CN218182187U - Chip transfer substrate and device - Google Patents
Chip transfer substrate and device Download PDFInfo
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- CN218182187U CN218182187U CN202222133431.8U CN202222133431U CN218182187U CN 218182187 U CN218182187 U CN 218182187U CN 202222133431 U CN202222133431 U CN 202222133431U CN 218182187 U CN218182187 U CN 218182187U
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Abstract
The present disclosure relates to a chip transfer substrate and an apparatus, the chip transfer substrate including a substrate; the substrate comprises a first surface and a second surface which are oppositely arranged; the first surface is used for adsorbing a chip to be transferred and comprises a magnetic electrode, and the second surface is provided with a plurality of magnetic suction units; the magnetic suction units are arranged in one-to-one correspondence with the chips to be transferred; the magnetic suction unit is used for providing magnetic force and fixedly arranging the chip to be transferred on the first surface of the substrate. According to the technical scheme provided by the embodiment of the disclosure, the chip can be prevented from overturning or translating in the chip preparation and transfer process, so that the chip to be transferred can accurately fall on the appointed position. Meanwhile, the cost of chip transfer can be effectively reduced, and the efficiency of chip transfer is improved.
Description
Technical Field
The present disclosure relates to the field of chip transfer technologies, and in particular, to a chip transfer substrate and a device.
Background
The fabrication size of Light Emitting Diodes (LEDs) tends to be more and more miniaturized. For example, micro Light Emitting Diode (Micro LED) technology or sub-millimeter Light Emitting Diode (Mini LED) technology refers to a high-density Micro-sized LED array integrated on one substrate, which can be widely applied to the fields of display screens, visible Light communication, intelligent portable devices, and the like. Due to the advantages of small volume, low power consumption, long product life and the like, the solar cell module is receiving more and more attention. How to transfer a large number of led chips to a driving substrate becomes an important technical difficulty in the chip transfer technology field.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the present disclosure provides a chip transfer substrate and an apparatus.
The present disclosure provides a chip transfer substrate, including a substrate;
the substrate comprises a first surface and a second surface which are oppositely arranged; the first surface is used for adsorbing a chip to be transferred and comprises a magnetic electrode, and the second surface is provided with a plurality of magnetic units; the magnetic suction units are arranged in one-to-one correspondence with the chips to be transferred;
the magnetic suction unit is used for providing magnetic force and fixedly arranging the chip to be transferred on the first surface of the substrate.
In some embodiments, the first surface is provided with positioning structures, and the positioning structures are arranged in one-to-one correspondence with the chips to be transferred;
the magnetic suction unit is used for fixing the chip to be transferred in the positioning structure in a suction manner.
In some embodiments, the positioning structure is provided with a groove; the groove is used for placing the chip to be transferred.
In some embodiments, the edge of the first surface is provided with a positioning mark.
In some embodiments, the magnetically attractive unit comprises an electromagnet configured to generate a magnetic force when energized.
In some embodiments, an adhesive structure is disposed on the first surface for securing the chip to be transferred to the first surface of the substrate.
In some embodiments, the bonding structure includes a plurality of bonding units, and the bonding units are arranged in one-to-one correspondence with the chips to be transferred.
In some embodiments, the magnetic attraction unit comprises a first magnetic attraction unit and a second magnetic attraction unit, and the magnetic electrode of the chip to be transferred comprises a first electrode and a second electrode;
the first magnetic suction units are arranged in one-to-one correspondence with the first electrodes; the second magnetic attraction units are arranged in one-to-one correspondence with the second electrodes.
The disclosure also provides a chip transfer device, which comprises a chip to be transferred and the chip transfer substrate provided by the disclosure.
In some embodiments, the chip to be transferred comprises a first electrode and a second electrode, and the first electrode and/or the second electrode are magnetic electrodes.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:
according to the technical scheme provided by the embodiment of the disclosure, the chip can be prevented from overturning or translating in the chip preparation and transfer process, so that the chip can accurately fall on the appointed position. Meanwhile, the cost of chip transfer can be effectively reduced, and the efficiency of chip transfer is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a chip transfer substrate according to an embodiment of the disclosure;
fig. 2 is a schematic structural diagram of another chip transfer substrate provided in the embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of another chip transfer substrate provided in the embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of another chip transfer substrate provided in the embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of another chip transfer substrate provided in an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of another chip transfer substrate provided in the embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of another chip transfer substrate provided in the embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a chip carrier substrate according to an embodiment of the disclosure;
fig. 9 is a schematic structural diagram of a chip transfer apparatus according to an embodiment of the disclosure.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
Currently, the fabrication size of LED chips tends to be more and more miniaturized, for example, micro LEDs or Mini LEDs are miniaturized, arrayed and thinned by Micro-fabrication technology. The main manufacturing process for Micro LED or Mini LED displays comprises three steps: a large number of micro-sized LED dies are prefabricated, a driving substrate is manufactured, and the LED dies are mounted on a preset position of the driving substrate one by one through a mass transfer technology.
However, in the LED process, after the LED die fabrication process is completed, millions or tens of millions of LED dies are transferred to the driving substrate accurately and efficiently, for example, in the production of Micro LEDs or Mini LEDs, millions or tens of millions of Micro-sized LED dies need to be transferred to the driving substrate accurately and efficiently, the transfer yield needs to reach 99.9999%, and for example, a display panel of a 4K tv, up to 2400 tens of thousands of LED dies may need to be transferred, so that 2400 times are required even if 1 ten thousand LED dies are transferred at a time. A Mass Transfer (Mass Transfer) technique is usually used to Transfer LED dies efficiently in large quantities. The mass transfer technique is a technique of transferring LED chips, such as Micro LED chips or Mini LED chips, formed on a wafer substrate to a driving substrate in a batch manner. In view of the importance of mass transfer technology, how to implement a mass transfer technical scheme with low process complexity, low cost and high transfer efficiency is a major technical difficulty at present.
The embodiment of the present disclosure provides a chip transfer substrate, which is used for transferring a plurality of chips, where each chip includes a magnetic electrode, fig. 1 is a schematic structural diagram of the chip transfer substrate provided by the embodiment of the present disclosure, and as shown in fig. 1, the chip transfer substrate includes a substrate 1.
The substrate 1 comprises a first surface 11 and a second surface 12 arranged opposite. The first surface 11 is used for attracting a chip to be transferred including a magnetic electrode, i.e., the chip to be transferred is provided with the magnetic electrode, and the first surface 11 can be used for attracting the chip to be transferred. The second surface 12 is provided with a plurality of magnetically attracting units 13. The magnetic units 13 are arranged in one-to-one correspondence with the chips to be transferred. The magnetic attraction unit 13 is used for providing magnetic force to fixedly arrange the chip to be transferred on the first surface 11 of the substrate 1. The magnetic unit 13 is used to provide magnetic force to the chip to be transferred, and the magnetic unit 13 can generate magnetic force with the magnetic electrode on the chip to be transferred, so that the chip to be transferred can be fixed on the first surface 11 by adsorption.
When the Micro LED or Mini LED display screen is manufactured, an LED crystal grain (LED WAFER) needs to be transferred to the substrate by using a laser lift-off technology. The laser lift-off technique is to decompose the GaN buffer layer at the GaN/sapphire interface using laser energy, thereby achieving separation of the LED dies from the chip carrier substrate, which may be a sapphire substrate, for example. Therefore, the LED crystal grains are irradiated by laser, and the LED chip to be transferred can be peeled off after the laser reacts with the chip bearing substrate. However, when the LED die is irradiated by the laser, after the laser and the chip carrier substrate act on each other, when the chip to be transferred drops, the chip to be transferred is easily turned over or translated due to the influence of the surrounding environment or the laser because the chip to be transferred has no initial guiding force, so that the chip to be transferred cannot accurately drop at the designated position. According to the technical scheme provided by the embodiment of the disclosure, the plurality of magnetic units are arranged on the second surface of the substrate and are arranged in one-to-one correspondence with the chips to be transferred, the magnetic units can provide magnetic force, and the chips to be transferred can be fixedly arranged on the first surface of the substrate under the action of the magnetic force due to the magnetic electrodes arranged on the chips to be transferred. The magnetic force between the magnetic electrode and the magnetic unit can provide a guiding force for the chip to be transferred, so that the chip to be transferred is guided to accurately fall at the designated position of the substrate, and meanwhile, the chip to be transferred can be prevented from overturning or translating. The chip transfer substrate can be applied to the occasions of transferring LED chips in batches, not only can improve the transfer efficiency, but also can reduce the cost, and has a simple structure and easy realization.
In some embodiments, the substrate 1 may be a transparent substrate. For example, the substrate 1 may be a glass substrate or a flexible transparent substrate attached on a glass substrate. For example, the substrate 1 may be made of Polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film. The disclosed embodiments do not limit the material of the substrate.
In some embodiments, the magnetic units disposed on the second surface of the substrate are arranged in rows and columns. Fig. 2 is a schematic structural view of another chip transfer substrate provided in the embodiment of the disclosure, and as shown in fig. 2, magnetic attraction units 13 disposed on the second surface 12 of the substrate are arranged in rows and columns. For example, the chips to be transferred are arranged in rows and columns on the chip bearing substrate, and the chips to be transferred and the magnetic units are arranged in a one-to-one correspondence manner.
In some embodiments, as shown in fig. 1, the first surface 11 is provided with positioning structures 14, for example, and the positioning structures 14 are arranged in one-to-one correspondence with the chips to be transferred. The magnetic units 13 are arranged in one-to-one correspondence with the chips to be transferred. I.e. the positioning structure 14 can be used for placing the chips to be transferred. The magnetic unit 13 is used for fixing the chip to be transferred in the positioning structure 14. That is, the magnetic unit 13 is used to provide magnetic force to the chip to be transferred, and the chip to be transferred can be fixed in the positioning structure 14 of the first surface 11 by the magnetic force.
The technical scheme that this disclosed embodiment provided, through be provided with location structure on the first surface at the substrate, this location structure respectively with wait to shift the chip and inhale the unit one-to-one setting of magnetism, can treat to shift the chip and provide a guiding force through the magnetic force of magnetism between the unit of magnetism and the magnetism on waiting to shift the chip like this, the guide is waited to shift the chip and is accurately dropped in the location structure that sets up on the first surface, can treat to shift the chip through location structure like this and carry out accurate location, ensure to wait to shift the assigned position department that the chip can be accurate at the substrate. Meanwhile, the chip to be transferred can be further prevented from being turned over or translated.
In some embodiments, the locating structure is provided with a recess. The groove is used for placing a chip to be transferred.
Optionally, the bottom surface of the groove provided by the positioning structure is parallel to the first surface of the substrate. As shown in fig. 1, the positioning structure 14 is provided with a groove having a quadrangular cross-sectional shape on the first surface 11 perpendicular to the substrate 1. Illustratively, as shown in fig. 1, the positioning structure 14 is, for example, a raised structure provided on the first surface 11, and a groove is provided in the raised structure.
Optionally, fig. 3 is a schematic structural diagram of another chip transfer substrate provided in the embodiment of the present disclosure, and as shown in fig. 3, the positioning structure 14 is, for example, a groove disposed in the first surface 11.
In some embodiments, the positioning structure and the substrate may be, for example, integrally formed structures.
According to the technical scheme, the positioning structure is arranged to the groove, so that the position of the chip to be transferred on the substrate can be well positioned, the chip to be transferred can be arranged in the groove, the chip to be transferred is prevented from being turned or shifted due to shaking and the like in the transferring process, and the position of the chip to be transferred on the first surface of the substrate can be further accurately positioned.
In some embodiments, the edge of the first surface of the substrate of the chip transfer substrate is provided with a positioning mark.
Because the chip to be transferred is arranged on the chip bearing substrate, after the LED crystal grains are irradiated by laser, the chip to be transferred can be peeled off after the laser and the chip bearing substrate react, and the chip to be transferred can fall at the designated position on the chip transferring substrate. The chip bearing substrate and the first surface of the substrate of the chip transfer substrate are arranged oppositely, so that when the chip to be transferred is peeled by adopting a laser peeling technology, the chip bearing substrate and the substrate of the chip transfer substrate need to be aligned to ensure that the chip to be transferred can fall at the specified position of the substrate. According to the technical scheme provided by the embodiment of the disclosure, the positioning mark is arranged on the edge of the first surface of the substrate, so that the substrate and the chip bearing substrate can be aligned well, and the chip to be transferred can be ensured to accurately fall at the specified position of the substrate.
In some embodiments, the magnetically attractive unit comprises, for example, an electromagnet configured to generate a magnetic force when energized.
According to the technical scheme provided by the embodiment of the disclosure, the magnetic attraction unit can generate magnetic force when being electrified. Therefore, the size of the magnetic force generated by the magnetic unit can be adjusted by adjusting the current flowing through the magnetic unit, so that the chip to be transferred is guided to accurately drop at the specified position of the substrate under the action of the magnetic force generated by the magnetic unit, and meanwhile, the chip to be transferred can be prevented from overturning or translating.
Alternatively, the magnetic unit may be made of a magnetic material, for example, and may generate a magnetic force having an adsorption effect on the magnetic electrode disposed on the chip to be transferred.
In some embodiments, an adhesive structure is disposed on the first surface for securing a chip to be transferred to the first surface of the substrate.
Fig. 4 is a schematic structural diagram of another chip transfer substrate provided in an embodiment of the present disclosure, and as shown in fig. 4, an adhesion structure 15 is disposed on the first surface 11, and the adhesion structure 15 is used for fixing a chip to be transferred on the first surface 11 of the substrate 1. The adhesive structure 15 is, for example, an adhesive layer provided on the first surface 11.
According to the technical scheme provided by the embodiment of the disclosure, the bonding structure is arranged on the first surface, so that the chip to be transferred can be further fixed, and the chip transfer substrate is prevented from overturning or translating the chip to be transferred in the transferring process.
Alternatively, the adhesive structure may be, for example, a removable layer of photosensitive adhesive material. The bonding structure may be, for example, a photoresist material layer, or the like. The bonding structure may be a layer of photoresist material and may be removed using a developing solution. Alternatively, the bonding structure may be a layer of photoresist material, which may be removed using a laser. Therefore, the bonding structure can be conveniently removed, and when the chip to be transferred on the chip transfer substrate needs to be transferred to the driving substrate, the bonding structure can be removed, so that the chip to be transferred can be conveniently separated from the chip transfer substrate.
For example, the photoresist material layer may comprise a material such as propylene glycol methyl ether acetate (PMA) that is removable by development. For example, the layer of photo-photoresist material may be a tie layer comprising a thermoplastic elastomer material and a tackifying resin material. The thermoplastic elastomer material may include, for example, ethylene, butadiene, styrene block copolymer, styrene, isoprene, or styrene block copolymer, the tackifying resin material may include, for example, polymerized, rosin, terpene, or synthetic resin materials, and the photo-resist material layer may be, for example, a bonding layer that is obtained by mixing the thermoplastic elastomer material and the tackifying resin material and undergoes phase change removal under light conditions.
In some embodiments, the developer may contain a low concentration of an inorganic base, such as sodium hydroxide, potassium hydroxide, sodium bicarbonate, potassium bicarbonate, or the like, or may contain a low concentration of an organic base, such as an amine compound (e.g., tetramethylammonium hydroxide, sodium methoxide, potassium ethoxide, or the like), an alkali metal salt, or an alkyllithium metal compound, or the like. For example, when the bonding structure is developed, the developing solution may be a 2.38% aqueous solution of Tetra Methyl Ammonium Hydroxide (TMAH), which is not limited in the embodiment of the disclosure.
In some embodiments, fig. 5 is a schematic structural diagram of another chip transfer substrate provided in the embodiments of the present disclosure, and as shown in fig. 5, the positioning structure 14 is, for example, a groove disposed in the first surface 11. The bonding structure 15 is for example a bonding layer provided on a groove of the first surface 11. Therefore, the positioning structure and the bonding structure are arranged on the first surface, the chip to be transferred is accurately positioned through the positioning structure, and the chip to be transferred can be accurately arranged at the specified position of the substrate. Simultaneously can also further treat through the bonding structure and shift the chip and bond fixedly, prevent to treat that the chip that shifts takes place to overturn or the translation.
In some embodiments, the bonding structure includes a plurality of bonding units, and the bonding units are arranged in one-to-one correspondence with the chips to be transferred.
Fig. 6 is a schematic structural diagram of another chip transfer substrate provided in an embodiment of the present disclosure, and as shown in fig. 6, the bonding structure includes a plurality of bonding units 151, and the bonding units 151 are disposed in one-to-one correspondence with chips to be transferred. The bonding units 151 may be arranged in rows and columns on the first surface 11, for example, and the bonding units 151 are used for fixing the chips to be transferred on the first surface 11 of the substrate 1.
Optionally, the bonding unit is disposed within the positioning structure. Fig. 7 is a schematic structural diagram of another chip transfer substrate provided in an embodiment of the disclosure, and as shown in fig. 7, for example, a positioning structure 14 is disposed on the first surface 11, and the positioning structures 14 are disposed in one-to-one correspondence with chips to be transferred. The magnetic units 13 are arranged in one-to-one correspondence with the chips to be transferred. I.e. the positioning structure 14 can be used for placing the chips to be transferred. The magnetic unit 13 is used for fixing the chip to be transferred in the positioning structure 14. That is, the magnetic unit 13 is used to provide a magnetic force to the chip to be transferred, and the chip to be transferred can be adsorbed and fixed in the positioning structure 14 of the first surface 11 by the magnetic force. The positioning structure 14 is provided with a bonding unit 151 therein, and the bonding unit 151 is arranged in one-to-one correspondence with the chip to be transferred. The positioning structure 14 is provided with a recess, in which the bonding unit 151 is arranged, for example.
According to the technical scheme provided by the embodiment of the disclosure, the bonding unit is arranged in the positioning structure. Therefore, the chip to be transferred can be accurately positioned through the positioning structure, and the chip to be transferred can be accurately arranged at the specified position of the substrate. Simultaneously can also further will treat that the chip that shifts bonds fixes in location structure through the unit that bonds, prevents to treat that the chip that shifts takes place to overturn or the translation.
In some embodiments, the magnetic unit includes a first magnetic unit and a second magnetic unit, and the magnetic electrode of the chip to be transferred includes a first electrode and a second electrode. The first magnetic units are arranged corresponding to the first electrodes one by one. The second magnetic units are arranged corresponding to the second electrodes one by one.
Fig. 8 is a schematic structural diagram of a chip carrier substrate according to an embodiment of the disclosure, and as shown in fig. 8, a plurality of chips 2 to be transferred are disposed on a chip carrier substrate 3. The chip 2 to be transferred includes a second semiconductor layer 21, a light emitting layer 22, and a first semiconductor layer 23, which are sequentially stacked. The chip 2 to be transferred also comprises a first electrode 24 and a second electrode 25, the first electrode 24 being in contact with the first semiconductor layer 23 and the second electrode 25 being in contact with the second semiconductor layer 21. Wherein the second semiconductor layer 21 of the chip 2 to be transferred is arranged on the chip carrier substrate 3. The first electrode 24 and the second electrode 25 are, for example, both magnetic electrodes of the chip 2 to be transferred.
According to the technical scheme provided by the embodiment of the disclosure, the magnetic unit comprises a first magnetic unit and a second magnetic unit, and the first magnetic unit and the first electrode are arranged in a one-to-one correspondence manner. The second magnetic units are arranged corresponding to the second electrodes one by one. Make magnetism inhale the unit like this and can provide magnetic force effect to waiting to shift the first electrode and the second electrode of chip respectively, can make magnetism inhale the unit like this and treat shifting the location of chip more accurate, ensure to wait to shift the chip and can inhale the accurate fixed setting of unit and locate at the assigned position of substrate through magnetism. And can effectively prevent the chip to be transferred from overturning or translating.
In some embodiments, the first and second electrodes may include a magnetic material having electrical conductivity, which may be, for example, iron (Fe), nickel (Ni), or a related alloy, etc.
In some embodiments, the first semiconductor layer may be a P-type semiconductor layer, and the second semiconductor layer may be an N-type semiconductor layer. Alternatively, the first semiconductor layer may be an N-type semiconductor layer, and the second semiconductor layer may be a P-type semiconductor layer.
For example, the materials of the N-type semiconductor layer and the P-type semiconductor layer may be both gallium nitride (GaN) materials. Of course, the material of the N-type semiconductor layer and the P-type semiconductor layer may also be other materials, and this is not limited herein by the embodiments of the present disclosure.
In some embodiments, the light emitting layer may be a quantum Well layer, for example, the light emitting layer may be a Multiple Quantum Well (MQW) layer.
For example, the material of the light emitting layer may be gallium nitride (GaN). Here, the embodiment of the present disclosure does not limit this.
The embodiment of the disclosure further provides a chip transfer device, which includes a chip to be transferred and the chip transfer substrate provided by the embodiment of the disclosure, and has the same or corresponding beneficial effects, and in order to avoid repetition, the details are not repeated herein.
Fig. 9 is a schematic structural diagram of a chip transfer apparatus provided in an embodiment of the present disclosure, and as shown in fig. 9, the chip transfer apparatus includes a chip carrier substrate 3, a chip 2 to be transferred, and a substrate 1 of the chip transfer substrate. The chip 2 to be transferred is disposed on the chip carrier substrate 3. The side of the chip carrier substrate 3 on which the chip 2 is to be transferred is arranged opposite the first surface 11 of the substrate 1 of the chip transfer substrate.
When the chip 2 to be transferred is transferred onto the substrate by using the laser lift-off technology, the LED die is irradiated by using laser, and after the laser reacts with the chip carrier substrate, the chip 2 to be transferred falls onto the first surface 11 of the substrate 1 along a direction perpendicular to the substrate 1, that is, the chip 2 to be transferred falls onto the first surface 11 of the substrate 1 along a direction of an arrow shown in fig. 9. According to the technical scheme provided by the embodiment of the disclosure, the second surface 12 of the substrate 1 is provided with the plurality of magnetic units 13, the magnetic units 13 are arranged in one-to-one correspondence with the chips 2 to be transferred, the magnetic units 13 can provide magnetic force, and the chips 2 to be transferred can be fixedly arranged on the first surface 11 of the substrate 1 under the action of the magnetic force due to the magnetic electrodes arranged on the chips 2 to be transferred. The magnetic force between the magnetic electrode and the magnetic unit 13 can provide a guiding force for the chip 2 to be transferred, so as to guide the chip 2 to be transferred to accurately fall at the designated position of the substrate 1, and simultaneously prevent the chip 2 to be transferred from turning over or translating.
Alternatively, the material of the chip carrier substrate may be, for example, a sapphire substrate whose main component is one or more materials of aluminum oxide (Al 2O 3), silicon carbide (SiC), single crystal silicon (Si), gallium nitride (GaN), gallium arsenide (GaAs), aluminum nitride (AlN), and zinc oxide (ZnO). Of course, besides the materials listed above, the material of the chip carrier substrate may be other materials such as gallium phosphide (GaP), which is not limited in the embodiments of the present disclosure.
In some embodiments, the chip to be transferred comprises a first electrode and a second electrode, the first electrode and/or the second electrode being magnetic electrodes.
Alternatively, referring to the structure shown in fig. 8, a plurality of chips 2 to be transferred are disposed on the chip carrier substrate 3. The chip 2 to be transferred includes a second semiconductor layer 21, a light emitting layer 22, and a first semiconductor layer 23, which are sequentially stacked. The chip to be transferred further comprises a first electrode 24 and a second electrode 25, the first electrode 24 being in contact with the first semiconductor layer 23 and the second electrode 25 being in contact with the second semiconductor layer 21. Wherein the second semiconductor layer 21 of the chip 2 to be transferred is arranged on the chip carrier substrate 3. The first electrode 24 and/or the second electrode 25 are magnetic electrodes.
In some embodiments, the chip to be transferred is a Light Emitting Diode (LED) chip. The LED chip is, for example, a Micro LED chip or a Mini LED chip.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
The previous description is only for the purpose of describing particular embodiments of the present disclosure, so as to enable those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A chip transfer substrate is characterized by comprising a substrate;
the substrate comprises a first surface and a second surface which are oppositely arranged; the first surface is used for adsorbing a chip to be transferred and comprises a magnetic electrode, and the second surface is provided with a plurality of magnetic units; the magnetic suction units are arranged in one-to-one correspondence with the chips to be transferred;
the magnetic suction unit is used for providing magnetic force and fixedly arranging the chip to be transferred on the first surface of the substrate.
2. The chip transfer substrate according to claim 1, wherein the first surface is provided with positioning structures, and the positioning structures are arranged in one-to-one correspondence with the chips to be transferred;
the magnetic suction unit is used for fixing the chip to be transferred in the positioning structure in a suction manner.
3. The chip transfer substrate according to claim 2, wherein the positioning structure is provided with a groove; the groove is used for placing the chip to be transferred.
4. The chip transfer substrate according to claim 1, wherein an edge of the first surface is provided with a positioning mark.
5. The chip transfer substrate according to claim 1, wherein the magnetic attracting unit comprises an electromagnet configured to generate a magnetic force when energized.
6. The chip transfer substrate according to claim 1, wherein an adhesive structure is disposed on the first surface for fixing the chip to be transferred on the first surface of the substrate.
7. The chip transfer substrate according to claim 6, wherein the bonding structure comprises a plurality of bonding units, and the bonding units are arranged in one-to-one correspondence with the chips to be transferred.
8. The chip transfer substrate according to claim 1, wherein the magnetic unit comprises a first magnetic unit and a second magnetic unit, and the magnetic electrode of the chip to be transferred comprises a first electrode and a second electrode;
the first magnetic suction units are arranged in one-to-one correspondence with the first electrodes; the second magnetic suction units are arranged in one-to-one correspondence with the second electrodes.
9. A chip transfer apparatus comprising a chip to be transferred and the chip transfer substrate according to any one of claims 1 to 8.
10. The chip transfer device according to claim 9, wherein the chip to be transferred comprises a first electrode and a second electrode, and the first electrode and/or the second electrode is a magnetic electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222133431.8U CN218182187U (en) | 2022-08-12 | 2022-08-12 | Chip transfer substrate and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222133431.8U CN218182187U (en) | 2022-08-12 | 2022-08-12 | Chip transfer substrate and device |
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| CN218182187U true CN218182187U (en) | 2022-12-30 |
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| CN202222133431.8U Active CN218182187U (en) | 2022-08-12 | 2022-08-12 | Chip transfer substrate and device |
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