CN218210257U - Warm logical water-cooling heat abstractor of building - Google Patents

Warm logical water-cooling heat abstractor of building Download PDF

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Publication number
CN218210257U
CN218210257U CN202222418747.1U CN202222418747U CN218210257U CN 218210257 U CN218210257 U CN 218210257U CN 202222418747 U CN202222418747 U CN 202222418747U CN 218210257 U CN218210257 U CN 218210257U
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cooling
water
pipe
heating
heat dissipation
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CN202222418747.1U
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王昌盛
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Abstract

The embodiment of the utility model provides a pair of warm logical water-cooling heat abstractor of building relates to warm logical technical field. This a warm logical water-cooling heat abstractor of building, when using water cooling plant to cool down warm logical equipment, the inside water pump of water pump box draws water, let in circulation liquid to the circulating pipe through communicating pipe A, circulation liquid circulates through precooling portion and cooling tube, semiconductor refrigeration piece circular telegram simultaneously, the air conditioning of one side diffuses through diffusion piece A, later air conditioning is aired exhaust to the upper end through the cooling fan, blow air conditioning to precooling portion, fall the inside circulation liquid temperature of precooling portion, later get into the cooling tube through the connecting pipe, dispel the heat to warm logical equipment, make circulation liquid cooling effect better, promote cooling effect, the cooling fan is aired exhaust to the upper end simultaneously, also can blow the cold wind liquid temperature to the cooling tube through the install bin, conveniently fall the inside circulation of cooling tube, conveniently cool down the operation.

Description

Warm logical water-cooling heat abstractor of building
Technical Field
The utility model belongs to the technical field of warm logical technique and specifically relates to a building is warm leads to and is used water-cooling heat abstractor is related to.
Background
Heating and ventilation are one component of a building. The method comprises the following steps: heating, ventilation and air conditioning. The central air conditioner is divided into water system and freon system. The air treatment process of the central air conditioner comprises the following processes: firstly, fresh air is introduced, the air can be cooled, then filtration treatment is carried out, and dust, bacteria, viruses, smoke dust or peculiar smell can be filtered out after the filtration treatment; in addition, a humidifying device is added, and the humidifying device can create the relative humidity of the room of people, wherein the relative humidity reaches about 40%, so that people feel comfortable. Because the central air conditioner controls a plurality of split devices, a large amount of heat can be generated when the control device operates, if the device is not timely cooled, the device is easy to damage, and the use is inconvenient.
In the prior art (application No. CN202022172732.2, chinese patent application entitled "a water-cooling heat dissipation device for building heating and ventilation"), a motor, a first belt pulley, a ventilation funnel, a first rotating rod, a second belt pulley, a pull belt, blades, a cassette, a first bevel gear, a second rotating rod, a second bevel gear, and a tapered cover are used in cooperation, so that the circulating cooling liquid can be cooled in an accelerated manner, and the cooling effect of the cooling liquid is better. In the process of implementing the technical scheme, the inventor finds that at least the following problems exist in the prior art:
the fan blades are used for accelerating cooling of the cooling liquid, if the heating and ventilation equipment runs for a long time, the temperature of the cooling liquid rises when the cooling liquid contacts with the equipment to be cooled, the temperature of the cooling liquid in the water tank rises, the cooling effect is poor, and the use is inconvenient.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a warm general water-cooling heat abstractor that uses of building can avoid warm general equipment to carry out long-time operation, and the coolant liquid rises with the temperature of treating the cooling equipment contact cooling time, the problem of the coolant liquid temperature rise in the water tank.
The utility model provides a warm logical water-cooling heat abstractor of building, include:
the cooling unit, the cooling unit includes the install bin and installs the circulating pipe in the install bin inside, the middle part of install bin is provided with the cooling portion, the upper end of cooling portion is provided with the cooling fan, the lower extreme of cooling portion is provided with the heat dissipation fan.
In a specific embodiment, the lower end of the cooling fan is provided with a mounting frame, and the cooling fan is fixed between the inner walls of the mounting box through the mounting frame.
In a specific implementation scheme, heat dissipation holes are formed in two sides of the bottom of the lower end of the installation box, and the heat dissipation fan is installed on the inner side of the heat dissipation holes.
In a specific implementation scheme, the cooling part comprises a diffusion sheet A and a diffusion sheet B arranged on one side of the diffusion sheet A, semiconductor refrigerating sheets are arranged in the middle of the diffusion sheet A and the diffusion sheet B, and the semiconductor refrigerating sheets are arranged in mounting grooves formed in the inner sides of the diffusion sheet A and the diffusion sheet B.
In a specific embodiment, the refrigerating surface of the semiconductor refrigerating sheet is attached to the diffusion sheet a, and the heating surface of the semiconductor refrigerating sheet is attached to the diffusion sheet B.
In a specific embodiment, the circulating pipe comprises a precooling part installed inside the installation box and a cooling pipe installed at the upper end of the precooling part, the cooling pipe is communicated with the precooling part through a connecting pipe installed on one side, and the cooling pipe and the precooling part are both connected with a circulating water tank installed at the lower end of the installation box.
In a specific embodiment, one side of the circulating water tank is provided with a water pump box, one side of the water pump box is communicated with the bottom of the inner cavity of the circulating water tank, a communicating pipe A is arranged on the other side of the water pump box, and a communicating pipe B is arranged on one side of the circulating water tank.
In a specific embodiment, the upper end of the communication pipe a is communicated with the pre-cooling part, and the upper end of the communication pipe B is communicated with a cooling pipe, which is installed at the lower end of the fixing unit.
In a specific embodiment, the fixing unit comprises a cold guide sheet and a protective cover arranged at the lower end of the cold guide sheet, and the side surfaces of the protective cover are provided with positioning components.
In a specific embodiment, the positioning assembly comprises a positioning pipe fixedly arranged on the side edge of the protective cover and a telescopic rod arranged inside the positioning pipe, an expansion spring is fixedly arranged at the lower end of the telescopic rod, the lower end of the expansion spring is arranged in an inner cavity of the positioning pipe, and a fixedly arranged clamping piece is arranged on the side surface of the telescopic rod.
The embodiment of the utility model provides a pair of warm logical water-cooling heat abstractor of building, when using water cooling plant to cool down warm logical equipment, the inside water pump of water pump case draws water, let in circulation liquid to the circulating pipe through communicating pipe A, circulation liquid circulates through precooling portion and cooling tube, semiconductor refrigeration piece circular telegram simultaneously, the air conditioning of one side diffuses through diffusion piece A, later air exhaust to the upper end through the cooling fan, blow air to precooling portion, fall the inside circulation liquid temperature of precooling portion, later get into the cooling tube through the connecting pipe, dispel the heat to warm logical equipment, make circulation liquid cooling effect better, promote the cooling effect, the cooling fan is aired exhaust to the upper end simultaneously, also can blow cold wind to the cooling tube through the install bin, the convenient inside cooling cycle liquid temperature that falls, conveniently cool down the operation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall structure of the embodiment of the present invention.
Fig. 2 is a schematic diagram of the internal structure of the installation box according to the embodiment of the present invention.
Fig. 3 is a schematic structural view of a cooling portion according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a circulation pipe according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a fixing unit according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a positioning assembly according to an embodiment of the present invention.
Icon: 100-a cooling unit; 110-an installation box; 111-heat dissipation holes; 120-circulation pipe; 121-a pre-cooling section; 122-cooling tubes; 123-connecting pipe; 130-a cooling section; 131-a diffusion sheet A; 132-semiconductor chilling plates; 133-diffuser B; 134-mounting grooves; 140-a cooling fan; 141-a mounting frame; 150-heat dissipation fan; 160-a circulating water tank; 161-water pump box; 162-connecting tube A; 163-crossover tube B; 200-a stationary unit; 210-a cold conducting sheet; 220-a protective cover; 230-a positioning assembly; 231-a positioning tube; 232-telescopic rod; 233-snap-fit member; 234-extension spring.
Detailed Description
The fan blades are used for accelerating cooling of the cooling liquid, if the heating and ventilation equipment runs for a long time, the temperature of the cooling liquid rises when the cooling liquid contacts with the equipment to be cooled, the temperature of the cooling liquid in the water tank rises, the cooling effect is poor, and the use is inconvenient. Therefore, the inventor provides a water-cooling heat dissipation device for building heating and ventilation through research, when a water-cooling device is used for cooling heating and ventilation equipment, a water pump in a water pump box pumps water, circulating liquid is introduced into a circulating pipe through a communicating pipe A, the circulating liquid circulates through a pre-cooling part and a cooling pipe, meanwhile, a semiconductor refrigerating sheet is electrified, cold air on one surface is diffused through a diffusion sheet A, then the cold air is exhausted to the upper end through a cooling fan, the cold air is blown to the pre-cooling part, the temperature of the circulating liquid in the pre-cooling part is reduced, then the circulating liquid enters the cooling pipe through the connecting pipe, heat dissipation is carried out on the heating and ventilation equipment, the cooling effect of the circulating liquid is better, and the defects are solved.
Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 4, an embodiment of the present invention provides a water-cooling heat dissipation device for heating and ventilation in a building, including a cooling unit 100 for cooling a heating and ventilation device and a fixing unit 200 installed at an upper end of the cooling unit 100 and used for connecting the heating and ventilation device, wherein the fixing unit 200 is movably installed at an upper end of the cooling unit 100.
The cooling unit 100 includes an installation box 110 for installing equipment and a circulation pipe 120 installed inside the installation box 110 and used for circulating cooling liquid, a cooling portion 130 for cooling the cooling liquid is provided at the middle portion of the installation box 110, a cooling fan 140 for volatilizing cold air of the cooling portion 130 is provided at the upper end of the cooling portion 130, a mounting frame 141 for supporting the cooling fan 140 is provided at the lower end of the cooling fan 140, the cooling fan 140 is fixed between the inner walls of the installation box 110 through the mounting frame 141, a heat dissipation fan 150 for volatilizing hot air of the cooling portion 130 is provided at the lower end of the cooling portion 130, heat dissipation holes 111 for facilitating heat dissipation inside the installation box 110 are opened at both sides of the bottom of the lower end of the installation box 110, and the heat dissipation fan 150 is installed inside the heat dissipation holes 111.
The cooling part 130 comprises a diffusion sheet A131 for diffusing cold air and a diffusion sheet B133 which is arranged on the diffusion sheet A131 and used for diffusing the cold air, a semiconductor refrigerating sheet 132 for refrigerating is arranged in the middle of the diffusion sheet A131 and the diffusion sheet B133, the semiconductor refrigerating sheet 132 is arranged in an installation groove 134 which is formed in the inner sides of the diffusion sheet A131 and the diffusion sheet B133, the refrigerating surface of the semiconductor refrigerating sheet 132 is attached to the diffusion sheet A131, and the heating surface is attached to the diffusion sheet B133.
The circulation pipe 120 includes a pre-cooling unit 121 installed inside the installation case 110 for pre-cooling the circulation liquid in advance, and a cooling pipe 122 installed at an upper end of the pre-cooling unit 121 for cooling the heating and ventilating device, the cooling pipe 122 and the pre-cooling unit 121 are communicated through a connection pipe 123 installed at one side, and both the cooling pipe 122 and the pre-cooling unit 121 are connected to a circulation water tank 160 installed at a lower end of the installation case 110.
A water pump box 161 for pumping out and circulating liquid in the circulating water tank 160 is arranged on one side of the circulating water tank 160, one side of the water pump box 161 is communicated with the bottom of the inner cavity of the circulating water tank 160, a communicating pipe A162 is arranged on the other side of the water pump box 161, a communicating pipe B163 is arranged on one side of the circulating water tank 160, the upper end of the communicating pipe A162 is communicated with the precooling part 121, the upper end of the communicating pipe B163 is communicated with the cooling pipe 122, and the cooling pipe 122 is installed at the lower end of the fixing unit 200.
When the water cooling device is used for cooling the heating and ventilation equipment, the water pump in the water pump box 161 pumps water, circulating liquid is introduced into the circulating pipe 120 through the communicating pipe A162, the circulating liquid circulates through the pre-cooling part 121 and the cooling pipe 122, meanwhile, the semiconductor refrigerating sheet 132 is electrified, cold air on one surface is diffused through the diffusion sheet A131, then the cold air is exhausted to the upper end through the cooling fan 140, the cold air is blown to the pre-cooling part 121, the temperature of the circulating liquid in the pre-cooling part 121 is reduced, then the cold air enters the cooling pipe 122 through the connecting pipe 123, heat dissipation is performed on the heating and ventilation equipment, the cooling effect of the circulating liquid is better, the cooling effect is improved, meanwhile, the cooling fan 140 exhausts to the upper end, cold air can also be blown to the cooling pipe 122 through the installation box 110, the temperature of the circulating liquid in the cooling pipe 122 is conveniently reduced, and cooling operation is convenient to carry out.
Referring to fig. 5 to 6, the fixing unit 200 includes a cold conducting sheet 210 for making the cold air uniformly disperse and a protective cover 220 installed at the lower end of the cold conducting sheet 210 for protecting the cold conducting sheet 210 and the cooling tube 122, the side surfaces of the protective cover 220 are provided with positioning assemblies 230 for attaching the cold conducting sheet 210 to the heating and ventilation equipment, each positioning assembly 230 includes a positioning tube 231 fixedly installed at the side of the protective cover 220 for positioning and a telescopic rod 232 installed inside the positioning tube 231 for telescopic movement, the lower end of the telescopic rod 232 is fixedly provided with a telescopic spring 234 for conveniently driving the telescopic rod 232 to reset and rebound, the lower end of the telescopic spring 234 is installed in the inner cavity of the positioning tube 231, and the side surface of the telescopic rod 232 is provided with a fixedly installed engaging member 233.
When using water-cooling heat abstractor to dispel the heat to equipment, can be with the warm equipment side of ventilating of leading cold fin 210 laminating that the heat conduction effect is good, conveniently conduct the inside cooling tube 122 temperature of protection casing 220 to the equipment side, can stimulate telescopic link 232 simultaneously, fastener 233 through side fixed mounting fixes equipment and leading cold fin 210 and pulls, conveniently makes leading cold fin 210 and equipment laminate more, conveniently fixes leading cold fin 210, and it is more nimble to use.
To sum up, the utility model discloses a warm logical water-cooling heat abstractor of building of embodiment, when using water cooling plant to warm logical equipment and cooling down, the inside water pump of water pump box 161 draws water, let in circulation liquid to circulating pipe 120 through communicating pipe A162, circulation liquid circulates through precooling portion 121 and cooling tube 122, semiconductor refrigeration piece 132 circular telegram simultaneously, the air conditioning of one side diffuses through diffusion piece A131, later air conditioning is to the upper end through cooling fan 140 and airs exhaust, blow air conditioning to precooling portion 121, cool down the inside circulation liquid temperature of precooling portion 121, later get into cooling tube 122 through connecting pipe 123, dispel the heat to warm logical equipment, make circulation liquid cooling effect better, promote cooling effect, cooling fan 140 airs exhaust to the upper end simultaneously, also can blow cold wind to cooling tube 122 through install bin 110, conveniently drop the inside circulation liquid temperature of cooling tube 122, conveniently cool down the operation of cooling.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A water-cooling heat dissipation device for heating and ventilation of a building is characterized by comprising:
the cooling unit, the cooling unit includes the install bin and installs the circulating pipe in the install bin inside, the middle part of install bin is provided with the cooling portion, the upper end of cooling portion is provided with the cooling fan, the lower extreme of cooling portion is provided with the heat dissipation fan.
2. A water-cooling heat sink for heating and ventilating buildings as claimed in claim 1, wherein the lower end of the cooling fan is provided with a mounting rack, and the cooling fan is fixed between the inner walls of the mounting box through the mounting rack.
3. The water-cooling heat dissipation device for heating and ventilation of buildings as claimed in claim 2, wherein heat dissipation holes are formed in two sides of the bottom of the lower end of the installation box, and the heat dissipation fan is installed inside the heat dissipation holes.
4. The water-cooling heat dissipation device for building heating and ventilation as claimed in claim 3, wherein the cooling portion comprises a diffusion sheet A and a diffusion sheet B mounted on one side of the diffusion sheet A, semiconductor refrigeration sheets are mounted in the middle of the diffusion sheet A and the diffusion sheet B, and the semiconductor refrigeration sheets are mounted inside mounting grooves formed in the inner sides of the diffusion sheet A and the diffusion sheet B.
5. The water-cooling heat dissipation device for heating and ventilating of buildings as claimed in claim 4, wherein the cooling surface of the semiconductor cooling plate is attached to a diffusion plate A, and the heating surface is attached to a diffusion plate B.
6. The water-cooling heat dissipation device for heating and ventilation of buildings as claimed in claim 5, wherein the circulation pipe comprises a pre-cooling part installed inside the installation box and a cooling pipe installed on the upper end of the pre-cooling part, the cooling pipe and the pre-cooling part are communicated through a connecting pipe installed on one side, and both the cooling pipe and the pre-cooling part are connected with a circulation water tank installed on the lower end of the installation box.
7. A heating and ventilating water-cooling heat dissipation device as defined in claim 6, wherein a water pump box is disposed on one side of the circulation water tank, one side of the water pump box is communicated with the bottom of the inner cavity of the circulation water tank, a communication pipe A is disposed on the other side of the water pump box, and a communication pipe B is disposed on one side of the circulation water tank.
8. A water-cooled heat sink for heating and ventilating buildings as claimed in claim 7, wherein the upper end of the communication pipe a communicates with the pre-cooling part, the upper end of the communication pipe B communicates with the cooling pipe, and the cooling pipe is installed at the lower end of the fixing unit.
9. A heating and ventilating water-cooling heat sink for building as claimed in claim 8, wherein said fixing unit comprises a cold guiding plate and a protective cover mounted at the lower end of the cold guiding plate, and the side surfaces of the protective cover are provided with positioning components.
10. A water-cooling heat sink for heating and ventilating buildings according to claim 9, wherein the positioning assembly comprises a positioning tube fixedly installed at a side of the shield and a telescopic rod installed inside the positioning tube, a telescopic spring is fixedly installed at a lower end of the telescopic rod, a lower end of the telescopic spring is installed in an inner cavity of the positioning tube, and a side surface of the telescopic rod is provided with a fixedly installed engaging member.
CN202222418747.1U 2022-09-13 2022-09-13 Warm logical water-cooling heat abstractor of building Active CN218210257U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222418747.1U CN218210257U (en) 2022-09-13 2022-09-13 Warm logical water-cooling heat abstractor of building

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222418747.1U CN218210257U (en) 2022-09-13 2022-09-13 Warm logical water-cooling heat abstractor of building

Publications (1)

Publication Number Publication Date
CN218210257U true CN218210257U (en) 2023-01-03

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Application Number Title Priority Date Filing Date
CN202222418747.1U Active CN218210257U (en) 2022-09-13 2022-09-13 Warm logical water-cooling heat abstractor of building

Country Status (1)

Country Link
CN (1) CN218210257U (en)

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