CN218183813U - Food processor circuit board and food processor - Google Patents

Abstract

The application discloses food preparation machine circuit board and food preparation machine, food preparation machine circuit board includes: the circuit board comprises a circuit board body, wherein strong current areas and weak current areas are distributed on the circuit board body, the strong current areas are close to the edges of the circuit board body relative to the weak current areas, and at least part of the edges of the weak current areas are surrounded by the strong current areas. According to the method, the strong-current electronic components are distributed at the edge of the circuit board, the weak-current electronic components are distributed at the center of the circuit board, the layout that the strong-current area at least partially surrounds the weak-current area is formed, the electric signals can be fully utilized to be processed step by step and the edge trend can be fully utilized, the space of the circuit board is smaller, and the method is applicable to equipment with a smaller size; besides, the strong current part is distributed and distributed on the edge, so that the module is favorable for heat dissipation of each module, is applicable to equipment with higher power, and provides a wider application range for installation and use of a circuit board.

Description

Food processor circuit board and food processor

Technical Field

The utility model relates to a food processing technology field, concretely relates to food preparation machine circuit board and food preparation machine.

Background

With the continuous progress of science and technology, the living standard of people is gradually improved, for example, in daily life, people cook more variously and more conveniently, various food processing products appear on the market, and further, companies related to food processing technology compete increasingly.

In some existing food processing machines, a strong current part and a weak current part are often spliced into an integrated plate in an up-down or left-right layout mode. For example, in chinese patent publication No. CN212213573U, there is only one circuit board of the wall-breaking food processor, and the circuit board includes a second board and a first board having a strong electric region, and the first board is connected to the second board. However, the circuit board is limited by the influence of factors such as power supply, heat dissipation, signal transmission and the size of electronic components, when the circuit board is integrally arranged, if the integrated boards are spliced according to the vertical or horizontal layout and the circuit board layout principle is satisfied, the layout space of the circuit board is difficult to efficiently utilize, the overall size of the circuit board is increased, the space for installing the circuit board is large, meanwhile, the power supply part is intensively arranged, in some equipment with large power, the power supply part can be seriously heated, therefore, the layout mode that the integrated boards are spliced by the vertical or horizontal layout on the upper and lower sides of the power supply part and the weak power part can lead to the increase of the size of the circuit board, the heat is concentrated in the work of the circuit board, and the problem of difficult heat dissipation is solved.

Therefore, a technical problem of how to solve at least one of the problems of large size and difficult heat dissipation of the circuit board in the prior art is urgently needed to be solved.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem of how to solve at least one of the problems of large volume and difficult heat dissipation of the circuit board in the prior art, the present application provides a food processor circuit board and a food processor.

According to a first aspect, an embodiment of the present application provides a food processor circuit board, including: the circuit board comprises a circuit board body, wherein strong current areas and weak current areas are distributed on the circuit board body, the strong current areas are close to the edges of the circuit board body relative to the weak current areas, and at least part of the edges of the weak current areas are surrounded by the strong current areas.

Optionally, the circuit board body includes four sides, wherein the strong electric region includes three strong electric regions respectively distributed along any three sides of the four sides, so that the strong electric regions form a concave layout.

Optionally, the strong electric region includes a plurality of heat sources respectively distributed in different strong electric regions.

Optionally, the functional module in the high current region includes at least part of an electromagnetic compatibility module, a current sampling module, a power supply module in the low current region, and a motor driving module.

Optionally, the circuit board body includes a first side strong electronic region close to an input power, a third side strong electronic region disposed opposite to the first side strong electronic region, and a second side strong electronic region disposed between the first side strong electronic region and the third side strong electronic region, wherein the electromagnetic compatibility module is disposed in the first side strong electronic region; the current sampling module is arranged in the second side strong electronic region, and the power supply module is arranged in the third side strong electronic region.

Optionally, in the strong electric region, the height of the electronic component near the edge of the circuit board body is smaller than the height of the electronic component near the center of the circuit board body; or, a connecting terminal is arranged in the strong current region.

Optionally, the heights of the electronic components distributed within 5mm-15mm from the edge of the circuit board body are less than 10mm.

Optionally, the electronic components distributed in the strong electric area are horizontal electronic components.

Optionally, the circuit board body is a double-sided circuit board, wherein the electronic components with a height greater than 10mm in the high-voltage region are distributed on one side of the circuit board body, and a UI module is arranged on the other side of the circuit board body.

According to a second aspect, the application provides a food processor, a food processor body and a processing chamber, wherein an accommodating space for accommodating a circuit board is arranged in the food processor body, and the food processor circuit board according to any one of the above embodiments is installed in the accommodating space.

The circuit board body is divided into a strong current area and a weak current area, the weak current area is distributed at the position relative to the middle, the strong current area is distributed at the edge of the weak current area, the layout that the strong current area surrounds or surrounds the edge of the partial or whole weak current area is formed, electronic components of the strong current area are not limited to be distributed on one side of the weak current area in a centralized mode, but surround or surround the edge of the partial or whole weak current area, and because the strong current module of the strong current part is used for processing electric signals step by step and is consistent with the edge trend, the full utilization of the edge can be achieved by fully utilizing the cooperation of step-by-step processing of the electric signals and the edge trend, the layout is more flexible, the space occupation of the circuit board is smaller, and the circuit board can be suitable for equipment with a smaller size; and, with the partial distribution of forceful electric power scatter layout at the edge, reduce the module heat dissipation of generating heat and concentrate the problem, be favorable to the heat dissipation of each module, the applicable bigger equipment of power provides wider application scope to the installation and the use of circuit board.

Furthermore, different heating sources on the circuit board are distributed in different strong current regions respectively, the strong current regions are distributed along the edges of the weak current regions, compared with strong current regions which are intensively distributed on electronic components, the interval between the heating sources can be larger, the mutual influence can be smaller, more effective heat dissipation can be guaranteed, and the temperature rise of the strong current electronic components can be prevented from influencing and even damaging other electronic components when the circuit board works.

Furthermore, the power supply module of the strong current area is distributed close to the power utilization components of the weak current area, so that the power supply module can supply power to the power utilization components of the weak current area more stably, and meanwhile, the motor driving module is arranged at the junction of the current sampling module and the power supply module of the strong current area, so that the shortest control signal route and the shortest 220V power supply route can be ensured, the motor control is more reliable, and the difficulty of wire arrangement can be reduced.

Furthermore, the height of the strong-current electronic component in the strong-current area from the center to the edge is gradually reduced, so that the circuit board can adapt to a space structure with a high middle part and narrow two sides of the arc-shaped machine body, and the universality of the circuit board on different machine bodies is improved.

Furthermore, horizontal electronic components are adopted as the electronic components distributed in the strong electric area, so that the occupied space of the circuit board can be further reduced, and the universality of the circuit board is further improved.

Drawings

The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:

FIG. 1 is a schematic view of a food processor circuit board according to an embodiment of the present application;

FIG. 2 is a schematic view of a food processor circuit board according to another embodiment of the present application;

FIG. 3 is a schematic diagram of a food processor circuit board according to another embodiment of the present application.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings, wherein the same reference numerals in the drawings denote the same components or similar components.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

According to a first aspect of the present application, with reference to fig. 1, a food processor circuit board is proposed, comprising: the circuit board comprises a circuit board body 30, wherein a strong current region 10 and a weak current region 20 are distributed on the circuit board body 30, wherein the strong current region 10 is close to the edge of the circuit board body 30 relative to the weak current region 20, and at least part of the edge of the weak current region 20 is surrounded by the strong current region 10.

In the embodiment, the circuit board divides a strong current area and a weak current area, the weak current area is distributed at the position relative to the middle, the strong current area is distributed at the edge of the weak current area, the layout that the strong current area surrounds or surrounds the edge of the partial or whole weak current area is formed, electronic components of the strong current area are not limited to be distributed on one side of the weak current area in a centralized mode, but surround or surround the edge of the partial or whole weak current area, and because the processing of electric signals by a strong current module of the strong current area is propagated step by step and is consistent with the edge trend, the full utilization of the edge can be realized by fully utilizing the cooperation of step by step processing and the edge trend of the electric signals, the layout is more flexible, the space occupation of the circuit board is smaller, and the circuit board can be applied to equipment with a smaller volume. Besides, the strong electricity parts are distributed and distributed on the edge, so that the module is beneficial to heat dissipation of each module, and is applicable to equipment with higher power, and therefore, a wider application range is provided for installation and use of the circuit board.

The circuit board body in this embodiment can be for dividing the board, and is exemplary, and the circuit board body is strong electric plate and weak electric plate, and weak electric plate can be circular or rectangular plate, and strong electric plate is the arc, "L" shaped plate or "concave" shaped plate that can encircle weak electric plate, also can be a plurality of discrete daughter boards. The strong current board and the weak current board can be connected in a plugging or lead mode.

Because the separate strong and weak electric boards are inserted into the socket through the pin header or connected through the lead wire, for example, the strong and weak electric boards are inserted into the socket up and down through the pin header or installed on the same plane through the flat cable. The problems of complex process, poor reliability, high labor cost and the like can be caused, the thickness can be increased by vertically inserting the pin header and the pin header, and the use of equipment with limited thickness can not be met. Meanwhile, signal transmission between the separate strong and weak electric boards may also be affected by poor plug contact to cause signal interruption or interference or too long flat cable to cause signal interference. As an optional embodiment, the circuit board body may adopt an integrated board, as shown in fig. 1, the electronic component is integrated on one circuit board, the weak current region is distributed at a position corresponding to the middle, and the strong current region is distributed at the edge of the weak current region, so as to form an integrated layout in which the strong current region surrounds or encloses part or all of the edges of the weak current region, and further improve the utilization rate of the spatial layout of the circuit board, and at the same time, can also reduce the difficulty of the mounting process, and improve the reliability and the stability of signal transmission.

Based on the equipment with different structures, the shapes of the circuit boards can be different, for example, the shapes of the circuit boards can be circular, quadrilateral, polygonal and the like, and the universality of the circuit boards is further improved.

In the present application, a quadrangular circuit board is explained as an example.

As an exemplary embodiment, referring to fig. 2, the circuit board body 30 includes four sides, wherein the heavy current region 10 includes three heavy current regions respectively distributed along any three sides of the four sides, so that the heavy current regions form a concave layout.

Alternatively, if the circuit board is circular, the strong current region may form an arc partially surrounding the weak current region or a circle surrounding the weak current region.

Because the forceful electric power module is mostly the module that generates heat, when carrying out the overall arrangement to the forceful electric power region in order to make the better heat dissipation of circuit board during operation, can carry out the overall arrangement according to the source that generates heat, distribute the forceful electric power module that belongs to the source that generates heat in different forceful electric power sub-regions, avoid the heat to concentrate. Illustratively, the strong electric region 10 includes a plurality of heat sources respectively distributed in different strong electric regions. In this embodiment, the distribution mode of forceful electric power electronic components in forceful electric power region 10 can distribute according to the condition of generating heat, forceful electric power region 10 includes a plurality of electronic components that can generate heat, can distribute a plurality of electronic components that can generate heat in different forceful electric power regions, and the edge distribution of weak electric power region is followed again to the forceful electric power subregion, compare in the forceful electric power region of concentrated arrangement electronic components, the interval can be bigger between the heat source, influence each other can be littleer, can guarantee more effectively and dispel the heat, avoid electronic components during operation because of producing high temperature and influence electronic components itself or near electronic components's work. For example, the heat generating source may include an electromagnetic compatibility module 1011, a current sampling module 1021, a power supply module 1031, and a motor driving module 1032, and different modules may be distributed in different strong electronic regions. As an alternative embodiment, the distribution of the high-voltage electronic components may also be distributed according to functional modules, and for example, the functional modules of the high-voltage region may include at least some of the electromagnetic compatibility module 1011, the current sampling module 1021, the power supply module 1031, the motor driving module 1032, and the circuit protection module. Different functional modules may be distributed in different power electronic regions. Preferably, among all the functional modules, the functional module that generates heat during operation, that is, the heat generation source, may be distributed in different power electronic regions. Illustratively, the electromagnetic compatibility module 1011, the current sampling module 1021, the power supply module 1031, and the motor driving module 1032 are heat generating modules, and the above functional modules may be allocated to different strong electronic regions.

As an exemplary embodiment, the layout of the functional modules may be performed according to the processing order of the strong electric signals and the principle of supplying and interacting with the weak electric areas as close as possible. Exemplarily, referring to fig. 2 and 3, the strong electric region may include a first side strong electric region 101 close to the input power, a third side strong electric region 103 disposed opposite to the first side strong electric region 101, and a second side strong electric region 102 disposed between the first side strong electric region 101 and the third side strong electric region 103, wherein an electromagnetic compatibility module 1011 may be disposed in the first side strong electric region according to the processing order of the strong electric signals and the principle of supplying power to and interacting with the weak electric region as close as possible; a current sampling module 1021 is arranged in the second side high-voltage region, and a power supply module 1031 of the low-voltage region is arranged in the third side high-voltage region. According to the principles of edge trend, processing sequence of strong electric signals, power supply with a weak electric area, interaction and the like, all the functional modules are sequentially arranged at the edge of the weak electric area through the shortest signal wiring and power supply wiring, wiring among all the functional modules does not need to be crossed, positions and wiring among all the functional modules do not influence each other, the modules are more reliable in both power supply and control, and the layout of the strong electric area can be completed through a smaller layout space.

Referring to fig. 2 and 3, electromagnetic compatibility modules 1011 are distributed on a first-edge strong electronic region 101 and are arranged close to the input end of alternating current AC, so that a good filtering effect can be achieved, a power line is directly welded on a circuit board through a direct welding hole, a shorter 220V power supply circuit is achieved, a safe distance of 3mm is guaranteed during structural design, 220V power supply can be achieved, meanwhile, wiring terminals are reserved, in a non-arc-surface structure, the wiring terminals can be used for power line incoming connection, and the universality is higher.

Referring to fig. 2 and 3, the current sampling module 1021 is distributed in the second side ferroelectric region 102, and can collect the current of the control module 201 to ensure the safety of the circuit board and the whole machine, for example, only one resistor is arranged in the second side ferroelectric region 102 to sample the current, and other electronic components are not arranged, so that the circuit board can adapt to a machine body with a concave shape at the bottom, and the application range of the circuit board is wider. It should be noted that other electronic components may be added to the second edge electron region 102.

Referring to fig. 2 and 3, a power supply module 1031 and a motor driving module 1032 are distributed in the third strong electronic region 103, the power supply module 1031 is distributed near the control module 201 and the display module 202 in the weak electronic region 20, so that power supply is more stable, the motor driving module 1032 can also be arranged in the second strong electronic region 102, and the motor driving module 1032 is arranged in the second strong electronic region 102 and the third strong electronic region 103, so that the shortest control signal route and the shortest 220V power supply route can be ensured, so that motor control is more reliable, a direct welding hole is used for welding a motor wire to a circuit board, and meanwhile, a connecting terminal is reserved, so that the circuit board can be used for non-arc equipment, the requirement of the circuit board on the height of the edge of the machine body is reduced, a hole is not required to be opened from the middle of the circuit board to accommodate the motor, and influence of the heat generated by the motor and the generated carbon powder on the work of the circuit board is avoided.

It should be noted that the electronic components distributed in the above-mentioned strong electron region division and strong electron region are not limited to the embodiments of the present application, and other adjustments may be made to the body having other requirements.

As an exemplary embodiment, in the strong electric region, the height of the electronic component near the edge of the circuit board body is smaller than the height of the electronic component near the center of the circuit board body. For example, if each strong electric region includes a plurality of strong electric components arranged side by side, the heights of the electronic components distributed on the circuit board body 30 gradually decrease from the center to the edge of the circuit board body 30.

Illustratively, the height of the electronic components distributed within 5-15mm from the edge of the circuit board body 30 is less than 10mm. In this embodiment, the heights of the electronic components in the strong current region 10 from the center to the edge are gradually reduced, so that the circuit board can adapt to a space structure with a high middle part and narrow sides, and the universality of the circuit board to different bodies is improved.

In order to further improve the versatility of the circuit board, the electronic components in the strong electric region 10 may be horizontal electronic components, so as to further reduce the maximum height of the strong electric region 10, and further adapt to a machine body with strict height restriction.

Even if the strong current electronic components are distributed in the strong current area 10 at the edge of the circuit board, the problem that the installation cannot be performed due to the strict height limitation of the machine body on the circuit board may also exist, so that a double-sided circuit board may be adopted, the electronic components of which the heights exceed the preset values in the strong current area 10 are distributed on one surface of the double-sided circuit board, and weak current electronic components and/or strong current electronic components of which the heights do not exceed the preset values are arranged on the other surface of the double-sided circuit board, wherein the preset values may be 10mm.

The strong current electronic components are distributed at the edge of the circuit board, the weak current electronic components are distributed at the center of the circuit board, the layout of the strong current area at least partially surrounding the weak current area is formed, the height of the edge electronic components of the strong current area is low, or the height of the edge electronic components of the strong current area is further reduced by adopting a double-panel, the size of the circuit board is further reduced, the setting space of the circuit board and the motor is enough, the motor can be kept in a sufficient gap with the circuit board, the motor can be provided with a motor cover for sealing, carbon powder generated by the operation of the motor is prevented from accumulating on the circuit board, and the abnormity of the circuit board is avoided.

As an exemplary embodiment, the strong current part and the weak current part in the circuit board are integrated plates, strong current electronic components are distributed at the edge of the circuit board, weak current electronic components are distributed at the center of the circuit board, a layout that the strong current area at least partially surrounds the weak current area is formed, the overall size of the circuit board is reduced, the occupied space of the circuit board is reduced, meanwhile, a complex wiring scheme for power supply and communication between the strong current and the weak current is avoided, and the process complexity and the labor cost are reduced. In the integrated circuit board without the flat cable arrangement, the phenomenon that the flat cable is too long and is easy to interfere signals can be avoided, so that the functions of electronic components and the working coordination among the electronic components can be started, the electronic components needing interaction or frequent interaction are arranged close to each other, the difficulty of the flat cable is reduced as much as possible, the cost can be reduced, and the interference of other signals is reduced.

According to a second aspect of the application, a food processor body and a processing cavity are further provided, wherein an accommodating space for accommodating a circuit board is arranged in the food processor body, and the food processor circuit board is provided according to any one of the embodiments.

As an illustrative example, the food processor may include a wall breaking machine with a motor, a soymilk maker, a meat grinder, and the like, in which the motor is provided separately from the circuit board and has a space sufficient to accommodate the motor cover. For example, the motor and the circuit board can be arranged in parallel, the occupied space of the circuit board is reduced, meanwhile, the arrangement space of the circuit board and the motor is enough, the motor can be kept in a sufficient gap with the circuit board, the motor can be provided with a motor cover for sealing, carbon powder generated by the operation of the motor is prevented from accumulating on the circuit board, and the circuit board is prevented from being abnormal.

So far, the technical solutions of the present disclosure have been described in connection with the foregoing embodiments, but it is easily understood by those skilled in the art that the scope of the present disclosure is not limited to only these specific embodiments. The technical solutions in the above embodiments can be split and combined, and equivalent changes or substitutions can be made on related technical features by those skilled in the art without departing from the technical principles of the present disclosure, and any changes, equivalents, improvements, and the like made within the technical concept and/or technical principles of the present disclosure will fall within the protection scope of the present disclosure.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, as for the system embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and reference may be made to the partial description of the method embodiment for relevant points.

The above are merely examples of the present invention, and are not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (10)

1. A food processor circuit board, comprising:

the circuit board comprises a circuit board body, wherein strong current areas and weak current areas are distributed on the circuit board body, the strong current areas are close to the edges of the circuit board body relative to the weak current areas, and at least part of the edges of the weak current areas are surrounded by the strong current areas.

2. The food processor circuit board of claim 1, wherein the circuit board body includes four sides, wherein the high current region includes three high current regions respectively disposed along any three of the four sides such that the high current regions form a "concave" layout.

3. The food processor circuit board of claim 2, wherein the high current region comprises a plurality of heat generating sources respectively distributed in different ones of the high current regions.

4. The food processor circuit board of claim 1 or 2, wherein the functional modules of the high current region comprise at least some of an electromagnetic compatibility module, a current sampling module, a power supply module of the low current region, and a motor driving module.

5. The food processor circuit board of claim 4, wherein the circuit board body includes a first side power region proximate to an input power, a third side power region disposed opposite the first side power region, and a second side power region disposed between the first side power region and the third side power region, wherein the electromagnetic compatibility module is disposed within the first side power region; the current sampling module is arranged in the second side strong electronic region, and the power supply module is arranged in the third side strong electronic region.

6. The food processor circuit board of claim 1, wherein in the power-on region, the height of electronic components near the edge of the circuit board body is less than the height of electronic components near the center of the circuit board body;

or the like, or, alternatively,

and a connecting terminal is arranged in the strong current region.

7. A food processor circuit board according to claim 1 or 6, characterized in that the height of the distributed electronic components within 5mm-15mm from the edge of the circuit board body is less than 10mm.

8. The food processor circuit board of claim 1, wherein the electronic components distributed in the intense power region are horizontal electronic components.

9. The food processor circuit board of claim 1 or 8, wherein the circuit board body is a double-sided circuit board, wherein electronic components with a height greater than 10mm in the high-voltage region are distributed on one side, and a UI module is arranged on the other side.

10. A food processor, comprising: a food processor body and a processing cavity, wherein the food processor body is internally provided with a containing space for containing a circuit board, and the food processor circuit board as claimed in any one of claims 1-9 is arranged in the containing space.

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