CN218215258U - Semiconductor diode frame rapid Assembly appurtenance - Google Patents
Semiconductor diode frame rapid Assembly appurtenance Download PDFInfo
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- CN218215258U CN218215258U CN202222016235.2U CN202222016235U CN218215258U CN 218215258 U CN218215258 U CN 218215258U CN 202222016235 U CN202222016235 U CN 202222016235U CN 218215258 U CN218215258 U CN 218215258U
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Abstract
The utility model discloses a semiconductor diode frame rapid Assembly appurtenance, including mount, holding plate, fixed column and the stop gear that has the supporting role, the middle part fixedly connected with of mount upper end is the fixed disk of horizontality, the fixed column sets up the top at fixed long slab, holding plate sets up in the top of loading board, and holding plate combines the loading board to be used for carrying out the centre gripping spacingly to the semiconductor diode by the assembly, stop gear sets up the lower extreme at the fixed column that is vertical state. This semiconductor diode frame rapid Assembly appurtenance is convenient for adjust semiconductor diode's assembly angle, is convenient for carry out the centre gripping to the semiconductor diode who assembles spacing, and the fastening is good, slides through between movable sleeve and the fixed long board moreover, is convenient for drive the interval size between fixed column and the fixed column and adjusts, can fix not unidimensional semiconductor diode.
Description
Technical Field
The utility model relates to a semiconductor diode frame assembles relevant technical field, specifically is a semiconductor diode frame rapid Assembly appurtenance.
Background
The semiconductor diode refers to a two-terminal electronic device utilizing semiconductor characteristics, and the semiconductor diodes are various in types, wherein the most common semiconductor diodes are a PN junction diode and a metal semiconductor contact diode, and when the semiconductor diode frame is assembled, a corresponding auxiliary tool is required to be used for clamping and limiting the semiconductor diode;
however, in the process of actual use, the commonly used auxiliary device for assembling the semiconductor diode frame is inconvenient to clamp and fix the semiconductor diodes with different sizes, has limitations in use scenes, is not good in clamping and limiting the semiconductor diodes, is easy to loosen, and is inconvenient to adjust the assembling angle of the semiconductor diodes according to actual use conditions;
we therefore provide a tool for quickly assembling a semiconductor diode frame to solve the problems set forth above.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor diode frame rapid Assembly appurtenance to solve the semiconductor diode frame assembly appurtenance who generally uses that proposes in the above-mentioned background art, at the in-service use in-process, it is inconvenient to carry out the centre gripping to not unidimensional semiconductor diode fixed, the use scene has the limitation, and spacing not good to semiconductor diode's centre gripping, produce the pine easily and take off, inconvenient according to the problem that the actual use condition adjusted semiconductor diode's assembly angle moreover.
In order to achieve the above object, the utility model provides a following technical scheme: an auxiliary tool for rapidly assembling a semiconductor diode frame comprises a fixed frame with a supporting function, wherein a fixed disc in a horizontal state is fixedly connected to the middle of the upper end of the fixed frame, and a movable block is arranged at the edge of the fixed disc;
the fixing column is arranged above the fixed long plate, and the fixed long plate is fixedly connected to the side face of the movable block;
further comprising:
the fixed pressing plate is arranged above the bearing plate, the fixed pressing plate is combined with the bearing plate and used for clamping and limiting the assembled semiconductor diode, and the fixed pressing plate and the bearing plate are arranged in one-to-one correspondence with the movable blocks and the fixed long plate;
and the limiting mechanism is arranged at the lower end of the fixing column in a vertical state, the lower end of the fixing column is fixedly connected with the movable sleeve, and the limiting mechanism is used for limiting the space between the movable sleeve and the fixed long plate.
Adopt above-mentioned technical scheme, in the in-service use process, move between through movable block and fixed disk, be convenient for drive and carry out relative rotation between fixed long board and the fixed disk, thereby can adjust semiconductor diode's assembly angle, combine the loading board, the setting of solid fixed pressing plate and adapter sleeve, it is spacing to be convenient for carry out the centre gripping to the semiconductor diode who assembles, fastening nature is good, difficult production pine takes off, and slide between through movable sleeve and fixed long board, be convenient for drive the interval size between fixed column and the fixed column and adjust, can fix not unidimensional semiconductor diode, therefore, the practicality is high, and through stop gear's setting, be convenient for fix between fixed long board and the movable sleeve.
As a preferred technical scheme of the utility model, the fixed disc is connected with the movable block by a clamping groove, and the movable block drives the fixed long plate and the fixed disc to form a relative rotation structure, and the movable block and the fixed disc are limited by a fixing bolt;
the fixed bolt is in threaded connection with the fixed disc and the movable block.
By adopting the technical scheme, the fixed disc is connected with the movable block in a clamping groove manner, the movable block drives the fixed long plate and the fixed disc to form a relative rotation structure, and the movable block and the fixed disc are limited by the fixing bolt;
the fixed bolt is connected with the fixed disc and the movable block in a threaded manner, so that the assembly angle of the semiconductor diode can be adjusted conveniently.
As the utility model discloses an preferred technical scheme, fixed long board and movable block all are angle setting such as in the edge in the fixed disk outside, and are connected through gliding mode between fixed long board and the movable sleeve to the movable sleeve drives the loading board through the fixed column and removes, and loading board fixed connection is in the upper end of fixed column moreover.
Adopt above-mentioned technical scheme, all be angle settings such as in the edge in the fixed disk outside through fixed long board and movable block, and be connected through gliding mode between fixed long board and the movable sleeve to the movable sleeve drives the loading board through the fixed column and removes, and loading board fixed connection is in the upper end of fixed column in addition, and it is spacing to be convenient for carry out the centre gripping to semiconductor diode.
As a preferred technical solution of the present invention, the upper end of the bearing plate is fixedly connected with a connecting frame with a thread on the outer surface, and the inner side wall of the upper end of the connecting frame is provided with a first spring, and the movable end of the first spring is fixedly connected with a fixed pressing plate for clamping and limiting, and the fixed pressing plate is connected with the connecting frame in a sliding manner;
the connecting frame is connected with the connecting sleeve with a limiting effect in a threaded mode, and the connecting sleeve is attached to the upper surface of the fixed pressing plate.
By adopting the technical scheme, the upper end of the bearing plate is fixedly connected with the connecting frame with the outer surface provided with threads, the inner side wall of the upper end of the connecting frame is provided with the first spring, the movable end of the first spring is fixedly connected with the fixed pressing plate for clamping and limiting, and the fixed pressing plate is connected with the connecting frame in a sliding manner;
the connecting frame is connected with the connecting sleeve with the limiting effect in a threaded mode, the connecting sleeve is attached to the upper surface of the fixed pressing plate, fastening performance of clamping the semiconductor diode is good, and the semiconductor diode is not prone to loosening.
As the utility model discloses an optimized technical scheme, stop gear establishes including the dead lever cover that becomes "T" font structure the second spring of dead lever surface, the fixed block that has the positioning action and equidistant fixed slot of seting up in fixed long slab middle part.
By adopting the technical scheme, the fixing rod sleeve which comprises the T-shaped structure through the limiting mechanism is arranged on the second spring on the outer surface of the fixing rod, the fixing block with the positioning function and the fixing groove which is arranged at the middle part of the fixed long plate at equal intervals, so that the movable sleeve and the fixed long plate are limited.
As the utility model discloses an optimal technical scheme, the fixed block is connected in the fixed slot of relevant position, and fixed block fixed connection is at the lower extreme of dead lever to dead lever sliding connection is in the upper end of movable sleeve, is connected through the mode of draw-in groove between dead lever and the fixed long slab moreover.
Adopt above-mentioned technical scheme, connect in the fixed slot of relevant position through the fixed block, and fixed block fixed connection is at the lower extreme of dead lever to dead lever sliding connection is in the upper end of movable sleeve, is connected through the mode of draw-in groove between dead lever and the fixed long slab moreover, prevents to produce the pine between movable sleeve and the fixed long slab and takes off.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model is provided with the fixed disc, the movable block and the fixed long plate, the fixed disc is connected with the movable block through the clamping groove, and the fixed long plate forms a relative rotation structure through the movable block and the fixed disc, thereby being convenient for adjusting the assembly angle of the semiconductor diode;
2. the utility model discloses a set up loading board, fixed pressing plate and adapter sleeve, through the setting of loading board and fixed pressing plate, be convenient for carry out the centre gripping to semiconductor diode and fix, combine the setting of adapter sleeve, can further lock spacing to fixed pressing plate, can be better carry out the centre gripping to semiconductor diode and fix, spacing effectual;
3. the utility model discloses a set up stop gear and movable sleeve, slide between movable sleeve and the fixed long slab, can drive the interval size between fixed column and the fixed column and adjust, be convenient for assemble not unidimensional semiconductor diode, combine stop gear to obtain setting, stop gear includes dead lever, second spring, fixed block and fixed slot, is convenient for carry on spacingly between movable sleeve and the fixed long slab.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of the connection overlooking structure of the fixed disc, the movable block and the fixed long plate of the present invention;
FIG. 3 is a front view of the connection and cutting structure of the fixed long plate, the movable sleeve and the fixed rod of the present invention;
FIG. 4 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;
fig. 5 is a schematic view of the connection structure of the bearing plate, the connecting frame and the fixing pressing plate of the present invention.
In the figure: 1. a fixed mount; 2. fixing the disc; 3. a movable block; 4. fixing the long plate; 5. a movable sleeve; 6. fixing the column; 7. a carrier plate; 8. a connecting frame; 9. a first spring; 10. fixing the pressing plate; 11. connecting sleeves; 12. a limiting mechanism; 13. fixing the rod; 14. a second spring; 15. a fixed block; 16. fixing grooves; 17. and (4) fixing the bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: an auxiliary tool for rapidly assembling a semiconductor diode frame comprises a fixing frame 1, a fixing column 6, a fixing pressing plate 10 and a limiting mechanism 12.
With the aid of the technical scheme, as shown in fig. 1, 3 and 4, the upper end of a fixed frame 1 is fixedly connected with a fixed disc 2 in a horizontal state, the edge of the outer side of the fixed disc 2 is provided with movable blocks 3 at equal angles, the movable blocks 3 are connected with the fixed disc 2 in a clamping groove mode, meanwhile, the side surfaces of the movable blocks 3 are fixedly connected with a fixed long plate 4 in a horizontal state, the outer surface of the fixed long plate 4 is sleeved with a movable sleeve 5, the movable sleeve 5 and the fixed long plate 4 are limited by a limiting mechanism 12, the upper end of the movable sleeve 5 is fixedly connected with a fixed column 6 in a vertical state, and the limiting mechanism 12 comprises a fixed rod 13 in a T-shaped structure, wherein the fixed rod 13 is sleeved with a second spring 14 on the outer surface of the fixed rod 13, a fixed block 15 with a positioning effect and fixed grooves 16 which are arranged in the middle of the fixed long plate 4 at equal intervals;
the fixed rod 13 is pressed downwards, the fixed rod 13 slides with the movable sleeve 5, meanwhile, the fixed rod 13 is connected with a clamping groove at the lower end of the fixed long plate 4, the fixed rod 13 extrudes the second spring 14, the second spring 14 is elastically deformed, the lower end of the fixed rod 13 is fixedly connected with a fixed block 15 used for positioning, the fixed block 15 is clamped in a fixed groove 16 at a corresponding position, the fixed rod 13 drives the fixed block 15 to be separated from the fixed groove 16, the fixed block 15 loosens the limit between the movable sleeve 5 and the fixed long plate 4, then the movable sleeve 5 is pulled to slide with the fixed long plate 4, further, the distance between the fixed column 6 and the fixed column 6 is conveniently driven to be adjusted, semiconductor diodes with different sizes can be assembled, the practicability is high, after the adjustment is completed, the fixed rod 13 is loosened, at the moment, the second spring 14 recovers the elastic deformation, the fixed rod 13 and the movable sleeve 5 are driven to slide, the fixed block 15 is driven to be clamped in the fixed groove 16 at the corresponding position, and the movable sleeve 5 and the fixed long plate 4 are conveniently limited;
after the movable sleeve 5 and the fixed long plate 4 are fixed, as shown in fig. 1 and 5, the upper end of the fixed column 6 is fixedly connected with a bearing plate 7, the upper end of the bearing plate 7 is fixedly connected with a connecting frame 8, a first spring 9 is arranged inside the connecting frame 8, the fixed pressing plate 10 is fixedly connected to the movable end of the first spring 9, the fixed pressing plate 10 is pulled upwards, the fixed pressing plate 10 slides with the connecting frame 8, the fixed pressing plate 10 extrudes the first spring 9 to enable the first spring 9 to generate elastic deformation, then the semiconductor diode to be assembled is arranged at the upper end of the bearing plate 7, the fixed pressing plate 10 is loosened, the first spring 9 recovers the elastic deformation at the moment, the fixed pressing plate 10 is driven to move downwards, the semiconductor diode is clamped and limited through the fixed pressing plate 10, then the connecting sleeve 11 in threaded connection with the outer surface of the connecting frame 8 is rotated, the connecting sleeve 11 is attached to the upper surface of the fixed pressing plate 10, the connecting frame 8 and the fixed pressing plate 10 are further limited, the tightness of clamping of the semiconductor diode is good, and the semiconductor diode is not easy to be generated;
after the semiconductor diode centre gripping is accomplished, assembly operation is carried out to semiconductor diode, and in actual assembling process, slide between movable block 3 and fixed disk 2, as shown in fig. 1 and fig. 2, it constitutes relative revolution mechanic to drive between fixed long board 4 and the fixed disk 2, thereby be convenient for adjust semiconductor diode's assembly angle, reach better assembly effect, and after adjusting the completion, gim peg 17 that has limiting displacement through rotating, be threaded connection between gim peg 17 and movable block 3 and gim peg 17 and the fixed disk 2, fix between movable block 3 and the fixed disk 2 through gim peg 17, and the operation is convenient, and it is very convenient to use.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An auxiliary tool for rapidly assembling a semiconductor diode frame comprises a fixing frame (1) with a supporting function, wherein a fixing disc (2) in a horizontal state is fixedly connected to the middle of the upper end of the fixing frame (1), and a movable block (3) is arranged at the edge of the fixing disc (2);
the fixing column (6) is arranged above the fixed long plate (4), and the fixed long plate (4) is fixedly connected to the side face of the movable block (3);
it is characterized by also comprising:
the fixed pressing plate (10) is arranged above the bearing plate (7), the fixed pressing plate (10) is combined with the bearing plate (7) and used for clamping and limiting the assembled semiconductor diode, and the fixed pressing plate (10) and the bearing plate (7) are arranged in one-to-one correspondence with the movable block (3) and the fixed long plate (4);
the limiting mechanism (12) is arranged at the lower end of the fixing column (6) in a vertical state, the lower end of the fixing column (6) is fixedly connected with the movable sleeve (5), and the limiting mechanism (12) is used for limiting the position between the movable sleeve (5) and the fixed long plate (4).
2. The tool of claim 1, wherein the tool comprises: the fixed disc (2) is connected with the movable block (3) in a clamping groove mode, the movable block (3) drives the fixed long plate (4) and the fixed disc (2) to form a relative rotation structure, and the movable block (3) and the fixed disc (2) are limited through a fixing bolt (17);
the fixed bolt (17) is in threaded connection with the fixed disc (2) and the fixed bolt (17) is in threaded connection with the movable block (3).
3. The tool of claim 2, wherein: fixed long board (4) and movable block (3) all are angle settings such as in the edge in fixed disk (2) outside, and are connected through gliding mode between fixed long board (4) and movable sleeve (5) to movable sleeve (5) drive loading board (7) through fixed column (6) and remove, and loading board (7) fixed connection is in the upper end of fixed column (6) moreover.
4. The tool of claim 3, wherein the tool comprises: the upper end of the bearing plate (7) is fixedly connected with a connecting frame (8) with a thread arranged on the outer surface, a first spring (9) is installed on the inner side wall of the upper end of the connecting frame (8), a fixed pressing plate (10) used for clamping and limiting is fixedly connected with the movable end of the first spring (9), and the fixed pressing plate (10) is connected with the connecting frame (8) in a sliding mode;
the connecting frame (8) is connected with the connecting sleeve (11) with the limiting effect in a threaded mode, and the connecting sleeve (11) is attached to the upper surface of the fixed pressing plate (10).
5. The tool of claim 1, wherein: the limiting mechanism (12) comprises a fixing rod (13) which is of a T-shaped structure, a second spring (14) which is sleeved on the outer surface of the fixing rod (13), a fixing block (15) with a positioning function and fixing grooves (16) which are arranged in the middle of the fixing long plate (4) at equal intervals.
6. The tool of claim 5, wherein the tool comprises: the fixing block (15) is clamped and connected in a fixing groove (16) at a corresponding position, the fixing block (15) is fixedly connected to the lower end of the fixing rod (13), the fixing rod (13) is slidably connected to the upper end of the movable sleeve (5), and the fixing rod (13) is connected with the fixing long plate (4) in a clamping groove mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222016235.2U CN218215258U (en) | 2022-08-02 | 2022-08-02 | Semiconductor diode frame rapid Assembly appurtenance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222016235.2U CN218215258U (en) | 2022-08-02 | 2022-08-02 | Semiconductor diode frame rapid Assembly appurtenance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218215258U true CN218215258U (en) | 2023-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222016235.2U Active CN218215258U (en) | 2022-08-02 | 2022-08-02 | Semiconductor diode frame rapid Assembly appurtenance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218215258U (en) |
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2022
- 2022-08-02 CN CN202222016235.2U patent/CN218215258U/en active Active
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