CN218137350U

CN218137350U - Polishing device for reflow soldering tin-plated copper-clad steel wire

Info

Publication number: CN218137350U
Application number: CN202221159447.XU
Authority: CN
Inventors: 韩相日
Original assignee: Jiangmen Hancheng Metal Co ltd
Current assignee: Jiangmen Hancheng Metal Co ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-12-27
Anticipated expiration: 2032-05-13

Abstract

The utility model relates to the field of tinned copper clad steel wires, in particular to a polishing device for reflow soldering tinned copper clad steel wires, which comprises a collecting box, a polishing box, a first water pump, a collecting cylinder, a first liquid outlet pipe, a spray head, a first buffer plate, a second buffer plate, a first spring, a plurality of second springs and a second liquid outlet pipe; the collecting cylinder is arranged on the polishing box; the first water pump is arranged in the collecting cylinder; the first liquid outlet pipe is connected with the first water pump and the spray head; the second buffer plate is arranged in the collecting box in a sliding mode, through holes are formed in the second buffer plate, and the second buffer plate is connected with the collecting box through a plurality of second springs; one end of the first spring is connected with the inner wall of the bottom surface of the collecting box, and the other end of the first spring penetrates through the through hole and is connected with the first buffer plate; a second water pump is arranged in the collecting box; two ends of the second liquid outlet pipe are respectively communicated with the polishing box and the collecting box, and a filter plate is arranged in the second liquid outlet pipe. The utility model discloses simple structure is convenient for carry out the buffer protection and be convenient for carry out the drainage to solution to the wire rod.

Description

Polishing device for reflow soldering tin-plated copper-clad steel wire

Technical Field

The utility model belongs to the technical field of tinned copper clad steel wire and specifically relates to a burnishing device of reflow soldering tinned copper clad steel wire.

Background

Tin-plated copper-clad steel wire is a multi-metal composite wire widely used in the electronic industry, and has high conductivity of copper wire, high strength, bendability of steel wire, and corrosion resistance of tin. However, the existing tin-copper-plated steel cannot be suitable for reflow soldering, and in order to meet the requirement that the existing tin-copper-plated steel is suitable for reflow soldering, the production process of the tin-copper-plated steel needs to be improved, namely, the polishing of the tin-copper-plated steel before the wire is taken up and coiled is improved, and a liquid medicine containing 5% of antioxidant liquid medicine is added before an eye-passing die to soak wires; washing with water after the eye mask is formed; the wire is soaked in a high temperature resistant variable coloring agent (TT-301) liquid medicine stock solution; and then the wire is washed by hot water so as to achieve the purpose of meeting the reflow soldering.

Chinese patent with publication number CN209854250U discloses a polishing device for reflow soldering tin-copper-clad steel wires, the liquid spraying pipe is located directly over the guide mechanism and the length direction of the liquid spraying pipe is parallel along the wire inlet direction of the steel wire, the spray head is just opposite to the steel wire, the bottom of the rack is provided with a recovery tank, the recovery tank is communicated with the liquid medicine box body through a return pipe, a filter screen is longitudinally arranged in the recovery tank near the return pipe, and the requirement of adding liquid medicine to the steel wires before polishing can be met to realize the processing of new technology.

However, the device is not convenient for buffering the wires which are put into the device, so that the wires impact the water surface to cause splash splashing, and the practicability of the device is lower.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the problem that exists among the background art, provide a burnishing device of reflow soldering tin-plating copper clad steel wire convenient to buffer protection and be convenient for carry out the drainage to solution to the wire rod.

The technical scheme of the utility model: a polishing device for reflow soldering tin-plated copper-clad steel wires comprises a collecting box, a polishing box, a first water pump, a collecting barrel, a first liquid outlet pipe, a spray head, a first buffer plate, a second buffer plate, a first spring, a plurality of second springs and a second liquid outlet pipe;

a plurality of openings are arranged on the polishing box, and a plurality of supporting legs are arranged on the bottom surface of the polishing box; the collecting cylinder is arranged on the polishing box and is positioned at the plurality of openings, and the collecting cylinder is communicated with the polishing box through the plurality of openings; the first water pump is arranged in the collecting cylinder; one end of the first liquid outlet pipe is connected with the first water pump, and the other end of the first liquid outlet pipe extends into the polishing box and is connected with the spray head;

the second buffer plate is arranged in the collecting box in a sliding mode, through holes are formed in the second buffer plate, and the second buffer plate is connected with the inner wall of the bottom face of the collecting box through a plurality of second springs; the first buffer plate is positioned right above the second buffer plate, and liquid outlet holes are formed in the first buffer plate and the second buffer plate; one end of the first spring is connected with the inner wall of the bottom surface of the collecting box, and the other end of the first spring penetrates through the through hole and is connected with the first buffer plate;

the collecting box is arranged on the polishing box, and a second water pump used for communicating the polishing box is arranged in the collecting box; two ends of the second liquid outlet pipe are respectively communicated with the polishing box and the collecting box, and a filter plate is arranged in the second liquid outlet pipe.

Preferably, the device also comprises a main corrugated pipe, branch pipes and auxiliary corrugated pipes; one end of the main corrugated pipe is connected with the liquid outlet port of the second liquid outlet pipe, and the other end of the main corrugated pipe extends into the collecting box; the branch pipe is arranged on the main corrugated pipe, and a second control valve and a first control valve are respectively arranged on the branch pipe and the second liquid outlet pipe; one end of the auxiliary corrugated pipe is connected with a discharge port of the branch pipe, the other end of the auxiliary corrugated pipe is matched with the branch pipe to stretch into the collecting box, and filter screens are arranged in the auxiliary corrugated pipe and the main corrugated pipe.

Preferably, the main corrugated pipe and the branch pipes are of an integrally formed structure.

Preferably, a plurality of spray heads are arranged; the plurality of spray heads are uniformly distributed on the inner circumferential surface of the polishing box.

Preferably, the discharging directions of the plurality of spray heads face to the central axis direction of the polishing box.

Preferably, the device also comprises a connecting plate; the connecting plate is arranged on the plurality of supporting legs; the collecting box is arranged on the connecting plate.

Preferably, a plurality of first raised plates are arranged on the first buffer plate; the second buffer plate is provided with a plurality of second protruding plates.

Preferably, the device further comprises a baffle; the baffle is arranged at the opening of the polishing box.

Compared with the prior art, the utility model discloses following profitable technological effect has:

a user puts a plurality of wires into the polishing box, the first springs buffer and support the first buffer plate and the plurality of wires, and the second springs buffer the second buffer plate, so that the plurality of wires are further buffered, and the impact of the plurality of wires on liquid in the polishing box is reduced; the liquid level in the polishing box rises, liquid enters the collecting cylinder through the plurality of openings, and the first water pump sprays the liquid in the collecting cylinder to the upper surfaces of the plurality of wires through the plurality of spray heads, so that the wires can be polished comprehensively; meanwhile, the plurality of openings limit the height of the liquid level, so that the situation that excessive wires are put into the polishing box to cause the liquid level to gush out of the polishing box is avoided, and the practicability of the device is further improved; a user connects and disconnects the branch pipe and the second liquid outlet pipe through the second control valve and the first control valve, and the main corrugated pipe and the auxiliary corrugated pipe are convenient for replacing the arranged filter screen; when the filter screen in the main bellows was blockked up, liquid carried out flowing back and filtration through minute pipe and supplementary bellows, blockked up the second drain pipe through first control valve, was convenient for change the filter screen in the main bellows, improved device's practicality.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a front view of the present invention.

Fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Reference numerals: 1. a collection box; 2. a polishing box; 201. an opening; 21. supporting legs; 3. a first water pump; 4. a collection canister; 5. a first liquid outlet pipe; 6. a spray head; 7. a first buffer plate; 71. a first raised plate; 8. A second buffer plate; 81. a second raised plate; 801. a through hole; 9. a first spring; 10. a second spring; 11. a second liquid outlet pipe; 12. a main corrugated pipe; 13. a first control valve; 14. a second control valve; 15. pipe distribution; 16. an auxiliary bellows.

Detailed Description

Example one

As shown in fig. 1-2, the utility model provides a burnishing device of reflow soldering tin-plated copper clad steel wire, including collecting box 1, polishing case 2, first water pump 3, collecting vessel 4, first drain pipe 5, shower nozzle 6, first buffer board 7, second buffer board 8, first spring 9, a plurality of second spring 10, connecting plate, baffle and second drain pipe 11.

A plurality of openings 201 are arranged on the polishing box 2, and a plurality of supporting legs 21 are arranged on the bottom surface of the polishing box 2; the baffle is arranged at the opening of the polishing box 2, so that splashed liquid can be conveniently blocked; the collecting cylinder 4 is arranged on the polishing box 2, the collecting cylinder 4 is positioned at the plurality of openings 201, and the collecting cylinder 4 is communicated with the polishing box 2 through the plurality of openings 201; the first water pump 3 is arranged in the collecting cylinder 4; one end of a first liquid outlet pipe 5 is connected with a first water pump 3, and the other end of the first liquid outlet pipe 5 extends into the polishing box 2 and is connected with a spray head 6; a plurality of spray heads 6 are arranged; a plurality of 6 evenly distributed of shower nozzle are on the inner peripheral surface of polishing case 2, and the ejection of compact direction of a plurality of shower nozzles 6 all faces the axis direction of polishing case 2, through setting up the upper surface that first water pump 3 and a plurality of shower nozzle 6 spout the liquid in the surge drum 4 to the wire rod, are convenient for carry out comprehensive polishing to the wire rod, have improved the practicality of device.

The second buffer plate 8 is arranged in the collecting box 1 in a sliding mode, a through hole 801 is formed in the second buffer plate 8, and the second buffer plate 8 is connected with the inner wall of the bottom face of the collecting box 1 through a plurality of second springs 10; the first buffer plate 7 is positioned right above the second buffer plate 8, and liquid outlet holes are formed in the first buffer plate 7 and the second buffer plate 8; one end of the first spring 9 is connected with the inner wall of the bottom surface of the collecting box 1, and the other end of the first spring 9 penetrates through the through hole 801 and is connected with the first buffer plate 7; a plurality of first convex plates 71 are arranged on the first buffer plate 7; a plurality of second protrusion plates 81 are provided on the second buffer plate 8.

The collecting box 1 is arranged on the polishing box 2, and a second water pump used for communicating the polishing box 2 is arranged in the collecting box 1; two ends of the second liquid outlet pipe 11 are respectively communicated with the polishing box 2 and the collecting box 1, and a filter plate is arranged in the second liquid outlet pipe 11; the connecting plate is arranged on a plurality of supporting legs 21; the collecting box 1 is arranged on the connecting plate, and the collecting box 1 is convenient to install by arranging the connecting plate.

In the embodiment, when the polishing box is used, a user puts a plurality of wires into the polishing box 2, the first springs 9 buffer and support the first buffer plate 7 and the plurality of wires, and the second springs 10 buffer the second buffer plate 8, so that the plurality of wires are further buffered, and the impact of the plurality of wires on liquid in the polishing box 2 is reduced; the liquid level in the polishing box 2 rises, liquid enters the collecting cylinder 4 through the plurality of openings 201, and the liquid in the collecting cylinder 4 is sprayed to the upper surfaces of the plurality of wires through the plurality of spray heads 6 by the first water pump 3, so that the wires can be polished comprehensively; simultaneously, a plurality of openings 201 have carried out the restriction to the height of liquid level, have avoided putting into too much wire rod and have made the liquid level to gush out polishing case 2, have further improved the practicality of device.

Example two

As shown in fig. 3, compared with the first embodiment, the polishing apparatus for reflow soldering tin-plated copper-clad steel wire of the present invention further includes a main corrugated pipe 12, a branch pipe 15 and an auxiliary corrugated pipe 16; one end of the main bellows 12 is connected with the liquid outlet port of the second liquid outlet pipe 11, and the other end of the main bellows 12 extends into the collecting box 1; the branch pipe 15 is arranged on the main corrugated pipe 12, and a second control valve 14 and a first control valve 13 are respectively arranged on the branch pipe 15 and the second liquid outlet pipe 11; the second liquid outlet pipe 11 and the branch pipe 15 are of an integrally formed structure, and the integrally formed second liquid outlet pipe 11 and the branch pipe 15 are connected more firmly, so that the service lives of the second liquid outlet pipe 11 and the branch pipe 15 are prolonged; one end of the auxiliary corrugated pipe 16 is connected with a discharge port of the branch pipe 15, the other end of the auxiliary corrugated pipe 16 is matched with and extends into the collecting box 1, and filter screens are arranged in the auxiliary corrugated pipe 16 and the main corrugated pipe 12.

In this embodiment, when in use, a user connects and disconnects the branch pipe 15 and the second liquid outlet pipe 11 through the second control valve 14 and the first control valve 13, and the main corrugated pipe 12 and the auxiliary corrugated pipe 16 facilitate replacement of the filter screen; when the filter screen in the main bellows 12 was blockked up, liquid carried out flowing back and filtration through branch pipe 15 and supplementary bellows 16, blockked up second drain pipe 11 through first control valve 13, was convenient for change the filter screen in the main bellows 12, improved device's practicality.

The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made without departing from the gist of the present invention within the knowledge of those skilled in the art.

Claims

1. A polishing device for reflow soldering tin-plated copper-clad steel wires is characterized by comprising a collecting box (1), a polishing box (2), a first water pump (3), a collecting barrel (4), a first liquid outlet pipe (5), a spray head (6), a first buffer plate (7), a second buffer plate (8), a first spring (9), a plurality of second springs (10) and a second liquid outlet pipe (11);

a plurality of openings (201) are arranged on the polishing box (2), and a plurality of supporting legs (21) are arranged on the bottom surface of the polishing box (2); the collecting cylinder (4) is arranged on the polishing box (2), the collecting cylinder (4) is positioned at the plurality of openings (201), and the collecting cylinder (4) is communicated with the polishing box (2) through the plurality of openings (201); the first water pump (3) is arranged in the collecting cylinder (4); one end of the first liquid outlet pipe (5) is connected with the first water pump (3), and the other end of the first liquid outlet pipe (5) extends into the polishing box (2) and is connected with the spray head (6);

the second buffer plate (8) is arranged in the collecting box (1) in a sliding mode, a through hole (801) is formed in the second buffer plate (8), and the second buffer plate (8) is connected with the inner wall of the bottom face of the collecting box (1) through a plurality of second springs (10); the first buffer plate (7) is positioned right above the second buffer plate (8), and liquid outlet holes are formed in the first buffer plate (7) and the second buffer plate (8); one end of the first spring (9) is connected with the inner wall of the bottom surface of the collecting box (1), and the other end of the first spring (9) penetrates through the through hole (801) and is connected with the first buffer plate (7);

the collecting box (1) is arranged on the polishing box (2), and a second water pump used for communicating the polishing box (2) is arranged in the collecting box (1); two ends of the second liquid outlet pipe (11) are respectively communicated with the polishing box (2) and the collecting box (1), and a filtering plate is arranged in the second liquid outlet pipe (11).

2. The polishing device for the reflow tinned copper clad steel wire of claim 1, characterized by further comprising a main corrugated pipe (12), a branch pipe (15) and an auxiliary corrugated pipe (16); one end of the main corrugated pipe (12) is connected with the liquid outlet port of the second liquid outlet pipe (11), and the other end of the main corrugated pipe (12) extends into the collection box (1); the branch pipe (15) is arranged on the main corrugated pipe (12), and a second control valve (14) and a first control valve (13) are respectively arranged on the branch pipe (15) and the second liquid outlet pipe (11); one end of the auxiliary corrugated pipe (16) is connected with a discharge port of the branch pipe (15), the other end of the auxiliary corrugated pipe (16) is matched with and extends into the collecting box (1), and filter screens are arranged in the auxiliary corrugated pipe (16) and the main corrugated pipe (12).

3. The device for polishing the reflowed tinned copper clad steel wire according to claim 2, characterized in that the main corrugated pipe (12) and the branch pipe (15) are of an integral structure.

4. The polishing device for the reflow tinned copper clad steel wire of claim 1, characterized in that the shower head (6) is provided in plurality; a plurality of spray heads (6) are uniformly distributed on the inner circumferential surface of the polishing box (2).

5. A polishing device for reflow tinned copper clad steel wire in accordance with claim 4, characterized in that the discharge direction of the plurality of nozzles (6) is toward the central axis of the polishing box (2).

6. The polishing device for the reflow tinned copper clad steel wire of claim 1, characterized by further comprising a connecting plate; the connecting plate is arranged on a plurality of supporting legs (21); the collecting box (1) is arranged on the connecting plate.

7. The polishing device for reflow tin-plated copper-clad steel wire as recited in claim 1, wherein the first buffer plate (7) is provided with a plurality of first convex plates (71); a plurality of second convex plates (81) are arranged on the second buffer plate (8).

8. The polishing device for reflow tin-plated copper clad steel wire as recited in claim 1, further comprising a baffle plate; the baffle is arranged at the opening of the polishing box (2).