CN218138546U

CN218138546U - Punching device for semiconductor IC packaging tube

Info

Publication number: CN218138546U
Application number: CN202222235791.9U
Authority: CN
Inventors: 郑英祥
Original assignee: Guizhou Shaohua Electronic Technology Co ltd
Current assignee: Guizhou Shaohua Electronic Technology Co ltd
Priority date: 2022-08-25
Filing date: 2022-08-25
Publication date: 2022-12-27
Anticipated expiration: 2032-08-25

Abstract

The utility model discloses a die-cut device of semiconductor IC packing tube, including die-cut platform, the surface of die-cut platform sets up the supporting seat, the surface of supporting seat sets up the cylinder, the propulsion rod terminal surface of cylinder is fixed with the blade holder, the surface mounting of blade holder has the die-cutting sword, the outside of blade holder is provided with positioner, through set up positioner outside the blade holder, can directly extrude the location when the die-cut descends, and the die-cut location of being convenient for saves the drive apparatus cost.

Description

Punching device for semiconductor IC packaging tube

Technical Field

The utility model relates to a IC packing tube processing field, more specifically say, relate to a die-cut device of semiconductor IC packing tube.

Background

The semiconductor IC electronic packaging tube is a transparent plastic tube, the structure of the semiconductor IC electronic packaging tube is of a square concave type, and punching is needed during processing;

the existing punching device is inconvenient to position the structure of the IC packaging tube, and needs to use independent drive to extrude and position when punching, so that the punching and positioning are inconvenient, and the equipment cost is increased.

SUMMERY OF THE UTILITY MODEL

To the problem that exists among the prior art, the utility model aims to provide a die-cut device of semiconductor IC packing tube through set up positioner outside the blade holder, can directly extrude the location when the die-cut descends, and the drive equipment cost is saved in the die-cut location of being convenient for.

In order to solve the above problems, the utility model adopts the following technical proposal.

The utility model provides a die-cut device of semiconductor IC packing tube, includes die-cut platform, the surface of die-cut platform sets up the supporting seat, the surface of supporting seat sets up the cylinder, the propulsion rod terminal surface of cylinder is fixed with the blade holder, the surface mounting of blade holder has die-cutting knife, the outside of blade holder is provided with positioner, through set up positioner outside the blade holder, can directly extrude the location when the die-cut descends, and the die-cut location of being convenient for saves the drive apparatus cost.

Furthermore, positioner includes locating lever and nut, and the locating lever alternates at the inboard surface of blade holder, and the nut passes through the screw thread to be installed at the surface of blade holder, and the lower fixed surface of locating lever has the clamp plate, and the lower fixed surface of clamp plate has vertical board, and the drive clamp plate descends when being convenient for die-cut, can be convenient for extrude the location.

Furthermore, the outer surface of the positioning rod is sleeved with a pressure spring, so that the pressure spring is compressed to generate extrusion elasticity during extrusion, and the elastic extrusion positioning is facilitated.

Furthermore, the longitudinal plates are uniformly distributed on the lower surface of the pressing plate, so that the longitudinal plates are uniformly distributed, the extrusion fixing area is increased, and the extrusion positioning is firm.

Furthermore, the lower surface of the longitudinal plate is fixed with a rubber strip, so that friction is increased, and abrasion is avoided.

Furthermore, the surface of the punching platform is provided with a cutter falling groove, so that the cutter falling groove is convenient to position and does not damage a cutter edge.

Furthermore, the punching cutter is fixed on the outer surface of the cutter holder through a bolt, and the installation is convenient.

Compared with the prior art, the utility model has the advantages of:

(1) The positioning device is arranged outside the cutter holder, so that the punching and positioning can be directly carried out when the cutter is lowered and punched, the punching and positioning are facilitated, and the cost of driving equipment is saved.

(2) The positioning device comprises a positioning rod and a nut, the positioning rod is inserted into the inner side surface of the tool apron, the nut is installed on the outer surface of the tool apron through threads, a pressing plate is fixed on the lower surface of the positioning rod, a longitudinal plate is fixed on the lower surface of the pressing plate, the pressing plate is driven to descend when punching is facilitated, and extrusion positioning can be facilitated.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged view of the point A of the present invention;

fig. 3 is a right side view of the connection relationship between the tool holder and the positioning rod of the present invention.

The reference numbers in the figures illustrate:

1 punching platform, 2 supporting seats, 3 cylinders, 4 tool holders, 5 punching cutters, 6 positioning devices, 60 positioning rods, 61 nuts, 62 pressing plates, 63 longitudinal plates, 64 compression springs, 630 rubber strips, 100 cutter grooves and 50 bolts.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-3, a semiconductor IC packaging tube punching device includes a punching table 1, a supporting seat 2 is disposed on the surface of the punching table 1, a cylinder 3 is disposed on the surface of the supporting seat 2, a cutter holder 4 is fixed on the end face of a push rod of the cylinder 3, a punching cutter 5 is mounted on the outer surface of the cutter holder 4, and a positioning device 6 is disposed on the outer side of the cutter holder 4;

the positioning device 6 comprises a positioning rod 60 and a nut 61, the positioning rod 60 is inserted into the inner side surface of the tool apron 4, the nut 61 is installed on the outer surface of the tool apron 4 through threads, a pressing plate 62 is fixed on the lower surface of the positioning rod 60, a longitudinal plate 63 is fixed on the lower surface of the pressing plate 62, a pressure spring 64 is sleeved on the outer surface of the positioning rod 60, the longitudinal plate 63 is uniformly distributed on the lower surface of the pressing plate 62, and rubber strips 630 are fixed on the lower surface of the longitudinal plate 63, so that friction is increased during extrusion;

during the use, with the inboard feeding that impels of IC packing tube laminating supporting seat 2, during die-cut blanking, can directly drive clamp plate 62 and descend, can press the surface at the IC packing tube with vertical board 63 earlier, during die-cut, compressible pressure spring 64 can push clamp plate 62 downwards, can compress tightly IC packing tube fixed, and the direct positioning when being convenient for die-cut need not establish in addition the drive arrangement extrusion, reduction equipment cost.

Example 2

Referring to fig. 1-3, a semiconductor IC packaging tube punching device comprises a punching table 1, a supporting seat 2 is arranged on the surface of the punching table 1, an air cylinder 3 is arranged on the surface of the supporting seat 2, a cutter holder 4 is fixed on the end face of a pushing rod of the air cylinder 3, a punching cutter 5 is arranged on the outer surface of the cutter holder 4, the punching cutter 5 is fixed on the outer surface of the cutter holder 4 through a bolt 50, the installation is convenient, and a positioning device 6 is arranged on the outer side of the cutter holder 4;

the cutter falling groove 100 is formed in the surface of the punching platform 1, the cutter holder 4 can be driven to descend through the air cylinder 3, the punching cutter 5 can be driven to descend to punch the IC packaging tube, the punching cutter 5 can fall into the cutter falling groove 100 to be supported and positioned, and the cutter edge cannot be damaged.

The foregoing is only a preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the protection scope of the present invention by replacing or changing the technical solution and the modified concept of the present invention within the technical scope of the present invention.

Claims

1. A semiconductor IC packaging tube punching device comprises a punching table (1) and is characterized in that: the surface of die-cut platform (1) sets up supporting seat (2), the surface of supporting seat (2) sets up cylinder (3), the propelling rod terminal surface of cylinder (3) is fixed with blade holder (4), the surface mounting of blade holder (4) has die-cutting knife (5), the outside of blade holder (4) is provided with positioner (6).

2. A semiconductor IC packaging tube die-cutting device as defined in claim 1, wherein: positioner (6) include locating lever (60) and nut (61), and locating lever (60) alternate at the inboard surface of blade holder (4), and nut (61) pass through the screw thread and install the surface at blade holder (4), and the lower fixed surface of locating lever (60) has clamp plate (62), and the lower fixed surface of clamp plate (62) has vertical board (63).

3. A semiconductor IC packaging tube die-cutting device as defined in claim 2, wherein: the outer surface of the positioning rod (60) is sleeved with a pressure spring (64).

4. A semiconductor IC packaging tube die-cutting device as defined in claim 2, wherein: the longitudinal plates (63) are uniformly distributed on the lower surface of the pressing plate (62).

5. A semiconductor IC packaging tube die-cutting device as defined in claim 2, wherein: and a rubber strip (630) is fixed on the lower surface of the longitudinal plate (63).

6. The semiconductor IC packaging tube die-cutting device according to claim 1, wherein: a cutter falling groove (100) is formed in the surface of the punching platform (1).

7. A semiconductor IC packaging tube die-cutting device as defined in claim 1, wherein: the punching cutter (5) is fixed on the outer surface of the cutter holder (4) through a bolt (50).