CN218139549U

CN218139549U - High-temperature injection molding light guide plate forming mold device

Info

Publication number: CN218139549U
Application number: CN202221829188.7U
Authority: CN
Inventors: 郭明刚; 郭先付; 于立新; 王征辉
Original assignee: Nano Precision Suzhou Co Ltd
Current assignee: Nano Precision Suzhou Co Ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2022-12-27
Anticipated expiration: 2032-07-15

Abstract

The utility model provides a fashioned light guide plate forming die device is penetrated to high temperature, including die holder, first mould benevolence, second mould benevolence, first pipeline and second pipeline. The first die core is arranged in the die holder. The second die core is arranged in the die holder. The first pipeline is arranged in the first mold core. The second pipeline is arranged in the second die core. The first pipeline is overlapped with the second pipeline in a top view, and the light guide plate is formed between the first mold core and the second mold core. The first pipeline and the second pipeline allow the temperature control fluid to pass through, and the temperature control fluid comprises at least one of steam, cooling water and gas. The utility model provides a fashioned light guide plate forming die device is jetted out to high temperature is used for the light guide plate of the thinner thickness of shaping bigger size, and has the shaping quality of preferred.

Description

High-temperature injection molding light guide plate forming mold device

Technical Field

The utility model discloses a light guide plate forming die device, and especially about a light guide plate forming die device of high temperature injection Molding (Rapid Heat Cycle Molding, RHCM).

Background

The existing injection molding mold is designed to maintain a constant temperature state, and the temperature of the matched mold is different according to different raw materials, but the temperature of the matched mold is not higher than the crystallization point of the glass transition temperature (Tg) of the raw materials (sizing materials). The temperature of the mold is limited, so the forming period of the light guide plate is long, and the technical development of the light guide plate is difficult to break through. On the other hand, if a mold having a compression plate is used to manufacture a light guide plate, the size of the mold is much larger than that of a normal mold due to the fact that a plurality of compression plates are provided and the mold is provided with a structure for compressing oil pressure or a spring, and the temperature of the constant temperature mold needs to be increased or decreased for a long time, and the ultra-thin light guide plate mold needs to be further improved and optimized. For example, in an ultra-thin light guide plate in which the temperature of the normal glue of the polymethyl methacrylate (PMMA) raw material is 300 ℃ and the temperature of the mold is 80 ℃, heat is instantly taken away by the mold when the glue is injected into the cavity, and at this time, the formed ultra-thin light guide plate is easy to be short-shot, and poor transfer of microstructures (such as mesh points, light incident surface microstructures, prism column microstructures) occurs.

The background section is only provided to aid in understanding the present invention, and therefore the disclosure in the background section may include some prior art that does not constitute a part of the knowledge of those skilled in the art. The disclosure in the "background" section does not represent that matter or the problems which may be solved by one or more embodiments of the present invention are known or appreciated by those skilled in the art prior to the filing of the present application.

SUMMERY OF THE UTILITY MODEL

The utility model provides a fashioned light guide plate forming die device is jetted out to high temperature for the light guide plate of the thinner thickness of shaping bigger dimension, and have the shaping quality of preferred.

Other objects and advantages of the present invention can be obtained from the technical features disclosed in the present invention.

In order to achieve one or a part of or all of the above or other objectives, an embodiment of the present invention provides a light guide plate forming mold device for high temperature injection molding, including a mold base, a first mold core, a second mold core, a first pipeline and a second pipeline. The first die core is arranged in the die holder. The second die core is arranged in the die holder. The first pipeline is arranged in the first mold core. The second pipeline is arranged in the second die core. The first pipeline is overlapped with the second pipeline in a top view, and the light guide plate is formed between the first mold core and the second mold core. The first pipeline and the second pipeline allow the temperature control fluid to pass through, and the temperature control fluid comprises at least one of steam, cooling water and gas.

Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. The utility model discloses an in the design of high temperature injection molding's light guide plate forming die device, dispose in first mould benevolence and second mould benevolence in first pipeline and second pipeline can make the temperature control fluid (including steam, cooling water and at least one of them in the gas) pass through, borrow by the temperature control fluid and carry out temperature control in order to cooperate different processing procedure stages, borrow the temperature of rapid heating up and cooling mould to improve the shaping quality. In addition, by the utility model discloses a light guide plate that high temperature jet molding's light guide plate forming die device formed between first mould benevolence and second mould benevolence then can have bigger size and thinner thickness.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a perspective schematic view of a light guide plate molding die device for high-temperature injection molding according to an embodiment of the present invention.

Fig. 2 is a schematic side perspective view of the light guide plate molding die assembly of fig. 1.

Fig. 3 is a schematic top perspective view of the light guide plate molding apparatus of fig. 1 for high temperature injection molding.

Fig. 4 is a schematic perspective view of a first mold core and a first pipeline of the light guide plate molding apparatus for high-temperature injection molding shown in fig. 1.

Fig. 5 is a schematic perspective view of a second mold core and a second pipeline of the light guide plate molding apparatus of fig. 1.

Fig. 6 is a graph showing the surface temperature of the mold core and the temperature-controlling fluid of the molding apparatus for molding light guide plate of fig. 1.

List of reference numerals

100: light guide plate forming die device for high-temperature injection molding

110: die holder

112 first die holder

114 second die holder

120 the first mold core

122 first surface

124 first die face

130 the second mold core

132 second surface

134 second die face

140 first pipeline

150: second pipeline

160 first adiabatic material

170 second adiabatic material

180 hot runner

185 valve needle

190: liftout mechanism

192 first steam transport pipe

194 second steam transport pipe

196 third steam conveying pipe

198 fourth steam transport pipe

A1, A2, A3, A4, A5: intervals

C1, C2, C3 ranges

D diameter

E1 fluid pipeline

E2: connecting pipeline

F temperature control fluid

G is the pitch

S is distance

P is a light guide plate.

Detailed Description

The foregoing and other technical and other features and advantages of the invention will be apparent from the following detailed description of a preferred embodiment, which proceeds with reference to the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

Fig. 1 is a schematic perspective view of a light guide plate molding apparatus for high temperature injection molding according to an embodiment of the present invention. Fig. 2 is a schematic side perspective view of the light guide plate molding die assembly of fig. 1. Fig. 3 is a schematic top perspective view of the light guide plate molding die assembly of fig. 1 for high temperature injection molding. Fig. 4 is a schematic perspective view of a first mold core and a first pipeline of the light guide plate molding apparatus for high-temperature injection molding shown in fig. 1. Fig. 5 is a schematic perspective view of a second mold core and a second pipeline of the light guide plate molding apparatus of fig. 1. Fig. 6 is a graph showing the surface temperature of the mold core and the temperature-controlling fluid of the molding apparatus for molding light guide plate of fig. 1. For convenience of explanation, fig. 1 to 5 show a part of the perspective members in solid lines.

Referring to fig. 1, fig. 2, fig. 3 and fig. 6, in the present embodiment, a molding device 100 for molding a light guide plate by high-temperature injection molding includes a mold base 110, a first mold core 120, a second mold core 130, a first pipeline 140 and a second pipeline 150. The first mold core 120 is disposed in the mold base 110. The second mold core 130 is disposed in the mold base 110. The first pipeline 140 is disposed in the first mold core 120. The second pipeline 150 is disposed in the second mold core 130. In a top view, the first pipeline 140 overlaps the second pipeline 150, and the light guide plate P is formed between the first mold core 120 and the second mold core 130 (i.e., the formed light guide plate P is located between the first pipeline 140 and the second pipeline 150). The first pipe 140 and the second pipe 150 allow the temperature control fluid F to pass through, wherein the temperature control fluid F includes at least one of steam, cooling water and gas.

In detail, in the present embodiment, the die sets 110 include a first die set 112 and a second die set 114, wherein one of the first die set 112 and the second die set 114 is a male die set, and the other one of the first die set 112 and the second die set 114 is a female die set. Herein, the first mold base 112 is a female mold base, the second mold base 114 is a male mold base, and the second mold base 114 includes, for example, a fixed base and a movable plate. The first mold core 120 and the second mold core 130 are stacked in the mold base 110, wherein the first mold surface 124 of the first mold core 120 faces the second mold surface 134 of the second mold core 130, and the light guide plate P is formed between the first mold surface 124 and the second mold surface 134. Herein, the size of the first mold core 120 is larger than that of the second mold core 130, but not limited thereto. Since the material of the mold core is one of the factors affecting the molding quality of the mold, the material of the mold core preferably has polishing property, corrosion resistance, wear resistance, thermal strength, toughness, processability, and low thermal expansion coefficient, wherein the polishing property, the corrosion resistance, the thermal strength, and the thermal expansion coefficient are particularly important for highlight molds.

Next, referring to fig. 2, fig. 4 and fig. 5, in the present embodiment, the first pipeline 140 and the second pipeline 150 each include a plurality of fluid pipelines E1 and a plurality of connecting pipelines E2, respectively. The fluid pipelines E1 are arranged in parallel, and the connecting pipeline E2 is vertically connected between adjacent fluid pipelines E1 to form a part of a loop (e.g. a flow channel of a single path). The length of the first pipe 140 is different from the length of the second pipe 150, and herein, the length of the first pipe 140 is greater than the length of the second pipe 150, but is not limited thereto.

In one embodiment, the diameter D of each of the fluid conduits E1 is, for example, 8 mm, and the distance G between the fluid conduits E1 is, for example, 20 mm. The first and

second pipelines

140 and 150 are spaced apart from the first and second mold surfaces 124 and 134 of the first and

second mold cores

120 and 130, respectively, by a distance S, for example, greater than or equal to 2 mm and less than or equal to 8 mm, so that the first and second mold surfaces 124 and 134 of the first and

second mold cores

120 and 130 can be rapidly heated and cooled. Specifically, the distance S is 2 times or less the diameter D, and the distance S is 1/4 times or more the diameter D. That is, although the first pipe 140 and the second pipe 150 are as close to the first mold surface 124 and the second mold surface 134 as possible to increase the heat conduction speed, the first pipe 140 and the second pipe 150 may not be too close to each other in consideration of the temperature uniformity during the injection molding, so that the position arrangement and the structural design of the first pipe 140 and the second pipe 150 can greatly shorten the cooling and heating time, and reduce the injection molding cycle, thereby realizing the rapid cycle molding.

In another embodiment, the diameter D of each of the fluid conduits E1 may also be 6 mm, for example, and the spacing G between the fluid conduits E1 may also be 15 mm, for example. The first pipeline 140 and the second pipeline 150 are respectively spaced apart from the first mold surface 124 of the first mold core 120 and the second mold surface 134 of the second mold core 130 by a distance S, which is, for example, greater than or equal to 2 mm and less than or equal to 8 mm.

In another embodiment, the diameter D of each of the fluid pipes E1 may also be 4 mm, for example, and the distance G between the fluid pipes E1 may also be 12 mm, for example. The first pipeline 140 and the second pipeline 150 are respectively spaced apart from the first mold surface 124 of the first mold core 120 and the second mold surface 134 of the second mold core 130 by a distance S, which is, for example, greater than or equal to 2 mm and less than or equal to 8 mm.

By means of simulated preheating verification of the die holder 110, it can be known that when the diameter D of the fluid pipeline E1 is 6 mm, 11 seconds of preheating time is needed for raising the die temperature to the glass conversion temperature of the injected rubber; when the diameter D of the fluid line E1 is 4 mm or 8 mm, a preheating time of 13 seconds is required to raise the mold temperature to the glass transition temperature of the injected rubber.

Referring to fig. 1, fig. 3, fig. 4 and fig. 5, the molding device 100 for forming a light guide plate by high temperature injection molding of the present embodiment further includes a first fluid transport tube 192, a second fluid transport tube 194, a third fluid transport tube 196 and a fourth fluid transport tube 198. The first fluid pipe 192 and the second fluid pipe 194 pass through the die holder 110 and are connected to two ends of the first pipeline 140, respectively, and the third fluid pipe 196 and the fourth fluid pipe 198 pass through the die holder 110 and are connected to two ends of the second pipeline 150, respectively, for performing external circulation. The first fluid-carrying tube 192 is disposed in parallel with the third fluid-carrying tube 196, and the second fluid-carrying tube 194 is disposed in parallel with the fourth fluid-carrying tube 198. Here, the outer surfaces of the first fluid transport pipe 192, the second fluid transport pipe 194, the third fluid transport pipe 196, and the fourth fluid transport pipe 198 may be coated with an insulating material, but not limited thereto.

In addition, the light guide plate molding die device 100 of the high temperature injection molding of the present embodiment further includes a first heat-insulating material 160 and a second heat-insulating material 170. The first thermal insulation material 160 is disposed on the first surface 122 of the first mold core 120 relatively far from the second mold core 130. The second thermal insulation material 170 is disposed on the second surface 132 of the second mold core 130, which is relatively far away from the first mold core 120. Here, the first thermal insulating material 160 and the second thermal insulating material 170 are preferably heat-resistant and high-pressure-resistant materials.

Furthermore, the light guide plate molding apparatus 100 of the high temperature injection molding of the present embodiment may further include a hot runner 180 and a valve pin 185. The hot runner 180 is disposed in the mold base 110. The valve pin 185 is connected to the hot runner 180 to control the time for the glue in the hot runner 180 to flow into the first mold core 120 and the second mold core 130. In addition, the light guide plate molding apparatus 100 of the high temperature injection molding of the present embodiment may further include an ejection mechanism 190 disposed on the mold base 110. Here, the ejection mechanism 190 is an oil-pressure ejection mechanism, for example, disposed between the fixed base and the movable plate of the second die holder 114, and configured to control the movement of the movable plate of the second die holder 114.

Next, referring to fig. 1 and fig. 6, in the present embodiment, the temperature-control fluid F includes at least one of steam, cooling water and gas, and in the light guide plate molding mold device 100 of the high-temperature injection molding of the present embodiment, the first pipeline 140 and the second pipeline 150 can simultaneously allow the same temperature-control fluid F to pass through, wherein when the temperature-control fluid F is steam, the temperature of the steam is, for example, greater than 170 degrees and less than 200 degrees; when the temperature control fluid F is cooling water, the temperature of the cooling water is, for example, greater than 30 degrees and less than 50 degrees.

The working principle of the light guide plate molding die device 100 for high-temperature injection molding of the present embodiment is as follows: in an injection molding cycle, the injection mold temperature for high-temperature injection molding fluctuates in a relatively large temperature range. During the rapid heating phase of the mold, the mold temperature is first raised above the melting point or heat distortion temperature of the compound by using a dynamic temperature control system. Then, in order to ensure a good filling state of the plastic material solution, the temperature needs to be maintained for a certain period of time to prevent the situation that the adhesive is cured too early to form the microstructure on the surface of the light guide plate reliably. Specifically, the mold rapid heating stage is a filling and pressure maintaining stage, i.e., a range C1 in fig. 6, which includes the interval A1. In the interval A1, the mold enters a mold clamping state, the temperature control fluid F is steam at 180 ℃, the operation time is 9 seconds, and the steam is continuously injected into the first pipeline 140 and the second pipeline 150, so that the surface temperatures of the first mold core 120 and the second mold core 130 can be rapidly increased.

Then, the cooling stage, i.e. the range C2 in fig. 6, is performed, the mold temperature is maintained first, and then the shaped rubber is rapidly cooled, so as to rapidly reduce the rubber temperature below the plastic ejection temperature. The range C2 includes an interval A2, an interval A3, and an interval A4. The interval A2 represents that the cooling is waited for 4 seconds, for example, the steam is not injected into the first pipeline 140 and the second pipeline 150, but the steam entering the first pipeline 140 and the second pipeline 150 is retained in the pipelines to maintain the temperature of the mold at a high temperature, and at this time, the glue is injected between the first mold core 120 and the second mold core 130 and waits for a period of time (for example, the second mold core 130 can be moved to perform compression molding), for example, 4 seconds, so that the glue can be transferred to the microstructure on the surface of the light guide plate. The interval A3 represents that the temperature control fluid F is cooling water of 40 ℃ and the working time is 12 seconds, and the cooling water is continuously injected into the first pipeline 140 and the second pipeline 150, so that the mold is rapidly cooled and the light guide plate is shaped. The interval A4 indicates that water is blown for 7 seconds, and gas (temperature control fluid F, for example, room temperature gas) is injected into the first pipe 140 and the second pipe 150, so that the cooling water in the first pipe 140 and the second pipe 150 can be discharged.

Finally, the mold is opened (i.e., the mold opening stage) to remove the injection molded product (i.e., the light guide plate), i.e., the range C3 in fig. 6, which includes the interval A5. In the interval A5, when the light guide plate is taken out, steam with the temperature control fluid F of 180 ℃ is injected into the first pipeline 140 and the second pipeline 150 for about 5 seconds to rapidly raise the temperature of the mold in preparation for the next injection molding process. Specifically, the present invention is adapted to inject one of the steam, the cooling water and the gas of the temperature control fluid F into the first pipe 140 and the second pipe 150 according to different manufacturing stages. In particular, the working time of each stage and the temperature of each temperature control fluid F can be adjusted within a limited range according to actual conditions.

In short, the mold device 100 for molding a light guide plate by high-temperature injection molding according to the present embodiment can adjust the mold temperature according to the characteristics of each process stage. Here, the glass transition temperature (Tg) of the light guide plate molding die device 100 for high-temperature injection molding was 82.85 ℃, and the time of the entire temperature control cycle was 37 seconds. The normal-scale temperature is low, so that the cooling time is short, but the formability is poor; on the other hand, the high mold temperature is good in formability, but the cooling time must be long. Generally, the molding uses a fixed mold temperature device, so a better balance point between the mold temperature and the mold temperature must be obtained. The light guide plate molding mold device 100 of the high temperature injection molding of the embodiment is to use a high mold temperature during the filling pressure maintaining (i.e. the range C1), and use a low mold temperature during the cooling stage (i.e. the range C2), and the first mold core and the second mold core are provided with the temperature control pipelines (i.e. the first pipeline and the second pipeline) and the arrangement of the heat insulation material, i.e. the mold temperature during the filling pressure maintaining stage can be rapidly increased and stabilized above the glass transition point, the fluidity of the injection molding plastic can be increased, so as to improve the filling and product appearance, and the temperature can be rapidly decreased during the cooling stage, so as to increase the cooling efficiency, so that the light guide plate molding mold device 100 of the high temperature injection molding of the embodiment has better molding quality.

In summary, the embodiments of the present invention have at least one of the following advantages or effects. The utility model discloses an in the design of high temperature ejection forming's light guide plate forming die device, dispose in first mould benevolence and second mould benevolence in first pipeline and second pipeline can make the accuse temperature fluid (including steam, at least one of them in cooling water and the gas) pass through, borrow the specific processing procedure stage that sets up the position in order to cooperate different that the accuse temperature fluid carries out temperature control and accuse temperature pipeline, borrow the temperature of rapid heating up and cooling mould by this to improve the shaping quality. In addition, by the utility model discloses a light guide plate that high temperature jet molding's light guide plate forming die device formed between first mould benevolence and second mould benevolence then can have bigger size and thinner thickness.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereto, that is, all the simple equivalent changes and modifications made according to the claims and the content of the specification should be included in the scope covered by the present invention. Furthermore, it is not necessary for any embodiment or claim of the invention to achieve all of the objects, advantages, or features disclosed herein. Furthermore, the abstract and the title of the specification are provided only for assisting the retrieval of patent documents and are not intended to limit the scope of the present invention. Furthermore, the terms "first", "second", and the like in the description or the claims are used only for naming elements (elements) or distinguishing different embodiments or ranges, and are not used for limiting the upper limit or the lower limit on the number of elements.

Claims

1. The high temperature injection molded light guide plate forming mold device includes mold seat, the first mold core, the second mold core, the first pipeline and the second pipeline

The first die core is arranged in the die holder;

the second die core is arranged in the die holder;

the first pipeline is arranged in the first die core; and

the second pipeline is arranged in the second mold core, wherein the first pipeline is overlapped with the second pipeline in a top view, the light guide plate is formed between the first mold core and the second mold core, the first pipeline and the second pipeline enable temperature control fluid to pass through, and the temperature control fluid comprises at least one of steam, cooling water and gas.

2. The high temperature injection molded light guide plate molding die apparatus of claim 1, further comprising a first adiabatic material and a second adiabatic material, wherein

The first heat-insulating material is arranged on a first surface of the first die core, which is relatively far away from the second die core; and

the second heat-insulating material is arranged on a second surface of the second die core, which is relatively far away from the first die core.

3. The light guide plate molding die set according to claim 1, wherein the temperature of the steam is greater than 170 degrees and less than 200 degrees, and the temperature of the cooling water is greater than 30 degrees and less than 50 degrees.

4. The high temperature injection molded light guide plate molding die apparatus of claim 1, further comprising a hot runner and a valve pin, wherein

The hot runner is configured in the die holder; and

the valve needle is connected with the hot runner to control the colloid in the hot runner to flow into the space between the first mold core and the second mold core.

5. The high temperature injection molded light guide plate molding die apparatus of claim 1, further comprising an ejection mechanism,

the ejection mechanism is configured on the die holder.

6. The mold apparatus of claim 1, wherein the first and second pipes each comprise a plurality of fluid pipes and a plurality of connecting pipes, the fluid pipes are arranged in parallel, and the connecting pipes are connected between adjacent fluid pipes to form a loop.

7. The apparatus of claim 6, wherein each of the plurality of fluid lines has a diameter of 8 mm, the distance between the plurality of fluid lines is 20 mm, and the first and second lines are spaced apart from the first and second mold surfaces of the first and second molds by a distance of 2 mm or more and 8 mm or less, respectively.

8. The apparatus of claim 6, wherein each of the plurality of fluid lines has a diameter of 6 mm, the distance between the plurality of fluid lines is 15 mm, and the first and second lines are spaced apart from the first and second mold surfaces of the first and second molds by a distance of 2 mm or more and 8 mm or less, respectively.

9. The apparatus of claim 6, wherein each of the plurality of fluid lines has a diameter of 4 mm, the distance between the plurality of fluid lines is 12 mm, and the first and second lines are spaced apart from the first and second mold surfaces of the first and second molds by a distance of 2 mm or more and 8 mm or less, respectively.

10. The light guide plate molding die apparatus for high temperature injection molding according to claim 1, wherein the first pipe has a length different from that of the second pipe.