CN218162974U - Mixed-voltage high-frequency microwave multilayer circuit board - Google Patents
Mixed-voltage high-frequency microwave multilayer circuit board Download PDFInfo
- Publication number
- CN218162974U CN218162974U CN202120492787.3U CN202120492787U CN218162974U CN 218162974 U CN218162974 U CN 218162974U CN 202120492787 U CN202120492787 U CN 202120492787U CN 218162974 U CN218162974 U CN 218162974U
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- Prior art keywords
- lower substrate
- mixed
- upper substrate
- frequency microwave
- microwave multilayer
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- 239000000758 substrate Substances 0.000 claims abstract description 89
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 12
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 12
- 239000004744 fabric Substances 0.000 claims abstract description 9
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 7
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 238000007906 compression Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 26
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A mixed-voltage high-frequency microwave multilayer circuit board comprises a lower substrate, an upper substrate positioned above the lower substrate and a bonding layer for connecting the lower substrate and the upper substrate; the lower substrate and the upper substrate are made of polytetrafluoroethylene glass fiber cloth; the bonding layer is a thermoplastic bonding film with the thickness of 35-40 microns; the top surface of the upper substrate is provided with a first copper layer, the top surface of the lower substrate is provided with a second copper layer, and the bottom surface of the lower substrate is provided with a third copper layer. Thus, the high-frequency loss is small, and electronic components and external leads are convenient to mount.
Description
Technical Field
The utility model relates to a high frequency circuit board product technical field, especially a thoughtlessly press high frequency microwave multilayer circuit board.
Background
According to statistics of engineering technicians in an authoritative electronic circuit industry, in the design of an integrated circuit, the resistance accounts for about 30%, the capacitance accounts for about 40%, and other components account for about 30% in total. Because the resistor and the capacitor occupy most of components, the trouble is added to the assembly and connection process of the printed board, such as plug-in mounting and surface mounting process. In addition, if resistors are placed on the surface of the circuit board and connected to the circuit by wires, the complexity of the circuit is greatly increased and the performance of the circuit is degraded.
The substrate of the existing high-frequency microwave multilayer circuit board adopts polytetrafluoroethylene glass fiber cloth, the bonding layer is an epoxy resin bonding sheet, and the epoxy resin bonding sheet is thermosetting resin. The node constant of the epoxy resin bonding sheet is greatly different from that of polytetrafluoroethylene glass fiber cloth, so that high-frequency loss is large. In addition, the existing electronic components are embedded and are inconvenient to install, and external leads are troublesome.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a mixed pressure high frequency microwave multilayer circuit board that high frequency loss is little, be convenient for install electronic components and external lead wire to solve above-mentioned problem.
A mixed-voltage high-frequency microwave multilayer circuit board comprises a lower substrate, an upper substrate positioned above the lower substrate and a bonding layer for connecting the lower substrate and the upper substrate; the lower substrate and the upper substrate are made of polytetrafluoroethylene glass fiber cloth; the bonding layer is a thermoplastic bonding film with the thickness of 35-40 microns; the top surface of the upper substrate is provided with a first copper layer, the top surface of the lower substrate is provided with a second copper layer, and the bottom surface of the lower substrate is provided with a third copper layer.
Furthermore, a step groove is concavely arranged on the side edge of the upper substrate, and the second copper layer protrudes out of the step groove to form an external terminal.
Furthermore, the middle part of the upper substrate is provided with a plurality of mounting grooves, and the second copper layer protrudes out of the mounting grooves to form an internal connection terminal.
Furthermore, a plurality of through holes are formed in the mixed-compression high-frequency microwave multilayer circuit board, and the diameter of the inner side wall of the part, penetrating through the upper substrate, of the through hole is gradually increased from the position close to the lower substrate to the position far away from the lower substrate, so that a counter bore is formed.
Further, the adhesive layer is a polyimide film.
Further, the dielectric constant of the thermoplastic bonding film is 2.35.
Further, the thermoplastic adhesive film had a high frequency loss of 0.0025.
Compared with the prior art, the mixed-pressure high-frequency microwave multilayer circuit board comprises a lower substrate, an upper substrate positioned above the lower substrate and a bonding layer for connecting the lower substrate and the upper substrate; the lower substrate and the upper substrate are made of polytetrafluoroethylene glass fiber cloth; the bonding layer is a thermoplastic bonding film with the thickness of 35-40 microns; the top surface of the upper substrate is provided with a first copper layer, the top surface of the lower substrate is provided with a second copper layer, and the bottom surface of the lower substrate is provided with a third copper layer. Thus, the high-frequency loss is small, and electronic components and external leads are convenient to mount.
Drawings
Embodiments of the present invention are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic top view of the mixed-voltage high-frequency microwave multilayer circuit board provided by the present invention.
Fig. 2 is a schematic partial perspective view of the mixed-voltage high-frequency microwave multilayer circuit board provided by the present invention.
Fig. 3 is a schematic side view of the mixed-voltage high-frequency microwave multilayer circuit board provided by the present invention.
Fig. 4 is a schematic diagram of a conventional press-fitting method.
Fig. 5 is a press-fit schematic diagram of the mixed-pressure high-frequency microwave multilayer circuit board provided by the utility model.
Detailed Description
The following describes in further detail specific embodiments of the present invention based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 to 3, the mixed-voltage high-frequency microwave multilayer circuit board of the present invention includes a lower substrate 10, an upper substrate 20 located above the lower substrate 10, and a bonding layer 30 connecting the lower substrate 10 and the upper substrate 20.
The lower substrate 10 and the upper substrate 20 are made of teflon glass cloth. The adhesive layer 30 is a thermoplastic adhesive film such as a polyimide film. The dielectric constant of the thermoplastic bonding film is 2.35, which is similar to that of polytetrafluoroethylene fiberglass cloth, the high-frequency loss of the thermoplastic bonding film is 0.0025, the thickness is 35-40 microns, and the high-frequency loss is small because the thickness is 38 microns.
The top surface of the upper substrate 20 is provided with a first copper layer 41, the top surface of the lower substrate 10 is provided with a second copper layer 42, and the bottom surface of the lower substrate 10 is provided with a third copper layer 43.
The side of the upper substrate 20 is recessed to form a step groove 21, and the second copper layer 42 protrudes from the step groove 21 to form an external connection terminal 421.
The middle part of the upper substrate 20 is provided with a plurality of mounting grooves 22, the second copper layer 42 protrudes out of the mounting grooves 22 to form an internal terminal 422, and electronic components, such as resistors, capacitors and the like, are arranged in the mounting grooves 22, so that pins of the electronic components are in contact with the internal terminal 422, and the electronic components are embedded in the mounting grooves 22. Thus, the electronic components and the external leads are convenient to install.
The circuitry is formed on the second copper layer 42 by means of etching.
The utility model provides a mix and press still seted up a plurality of through-holes 50 on the high frequency microwave multilayer circuit board, the diameter of the inside wall of the part that through-hole 50 passed upper substrate 20 is from the position that is close to infrabasal plate 10 to the position crescent of keeping away from infrabasal plate 10, forms counter bore 51, counter bore 51 be used for with the screw cooperation that passes through-hole 50.
In the production process of the mixed-compression high-frequency microwave multilayer circuit board, pressing is needed. Referring to fig. 4, the conventional pressing method is: the upper substrate 20 is placed on a rigid pad 70, and the pressing structure presses the lower substrate 10 downward, so that the lower substrate 10, the adhesive layer 30 and the upper substrate 20 are pressed together. In this bonding method, since the circuit is laid out through the second copper layer 42, a void inevitably exists in a portion where the circuit exists, and a delamination phenomenon is likely to occur between the lower substrate 10 and the upper substrate 20 after a long time.
Referring to fig. 5, the pressing industry of the mixed-pressure high-frequency microwave multilayer circuit board provided by the present invention includes the following steps:
step S1: placing a silicone pad 80 on the rigid backing plate 70;
step S2: placing the upper substrate 20 with the adhesive layer 30 coated on one side upward on the silicone pad 80;
and step S3: covering the lower substrate 10 on the upper substrate 20;
and step S4: the lower substrate 10 is pressed downward by the pressing structure, so that the lower substrate 10, the adhesive layer 30 and the upper substrate 20 are pressed together. Due to the buffering effect of the silicone pad 80, the upper substrate 20 bends and deforms downward to protrude at the portion where the circuit exists, so as to form the circuit protruding portion 60, so that the lower substrate 10 and the upper substrate 20 are tightly combined, the connection strength is high, and the phenomena of void and delamination are avoided.
Compared with the prior art, the mixed-compression high-frequency microwave multilayer circuit board comprises a lower substrate 10, an upper substrate 20 positioned above the lower substrate 10 and a bonding layer 30 connecting the lower substrate 10 and the upper substrate 20; the lower substrate 10 and the upper substrate 20 are made of teflon glass cloth; the bonding layer 30 is a thermoplastic bonding film with the thickness of 35-40 microns; the top surface of the upper substrate 20 is provided with a first copper layer 41, the top surface of the lower substrate 10 is provided with a second copper layer 42, and the bottom surface of the lower substrate 10 is provided with a third copper layer 43. Thus, the high-frequency loss is small, and electronic components and external leads are convenient to mount.
The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.
Claims (7)
1. A mixed-voltage high-frequency microwave multilayer circuit board is characterized in that: comprises a lower substrate, an upper substrate positioned above the lower substrate and a bonding layer for connecting the lower substrate and the upper substrate; the lower substrate and the upper substrate are made of polytetrafluoroethylene glass fiber cloth; the bonding layer is a thermoplastic bonding film with the thickness of 35-40 microns; the top surface of the upper substrate is provided with a first copper layer, the top surface of the lower substrate is provided with a second copper layer, and the bottom surface of the lower substrate is provided with a third copper layer.
2. The mixed-voltage high-frequency microwave multilayer wiring board according to claim 1, characterized in that: and a step groove is concavely arranged on the side edge of the upper substrate, and the second copper layer protrudes from the step groove to form an external terminal.
3. The mixed-voltage high-frequency microwave multilayer wiring board according to claim 1, characterized in that: a plurality of mounting grooves are formed in the middle of the upper substrate, and the second copper layer protrudes out of the mounting grooves to form the internal connection terminal.
4. The mixed-voltage high-frequency microwave multilayer wiring board according to claim 1, characterized in that: the mixed-compression high-frequency microwave multilayer circuit board is also provided with a plurality of through holes, and the diameter of the inner side wall of the part of the through hole penetrating through the upper substrate is gradually increased from the position close to the lower substrate to the position far away from the lower substrate to form a counter bore.
5. The mixed-voltage high-frequency microwave multilayer wiring board according to claim 1, characterized in that: the bonding layer is a polyimide film.
6. The mixed-voltage high-frequency microwave multilayer wiring board according to claim 1, characterized in that: the dielectric constant of the thermoplastic bonding film is 2.35.
7. The mixed-voltage high-frequency microwave multilayer wiring board according to claim 1, characterized in that: the high frequency loss of the thermoplastic bonding film was 0.0025.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120492787.3U CN218162974U (en) | 2021-03-08 | 2021-03-08 | Mixed-voltage high-frequency microwave multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120492787.3U CN218162974U (en) | 2021-03-08 | 2021-03-08 | Mixed-voltage high-frequency microwave multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218162974U true CN218162974U (en) | 2022-12-27 |
Family
ID=84548552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120492787.3U Active CN218162974U (en) | 2021-03-08 | 2021-03-08 | Mixed-voltage high-frequency microwave multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218162974U (en) |
-
2021
- 2021-03-08 CN CN202120492787.3U patent/CN218162974U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 314100 beihuanqiao Development Zone, ganyao Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee after: Zhejiang Wanzheng Electronic Technology Co.,Ltd. Address before: 314100 beihuanqiao Development Zone, ganyao Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG WANZHENG ELECTRONICS SCIENCE AND TECHNOLOGY Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Mixed voltage high-frequency microwave multilayer circuit board Effective date of registration: 20231222 Granted publication date: 20221227 Pledgee: Agricultural Bank of China Limited Zhejiang Yangtze River Delta integration demonstration zone sub branch Pledgor: Zhejiang Wanzheng Electronic Technology Co.,Ltd. Registration number: Y2023980072921 |