CN218160433U

CN218160433U - Ceramic substrate for preventing chip from shifting

Info

Publication number: CN218160433U
Application number: CN202221895885.2U
Authority: CN
Inventors: 张天宇; 丁彦奇; 牛瑞波
Original assignee: Hunan Tongdaxin Electronic Technology Co ltd
Current assignee: Hunan Tongdaxin Electronic Technology Co ltd
Priority date: 2022-07-22
Filing date: 2022-07-22
Publication date: 2022-12-27
Anticipated expiration: 2032-07-22

Abstract

The utility model discloses a ceramic substrate for preventing chip displacement, which comprises a substrate main body and a chip main body, wherein a limiting mechanism and a protection mechanism are arranged between the substrate main body and the chip main body; the limiting mechanism comprises a supporting spring, a limiting plate and a toggle strip, a mounting groove is formed in the center of the top surface of the substrate main body, a limiting groove in a convex shape is formed in the center of one side of the chip main body, the limiting groove is communicated with the mounting groove, and a sliding groove is formed in each of two opposite side groove walls of the limiting groove; protection machanism includes rectangle frame, hinge bar, apron, reset spring, locking arch and location and glues the post, and the rectangle frame is fixed to be set up at base plate main part top surface, and the mounting groove is located the rectangle frame inboard, and the hinge bar both ends respectively with the inside wall connection of the opposite sides of rectangle frame, the apron cover is established at the hinge bar outer peripheral face and is located the rectangle frame inside, the constant head tank has been seted up to rectangle frame one side outer wall. The utility model discloses the flexible simple and convenient while job stabilization nature of operation is high is maintained in the dismouting.

Description

Ceramic substrate for preventing chip from shifting

Technical Field

The utility model relates to a ceramic substrate technical field, in particular to prevent ceramic substrate that chip shifted.

Background

The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double) of an (Al 2O 3) or (AlN) ceramic substrate at a high temperature. Because the ceramic substrate has the characteristics of high heat dissipation, low thermal resistance, long service life and voltage resistance, the application field of the LED industry is indirectly enlarged, such as indicator lamps of household appliances, automobile lamps, street lamps, outdoor large-scale signboards and the like, and the semiconductor chip is often assembled on the ceramic substrate.

In the prior art, most of semiconductor chips are fixed on a ceramic substrate in a welding mode, the chips are welded and rewelded when being disassembled, assembled, maintained or replaced, the operation efficiency is low, the surfaces of the chips are exposed and easy to damage or shift under stress, and the stability is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a prevent ceramic substrate of chip aversion can effectively solve among the prior art semiconductor chip and adopt welded mode to fix on ceramic substrate mostly, will weld the rewelding when carrying out dismouting maintenance or change to the chip, and operating efficiency is low, and the exposed easy damage in chip surface or atress aversion, the problem that stability is low moreover.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme: a ceramic substrate for preventing chip displacement comprises a substrate main body and a chip main body, wherein a limiting mechanism and a protection mechanism are arranged between the substrate main body and the chip main body;

the limiting mechanism comprises a supporting spring, a limiting plate and a stirring strip, a mounting groove is formed in the center of the top surface of the substrate main body, a limiting groove in a convex shape is formed in the center of one side of the chip main body, the limiting groove is communicated with the mounting groove, two opposite side groove walls of the limiting groove are respectively provided with a sliding groove, one end of the supporting spring is connected with one side groove wall of the limiting groove, the limiting plate is fixedly arranged at the other end of the supporting spring, the stirring strip is movably arranged in the sliding groove, one end of the stirring strip is connected with one side surface of the limiting plate, the stirring strip can slide in the sliding groove, and the limiting plate can block the chip main body at an opening at one side of the mounting groove;

protection machanism includes rectangle frame, hinge rod, apron, reset spring, locking arch and location gluey post, the rectangle frame is fixed to be set up at base plate main part top surface, and the mounting groove is located the rectangle frame inboard, the hinge rod both ends respectively with the inside wall connection of the both sides that the rectangle frame is opposite, the apron cover is established at the hinge rod outer peripheral face and is located inside the rectangle frame, the constant head tank has been seted up to rectangle frame one side outer wall, apron one side center department has seted up and has accomodate the groove, the position and the size of constant head tank and the position and the size phase-match of accomodating the groove, reset spring one end is connected with accomodating groove one side cell wall, the protruding activity of locking sets up in the constant head tank and its one side surface is connected with the reset spring other end, location gluey post top is connected with apron bottom surface edge, the chip main part is placed in the mounting groove and its top surface and location gluey post bottom butt, the louvre has been seted up to the apron top surface, and the apron can rotate on the rectangle frame with the help of hinge rod, and the locking arch can translate business turn over in business turn over constant head tank and accomodate the groove.

Preferably, the poking strips are provided with two and correspondingly arranged in the two sliding grooves, and the limiting plates and the poking strips are arranged in a one-to-one correspondence manner.

Preferably, the supporting springs are provided with four and equally divided into two groups, and the two groups of supporting springs are correspondingly arranged on the two limiting plates.

Preferably, a semicircular lifting groove is formed in the top surface of one side, close to the horizontal plane of the vertical center of the rectangular frame, of the cover plate.

Preferably, the two cover plates are symmetrically arranged on the horizontal plane of the transverse center of the rectangular frame, and the hinged rods and the lifting grooves are arranged in one-to-one correspondence with the cover plates.

Preferably, the locking protrusion is provided with four and equally divided into two groups, the positioning rubber columns are provided with four and equally divided into two groups, two groups of locking protrusions and two groups of positioning rubber columns are correspondingly arranged on the two cover plates, and the positioning grooves and the accommodating grooves are correspondingly arranged with the locking protrusions one to one.

Preferably, the reset springs are eight and equally divided into four groups, and the four groups of reset springs are correspondingly arranged in the four accommodating grooves.

Compared with the prior art, the utility model relates to a prevent ceramic substrate of chip aversion has following beneficial effect:

the utility model discloses in, place the chip main part through seting up the mounting groove in base plate main part top surface center department, the chip main part is from chip main part one side center department and when being the spacing groove of "protruding" style of calligraphy form and putting into the mounting groove, stir the strip through pulling two, slide and when the interval enlarges gradually in the spout when two stir the strip, supporting spring compresses thereupon can help the limiting plate to shrink spacing groove depths and dodge to the chip main part, loose put stir after the strip, supporting spring deformation resumes can pull back the limiting plate and stop spacingly to the chip main part at mounting groove one side opening part, through pressing the locking arch, the protruding receipts groove back of receiving on the apron of return spring compression cooperation locking arch, the apron that loses the hindrance can rotate on the rectangle frame with the help of the hinge rod, can cover mounting groove top end opening part when the apron is set flat the louvre, when the chip main part obtains the protection, can guarantee the heat dissipation of chip main part on the apron, when receiving the constant head tank parallel and level on groove and rectangle frame, the reset spring that the protruding top surface that can push away the top surface of locking arch can get into on the locking groove and get into the frame, the chip main part is carried out the convenience when the fixed chip main part and is carried out the fixed chip and is carried out the recess of the fixed equipment and is carried out the convenience is dismantled to the convenience when the chip.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of a ceramic substrate for preventing chip displacement according to the present invention;

fig. 2 is a schematic front view of a ceramic substrate for preventing chip displacement according to the present invention;

FIG. 3 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 2 according to the present invention;

FIG. 4 is a schematic cross-sectional view taken along line B-B of FIG. 3 according to the present invention;

fig. 5 is a schematic cross-sectional view of the section C-C in fig. 4 according to the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a substrate main body; 2. a chip body; 3. mounting grooves; 4. a limiting groove; 5. a chute; 6. a support spring; 7. a limiting plate; 8. a rectangular frame; 9. a hinge rod; 10. a cover plate; 11. a return spring; 12. a locking projection; 13. positioning the glue column; 14. the bar is toggled.

Detailed Description

In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Referring to fig. 1-5, the utility model relates to a ceramic substrate for preventing chip displacement, which comprises a substrate main body 1 and a chip main body 2, wherein a limiting mechanism and a protection mechanism are arranged between the substrate main body 1 and the chip main body 2;

the limiting mechanism comprises a supporting spring 6, a limiting plate 7 and a toggle strip 14, a mounting groove 3 is formed in the center of the top surface of the substrate main body 1, a limiting groove 4 in a convex shape is formed in the center of one side of the chip main body 2, the limiting groove 4 is communicated with the mounting groove 3, sliding grooves 5 are formed in two opposite side groove walls of the limiting groove 4 respectively, one end of the supporting spring 6 is connected with one side groove wall of the limiting groove 4, the limiting plate 7 is fixedly arranged at the other end of the supporting spring 6, the toggle strip 14 is movably arranged in the sliding groove 5, one end of the toggle strip is connected with one side surface of the limiting plate 7, the toggle strip 14 can slide in the sliding groove 5, and the limiting plate 7 can block the chip main body 2 at an opening at one side of the mounting groove 3;

the protection mechanism comprises a rectangular frame 8, a hinge rod 9, a cover plate 10, a reset spring 11, a locking protrusion 12 and a positioning rubber column 13, the rectangular frame 8 is fixedly arranged on the top surface of the substrate main body 1, the mounting groove 3 is positioned on the inner side of the rectangular frame 8, two ends of the hinge rod 9 are respectively connected with the inner walls of two opposite sides of the rectangular frame 8, the cover plate 10 is sleeved on the outer peripheral surface of the hinge rod 9 and positioned inside the rectangular frame 8, a positioning groove is formed in the outer wall of one side of the rectangular frame 8, a containing groove is formed in the center of one side of the cover plate 10, the position and the size of the positioning groove are matched with those of the containing groove, one end of the reset spring 11 is connected with the groove wall of one side of the containing groove, the locking protrusion 12 is movably arranged in the positioning groove, one side surface of the locking protrusion is connected with the other end of the reset spring 11, the top end of the positioning rubber column 13 is connected with the edge of the bottom surface of the cover plate 10, the chip main body 2 is placed in the mounting groove 3, the top surface of the cover plate is abutted against the bottom end of the positioning rubber column 13, the top surface of the cover plate 10, the cover plate 10 is provided with a heat dissipation hole, the cover plate 10 can rotate on the rectangular frame 8 by means of the hinge rod 9, and the locking protrusion 12 can move in and out of the positioning groove and out of the containing groove.

Further, the toggle strips 14 are provided with two and correspondingly arranged in the two sliding grooves 5, and the limiting plates 7 are arranged in one-to-one correspondence with the toggle strips 14.

Further, the supporting springs 6 are provided with four and equally divided into two groups, and the two groups of supporting springs 6 are correspondingly arranged on the two limiting plates 7.

Furthermore, a semicircular lifting groove is formed in the top surface of one side, close to the horizontal plane of the vertical center of the rectangular frame 8, of the cover plate 10.

Furthermore, the two cover plates 10 are symmetrically arranged on the horizontal plane of the transverse center of the rectangular frame 8, and the hinged rods 9 and the lifting grooves are arranged in one-to-one correspondence with the cover plates 10.

Furthermore, the locking protrusions 12 are provided with four and equally divided into two groups, the positioning rubber columns 13 are provided with four and equally divided into two groups, the two groups of locking protrusions 12 and the two groups of positioning rubber columns 13 are correspondingly arranged on the two cover plates 10, and the positioning grooves and the accommodating grooves are correspondingly arranged with the locking protrusions 12.

Furthermore, the total number of the return springs 11 is eight and is equally divided into four groups, and the four groups of the return springs 11 are correspondingly arranged in the four accommodating grooves.

The working principle of the utility model is as follows:

when the personnel use, place chip main part 2 through seting up mounting groove 3 in 1 top surface center department of base plate main part, chip main part 2 is from 2 one side centers of chip main part and when being the spacing groove 4 of "protruding" style of calligraphy form and putting into mounting groove 3, stimulate two and stir strip 14, when two stir strip 14 slide in spout 5 and the interval enlarges gradually, supporting spring 6 compresses thereupon and helps limiting plate 7 to shrink to spacing groove 4 depth department and dodge chip main part 2, after loosening stir strip 14, supporting spring 6 deformation resumes to draw back limiting plate 7 and stop spacing to chip main part 2 at mounting groove 3 one side opening part, through pressing locking arch 12, after reset spring 11 compression cooperation locking arch 12 receive and release the groove of accomodating on apron 10, the apron 10 that loses the hindrance rotates on rectangle frame 8 with the help of hinge rod 9, cover mounting groove 3 top end opening part covers when apron 10 flattens rectangle frame 8 when apron 10, chip main part 2 obtains the protection rectangle, guarantee the heat dissipation of chip main part 2 on apron 10, when accepting the groove and losing the top surface pressure of rectangle frame 8 and getting into the top surface of cover plate 10 and getting into the fixed cover plate 2 side opening part and pressing the chip main part of the fixed groove 2 and drawing back, chip main part can be accomplished the chip main part through pressing the chip main part of the top surface of the fixed side of the chip main part 2 of the fixed side of the fixed groove 10 that the top surface of the fixed groove 12 that the top surface of taking the fixed post was taken.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The ceramic substrate for preventing the chip from shifting is characterized by comprising a substrate main body (1) and a chip main body (2), wherein a limiting mechanism and a protection mechanism are arranged between the substrate main body (1) and the chip main body (2);

the limiting mechanism comprises a supporting spring (6), a limiting plate (7) and a shifting strip (14), wherein a mounting groove (3) is formed in the center of the top surface of the substrate main body (1), a limiting groove (4) in a convex shape is formed in the center of one side of the chip main body (2), the limiting groove (4) is communicated with the mounting groove (3), two opposite groove walls of the limiting groove (4) are respectively provided with a sliding groove (5), one end of the supporting spring (6) is connected with one groove wall of one side of the limiting groove (4), the limiting plate (7) is fixedly arranged at the other end of the supporting spring (6), the shifting strip (14) is movably arranged in the sliding groove (5), and one end of the shifting strip is connected with one side surface of the limiting plate (7);

protection machanism includes rectangle frame (8), hinge bar (9), apron (10), reset spring (11), locking arch (12) and location gluey post (13), rectangle frame (8) fixed setting is at base plate main part (1) top surface, and mounting groove (3) are located rectangle frame (8) inboardly, hinge bar (9) both ends respectively with rectangle frame (8) both sides interior wall connection in opposite directions, apron (10) cover is established at hinge bar (9) outer peripheral face and is located inside rectangle frame (8), rectangle frame (8) one side outer wall has seted up the constant head tank, apron (10) one side center department has seted up and has accomodate the groove, the position and the size of constant head tank match with the position and the size of accomodating the groove, reset spring (11) one end is connected with accomodate groove side cell wall, locking arch (12) activity sets up in the constant head tank and its one side surface is connected with reset spring (11) other end, location gluey post (13) top is connected with apron (10) bottom surface edge department, chip main part (2) is placed in mounting groove (3) and its top surface has seted up the butt with location gluey post (13), top surface (10) bottom.

2. The ceramic substrate for preventing chip shifting as claimed in claim 1, wherein: the poking strips (14) are provided with two and are correspondingly arranged in the two sliding grooves (5), and the limiting plates (7) are in one-to-one correspondence with the poking strips (14).

3. The chip displacement-preventing ceramic substrate as claimed in claim 2, wherein: the supporting springs (6) are provided with four and equally divided into two groups, and the two groups of supporting springs (6) are correspondingly arranged on the two limiting plates (7).

4. The chip displacement-preventing ceramic substrate as claimed in claim 1, wherein: and a semicircular lifting groove is formed in the top surface of one side, close to the vertical central horizontal plane of the rectangular frame (8), of the cover plate (10).

5. The ceramic substrate of claim 4, wherein the chip displacement is prevented by: the two cover plates (10) are symmetrically arranged on the horizontal plane of the transverse center of the rectangular frame (8), and the hinged rods (9) and the lifting grooves are arranged in one-to-one correspondence with the cover plates (10).

6. The chip displacement-preventing ceramic substrate as claimed in claim 5, wherein: locking arch (12) are equipped with four and the equant divide into two sets ofly altogether, location gluey post (13) are equipped with four and the equant divide into two sets ofly altogether, and two sets of locking arch (12) and two sets of location gluey post (13) all correspond and set up on two apron (10), constant head tank and storage groove all are the one-to-one with locking arch (12) and set up.

7. The chip displacement-preventing ceramic substrate as claimed in claim 6, wherein: the four groups of reset springs (11) are correspondingly arranged in the four accommodating grooves.