 and by the outside second excitation portion 13 that extends of first excitation portion 12 on the LED chip 1 of first sub-bonding portion, set firmly also be provided with second excitation portion 13 on the LED chip 1 of second sub-bonding portion, it is specific, first excitation portion 12 and second excitation portion 13 are the fluorescent glue, this fluorescent glue is through toasting the solidification back, certain hardness has, wherein, the fluorescent glue is the mixture of silica gel and phosphor powder, in this embodiment, the phosphor powder can be YAG green phosphor powder or yellow phosphor powder and red phosphor powder's mixed phosphor powder, and LED chip 1 can be purple light or blue light LED chip 1, the light that this LED chip 1 sent can arouse the fluorescent glue.

It should be noted that the ratio of the fluorescent powder in the first excitation portion 12 is higher than that in the second excitation portion 13, wherein the ratio of the fluorescent powder in the first excitation portion 12 is 60-80%, the ratio of the fluorescent powder in the second excitation portion 13 is 30-50%, and the ratio is the weight ratio of the fluorescent powder, it can be understood that the fluorescent powder in the first excitation portion 12 and the fluorescent powder in the second excitation portion 13 are the same fluorescent powder, and only in the preparation process, the mixed concentration of the fluorescent powder and the silica gel is different, that is, the concentration of the fluorescent powder in the first excitation portion 12 is higher than that in the second excitation portion 13, and in addition, before the first excitation portion 12 and the second excitation portion 13 are not cured, the viscosity of the first excitation portion 12 is higher than that in the second excitation portion 13, and the viscosity of the first excitation portion 12 is 80000-130000mpa.s, and the viscosity of the second excitation portion 13 is 8000-00130mpa.s, it can be understood that, the larger the viscosity is, the worse the fluidity is, because the upper surface area of the LED chip 1 is very small, in order to form the first excitation part 12 on the upper surface of the LED chip 1, that is, the cured first excitation part 12 is a spherical crown or an ellipsoidal crown, the viscosity of the first excitation part 12 is slightly larger, see fig. 6, which is a schematic structural diagram of another matching mode of the first excitation part 12 and the LED chip 1, and the second excitation part 13 needs to cover the first excitation part 12, and at the same time, the upper surface of the LED chip 1 fixed on the second sub-bonding part is also covered, the lower viscosity can ensure the fluidity of the glue, and can be uniformly distributed in the bracket 2, when the second excitation part 13 is cured, the surface of the second excitation part 13 is parallel to the surface of the LED chip 1, in addition, the distance from the spherical top end of the first excitation part 12 to the upper surface of the LED chip 1 matched with the first excitation part 12 is 100-200 μm, the distance from the upper surface of the second excitation portion 13 to the upper surface of the LED chip 1 is greater than 300 μm.

In the embodiment, a high-precision visual dispenser is used for accurately dispensing fluorescent glue with high fluorescent powder concentration to one or more paths of LED chips 1, a first excitation part 12 located above the LED chips 1 is formed after solidification, then fluorescent glue with low fluorescent powder concentration is dispensed into the whole support 2 for secondary overall filling, when a circuit where the LED chip 1 covered with the first excitation part 12 is powered on, the LED chip 1 emits light to firstly excite the first excitation part 12 covered on the surface of the chip and then excites a second excitation part 13 of the filled support 2, secondary excitation is realized, white light with a color temperature of 1800K-4000K is compositely generated, and the color rendering index range is 60-100; when only the circuit where the LED chip 1 covered by the second excitation part 13 is located is electrified, the LED chip 1 emits light to excite the second excitation part 13, so that white light with color temperature between 4000K and 6500K is generated through one-time excitation compounding, and the color rendering index range is 60-100; when two or multichannel circuit switched on simultaneously, all LED chips 1 are luminous, then produce mixed light, because this LED device is an overall design, use same excitation portion in a support 2 for the homogeneity of mixed light further obtains promoting.

In addition, the current of different circuits is respectively controlled and adjusted, so that the color temperature range of light emitted by the LED device with different schemes can be adjusted in the range of 1800K-6500K, and the brightness of the light emitted by the LED device can be adjusted, and the LED chip 1 can be a chip with different main wavelengths, different voltages, different brightness and different sizes, and can also be a normal chip or a flip chip.

To sum up, the utility model provides a LED device, include the LED chip and be used for placing the support of LED chip, the support includes the base and by the outside fender that encloses that extends of base, including bonding portion and the bonding portion of setting in bonding portion both sides on the base, wherein, bonding portion is including setting up at the first sub-bonding portion of base middle zone and with the sub-bonding portion of second of first sub-bonding portion interval default distance, the LED chip is used for setting firmly the back in bonding portion, lay in base middle zone, make the light source more be close to the central point of whole LED device, furthermore, through wire and bonding portion conductive connection, the LED device includes two LED chips at least, set firmly the second excitation portion that is provided with first excitation portion on the LED chip of first sub-bonding portion and outwards extends by first excitation portion, set firmly also be provided with second excitation portion on the LED chip of the sub-bonding portion of second, because the integrated design of excitation portion and LED chip, the condition that the light that does not have the LED chip to send mixes and is sheltered from, make the homogeneity of light obtain the promotion.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a LED device, its characterized in that includes two at least LED chips and is used for placing the support of LED chip, the support include the base and by the base outwards extends enclose the fender, be equipped with on the base and be used for bonding the bonding portion of LED chip and set up respectively the bonding portion of bonding portion both sides, the LED chip pass through the wire with bonding portion conductive connection, wherein, bonding portion includes first sub-bonding portion and second sub-bonding portion, bonding portion including set up the base middle zone first sub-bonding portion and with the first sub-bonding portion interval preset distance's of second sub-bonding portion, set firmly in first sub-bonding portion be provided with first arousing portion and by the outside second arousing portion that extends of first arousing portion on the LED chip, set firmly in the second sub-bonding portion also be provided with on the LED chip the second arousing portion, respectively set firmly in first sub-bonding portion with correspond first sub-bonding portion establish ties, each set firmly in the second sub-bonding portion with the LED chip with correspond the second sub-bonding portion of establishing ties with the circuit board electrical property connection portion, second sub-bonding portion is through the printed circuit board electrical property.

2. The LED device of claim 1, wherein the first excitation portion and the second excitation portion are both fluorescent glue.

3. The LED device of claim 2, wherein the ratio of the phosphor in the first excitation portion is higher than that in the second excitation portion, and the ratio of the phosphor in the first excitation portion is 60-80%, and the ratio of the phosphor in the second excitation portion is 30-50%.

4. The LED device of claim 3, wherein the surface of the first excitation portion is a spherical surface, and the surface of the second excitation portion is a plane and parallel to the surface of the LED chip.

5. The LED device as claimed in claim 4, wherein the inner wall of the enclosure forms an inclined angle with the base, and the thickness of the enclosure near the base is greater than the thickness of the enclosure far from the base.

6. The LED device of claim 5, wherein the first sub-adhesive portion and the second sub-adhesive portion are arranged centrally symmetrically on the submount.

7. The LED device as claimed in claim 6, wherein the first and second excitation portions are respectively configured to excite white light with different color temperature ranges when the light emitted from the LED chip passes through the first and second excitation portions.

8. The LED device of claim 7, wherein the color temperature of the white light formed by the LED chip fixed on the first sub-bonding portion passing through the first excitation portion and the second excitation portion in sequence is 1800K-4000K, and the color rendering index is 60-100.

9. The LED device as claimed in claim 8, wherein the color temperature of the white light formed by the LED chip fixed on the second sub-bonding portion passing through the second excitation portion is 4000K-6500K, and the color rendering index is 60-100.