CN218213304U

CN218213304U - Durable chip testing device

Info

Publication number: CN218213304U
Application number: CN202222363450.XU
Authority: CN
Inventors: 刘佳均; 郭静; 季春瑞; 许桂洋; 贾亚飞; 张�浩
Original assignee: Anhui Xinxinwei Semiconductor Co ltd
Current assignee: Anhui Xinxinwei Semiconductor Co ltd
Priority date: 2022-09-06
Filing date: 2022-09-06
Publication date: 2023-01-03
Anticipated expiration: 2032-09-06

Abstract

The application discloses durable chip testing arrangement belongs to chip testing technical field. Mainly including the backup pad, install test circuit board in the backup pad, the last test position that is provided with of test circuit board, the backup pad is used for fixed test circuit board, the test position is chip access position, test circuit board is used for testing the chip, test position overcoat is equipped with the deep bead, be connected with the connecting rod between deep bead and the backup pad, the connecting rod is used for supporting the deep bead, the deep bead is used for when dismantling the chip, stops the hot-blast through the chip. When dismantling the chip, the deep bead is sheathe in at the test position, and the air heater blows hot-blastly towards the deep bead to demolish the chip, the hot-blastly blocked by the deep bead through the chip, avoid blowing other components and parts, by heating to high temperature many times, perhaps the soldering tin of components and parts stitch department is melted by the heating many times, thereby reinforcing test circuit board's durability. The application provides a durable chip testing arrangement solves the fragile problem of test circuit board.

Description

Durable chip testing device

Technical Field

The application relates to the technical field of chip testing, in particular to a durable chip testing device.

Background

After the chip is produced, a circuit board for testing is connected in a direct welding mode to test the chip. After the basic test in this way, the following methods exist for detaching the chip: the method comprises a craft knife removing method, a hot air gun removing method, a pin bending removing method and a tin adding filling welding removing method. The method for disassembling the hot air gun is a common disassembling method, and comprises the following specific steps: and heating the chip by using a hot air gun until the soldering tin at all pins is melted, and taking down the chip by using tweezers.

But the hot-blast other components and parts near the chip access position that also can blow that the hot-blast rifle blew off let the soldering tin of other components and parts stitch department melt. Because the test circuit board can repeatedly access the chip to test, the components can be heated for multiple times, the soldering tin at the pins of the components is also heated and melted for multiple times, the components are easily damaged, the test circuit board needs to be repeatedly repaired or replaced, and the efficiency and the accuracy of chip testing are reduced.

Therefore, it is necessary to provide a chip testing apparatus to block the hot air from the heat gun to solve the above problems.

It is noted that the above information disclosed in this background section is only for background purposes in understanding the inventive concept and, therefore, it may contain information that does not constitute prior art.

Disclosure of Invention

Based on the above problems in the prior art, the embodiments of the present application aim to: a durable chip testing device is provided to solve the problem that a circuit board for testing is easy to be damaged.

The technical scheme adopted by the application for solving the technical problem is as follows: the utility model provides a durable chip testing arrangement, includes the backup pad, install test circuit board in the backup pad, the last test position that is provided with of test circuit board, the backup pad is used for fixed test circuit board, the test position is chip access position, test circuit board is used for testing chip, its characterized in that:

the test position overcoat is equipped with the deep bead, be connected with the connecting rod between deep bead and the backup pad, the connecting rod is used for supporting the deep bead, the deep bead is used for blockking the hot-blast through the chip when dismantling the chip.

When dismantling the chip, the deep bead is sheathe in at the test position, and the air heater blows hot-blastly towards the deep bead to demolish the chip, the hot-blastly blocked by the deep bead through the chip, avoid blowing other components and parts, by heating to high temperature many times, perhaps the soldering tin of components and parts stitch department is melted by the heating many times, thereby reinforcing test circuit board's durability.

Furthermore, deep bead one side is articulated with the connecting rod, makes the deep bead rotatory around articulated department for the deep bead overlaps on testing the position and establishes.

Furthermore, the support plate is provided with a limiting hole, and the connecting rod is inserted into the limiting hole and used for being disassembled and assembled between the connecting rod and the support plate.

Furthermore, one of the limiting hole and the connecting rod is provided with a limiting block, and the other limiting hole is provided with a limiting groove corresponding to the limiting block and used for preventing the connecting rod from rotating in the circumferential direction in the limiting hole.

Furthermore, a friction block is arranged between the wind shield and the connecting rod and used for increasing the resistance of the wind shield when the wind shield rotates around the hinged part.

Furthermore, one side of the wind shield is provided with an opening, and the width of the opening is larger than that of the other side of the wind shield, so that hot air is blown in.

The beneficial effect of this application is: the application provides a pair of durable chip testing arrangement utilizes the deep bead to prevent through the chip hot-blast, avoids hot-blast heating other components and parts, or melts the soldering tin of other components and parts stitch departments to protect near other components and parts of chip access position, avoid test circuit board to damage, increase test circuit board's durability.

In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

FIG. 1 is a schematic overall view of a robust chip test apparatus of the present application;

FIG. 2 is an exploded view of the support plate of FIG. 1;

FIG. 3 is an exploded view of the windshield assembly of FIG. 2;

FIG. 4 is a schematic partial cross-sectional view of the support plate of FIG. 1;

wherein, in the figures, the respective reference numerals:

1. a base; 11. a support pillar;

2. a support plate; 21. positioning the pile; 22. a limiting hole; 221. a limiting block; 23. positioning blocks; 231. fixing grooves; 232. a bolt;

3. testing the circuit board; 31. a test bit; 32. a needle seat; 33. a through hole; 34. positioning holes;

4. a wind shielding assembly; 41. a limiting rod; 411. a limiting groove; 412. a fixing plate; 413. a first hinge hole; 414. a first limiting block; 415. a support block; 42. a wind deflector; 421. a hinge plate; 422. a second hinge hole; 423. a second limiting block; 43. hinging shafts; 431. and a baffle plate.

Detailed Description

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances for describing embodiments of the invention described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

As shown in fig. 1 to 4, the present application provides a durable chip testing apparatus including a base 1, a support plate 2 located at an upper side of the base 1, a test circuit board 3 located on the support plate 2, and a wind shielding assembly 4.

The test circuit board 3 is provided with a test position 31, and a plurality of needle seats 32 are arranged in the test position 31.

At least one through hole 33 is formed in one side of the test position 31, at least two positioning holes 34 are formed in the edge of the test circuit board 3, the through hole 33 and the positioning holes 34 communicate the upper side and the lower side of the test circuit board 3, in this embodiment, one through hole 33 is formed, and four positioning holes 34 are formed.

A plurality of support columns 11 are fixedly installed on the upper side of the base 1, and the support plate 2 is fixedly installed on the upper sides of the support columns 11.

The supporting plate 2 is fixed with a plurality of positioning studs 21 having the same positions as the positioning holes 34, limiting holes 22 having the same positions as the through holes 33, and at least two positioning blocks 23 movably disposed on the supporting plate 2, in the present embodiment, four positioning blocks 23 are provided.

At least one limiting block 221 is formed inwards in the limiting hole 22, and in the present embodiment, two limiting blocks 221 are provided.

The locating block 23 upside is provided with at least one fixed slot 231, and in this embodiment, every locating block 23 upside is provided with two fixed slots 231, and the fixed slot 231 communicates both sides about the locating block 23, all is provided with bolt 232 in the fixed slot 231, and the bolt 232 lower extreme and backup pad 2 threaded connection.

The wind shielding assembly 4 includes a stopper rod 41, and a wind shielding plate 42 at one end of the stopper rod 41.

The lateral wall of the limiting rod 41 is provided with a limiting groove 411 which is located at the same position as the limiting block 221, one end of the limiting groove 411 is communicated with one end of the limiting rod 41 far away from the wind shield 42, one end of the limiting rod 41 close to the wind shield 42 is fixed with a fixing plate 412, a first hinge hole 413 is arranged on the fixing plate 412, two sides of the fixing plate 412 are communicated through the first hinge hole 413, a plurality of first limiting blocks 414 are formed at the edge of one end of the first hinge hole 413, one side of the fixing plate 412 close to the first limiting blocks 414 is fixed with a supporting block 415, the supporting block 415 is located on the fixing plate 412 and is far away from one side of the test circuit board 3, and is close to the limiting rod 41.

The air baffle 42 is a U-shaped baffle with an opening on one side, the width of the opening on one side of the air baffle 42 is larger than that of the other side of the air baffle 42, a hinged plate 421 is fixed on one side, away from the opening, of the air baffle 42, the hinged plate 421 is provided with a second hinged hole 422, the axes of the first hinged hole 413 and the second hinged hole 422 are collinear, the hinged plate 421 is located on one side, provided with the first limiting block 414, of the fixing plate 412, and a plurality of second limiting blocks 423 are arranged on one side, close to the fixing plate 412, of the hinged plate 421.

At least one of the fixing plate 412 and the hinge plate 421 is made of an elastic material, and in this embodiment, both the fixing plate 412 and the hinge plate 421 are made of beryllium copper alloy.

The same hinge shaft 43 is movably arranged in the first hinge hole 413 and the second hinge hole 422, the two ends of the hinge shaft 43 are fixedly provided with the baffles 431, and the hinge plate 421 and the fixing plate 412 are positioned between the two baffles 431.

It is understood that the wind deflectors 42 of various sizes and the restricting rods 41 of various restricting grooves 411 in the long lake may be prepared in advance before the test.

The first embodiment is as follows:

during assembly, the bolt 232 is firstly unscrewed to enable the positioning block 23 to move, and then the positioning block 23 is moved towards the edge of the supporting plate to enable the space between the positioning blocks 23 to be enlarged. At this time, due to the enlarged space, the user can conveniently sleeve the positioning holes 34 into the corresponding positioning posts 21, so that the test circuit board 3 is mounted on the supporting plate 2, and the test circuit board 3 is limited to slide on the supporting plate 2 by the limitation of the positioning holes 34 and the positioning posts 21, thereby achieving the effect of preliminarily positioning the test circuit board 3.

After the test circuit board 3 is preliminarily positioned, because there is a certain size difference between the positioning hole 34 and the positioning pile 21, the test circuit board 3 can slide on the supporting plate 2 by a small margin, a suitable wind shield 42 and a limiting rod 41 are selected at the moment, the size of the wind shield 42 is consistent with that of the test position 31, the wind shield 42 is ensured to surround the test position 31, and other components on the test circuit board 3 can not be pressed. The length of the limiting groove 411 of the limiting rod 41 is related to the thickness of the test circuit board 3, the thicker the test circuit board 3 is, the shorter the required limiting groove 411 is, and the bottom surface of the wind shield 42 can be attached to the upper surface of the test circuit board 3 when subsequent wind shielding is ensured.

After the wind deflector 42 and the limiting rod 41 are selected, as shown in fig. 4, the side of the fixing plate 412 with the first limiting block 414 is opposite to the side of the hinge plate 421 with the second limiting block 423, the first hinge hole 413 is opposite to the second hinge hole 422, the hinge shaft 43 passes through the first hinge hole 413 and the second hinge hole 422, then the baffle 431 is installed, the baffle 431 clamps the fixing plate 412 and the hinge plate 421, at this time, the wind deflector 42 and the limiting rod 41 are hinged, that is, the assembly of the wind deflector assembly 4 is completed.

Because the supporting column 11, the base 1 and the supporting plate 2 have a certain distance therebetween, the limiting rods 41 with different lengths of the limiting grooves 411 can pass through the limiting holes 22.

When the wind deflector 42 is rotated, because the first limiting block 414 and the second limiting block 423 block each other, a user needs to push the wind deflector 42 with a large force, so that the first limiting block 414 and the second limiting block 423 are retracted by elastic contraction of the user, and the wind deflector 42 and the limiting rod 41 can rotate relative to each other around the hinge shaft 43, that is, a certain resistance exists when the wind deflector 42 rotates.

After the wind shielding assembly 4 is assembled, due to the limiting effect of the positioning hole 34 and the positioning pile 21, the through hole 33 is aligned with the limiting hole 22, so that a user can directly pass one end of the limiting rod 41 with the limiting groove 411 through the through hole 33 and insert the limiting hole 22, and simultaneously insert the limiting block 221 into the limiting groove 411 until the limiting block 221 moves to the tail end of the limiting groove 411, and cannot continue to descend. In this process, due to the size difference between the positioning hole 34 and the positioning pile 21, the test circuit board 3 slightly moves relative to the support plate 2, so that the through hole 33 can give way to a certain extent, and the limit rod 41 is ensured to be inserted into the limit hole 22. Due to the previous selection of the length of the limiting groove 411, the wind shield 42 can be ensured to be attached to the upper surface of the test circuit board 3 when rotating to one side of the test position 31. Meanwhile, due to the limitation of the limiting block 221 and the limiting groove 411, the rotation of the limiting rod 41 in the limiting hole 22 can be avoided, and the wind shield 42 is ensured to directly sleeve the test position 31 when rotating to one side of the test position 31.

After the wind shielding assembly 4 is installed, the positioning block 23 is pushed and extrudes the test circuit board 3, then the bolt 232 is screwed, the position of the positioning block 23 is fixed, at the moment, the positioning block 23 is matched with the positioning pile 21 and the limiting rod 41, the movement of the test circuit board 3 in one direction is limited, the movement of the test circuit board 3 in other directions is eliminated through the extrusion of the plurality of positioning blocks 23, and the effect of enhancing the positioning of the test circuit board 3 is achieved.

To sum up, reached easy to assemble to the effect of fixed test circuit board 3, when avoiding test circuit board 3 chip installation and test, test circuit board 3 takes place the skew, and then leads to the test inaccurate.

The second embodiment:

before installing the chip, will rotate the deep bead 42 to the one side of keeping away from test position 31 earlier, this in-process because spacing hole 22 entangles gag lever post 41, therefore the deep bead 42 mainly supports gag lever post 41 by the backup pad when rotatory, has avoided the torsional force who supports gag lever post 41 to damage through hole 33, avoids damaging test circuit board 3 promptly.

Due to the blocking of the supporting block 415, the wind shield 42 cannot rotate after rotating to a certain angle, as shown in fig. 1, the wind shield 42 is prevented from rotating towards the side away from the testing position 31, and the wind shield 42 is prevented from striking other components on the testing circuit board 3 when the user rotates too fast, so that the testing circuit board 3 is prevented from being damaged. The air deflector 42 may then be pivoted back to the test site 31 side due to the resistance of the first and second restraint blocks 414,423 and the weight of the air deflector 42 itself.

The wind shield 42 is avoided at the moment, the test position 31 is exposed, a user can conveniently weld the chip pins and the needle seat 32, and the pins of the chip can be continuously tested after the welding is finished.

Example three:

after the test is accomplished, when will demolising the chip, when rotatory test position 31 one side of deep bead 42 earlier, make deep bead 42 and test circuit board 3 upper surface laminating, if deep bead 42 is difficult to rotate to the position, then can pull out through hole 33 one end distance with gag lever post 41 earlier, and the person of facilitating the use rotates deep bead 42 to suitable angle, then presses deep bead 42 back again, ensures deep bead 42 and test circuit board 3 upper surface laminating.

After the wind shield 42 is attached to the upper surface of the test circuit board 3, the user can heat the pins by using the hot air gun, so that the soldered tin is melted, and then the chip is taken out. In this process, user's accessible deep bead 42 one side uses hot-blast rifle to blow hot-blast heating, deep bead 42 can block the hot-blast that leaves test position 31, avoid hot-blast tin with other components and parts stitch departments on the test circuit board 3 to melt, and simultaneously, utilize the resistance of first restriction piece 414 and second restriction piece 423, avoid deep bead 42 to be blown by hot-blast, avoid leaking out, thereby protect the components and parts of test circuit board 3, avoid the stitch of components and parts and elementary gas parts to damage after this heats many times, improve the durability of test circuit board 3.

After the chip is removed, the wind shield 42 is rotated to the side far away from the test position 31, so that the test of the next chip is facilitated, and the effect of convenient use is achieved.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

For ease of description, spatially relative terms such as "over 8230 \ 8230;,"' over 8230;, \8230; upper surface "," above ", etc. may be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a durable chip testing arrangement, includes backup pad (2), install test circuit board (3) on backup pad (2), be provided with test position (31) on test circuit board (3), backup pad (2) are used for fixed test circuit board (3), test position (31) are chip access position, test circuit board (3) are used for testing the chip, its characterized in that:

test position (31) overcoat is equipped with deep bead (42), be connected with the connecting rod between deep bead (42) and backup pad (2), the connecting rod is used for supporting deep bead (42), deep bead (42) are used for when dismantling the chip, block the hot-blast through the chip.

2. A robust chip test apparatus as recited in claim 1, wherein: and one side of the wind deflector (42) is hinged with the connecting rod, so that the wind deflector (42) rotates around the hinged part and is used for sleeving the wind deflector (42) on the test position (31).

3. A robust chip test apparatus as recited in claim 2, wherein: be provided with spacing hole (22) on backup pad (2), the connecting rod inserts in spacing hole (22) for the dismouting between connecting rod and backup pad (2).

4. A robust chip test apparatus as recited in claim 3, wherein: one of the limiting hole (22) and the connecting rod is provided with a limiting block (221), and the other one is provided with a limiting groove (411) corresponding to the limiting block (221) and used for preventing the connecting rod from rotating in the limiting hole (22) in the circumferential direction.

5. A robust chip test apparatus as recited in claim 2, wherein: a friction block is arranged between the wind deflector (42) and the connecting rod and used for increasing resistance of the wind deflector (42) when the wind deflector rotates around the hinged position.

6. A robust chip test apparatus as recited in claim 1, wherein: one side of the wind shield (42) is open, and the width of the opening is larger than that of the other side of the wind shield (42) and used for blowing in hot air.