CN218132936U - Continuous glue injection structure for semiconductor packaging mold - Google Patents
Continuous glue injection structure for semiconductor packaging mold Download PDFInfo
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- CN218132936U CN218132936U CN202222028040.XU CN202222028040U CN218132936U CN 218132936 U CN218132936 U CN 218132936U CN 202222028040 U CN202222028040 U CN 202222028040U CN 218132936 U CN218132936 U CN 218132936U
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- fixedly connected
- feed cylinder
- feeding
- injecting glue
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Abstract
The utility model discloses a semiconductor packaging mould is with continuous injecting glue structure, belong to semiconductor packaging mould processing field, a semiconductor packaging mould is with continuous injecting glue structure, including the feeding case, the inside of feeding case is provided with quantitative feeding subassembly, quantitative feeding subassembly includes the feed cylinder, the equal fixedly connected with extrusion spring in both sides of feed cylinder bottom, the bottom of extrusion spring and the bottom fixed connection of feeding incasement wall, the both sides of feed cylinder bottom just are located two equal fixedly connected with T type pole between the extrusion spring, the both sides of feed cylinder inner wall bottom just are located two equal fixed mounting between the extrusion spring and have touch switch, one side of feed cylinder is provided with electric telescopic handle through the mount, it can realize the quantitative injecting glue raw materials of adding to the feed cylinder is inside, input through quantitative injecting glue raw materials, not only can guarantee the quality of injecting glue work, reduce the waste, still can shorten the time limit for a project, guarantee the normal clear of injecting glue work, thereby provide very big convenience for the user.
Description
Technical Field
The utility model relates to a semiconductor package mold processing field, more specifically say, relate to a semiconductor package mold is with continuous injecting glue structure.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips through a scribing process, then the cut chips are pasted on the corresponding small islands of the substrate frame through glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate through superfine metal wires or conductive resin to form a required circuit; the individual chips are then encapsulated and protected by a plastic housing.
In order to guarantee the continuous proceeding of semiconductor packaging mold injecting glue work, in the prior art, the staff can generally directly add the injecting glue raw materials to the feed cylinder inside, however, the staff is when injecting the material into the feed cylinder inside, because the injection volume of material is difficult to handle the control, consequently, probably more or less phenomenon is injected to ejection of compact material, when more material is injected, can make the adhesion of residual part in injecting glue mouth department, the continuous operation of equipment has been influenced, and when less material is injected, then can influence the quality of injecting glue work, thereby bring a great deal of inconvenience for the user.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
To the problem that exists among the prior art, the utility model aims to provide a semiconductor packaging is continuous injecting glue structure for mould, it can realize the quantitative injecting glue raw materials of adding to the feed cylinder is inside, through the input of quantitative injecting glue raw materials, not only can guarantee the quality of injecting glue work, reduces extravagantly, still can the reduction of erection time, guarantees the normal clear of injecting glue work to provide very big convenient for the user.
2. Technical scheme
In order to solve the above problems, the utility model adopts the following technical proposal.
The utility model provides a semiconductor packaging is continuous injecting glue structure for mould, includes the feeding case, the inside of feeding case is provided with quantitative feeding subassembly, quantitative feeding subassembly includes the feed cylinder, the equal fixedly connected with extrusion spring in both sides of feed cylinder bottom, the bottom of extrusion spring and the bottom fixed connection of feeding incasement wall, the both sides of feed cylinder bottom just are located equal fixedly connected with T type pole between two extrusion springs, the both sides of feed cylinder inner wall bottom just are located equal fixed mounting between two extrusion springs and have touch switch, one side of feed cylinder is provided with electric telescopic handle through the mount, the feed chute department of feed cylinder articulates through the hinge has the stop gate, the bottom fixedly connected with who blocks the gate rotates the seat, electric telescopic handle's output is connected through round pin axle and one side rotation seat, electric telescopic handle is electric connection with touch switch, the top fixedly connected with agitator motor of feeding case, agitator motor's output fixedly connected with (mixing) shaft, the one end of (mixing) shaft runs through feeding case and feed cylinder in proper order and extends to the inside of feed cylinder, the (mixing shaft extends to the auger.
Further, the equal fixedly connected with hot plate in both sides of feed cylinder inner wall, the heating tank has been seted up to the inside of hot plate, fixedly connected with heat conduction pole between the top of heating tank inner wall and the bottom, the circular telegram mode of heat conduction pole is external power supply, through the power of switch-on heat conduction pole, can conveniently heat the inside of feed cylinder to can guarantee the inside stable relative invariant of feed cylinder, and then can effectively reduce the probability of injecting glue raw materials caking, guarantee going on smoothly of injecting glue process.
Further, a discharge port is formed in the bottom end of the feeding box, and the size of the discharge port is matched with that of the upper feed chute and the lower feed chute of the feed cylinder.
Further, the fixedly connected with of discharge gate department of feeding case divides the liquid fill, the bottom evenly distributed who divides the liquid fill has a plurality of injecting glue mouths, through the setting of a plurality of injecting glue mouths, can conveniently carry out injecting glue work, convenient to use to a plurality of semiconductor packaging mold.
Further, the top of feeding case is provided with the inlet pipe, the bottom of inlet pipe runs through feeding case and feed cylinder in proper order and extends to the inside of feed cylinder, is provided with control flap on the inlet pipe, through control flap's setting, can make things convenient for the staff to regulate and control it.
Further, the equal fixed mounting in both sides of feeding case has the supporting leg, and the quantity of supporting leg is two, and two supporting leg symmetries set up, through setting up the supporting leg, can conveniently support equipment is whole to the staff of can being convenient for carries out follow-up operation.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages of:
(1) This scheme can realize the quantitative injecting glue raw materials of adding to feed cylinder inside, through the input of quantitative injecting glue raw materials, not only can guarantee the quality of injecting glue work, reduces extravagantly, still can the reduction of erection time, guarantees the normal clear of injecting glue work to provide very big convenient for the user.
(2) This scheme the equal fixedly connected with hot plate in both sides of feed cylinder inner wall, the heating groove has been seted up to the inside of hot plate, fixedly connected with heat conduction pole between the top of heating inslot wall and the bottom, the circular telegram mode of heat conduction pole is external power supply, through the power of switch-on heat conduction pole, can conveniently heat the inside of feed cylinder to can guarantee the inside stable relatively invariable of feed cylinder, and then can effectively reduce the probability of injecting glue raw materials caking, guarantee going on smoothly of injecting glue process.
(3) This scheme the discharge gate has been seted up to the bottom of feeding case, the size of discharge gate and the feed cylinder size phase-match of silo from top to bottom.
(4) This scheme the discharge gate department fixedly connected with of feeding case divides the liquid fill, the bottom evenly distributed who divides the liquid fill has a plurality of injecting glue mouths, through the setting of a plurality of injecting glue mouths, can conveniently carry out injecting glue work, convenient to use to a plurality of semiconductor packaging mold.
(5) This scheme the top of feeding case is provided with the inlet pipe, the bottom of inlet pipe runs through feeding case and feed cylinder in proper order and extends to the inside of feed cylinder, is provided with control flap on the inlet pipe, through control flap's setting, can make things convenient for the staff to regulate and control it.
(6) This scheme the equal fixed mounting in both sides of feeding case has the supporting leg, and the quantity of supporting leg is two, and two supporting leg symmetries set up, through setting up the supporting leg, can conveniently support equipment is whole to the staff of can being convenient for carries out follow-up operation.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a three-dimensional view of a portion of the structure shown in FIG. 1;
FIG. 3 is a schematic view of the internal structure of the cartridge shown in FIG. 2;
fig. 4 is a schematic view illustrating an internal structure of the heating plate shown in fig. 3.
The numbering in the figures illustrates:
1. a feeding box; 2. a liquid separating hopper; 3. a glue injection nozzle; 4. a feed pipe; 5. a dosing assembly; 51. a charging barrel; 52. a compression spring; 53. a T-shaped rod; 54. a touch switch; 55. an electric telescopic rod; 56. a blocking door; 57. rotating the base; 58. a stirring motor; 59. a stirring shaft; 510. a packing auger; 511. heating plates; 512. a heating tank; 513. a heat conducting rod; 514. a discharge port; 6. and (7) supporting legs.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-4, a continuous glue injection structure for a semiconductor encapsulation mold includes a feeding box 1, a quantitative feeding assembly 5 is disposed inside the feeding box 1, the quantitative feeding assembly 5 includes a charging barrel 51, extrusion springs 52 are fixedly connected to both sides of the bottom of the charging barrel 51, the bottom ends of the extrusion springs 52 are fixedly connected to the bottom of the inner wall of the feeding box 1, T-shaped rods 53 are fixedly connected to both sides of the bottom of the charging barrel 51 and between the two extrusion springs 52, trigger switches 54 are fixedly mounted on both sides of the bottom of the inner wall of the charging barrel 51 and between the two extrusion springs 52, an electric telescopic rod 55 is disposed on one side of the charging barrel 51 through a fixing frame, a blocking door 56 is hinged to a discharging chute of the charging barrel 51 through a hinge, a rotating base 57 is fixedly connected to the bottom of the blocking door 56, an output end of the electric telescopic rod 55 is rotatably connected to one side of the rotating base 57 through a pin shaft, the electric telescopic rod 55 is electrically connected to the trigger switches 54, an agitating motor 58 is fixedly connected to the top of the feeding box 1, an output end of the agitating motor 58 is fixedly connected to an agitating shaft 59, one end of the agitating motor 59, and one end of the agitating shaft 59 is fixedly connected to the charging barrel 51, and extends to the inner wall 510 of the charging barrel 51.
Please refer to fig. 1-4, both sides of the inner wall of the charging barrel 51 are fixedly connected with a heating plate 511, a heating groove 512 is provided inside the heating plate 511, a heat conducting rod 513 is fixedly connected between the top and the bottom of the inner wall of the heating groove 512, the conduction mode of the heat conducting rod 513 is an external power supply, the inside of the charging barrel 51 can be conveniently heated by switching on the power supply of the heat conducting rod 513, so that the stability inside the charging barrel 51 can be ensured to be relatively constant, the probability of agglomeration of the glue injection raw materials can be effectively reduced, and the smooth proceeding of the glue injection process is ensured.
Referring to fig. 2-3, the bottom end of the feeding box 1 is provided with a discharge port 514, and the size of the discharge port 514 matches with the size of the feeding trough and the discharging trough of the charging barrel 51.
Referring to fig. 1, a discharge port 514 of a feeding box 1 is fixedly connected with a liquid separating hopper 2, a plurality of glue injection nozzles 3 are uniformly distributed at the bottom of the liquid separating hopper 2, and glue injection work can be conveniently performed on a plurality of semiconductor packaging molds through the arrangement of the plurality of glue injection nozzles 3, so that the use is convenient.
Referring to fig. 1-3, a feeding pipe 4 is disposed at the top of the feeding box 1, the bottom end of the feeding pipe 4 sequentially penetrates through the feeding box 1 and the charging barrel 51 and extends into the charging barrel 51, and a control valve is disposed on the feeding pipe 4, and can be conveniently controlled by a worker through the control valve.
Referring to fig. 1, the two sides of the feeding box 1 are fixedly provided with two supporting legs 6, the two supporting legs 6 are symmetrically arranged, and the whole equipment can be conveniently supported by arranging the supporting legs 6, so that the subsequent operation of workers can be facilitated.
The working principle is as follows: when the glue injection device is used, glue injection raw materials enter the material cylinder 51 through the feeding pipe 4, meanwhile, the power supplies of the heating plate 511 and the stirring motor 58 can be connected, the entering glue injection raw materials can be heated through the heating plate 511, the auger 510 can be indirectly driven to stir the entering glue injection raw materials through the rotation of the stirring shaft 59 by driving the stirring motor 58, the temperature inside the material cylinder 51 can be kept relatively stable through heating the entering glue injection raw materials, the uniformity of the temperature inside the material cylinder 51 can be further improved through stirring the entering glue injection raw materials, and therefore the phenomenon of material agglomeration is effectively avoided;
through the continuous entering of injecting glue raw materials, the weight of feed cylinder 51 can constantly aggravate, at this moment, feed cylinder 51 will extrude the extrusion spring 52 of bottom, and make it take place deformation, move down through feed cylinder 51 and can indirectly drive T type pole 53 and move down, when the injecting glue raw materials of feed cylinder 51 inside reach certain weight, T type pole 53 will contact with touch switch 54, because touch switch 54 and electric telescopic handle 55 are electric connection, at this moment, electric telescopic handle 55 will shorten, through the shortening of electric telescopic handle 55, can indirectly drive stop gate 56 and rotate, through the rotation of stop gate 56, can make the injecting glue raw materials of feed cylinder 51 inside pass through discharge gate 514 and get into the inside of branch liquid fill 2, can shunt it through the injecting glue mouth 3 of 2 bottoms, conveniently carry out the injecting glue respectively to a plurality of semiconductor packaging mould, so reciprocate, can realize the continuous injecting glue work of semiconductor packaging mould, through utilizing quantitative injecting glue raw materials to carry out a plurality of semiconductor packaging mould work, not only can guarantee the quality of injecting glue work, waste, still can shorten the time limit for a project, and then guarantee the normal work of injecting glue, provide convenient user for injecting glue.
The foregoing is only a preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the protection scope of the present invention by replacing or changing the technical solution and the modified concept of the present invention within the technical scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor packaging mould is with continuous injecting glue structure, includes feeding case (1), its characterized in that: the quantitative feeding device is characterized in that a quantitative feeding assembly (5) is arranged inside the feeding box (1), the quantitative feeding assembly (5) comprises a charging barrel (51), extrusion springs (52) are fixedly connected to two sides of the bottom of the charging barrel (51), the bottom ends of the extrusion springs (52) are fixedly connected with the bottom of the inner wall of the feeding box (1), T-shaped rods (53) are fixedly connected to two sides of the bottom of the charging barrel (51) and are positioned between the two extrusion springs (52), a trigger switch (54) is fixedly mounted on two sides of the bottom of the inner wall of the charging barrel (51) and is positioned between the two extrusion springs (52), an electric telescopic rod (55) is arranged on one side of the charging barrel (51) through a fixing frame, a blocking door (56) is hinged to a discharging groove of the charging barrel (51) through a hinge, a rotating seat (57) is fixedly connected to the bottom of the blocking door (56), an output end of the electric telescopic rod (55) is rotatably connected with one side of the rotating seat (57) through a pin shaft, the electric telescopic rod (55) is electrically connected with the switch (54), a stirring motor (58) is fixedly connected to the top of the feeding box (1), an output end of the stirring motor (58) sequentially penetrates through the charging barrel (59) and extends out of the stirring box (51), the stirring shaft (59) extends to one end inside the charging barrel (51) and is fixedly connected with a packing auger (510).
2. The continuous glue injection structure for the semiconductor packaging mold as claimed in claim 1, wherein: the equal fixedly connected with hot plate (511) in both sides of feed cylinder (51) inner wall, heating groove (512) have been seted up to the inside of hot plate (511), fixedly connected with heat conduction pole (513) between the top of heating groove (512) inner wall and the bottom.
3. The continuous glue injection structure for the semiconductor packaging mold as claimed in claim 1, wherein: the bottom of feeding case (1) has seted up discharge gate (514).
4. The continuous glue injection structure for the semiconductor packaging mold as claimed in claim 3, wherein: discharge gate (514) department fixedly connected with of feeding case (1) divides liquid fill (2), the bottom evenly distributed of dividing liquid fill (2) has a plurality of injecting glue mouths (3).
5. The continuous glue injection structure for the semiconductor packaging mold as claimed in claim 1, wherein: the top of feeding case (1) is provided with inlet pipe (4), the bottom of inlet pipe (4) runs through feeding case (1) and feed cylinder (51) in proper order and extends to the inside of feed cylinder (51).
6. The continuous glue injection structure for the semiconductor packaging mold as claimed in claim 1, wherein: the equal fixed mounting in both sides of feeding case (1) has supporting leg (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222028040.XU CN218132936U (en) | 2022-08-02 | 2022-08-02 | Continuous glue injection structure for semiconductor packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222028040.XU CN218132936U (en) | 2022-08-02 | 2022-08-02 | Continuous glue injection structure for semiconductor packaging mold |
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| Publication Number | Publication Date |
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| CN218132936U true CN218132936U (en) | 2022-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222028040.XU Active CN218132936U (en) | 2022-08-02 | 2022-08-02 | Continuous glue injection structure for semiconductor packaging mold |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116061386A (en) * | 2023-04-06 | 2023-05-05 | 扬州新扬光科技有限公司 | Injection molding device for diode |
| CN117293065A (en) * | 2023-11-24 | 2023-12-26 | 深圳市七彩虹禹贡科技发展有限公司 | Memory bank packaging assembly and manufacturing method thereof |
-
2022
- 2022-08-02 CN CN202222028040.XU patent/CN218132936U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116061386A (en) * | 2023-04-06 | 2023-05-05 | 扬州新扬光科技有限公司 | Injection molding device for diode |
| CN117293065A (en) * | 2023-11-24 | 2023-12-26 | 深圳市七彩虹禹贡科技发展有限公司 | Memory bank packaging assembly and manufacturing method thereof |
| CN117293065B (en) * | 2023-11-24 | 2024-03-12 | 深圳市七彩虹禹贡科技发展有限公司 | Memory bank packaging assembly and manufacturing method thereof |
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