CN218183586U - Novel multistage HDI high density circuit board of height - Google Patents
Novel multistage HDI high density circuit board of height Download PDFInfo
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- CN218183586U CN218183586U CN202221571900.8U CN202221571900U CN218183586U CN 218183586 U CN218183586 U CN 218183586U CN 202221571900 U CN202221571900 U CN 202221571900U CN 218183586 U CN218183586 U CN 218183586U
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- circuit board
- hdi
- high density
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Abstract
The utility model discloses a novel multistage HDI high density circuit board of height, including middle level HDI circuit board, the upper HDI circuit board is installed to middle level HDI circuit board upper end, lower floor's HDI circuit board is installed to middle level HDI circuit board lower extreme, corner fixing device is installed jointly to middle level HDI circuit board, upper HDI circuit board and lower floor's HDI circuit board left end and right-hand member, installation protector is installed jointly to corner fixing device left end and right-hand member, installation protector left end and right-hand member install installation device jointly. A novel multistage HDI high density circuit board of height, not only make multistage HDI high density circuit board be convenient for install and dismantle through installation protector, protect through the guard plate, and then avoid it to receive the outside easily and collide with, prevent the easy perk of multistage HDI high density circuit board corner through corner fixing device to the stability and the result of use of multistage HDI high density circuit board have been improved.
Description
Technical Field
The utility model relates to the technical field of, in particular to novel multistage HDI high density circuit board of height.
Background
HDI is an abbreviation for high density interconnect and is a technique for producing printed circuit boards, a circuit board with a relatively high line distribution density using micro-blind buried via technology. Particularly, in order to meet the current requirements of the development of electronic products towards miniaturization, high frequency, high speed, multiple functions and high precision, the HDI/micro via technology is undoubtedly the future PCB architecture, so the development of the high-density circuit board with high multi-level HDI is very important.
1. The conventional high-multi-stage HDI high-density circuit board is formed by pressing a plurality of layers of HDI circuit boards, so that the production cost of the HDI high-density circuit board is relatively high for a common circuit board, and the HDI high-density circuit board is relatively easy to scratch and rub by external sharp objects, so that the protection of the multi-layer HDI circuit board is particularly important, and the multi-layer HDI circuit board needs to manually loosen fixed screws during installation and disassembly, so that the installation and disassembly efficiency is low; 2. the current multistage HDI high density circuit board of high is formed by multilayer HDI circuit board suppression and HDI circuit board edge department does not obtain pressing from both sides tightly, only relies on the glue bonding, and especially the HDI high density circuit board receives for a long time and rocks when influencing, and HDI high density circuit board corner will the perk, and then leads to HDI high density circuit board to produce the layering, influences the use of HDI high density circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a novel multistage HDI high density circuit board of height can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the technical proposal that:
the utility model provides a novel multistage HDI high density circuit board of height, includes middle level HDI circuit board, the upper HDI circuit board is installed to middle level HDI circuit board upper end, lower floor's HDI circuit board is installed to middle level HDI circuit board lower extreme, corner fixing device is installed jointly to middle level HDI circuit board, upper HDI circuit board and lower floor's HDI circuit board left end and right-hand member, installation protector is installed jointly to corner fixing device left end and right-hand member, installation protector left end and right-hand member install installation device jointly.
Preferably, installation protector includes mounting bracket and No. two mounting brackets, the guard plate is installed jointly to mounting bracket and No. two mounting brackets upper ends, all install a set of spring on inner wall and the lower inner wall on mounting bracket and No. two mounting brackets, four group the cardboard is all installed to two double-phase relative one end of spring, four the link is all installed to the cardboard between two liang, mounting bracket and No. two mounting brackets pass through the link and install respectively at corner fixing device left end and right-hand member. Be H shape through two link on the installation protector, at this moment with two link propelling movement respectively into a mounting bracket and No. two mounting brackets in, the spring drive cardboard atress shrink in a mounting bracket and No. two mounting brackets this moment, until the link pushes the back completely, the cardboard and then press from both sides the link tightly, thereby fix the multistage HDI high density circuit board between two links, design through the spring chucking, make multistage HDI high density circuit board be convenient for install and dismantle, and multistage HDI high density circuit board is after the installation, protect its upper portion through the guard plate, and then avoid it to receive outside colliding with easily.
Preferably, corner fixing device includes the support frame, two chucking screws are all installed to support frame upper end left part and upper end right part, the fin is installed to the support frame upper end, two screw holes have all been opened to middle level HDI circuit board, upper HDI circuit board and lower floor HDI circuit board left end and right-hand member, the support frame passes through the chucking screw and installs at middle level HDI circuit board, upper HDI circuit board and lower floor HDI circuit board lower extreme. Through the chucking screw on the corner fixing device with the upper HDI circuit board, the four corners fixed mounting of middle level HDI circuit board and lower floor HDI circuit board is in the support frame, prevent upper HDI circuit board, middle level HDI circuit board and lower floor HDI circuit board receive the easy perk of corner when rocking, and then lead to the circuit board can the layering, thereby improved the stability and the result of use of multistage HDI high density circuit board, simultaneously through the fin laminating at multistage HDI high density circuit board lower extreme, and then improved the heat dispersion of multistage HDI high density circuit board.
Preferably, installation device includes a mounting panel and No. two mounting panels, two fixed screws are all installed to a mounting panel and No. two mounting panel upper ends, a mounting panel and No. two mounting panels are installed respectively at installation protector left end and right-hand member. Fix a mounting panel and No. two mounting panels through the set screw to fix the HDI circuit board thereupon.
Preferably, the connecting frame is H-shaped.
Preferably, the clamping screw is vertically corresponding to the screw hole.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. be H shape through two link on the installation protector, at this moment with two link propelling movement respectively into a mounting bracket and No. two mounting brackets in, the spring drive cardboard atress shrink in a mounting bracket and No. two mounting brackets this moment, until the link pushes the back completely, the cardboard and then press from both sides the link tightly, thereby fix the multistage HDI high density circuit board between two links, design through the spring chucking, make multistage HDI high density circuit board be convenient for install and dismantle, and multistage HDI high density circuit board is after the installation, protect its upper portion through the guard plate, and then avoid it to receive outside colliding with easily.
2. The clamping screw on the corner fixing device is used for fixedly mounting the upper-layer HDI circuit board, the middle-layer HDI circuit board and the lower-layer HDI circuit board in the supporting frame, the upper-layer HDI circuit board is prevented, the middle-layer HDI circuit board and the lower-layer HDI circuit board are prevented from being easily tilted at corners when being shaken, and then the circuit boards can be layered, so that the stability and the using effect of a multi-step HDI high-density circuit board are improved, meanwhile, the lower end of the multi-step HDI high-density circuit board is attached through the radiating fins, and the radiating performance of the multi-step HDI high-density circuit board is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a novel high multi-order HDI high-density circuit board according to the present invention;
fig. 2 is a schematic diagram of the overall structure of the novel mounting and protecting device for the high-order and multi-stage HDI high-density circuit board according to the present invention;
fig. 3 is a schematic diagram of the overall structure of the corner fixing device for the novel high multi-stage HDI high-density circuit board according to the present invention;
fig. 4 is the utility model relates to a novel installation of multistage HDI high density circuit board of height schematic structure diagram.
In the figure: 1. a middle HDI circuit board; 2. installing a protection device; 3. a corner fixing device; 4. mounting means; 5. an upper HDI circuit board; 6. a lower HDI circuit board; 20. a first mounting rack; 21. a second mounting rack; 22. a spring; 23. clamping a plate; 24. a connecting frame; 25. a protection plate; 30. a support frame; 31. clamping the screw; 32. a heat sink; 33. a screw hole; 40. a first mounting plate; 41. a second mounting plate; 42. and fixing the screw.
Detailed Description
In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a novel high multistage HDI high density circuit board of height, including middle level HDI circuit board 1, upper HDI circuit board 5 is installed to 1 upper end of middle level HDI circuit board, and lower floor HDI circuit board 6 is installed to 1 lower extreme of middle level HDI circuit board, and corner fixing device 3 is installed jointly to middle level HDI circuit board 1, upper HDI circuit board 5 and 6 left ends of lower floor HDI circuit board and right-hand member, and installation protector 2 is installed jointly to 3 left ends of corner fixing device and right-hand member, and installation protector 4 is installed jointly to 2 left ends of installation protector and right-hand member.
The installation protection device 2 comprises a first installation frame 20 and a second installation frame 21, a protection plate 25 is installed at the upper ends of the first installation frame 20 and the second installation frame 21 together, a group of springs 22 are installed on the upper inner wall and the lower inner wall of the first installation frame 20 and the second installation frame 21 respectively, two opposite ends of the four groups of springs 22 are provided with clamping plates 23 respectively, connecting frames 24 are installed between every two four clamping plates 23, and the first installation frame 20 and the second installation frame 21 are installed at the left end and the right end of the corner fixing device 3 respectively through the connecting frames 24; the connecting frame 24 is H-shaped. Be H shape through two link 24 on the installation protector 2, at this moment with two link 24 propelling movement respectively into an installation frame 20 and No. two installation frames 21, spring 22 in an installation frame 20 and No. two installation frames 21 drives 23 atress contractions of cardboard, push the back completely until link 24, cardboard 23 and then press from both sides link 24 tightly, thereby fix the multistage HDI high density circuit board between two link 24, design through the spring 22 chucking, make multistage HDI high density circuit board be convenient for install and dismantle, and multistage HDI high density circuit board is after the installation, protect its upper portion through guard plate 25, and then avoid it to receive outside colliding with easily.
The corner fixing device 3 comprises a supporting frame 30, two clamping screws 31 are respectively arranged at the left part and the right part of the upper end of the supporting frame 30, a radiating fin 32 is arranged at the upper end of the supporting frame 30, two screw holes 33 are respectively arranged at the left end and the right end of the middle-layer HDI circuit board 1, the upper-layer HDI circuit board 5 and the lower-layer HDI circuit board 6, and the supporting frame 30 is arranged at the lower ends of the middle-layer HDI circuit board 1, the upper-layer HDI circuit board 5 and the lower-layer HDI circuit board 6 through the clamping screws 31; the clamping screw 31 is vertically corresponding to the screw hole 33. Chucking screw 31 through on the corner fixing device 3 is with upper HDI circuit board 5, the four corners fixed mounting of middle level HDI circuit board 1 and lower floor HDI circuit board 6 is in support frame 30, prevent upper HDI circuit board 5, middle level HDI circuit board 1 and lower floor HDI circuit board 6 receive the easy perk of corner when rocking, and then lead to the circuit board can the layering, thereby the stability and the result of use of multistage HDI high density circuit board have been improved, laminate at multistage HDI high density circuit board lower extreme through fin 32 simultaneously, and then the heat dispersion of multistage HDI high density circuit board has been improved.
It should be noted that the utility model is a novel high multi-order high density HDI circuit board, the four corners of the upper HDI circuit board 5, the middle HDI circuit board 1 and the lower HDI circuit board 6 are fixedly installed in the supporting frame 30 by the clamping screw 31 on the corner fixing device 3, the corners of the upper HDI circuit board 5, the middle HDI circuit board 1 and the lower HDI circuit board 6 are prevented from easily tilting when shaking, and the circuit boards are further layered, thereby improving the stability and the using effect of the multi-order high density HDI circuit board, and the lower end of the multi-order high density HDI circuit board is attached by the radiating fin 32, and further improving the heat dissipation performance of the multi-order high density circuit board, then the first mounting board 40 and the second mounting board 41 are fixed by the fixing screw 42 on the mounting device 4, rethread installation protector 2 is last two link 24 and is the H shape, push into two link 24 respectively this moment in an installation frame 20 and No. two installation frames 21, spring 22 in an installation frame 20 and No. two installation frames 21 drives 23 atress contractions of cardboard, push the back completely until link 24, cardboard 23 and then press from both sides link 24 tightly, thereby fix the multistage HDI high density circuit board between two link 24, design through the spring 22 chucking, make multistage HDI high density circuit board be convenient for install and dismantle, and multistage HDI high density circuit board is after the installation, protect its upper portion through guard plate 25, and then avoid it to receive outside colliding with easily.
The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a novel multistage HDI high density circuit board of height, includes middle level HDI circuit board (1), its characterized in that: upper HDI circuit board (5) are installed to middle level HDI circuit board (1) upper end, lower floor HDI circuit board (6) are installed to middle level HDI circuit board (1) lower extreme, corner fixing device (3) are installed jointly to middle level HDI circuit board (1), upper HDI circuit board (5) and lower floor HDI circuit board (6) left end and right-hand member, installation protector (2) are installed jointly to corner fixing device (3) left end and right-hand member, installation protector (2) left end and right-hand member install installation device (4) jointly.
2. The novel high multistage HDI high density circuit board of claim 1, characterized in that: installation protector (2) include mounting bracket (20) and No. two mounting brackets (21), guard plate (25) are installed jointly to mounting bracket (20) and No. two mounting brackets (21) upper ends, all install a set of spring (22), four on mounting bracket (20) and No. two mounting brackets (21) on inner wall and the lower inner wall cardboard (23) are all installed to two double-phase relative one end in spring (22), four link (24) are all installed between two liang in cardboard (23), mounting bracket (20) and No. two mounting brackets (21) are installed respectively at corner fixing device (3) left end and right-hand member through link (24).
3. The novel high multi-order HDI high density circuit board of claim 1, wherein: corner fixing device (3) are including support frame (30), two chucking screws (31) are all installed to support frame (30) upper end left part and upper end right part, fin (32) are installed to support frame (30) upper end, middle level HDI circuit board (1), upper HDI circuit board (5) and lower floor HDI circuit board (6) left end and right-hand member have all opened two screw holes (33), install at middle level HDI circuit board (1), upper HDI circuit board (5) and lower floor HDI circuit board (6) lower extreme support frame (30) through chucking screw (31).
4. The novel high multi-order HDI high density circuit board of claim 1, wherein: installation device (4) are including mounting panel (40) and No. two mounting panels (41), two fixed screws (42) are all installed to mounting panel (40) and No. two mounting panels (41) upper ends, mounting panel (40) and No. two mounting panels (41) are installed respectively at installation protector (2) left end and right-hand member.
5. The novel high multi-order HDI high density circuit board of claim 2, wherein: the connecting frame (24) is H-shaped.
6. A novel high multistage HDI high density circuit board of claim 3, characterized in that: the clamping screw (31) corresponds to the screw hole (33) up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221571900.8U CN218183586U (en) | 2022-06-22 | 2022-06-22 | Novel multistage HDI high density circuit board of height |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221571900.8U CN218183586U (en) | 2022-06-22 | 2022-06-22 | Novel multistage HDI high density circuit board of height |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218183586U true CN218183586U (en) | 2022-12-30 |
Family
ID=84608733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221571900.8U Active CN218183586U (en) | 2022-06-22 | 2022-06-22 | Novel multistage HDI high density circuit board of height |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218183586U (en) |
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2022
- 2022-06-22 CN CN202221571900.8U patent/CN218183586U/en active Active
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