CN218170966U

CN218170966U - Semiconductor wafer cutting device

Info

Publication number: CN218170966U
Application number: CN202222254142.3U
Authority: CN
Inventors: 殷泽安
Original assignee: Suzhou Yipinxin Semiconductor Co ltd
Current assignee: Suzhou Yipinxin Semiconductor Co ltd
Priority date: 2022-08-26
Filing date: 2022-08-26
Publication date: 2022-12-30
Anticipated expiration: 2032-08-26

Abstract

The utility model discloses a semiconductor wafer cutting device, comprises an operation bench, the operation panel top is equipped with protector, protector includes first spacing groove, protection casing, second spacing groove, slider, third spacing groove and guard plate, first spacing groove has been seted up at the operation panel top, the welding of operation panel top has the protection casing, the second spacing groove has been seted up to protection casing inner wall bilateral symmetry, second spacing inslot wall sliding connection has the slider, the welding of slider one side has the guard plate, the protection casing top is run through and has been seted up the third spacing groove, the guard plate runs through the third spacing groove, and the gomphosis that slides is at first spacing inslot, and this semiconductor wafer cutting device when carrying out cutting work to semiconductor wafer, can keep apart, protect the cutting cover effectively, and carry out effectual dust fall work to its inside, has ensured that operating personnel on the side can not inhale into health when the cutting, safety more.

Description

Semiconductor wafer cutting device

Technical Field

The utility model relates to a semiconductor wafer processing technology field specifically is a semiconductor wafer cutting device.

Background

Through retrieval, chinese patent with grant number CN 210850879U discloses a semiconductor wafer cutting device, including base, first fixed plate and second fixed plate, the base top is equipped with first fixed plate, second fixed plate and water tank, the top of base and the bottom of first fixed plate are connected, first fixed plate one side is equipped with the spout, be equipped with the slider in the spout, the one side that the spout was kept away from to the slider is equipped with the head rod, head rod one end is equipped with the second connecting rod, the top that the one end of head rod was kept away from to the second connecting rod is equipped with the motor, the motor bottom is equipped with the pivot, the pivot bottom is equipped with diamond cutter, the base top is connected with the bottom of second fixed plate, second fixed plate one side is equipped with places the board, the one end that the second fixed plate was kept away from to placing the board is equipped with the locating hole.

The above patents suffer from the following disadvantages:

the existing semiconductor wafer cutting device is single in structure, when a semiconductor wafer is cut, a large amount of dust can be generated, and when an operator carries out long-time cutting work beside the semiconductor wafer, the operator can suck a large amount of dust, so that physical damage is caused, economic loss is caused, and the environment is polluted.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a semiconductor wafer cutting device, the problem of proposing in the background art has been solved to the not enough of prior art.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a semiconductor wafer cutting device, comprises an operation bench, the operation panel top is equipped with protector, protector includes first spacing groove, protection casing, second spacing groove, slider, third spacing groove and guard plate, first spacing groove has been seted up at the operation panel top, the welding of operation panel top has the protection casing, the second spacing groove has been seted up to protection casing inner wall bilateral symmetry, second spacing inslot wall sliding connection has the slider, the welding of slider one side has the guard plate, the protection casing top is run through and has been seted up the third spacing groove, the guard plate runs through the third spacing groove, and the gomphosis of just sliding is at first spacing inslot.

Preferably, the welding of operation panel top has the support frame, the operation panel top is equipped with cutting fixing device, cutting fixing device includes cutting bed, limiting plate, spacing hole, motor case, motor, connecting block, connecting rod and cutting blade.

Preferably, the cutting table is fixedly mounted at the top of the operating table, a limiting plate is welded at the top of the cutting table, and a limiting hole is formed in the top of the limiting plate in a penetrating mode.

Preferably, support frame bottom fixed mounting has a motor case, the inside motor that is equipped with of motor case, there is the connecting block motor bottom through output shaft connection, connecting block bottom threaded connection has the connecting rod, the welding of connecting rod bottom has cutting blade.

Preferably, the support frame top is equipped with dust device, dust device includes header tank, conveyer pipe, pressure pipe, mount, branch pipe and shower nozzle, support frame top symmetric welding has the mount, be equipped with the pressure pipe in the mount, the pressure pipe runs through the protection casing.

Preferably, the conveying pipe is connected to one side of the pressure pipe in a nested mode, one side of the conveying pipe extends into the water collecting tank, the water collecting tank is fixedly installed on the outer wall of the protective cover, the outer wall of the pressure pipe is symmetrically connected with the branch pipes in a transverse nested mode, and the outer wall of each branch pipe is connected with the spray head in a threaded mode.

(III) advantageous effects

The utility model provides a semiconductor wafer cutting device. The method has the following beneficial effects:

this semiconductor wafer cutting device, setting through protector and dust device, the structure and the function of current semiconductor wafer cutting device have been increased, make it when carrying out cutting operation to semiconductor wafer, can keep apart the cutting cover effectively, the protection, and carry out effectual dust fall work to its inside, it can not inhale into the health to have ensured one side operating personnel when the cutting, safety more, simultaneously can carry out effectual dust fall processing work to the dust in the protection casing fast, semiconductor wafer after having ensured will cutting takes out can not have the dust to spill the polluted environment.

Drawings

Fig. 1 is a schematic overall structure diagram of the present invention;

FIG. 2 is a schematic structural view of the knot cutting and fixing device of the present invention;

fig. 3 is a schematic structural view of the dust falling device of the present invention;

fig. 4 is a schematic structural view of the protection device of the present invention.

In the figure, 1, an operation table; 2. a support frame; 3. cutting and fixing devices; 31. cutting the table; 32. a limiting plate; 33. a limiting hole; 34. a motor case; 35. a motor; 36. connecting blocks; 37. a connecting rod; 38. a cutting blade; 4. a dust falling device; 41. a water collection tank; 42. a delivery pipe; 43. a pressure pipe; 44. a fixed mount; 45. a branch pipe; 46. a spray head; 5. a guard device; 51. a first limit groove; 52. a protective cover; 53. a second limit groove; 54. a slider; 55. a third limiting groove; 56. and (4) a protective plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, an embodiment of the present invention provides a technical solution: the utility model provides a semiconductor wafer cutting device, includes

operation panel

1, 1 top of operation panel is equipped with protector 5, protector 5 includes first spacing groove 51, protection casing 52, second spacing groove 53, slider 54, third spacing groove 55 and guard plate 56, first spacing groove 51 has been seted up at 1 top of operation panel, the welding of 1 top of operation panel has protection casing 52, second spacing groove 53 has been seted up to protection casing 52 inner wall bilateral symmetry, second spacing groove 53 inner wall sliding connection has slider 54, the welding of slider 54 one side has guard plate 56, third spacing groove 55 has been run through at protection casing 52 top, guard plate 56 runs through third spacing groove 55, and the gomphosis of just sliding is in first spacing groove 51.

Through the setting of protector 5, increased current semiconductor wafer cutting device's structure and function, make it when carrying out cutting work to semiconductor wafer, can keep apart, protect the cutting sleeve effectively, ensured that operating personnel on one side can not inhale into the health when the cutting, more safety.

The welding of 1 top of operation panel has

support frame

2, 1 top of operation panel is equipped with cutting fixing device 3, cutting fixing device 3 includes cutting bed 31, limiting plate 32, spacing hole 33, motor case 34, motor 35, connecting block 36, connecting rod 37 and

cutting blade

38, 1 top fixed mounting of operation panel has cutting bed 31, the welding of cutting bed 31 top has limiting plate 32, limiting plate 32 top is run through and has been seted up spacing hole 33.

Through the arrangement of the limiting plate 32 and the limiting hole 33, the semiconductor wafer on the cutting table 31 can be effectively limited and fixed, and can be indicated, so that the cutting blade 38 can be conveniently and better cut.

2 bottom fixed mounting of support frame has motor case 34, motor case 34 is inside to be equipped with motor 35, there is connecting block 36 motor 35 bottom through output shaft, connecting block 36 bottom threaded connection has connecting rod 37, the welding of connecting rod 37 bottom has cutting blade 38.

The motor rotates through the output shaft drive connecting block 36 of bottom, and connecting block 36 drives connecting rod 37 and the cutting blade 38 of bottom and rotates to the realization is to the cutting effect of semiconductor wafer, through connecting block 36 and connecting rod 37's setting, makes the installation in motor 35 bottom of its cutting blade 38 activity, conveniently when cutting blade 38 takes place to damage, can change with ground, ensures the cutting work of semiconductor wafer.

2 tops of support frame are equipped with dust device 4, dust device 4 includes header tank 41, conveyer pipe 42, pressure pipe 43, mount 44, branch pipe 45 and

shower nozzle

46, 2 top symmetrical welding of support frame have mount 44, be equipped with pressure pipe 43 in the mount 44, pressure pipe 43 runs through protection casing 52, pressure pipe 43 one side nested connection has conveyer pipe 42, inside header tank 41 was stretched into to conveyer pipe 42 one side, header tank 41 fixed mounting is in the 52 outer wall of protection casing, the horizontal nested connection of pressure pipe 43 outer wall symmetry has branch pipe 45, branch pipe 45 outer wall threaded connection has shower nozzle 46.

Through the setting of conveyer pipe 42 and pressure pipe 43, in extracting branch pipe 45 with the water in the header tank 41 effectively, stay shower nozzle 46 department through branch pipe 45, can carry out effectual dust fall processing work to the dust in the protection casing 52 fast, ensured that can not have the dust to fly out the polluted environment when taking out the semiconductor wafer after will cutting, through the setting of header tank 41, can ensure the sufficiency of water source, can fully carry out dust fall processing work to the dust in the protection casing 52.

The working principle is as follows: during the use, firstly through the setting of limiting plate 32 and spacing hole 33, can carry out effectual spacing and fixed to the semiconductor wafer on the cutting platform 31 effectively, and instruct, make things convenient for cutting blade 38 to cut better, secondly the motor passes through the output shaft drive connecting block 36 rotation of bottom, connecting block 36 drives connecting rod 37 and the cutting blade 38 of bottom and rotates, thereby realize the cutting effect to semiconductor wafer, and through the setting of connecting block 36 and connecting rod 37, make its cutting blade 38 activity install in motor 35 bottom, conveniently when cutting blade 38 takes place the damage, can and ground change, ensure the cutting work of semiconductor wafer, through the setting of protection casing 52 and protection plate 46, make it when cutting work to semiconductor wafer, can keep apart the cutting cover effectively, the protection, it can not inhale into the health when cutting to have ensured one-side operating personnel, more safety, then through the setting of conveyer pipe 42 and manometer pipe 43, water in the collection water tank 41 is effectively extracted to branch pipe 45, leave shower nozzle 46 department through branch pipe 45, can carry out effectual dust processing work to the dust in the protection casing 52 fast, ensured that the dust can not carry out through the dust pollution of the collection water source when cutting good, can fully carry out through the collection water source dust processing dust, it can carry out the dust through the collection water pollution of dust processing to the dust collection tank.

The utility model discloses 1, operation panel; 2. a support frame; 3. cutting and fixing devices; 31. cutting table; 32. a limiting plate; 33. a limiting hole; 34. a motor case; 35. a motor; 36. connecting blocks; 37. a connecting rod; 38. a cutting blade; 4. a dust falling device; 41. a water collection tank; 42. a delivery pipe; 43. a pressure pipe; 44. a fixed mount; 45. a branch pipe; 46. a spray head; 5. a guard; 51. a first limit groove; 52. a protective cover; 53. a second limit groove; 54. a slider; 55. a third limiting groove; 56. the protective plates, the parts are all universal standard parts or parts known to those skilled in the art, and the structure and principle of the protective plates and the parts are known to those skilled in the art through technical manuals or through routine experimental methods.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.

Claims

1. A semiconductor wafer dicing apparatus, characterized in that: including operation panel (1), operation panel (1) top is equipped with protector (5), protector (5) include first spacing groove (51), protection casing (52), second spacing groove (53), slider (54), third spacing groove (55) and guard plate (56), first spacing groove (51) have been seted up at operation panel (1) top, operation panel (1) top welding has protection casing (52), second spacing groove (53) have been seted up to protection casing (52) inner wall bilateral symmetry, second spacing groove (53) inner wall sliding connection has slider (54), slider (54) one side welding has guard plate (56), third spacing groove (55) have been run through at protection casing (52) top, guard plate (56) run through third spacing groove (55), and the gomphosis that slides is in first spacing groove (51).

2. The semiconductor wafer dicing apparatus according to claim 1, wherein: the welding of operation panel (1) top has support frame (2), operation panel (1) top is equipped with cutting fixing device (3), cutting fixing device (3) are including cutting bed (31), limiting plate (32), spacing hole (33), motor case (34), motor (35), connecting block (36), connecting rod (37) and cutting blade (38).

3. The semiconductor wafer dicing apparatus according to claim 2, wherein: operating panel (1) top fixed mounting has cutting bed (31), cutting bed (31) top welding has limiting plate (32), limiting plate (32) top is run through and has been seted up spacing hole (33).

4. The semiconductor wafer dicing apparatus according to claim 2, wherein: support frame (2) bottom fixed mounting has motor case (34), inside motor (35) that is equipped with of motor case (34), there is connecting block (36) motor (35) bottom through output shaft connection, connecting block (36) bottom threaded connection has connecting rod (37), the welding of connecting rod (37) bottom has cutting blade (38).

5. The semiconductor wafer dicing apparatus according to claim 2, wherein: support frame (2) top is equipped with dust device (4), dust device (4) include header tank (41), conveyer pipe (42), pressure pipe (43), mount (44), branch pipe (45) and shower nozzle (46), support frame (2) top symmetric welding has mount (44), be equipped with pressure pipe (43) in mount (44), protection casing (52) is run through in pressure pipe (43).

6. The semiconductor wafer dicing apparatus according to claim 5, wherein: the utility model discloses a pressure pipe (43) and water header, including delivery pipe (42), delivery pipe (42) one side nested connection have conveyer pipe (42), inside delivery pipe (42) one side stretched into header tank (41), header tank (41) fixed mounting is in protection casing (52) outer wall, the horizontal nested connection of pressure pipe (43) outer wall symmetry has branch pipe (45), branch pipe (45) outer wall threaded connection has shower nozzle (46).