CN218160437U

CN218160437U - High-heat-dissipation LED packaging structure

Info

Publication number: CN218160437U
Application number: CN202222452133.5U
Authority: CN
Inventors: 田钦; 张大梅; 张文生; 曾露露; 杜春芳; 张惠玉; 李英华
Original assignee: Shenzhen Xinguangtai Electronic Technology Co ltd
Current assignee: Shenzhen Xinguangtai Electronic Technology Co ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2022-12-27
Anticipated expiration: 2032-09-15

Abstract

The utility model relates to a LED encapsulates technical field, especially relates to a high radiating LED packaging structure, including lens, lens lower extreme circumference equidistance fixed mounting has four screw rods, four slidable mounting has sealed the pad between the screw rod upper segment circumferential surface, sealed pad is located lens lower extreme and laminating, four slidable mounting has the metal to sink between the screw rod interlude circumferential surface, the annular groove has been seted up to the metal on the heat sink. The utility model discloses an at the heat sink lower extreme installation heating panel of metal to and the fin has been installed to the heating panel lower extreme, make the heat that the chip during operation produced can transmit for the heating panel through the heat sink of metal, transmit for the fin, and the partly and external mobile air contact of fin, the heat dissipation of fin has been accelerated, and the heating panel can be separated and the joint through rotatory pull rod realization with the heat sink of metal, when making to coat heat conduction silicone grease between heating panel and the heat sink of metal, can be very convenient.

Description

High-heat-dissipation LED packaging structure

Technical Field

The utility model relates to a LED encapsulates technical field, especially relates to a high radiating LED packaging structure.

Background

The LED is also called a light emitting diode, is a common light emitting device, can convert electric energy into light energy, adopts a solid semiconductor chip as a light emitting material, and has the characteristics of high electro-optic conversion efficiency, long service life, high brightness and less heat generation.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides a high radiating LED packaging structure, including lens, lens lower extreme circumference equidistance fixed mounting has four screws, four slidable mounting has sealed the pad between the screw rod upper segment circumference surface, sealed pad is located lens lower extreme and laminating, four slidable mounting has the metal heat sink between the screw rod interlude circumference surface, the annular groove has been seted up to metal heat sink upper end, lens lower extreme and sealed pad all are located the annular inslot and the laminating that the metal heat sink was seted up, four slidable mounting has the circle case between the screw rod hypomere circumference surface, the circle case is located the metal heat sink lower extreme and laminates, the inside heat dissipation chamber of having seted up of circle case, the heat dissipation intracavity wall bottom that the circle case was seted up runs through and has seted up a plurality of sliding holes, four the equal threaded mounting in screw rod hypomere circumference surface has the nut, four the nut all is located circle case lower extreme and laminates, metal heat sink upper end fixed mounting has the chip, metal heat sink lower extreme is fixed has two rectangular plates, two the rectangular plate side all runs through has seted up the rectangular hole.

In order to solve the technical problem, the utility model provides a following technical scheme:

as an optimal technical scheme of the utility model, two the rectangular plate lower extreme all alternates to rotate and installs the pull rod.

As an optimal technical scheme of the utility model, two the equal fixed mounting in pull rod upper end has the clamp plate.

As a preferred technical scheme of the utility model, two the equal activity in pull rod circumferential surface has cup jointed the spring, two the spring is fixed mounting respectively and is offered between the rectangle downthehole wall at two clamp plates and rectangular plate.

As a preferred technical scheme of the utility model, the activity of the heat sink lower extreme of metal is provided with the heating panel, heating panel upper end both sides all run through and have seted up two through-holes, the heating panel is through two through-hole slidable mounting who sets up at two rectangular plate surfaces.

As a preferred technical scheme of the utility model, the heating panel lower extreme is equipped with a plurality of groups of fin, the fin of heating panel lower extreme all alternates slidable mounting and offers the slide hole at the round box in.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

1. this high radiating LED packaging structure, through at the heat sink lower extreme installation heating panel of metal, and the fin has been installed to the heating panel lower extreme, make the heat that the chip during operation produced can transmit for the heating panel through the heat sink of metal, transmitting for the fin, and a part of fin and external mobile air contact, the heat dissipation of fin has been accelerated, and the heating panel can realize separately and the joint through rotatory pull rod with the heat sink of metal, make when scribbling heat conduction silicone grease between heating panel and the heat sink of metal, can be very convenient.

2. According to the LED packaging structure with high heat dissipation, the sealing gasket is arranged at the lower end of the lens, and the metal heat sink is provided with the annular groove, so that the chip can be located in a sealed space, and the chip is prevented from being exposed in the air for a long time or being damaged mechanically to lose efficacy.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural diagram of the metal heat sink of the present invention;

FIG. 3 is a schematic structural diagram of a lens according to the present invention;

FIG. 4 is a schematic view of the structure of the round box of the present invention;

fig. 5 is an enlarged schematic view of a structure shown in fig. 4 according to the present invention.

Wherein: 11. a metal heat sink; 12. a through hole; 13. a heat dissipation plate; 14. a rectangular plate; 15. pressing a plate; 16. a spring; 17. a pull rod; 21. a chip; 22. an annular groove; 23. a lens; 24. a screw; 25. a gasket; 26. a nut; 31. a round box; 32. a slide hole.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the embodiment, those skilled in the art can obtain other embodiments without making creative efforts, and all of them belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

The embodiment is as follows:

as shown in fig. 1, 2, 3, 4 and 5, a high heat dissipation LED package structure includes a lens 23, four screws 24 are fixedly installed on the circumference of the lower end of the lens 23 at equal intervals, a gasket 25 is slidably installed between the upper circumferential surfaces of the four screws 24, the gasket 25 is located at the lower end of the lens 23 and is attached to the lower circumferential surface of the lens 23, a metal heat sink 11 is slidably installed between the intermediate circumferential surfaces of the four screws 24, an annular groove 22 is formed on the upper end of the metal heat sink 11, the lower end of the lens 23 and the gasket 25 are both located in the annular groove 22 formed on the metal heat sink 11 and are attached to each other, a round box 31 is slidably installed between the lower circumferential surfaces of the four screws 24, the high heat dissipation LED package structure is formed by fixedly installing the four screws 24 at the lower end of the lens 23, inserting the gasket 25, the metal heat sink 11 and the round box 31 into the circumferential surfaces of the four screws 24 in sequence, and locking the four screws 24 by the four screws 26, the lower end of the lens 23 is attached to the metal heat sink 11 and the metal heat sink 11, the heat sink 13, the heat sink 11 is capable of passing through the heat sink 13, and the heat sink 13, the heat sink 11, the heat sink 13 is capable of passing through the heat sink 13, and the heat sink 11, the heat sink 13, alright in can rotating the rectangular hole that rectangular plate 14 was seted up with two clamp plates 15, heating panel 13 alright take out on two rectangular plates 14 this moment, can paint heat conduction silicone grease between heating panel 13 and the metal heat sink 11, paint the completion back, pass two rectangular plates 14 with two through-holes 12 that heating panel 13 was seted up again, two pull rods 17 of rotation once more, two clamp plates 15 just laminate with heating panel 13, under two springs 16's elasticity, can fasten fix heating panel 13 at the 11 lower extreme of metal heat sink, circle case 31 is located the 11 lower extremes of metal heat sink and laminates, the inside heat dissipation chamber that has seted up of circle case 31, the heat dissipation intracavity wall bottom that circle case 31 was seted up runs through and has seted up a plurality of sliding holes 32, nut 26 is installed to four 24 lower sections circumference surfaces of screw rod equal screw threads, four nut 26 all are located circle case 31 lower extreme and laminate, 11 upper end fixed mounting of metal heat sink has

chip

21, 11 lower extreme is fixed and is installed two rectangular plates 14, two rectangular holes have all run through to set up in the side of rectangular plate 14. The lower ends of the two rectangular plates 14 are respectively provided with a pull rod 17 in a penetrating and rotating way. The upper ends of the two pull rods 17 are fixedly provided with a pressure plate 15. The springs 16 are movably sleeved on the circumferential surfaces of the two pull rods 17, and the two springs 16 are respectively and fixedly installed between the two pressure plates 15 and the inner wall of the rectangular hole formed in the rectangular plate 14. The lower end of the metal heat sink 11 is movably provided with a heat dissipation plate 13, two through holes 12 are formed in two sides of the upper end of the heat dissipation plate 13 in a penetrating mode, and the heat dissipation plate 13 is slidably mounted on the outer surfaces of the two rectangular plates 14 through the two through holes 12. The lower extreme of heating panel 13 is equipped with a plurality of groups of fin, the fin of heating panel 13 lower extreme all alternates slidable mounting and sets up slide hole 32 at circle case 31, the device is through at 11 lower extremes installation heating panel 13 of metal heat sink, and the fin has been installed to heating panel 13 lower extreme, make the heat that the chip 21 during operation produced can transmit for heating panel 13 through 11 metal heat sinks, transmitting for the fin, and partly and the external air contact that flows of fin, the heat dissipation of fin has been accelerated, and heating panel 13 can realize separately and the joint through rotatory pull rod 17 with 11 metal heat sinks, make when scribbling heat conduction silicone grease between

heating panel

13 and 11 metal heat sinks, can be very convenient. Meanwhile, the device enables the chip 21 to be in a sealed space by arranging the sealing gasket 25 at the lower end of the lens 23 and forming the annular groove 22 on the metal heat sink 11, so that the chip 21 is prevented from being exposed in the air for a long time or being damaged mechanically to fail.

Instructions for use: the high-heat-dissipation LED packaging structure is characterized in that four screws 24 are fixedly installed at the lower end of a lens 23, a sealing gasket 25, a metal heat sink 11 and a round box 31 penetrate through the circumferential surfaces of the four screws 24, and finally the four screws 24 are locked through four nuts 26, the lower end of the lens 23 is tightly attached to the metal heat sink 11 through the sealing gasket 25, gaps do not appear between the lens 23 and the metal heat sink 11 due to the material of the sealing gasket 25, air is prevented from entering the space between the lens 23 and the metal heat sink 11 and damaging the chip 21, heat generated during working of the chip 21 at the upper end of the metal heat sink 11 can be transferred towards a heat dissipation plate 13 at the lower end of the metal heat sink 11 through the metal heat sink 11, heat dissipation is performed through a plurality of heat dissipation fins at the lower end of the heat dissipation plate 13, the plurality of heat dissipation fins at the lower end of the heat dissipation plate 13 can be in contact with outside flowing air from a sliding hole 32 at the lower end of the round box 31, heat dissipation plate 13 is enlarged, heat dissipation fins at the lower end of the heat dissipation plate 13 can perform heat dissipation, heat conduction better heat conduction due to the fact that the heat dissipation plate 13 can be coated with heat dissipation silicone grease, so that two rectangular heat sinks 13 can pass through two heat dissipation plates 13 after the two rectangular heat dissipation plate 13 are fastened, two rectangular heat dissipation plate 13, two rectangular heat dissipation plates 13, two tension rods 17 are fastened, two rectangular heat sinks 14 are fastened, and two rectangular heat dissipation plates 13, and two rectangular heat dissipation plates 13 can be fastened, and two rectangular heat sinks 14 are fastened, and two rectangular heat dissipation plates 13 can be coated with two metal heat dissipation plates 13, and two rectangular heat dissipation plates 13. The device is through at 11 lower extremes installation heating panel 13 of metal heat sink, and the fin has been installed to heating panel 13 lower extreme, make the heat that chip 21 during operation produced can transmit for heating panel 13 through metal heat sink 11, transmitting for the fin, and partly and the external air contact that flows of fin, the heat dissipation of fin has been accelerated, and heating panel 13 can realize separately and the joint through rotatory pull rod 17 with metal heat sink 11, make when scribbling heat conduction silicone grease between heating panel 13 and metal heat sink 11, can be very convenient. Meanwhile, the device enables the chip 21 to be in a sealed space by arranging the sealing gasket 25 at the lower end of the lens 23 and arranging the annular groove 22 on the metal heat sink 11, so that the chip 21 is prevented from being out of work due to long-term exposure or mechanical damage in the air.

The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made without departing from the gist of the present invention within the knowledge of those skilled in the art.

Claims

1. A high radiating LED packaging structure, includes lens (23), its characterized in that: lens (23) lower extreme circumference equidistance fixed mounting has four screw rods (24), four slidable mounting has sealed pad (25) between screw rod (24) upper segment circumference surface, sealed pad (25) is located lens (23) lower extreme and laminates, four slidable mounting has metal heat sink (11) between screw rod (24) interlude circumference surface, annular groove (22) have been seted up to metal heat sink (11) upper end, lens (23) lower extreme and sealed pad (25) all are located the annular groove (22) that metal heat sink (11) was seted up and laminate, four slidable mounting has circle case (31) between screw rod (24) hypomere circumference surface, circle case (31) are located metal heat sink (11) lower extreme and laminate, the inside heat dissipation chamber of having seted up of circle case (31), the heat dissipation chamber inner wall bottom of seting up of circle case (31) has been run through and has been seted up a plurality of sliding holes (32), four nut (26) are installed to screw rod (24) hypomere circumference surface equal screw thread, four nut (26) all are located heat sink case (31) lower extreme and laminate, metal heat sink (11) upper end fixed mounting has been seted up rectangular plate (14) lower extreme and rectangular plate (14) have been run through two heat sink (14).

2. The high heat dissipation LED package structure of claim 1, wherein: the lower ends of the two rectangular plates (14) are respectively inserted with a pull rod (17) in a rotating way.

3. The high heat dissipation LED package structure of claim 2, wherein: the upper ends of the two pull rods (17) are fixedly provided with a pressure plate (15).

4. The high heat dissipation LED package structure of claim 3, wherein: two the spring (16) has all been cup jointed in the activity on pull rod (17) circumferential surface, two spring (16) respectively fixed mounting between the rectangle downthehole wall that two clamp plates (15) and rectangular plate (14) seted up.

5. The high heat dissipation LED package structure of claim 1, wherein: the metal heat sink (11) lower extreme activity is provided with heating panel (13), two through-holes (12) have all been seted up in heating panel (13) upper end both sides through running through, heating panel (13) are through two through-holes (12) slidable mounting seted up at two rectangular plate (14) surfaces.

6. The LED package structure with high heat dissipation of claim 5, wherein: the lower end of the heat dissipation plate (13) is provided with a plurality of groups of heat dissipation fins, and the heat dissipation fins at the lower end of the heat dissipation plate (13) are inserted into sliding holes (32) formed in the round box (31) in a sliding mode.