CN218103453U - Electret static earphone structure and head-wearing earphone - Google Patents

Abstract

The utility model discloses an electret static headphone structure and a headphone, electret static headphone structure includes: an insulating support; the metal front cover is buckled with the insulating support to form a first containing cavity; the electrostatic vibrating diaphragm, the insulating ring, the electret polar plate and the acoustic damping assembly are sequentially stacked in the first containing cavity, the acoustic damping assembly is attached to the insulating support, and the electrostatic vibrating diaphragm is attached to the metal front cover; the voltage boosting assembly is arranged on one side, away from the acoustic damping assembly, of the insulating support and is used for generating voltage signals between the electrostatic vibrating diaphragm and the electret polar plate. The utility model does not need an external DC power supply to provide bias voltage, and reduces the production cost while the structure is simpler; a first containing cavity is formed by buckling the metal front cover and the insulating support, so that the electrostatic vibrating diaphragm and the electret polar plate can be packaged and protected, and the assembly process is more reliable. The utility model discloses but wide application in earphone technical field.

Description

Electret static earphone structure and head-wearing earphone

Technical Field

The utility model belongs to the technical field of the earphone technique and specifically relates to an electret static headphone structure and a headphone.

Background

Earphones are common sound reproducing devices for people, and from the sound production principle, moving coil earphones are common. The moving-coil earphone unit mainly comprises various accessories such as a vibrating diaphragm, a voice coil and a magnet, and when an acoustic signal current passes through the voice coil, the voice coil can be acted by an ampere force, so that the voice coil vibrates up and down. The voice coil vibrates to drive the vibrating diaphragm to vibrate together, and the surrounding air is pushed to generate corresponding sound waves. Since the sound signal changes rapidly and the frequency information contained therein is very rich, the vibration mode of the diaphragm also changes rapidly along with the sound signal. However, at a specific moment, the diaphragm is expected to be a whole body and to vibrate uniformly, which requires that the material of the diaphragm is rigid, and the internal damping is high, so that the vibration is attenuated quickly, and the transient response is good. However, the actual diaphragm material is not rigid and not planar, and when vibrating, it often happens that the diaphragm is divided into a plurality of areas to vibrate, forming a plurality of local vibrations, thereby bringing distortion and affecting the restoration degree and the naturalness of sound. In addition, the diaphragm is made of thicker material and cannot respond to the change of signals in time.

The electrostatic earphone can better improve the problems, the basic principle is that a micron-sized plane vibrating diaphragm is fixed in an electrostatic field formed by two metal plates (stators), and when acoustic signal current is loaded on the stators, the electrostatic field changes to cause the change of the electrostatic adsorption force of the polar plate on the vibrating diaphragm, so that the vibrating diaphragm is driven to vibrate. The structure ensures that the electrostatic earphone has high response speed, can reproduce various small details of sound, has good analytic force, and therefore has good transient response, accurate detail expression and smaller distortion. In addition, the vibrating diaphragm of the electrostatic earphone is planar, the electric field is uniform on the whole plane, the vibrating diaphragm can be linearly driven in the same phase, and no segmentation vibration exists.

Most of the electrostatic earphones in the current market are designed by an external power amplifier and earphones, and because direct-current high voltage and alternating-current high voltage are output, the power of the power amplifier is large, the volume of the power amplifier is large, and the whole earphone is not easy to carry; the power amplifier output is divided into three groups of lines of bias high voltage and signal +/-high voltage, the bias high voltage is connected with the vibrating diaphragm, and the signal +/-high voltage is connected with the polar plates on two sides of the vibrating diaphragm respectively, so that the structure of the earphone is complex, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

To solve the above technical problem, the utility model discloses an aspect's aim at: the electret electrostatic earphone structure is simple in structure and low in production cost.

The utility model discloses another aspect's aim at: a portable headset is provided.

The utility model discloses the technical scheme who takes of first aspect is:

an insulating support;

the metal front cover is buckled with the insulating bracket to form a first accommodating cavity;

the electrostatic vibration film, the insulating ring, the electret polar plate and the acoustic damping component are sequentially stacked in the first containing cavity, the acoustic damping component is attached to the insulating support, and the electrostatic vibration film is attached to the metal front cover;

the voltage boosting assembly is arranged on one side, away from the acoustic damping assembly, of the insulating support and used for generating a voltage signal between the electrostatic vibrating diaphragm and the electret polar plate.

Further, the boost assembly comprises an audio input end, a boost circuit, an anode output end and a cathode output end, wherein the audio input end is used for inputting audio signals, the anode output end passes through the metal front cover and the electrostatic diaphragm are electrically connected, and the cathode output end is electrically connected with the electret polar plate.

Further, the edge of static vibrating diaphragm is provided with the becket, static vibrating diaphragm pass through the becket with the medial surface laminating setting of metal protecgulum.

Further, the electret static earphone structure still includes the elasticity probe, be equipped with the through-hole on the insulating support, the one end of elasticity probe with the negative pole output end electricity is connected, the other end of elasticity probe passes the through-hole with the acoustic damping subassembly with the electret polar plate electricity is connected.

Further, the acoustic damping component is sound-absorbing cotton.

Furthermore, the electret polar plate is provided with an opening.

Further, go out the phonate hole before being provided with on the metal protecgulum, electret static headphone structure still includes waterproof dust screen, waterproof dust screen sets up the metal protecgulum is kept away from one side of static vibrating diaphragm, just waterproof dust screen covers go out the phonate hole before.

Further, be provided with back phonate hole on the insulating support, electret static headphone structure still includes the tuning paper, the tuning paper sets up the insulating support is kept away from one side of acoustic damping subassembly, just the tuning paper covers back phonate hole.

The utility model discloses the technical scheme that the second aspect was taken is:

a headset, comprising:

a head beam;

the two brackets are respectively arranged at two ends of the head beam;

the earphone shell is rotatably connected with the support and comprises an earphone front cover and an earphone rear shell, and the earphone front cover and the earphone rear shell are buckled to form a second containing cavity;

according to the electret electrostatic earphone structure in the technical scheme adopted by the first aspect, the electret electrostatic earphone structure is arranged in the second accommodating cavity.

Further, the headset further comprises an earmuff, and the earmuff is installed on one side, away from the rear shell of the headset, of the headset front cover.

The utility model discloses an aspect's beneficial effect is: the electret electrostatic earphone structure comprises an insulating support, a metal front cover, an electrostatic vibrating diaphragm, an insulating ring, an electret polar plate, an acoustic damping component and a boosting component, wherein a voltage signal is generated between the electrostatic vibrating diaphragm and the electret polar plate through the boosting component, so that a stable electrostatic field can be formed to drive the electrostatic vibrating diaphragm to vibrate, an external direct-current power supply is not required to provide bias voltage, two polar plates are not required to be arranged to generate an electrostatic field, the structure is simpler, and meanwhile, the production cost is reduced; the metal front cover and the insulating support are buckled to form a first containing cavity, so that the electrostatic vibrating diaphragm and the electret polar plate can be packaged and protected, and the assembly process is more reliable; through the setting of acoustic damping subassembly, can reduce the influence of standing wave and first appearance chamber to the sound wave, improved earphone tone quality.

The utility model discloses on the other hand's beneficial effect is: the headphone comprises a head beam, a support, a headphone shell and the electret electrostatic headphone structure, and the electret electrostatic headphone structure adopts the structural design of an electret polar plate and an electrostatic vibrating diaphragm, so that an external direct-current power supply is not needed to provide bias voltage, and the headphone is more convenient to carry.

Drawings

Fig. 1 is a front view of an electret electrostatic earphone structure provided by an embodiment of the present invention;

fig. 2 is an exploded schematic view of an electret electrostatic earphone structure according to an embodiment of the present invention;

fig. 3 is a front view of a headphone according to an embodiment of the present invention;

fig. 4 is an exploded schematic view of a headphone according to an embodiment of the present invention.

Reference numerals:

1. an electret electrostatic earphone structure; 2. a head beam; 3. a support; 4. an earphone housing; 5. a front cover of the earphone; 6. a rear cover of the earphone; 7. ear cap; 10. an insulating support; 11. a through hole; 12. a rear sound outlet; 20. a metal front cover; 21. a front sound outlet; 30. an electrostatic diaphragm; 40. an insulating ring; 50. an electret plate; 51. opening a hole; 60. an acoustic damping component; 70. a boost assembly; 80. an elastic probe; 90. a waterproof and dustproof net; 100. and (7) mixing paper.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality is two or more, if there is a description that the first and the second are only used for distinguishing the technical features, but not understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the precedence of the indicated technical features.

In the description of the present invention, unless explicitly defined otherwise, the words such as setting, connecting and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention by combining the specific contents of the technical solutions.

Referring to fig. 1 and 2, the embodiment of the utility model provides an electret static earphone structure, include:

an insulating support 10;

the metal front cover 20 is buckled with the insulating bracket 10 to form a first containing cavity;

the electrostatic vibration film 30, the insulating ring 40, the electret polar plate 50 and the acoustic damping component 60 are sequentially stacked in the first cavity, the acoustic damping component 60 is attached to the insulating support 10, and the electrostatic vibration film 30 is attached to the metal front cover 20;

and the voltage boosting assembly 70, the voltage boosting assembly 70 is arranged on one side of the insulating support 10 far away from the acoustic damping assembly 60, and the voltage boosting assembly 70 is used for generating a voltage signal between the electrostatic diaphragm 30 and the electret plate 50.

In the embodiment of the present invention, the electret electrostatic earphone structure includes an insulating support 10, a metal front cover 20, an electrostatic diaphragm 30, an insulating ring 40, an electret plate 50, an acoustic damping component 60, and a boosting component 70, and a voltage signal is generated between the electrostatic diaphragm 30 and the electret plate 50 through the boosting component 70, so that a stable electrostatic field can be formed to drive the electrostatic diaphragm 30 to vibrate, an external dc power supply is not required to provide a bias voltage, two plates are not required to be provided to generate an electrostatic field, and the structure is simpler and the production cost is reduced; the metal front cover 20 and the insulating support 10 are buckled to form a first containing cavity, so that the electrostatic vibrating diaphragm 30 and the electret polar plate 50 can be packaged and protected, and the assembly process is more reliable; through the setting of acoustic damping subassembly 60, can reduce the influence of standing wave and first appearance chamber to the sound wave, improved earphone tone quality.

In some alternative embodiments, the electrostatic diaphragm 30 may be a plated film, and is fabricated to ensure uniform tension in all directions.

As a further optional implementation, the voltage boosting assembly 70 includes an audio input terminal, a voltage boosting circuit, a positive output terminal and a negative output terminal, the audio input terminal is used for inputting audio signals, the positive output terminal is electrically connected to the electrostatic diaphragm 30 through the metal front cover 20, and the negative output terminal is electrically connected to the electret plate 50.

Specifically, the audio signal is amplified by the booster circuit, the amplified positive signal is transmitted to the electrostatic diaphragm 30 made of the electroplated metal material through the metal front cover 20, and the amplified negative signal is transmitted to the electret plate 50. The electret plate 50 has a bias high voltage, the electrostatic diaphragm 30 and the electret plate 50 form an electrostatic field under the voltage of an alternating-current signal, and the electrostatic adsorption force changes along with the change of an audio signal, so that the electrostatic diaphragm 30 vibrates to generate sound waves.

Further as an optional implementation manner, a metal ring is disposed at an edge of the electrostatic diaphragm 30, and the electrostatic diaphragm 30 is attached to the inner side surface of the metal front cover 20 through the metal ring.

Specifically, the metal ring is used to contact the metal front cover 20, thereby transmitting the positive signal of the voltage boosting assembly 70 to the electrostatic diaphragm 30.

Referring to fig. 2, as a further alternative embodiment, the electret electrostatic earphone structure further includes an elastic probe 80, a through hole 11 is provided on the insulating support 10, one end of the elastic probe 80 is electrically connected to the negative output end, and the other end of the elastic probe 80 passes through the through hole 11 and the acoustic damping assembly 60 to be electrically connected to the electret plate 50.

Specifically, the pogo pin 80 is used to connect the negative output terminal of the voltage boosting assembly 70 and the electret plate 50, so as to transmit the negative signal of the voltage boosting assembly 70 to the electret plate 50.

Further as an alternative embodiment, the acoustic damping assembly 60 is an acoustic wool.

Specifically, the acoustic damping component 60 can adopt the sound absorption cotton, and also can adopt other sound absorption materials or sound absorption particles for reducing the influence of the standing wave and the first cavity on the sound wave and improving the sound quality of the earphone.

Referring to fig. 2, in a further alternative embodiment, electret plate 50 is provided with openings 51.

Specifically, the electret plate 50 may be perforated in fan-shaped areas with a pore diameter of 0.8-1.2 mm and a porosity of 5-10%, so as to generate electrostatic adsorption as large as possible and ensure smooth airflow of the plate.

Referring to fig. 2, as a further alternative embodiment, a front sound hole 21 is formed in the metal front cover 20, and the electret electrostatic earphone structure further includes a waterproof dustproof net 90, where the waterproof dustproof net 90 is disposed on a side of the metal front cover 20 away from the electrostatic diaphragm 30, and the waterproof dustproof net 90 covers the front sound hole 21.

Specifically, the waterproof and dustproof mesh 90 is used to protect the interior of the electret electrostatic earphone structure from being contaminated by water or dust, thereby protecting the stability of the electrostatic field in the first chamber.

Referring to fig. 2, as a further alternative embodiment, the insulating support 10 is provided with a rear sound outlet 12, the electret electrostatic earphone structure further comprises a tuning paper 100, the tuning paper 100 is arranged on a side of the insulating support 10 away from the acoustic damping member 60, and the tuning paper 100 covers the rear sound outlet 12.

Specifically, set up acoustic damping subassembly 60 between electret polar plate 50 and insulating support 10, the design has back sound outlet 12 and tuning paper 100 on insulating support 10 simultaneously for whole electret static earphone structure possesses suitable damping when static vibrating diaphragm 30 vibrates, in order to eliminate the influence that the standing wave that the acoustic reflection arouses brought, has further improved earphone tone quality.

Referring to fig. 3 and 4, the present invention further provides a headset, including:

a head beam 2;

two brackets 3 are arranged on two ends of the head beam 2 respectively;

the earphone shell 4 is rotatably connected with the support 3, the earphone shell 4 comprises an earphone front cover 5 and an earphone rear shell 6, and the earphone front cover 5 and the earphone rear shell 6 are buckled to form a second containing cavity;

as in any of the electret electrostatic earphone structures 1 of the above embodiments, the electret electrostatic earphone structure 1 is disposed in the second cavity.

The embodiment of the utility model provides an in, headphone includes nose beam 2, support 3, earphone casing 4 and foretell electret electrostatic earphone structure 1, because electret electrostatic earphone structure 1 adopts electret polar plate 50 and electrostatic vibrating diaphragm 30's structural design, need not external DC power supply and provides bias voltage for headphone portable more.

Referring to fig. 4, as a further alternative embodiment, the headset further comprises an ear muff 7, the ear muff 7 being mounted on the side of the headset front cover 5 facing away from the headset back housing 6.

It is right above the utility model discloses electret static headphone structure and headphone have explained, can understand, the utility model discloses still have following advantage:

1) The sound reduction degree is high, the distortion is small, and the low-frequency response is good;

2) The electret electrostatic earphone structure has simple and reliable assembly process and low cost;

3) Compared with the traditional electrostatic earphone which does not have an external power amplifier box, the electret electrostatic earphone can be directly assembled on the earphone, and the portability is better;

4) By adopting the electret technology, a power amplifier is not required to provide a direct-current bias high-voltage independently;

5) Through the setting of acoustic damping subassembly, both can remain the good characteristics of static earphone transient state, also can reduce the acoustic standing wave, solve the too harsh problem of high pitch.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If there is a description of first and second for the purpose of distinguishing technical features only, this is not to be understood as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.

Claims (10)

1. An electret electrostatic earphone structure, comprising:

an insulating support;

the metal front cover is buckled with the insulating support to form a first containing cavity;

the electrostatic vibration film, the insulating ring, the electret polar plate and the acoustic damping component are sequentially stacked in the first containing cavity, the acoustic damping component is attached to the insulating support, and the electrostatic vibration film is attached to the metal front cover;

the voltage boosting assembly is arranged on one side, away from the acoustic damping assembly, of the insulating support and used for generating a voltage signal between the electrostatic vibrating diaphragm and the electret polar plate.

2. An electret electrostatic earphone structure as claimed in claim 1, wherein: the boost assembly comprises an audio input end, a boost circuit, an anode output end and a cathode output end, wherein the audio input end is used for inputting audio signals, the anode output end passes through the metal front cover and the electrostatic diaphragm are electrically connected, and the cathode output end is electrically connected with the electret polar plate.

3. An electret electrostatic earphone structure as claimed in claim 2, wherein: the edge of static vibrating diaphragm is provided with the becket, the static vibrating diaphragm pass through the becket with the medial surface laminating setting of metal protecgulum.

4. An electret electrostatic earphone structure as claimed in claim 2, wherein: the electret electrostatic earphone structure further comprises an elastic probe, a through hole is formed in the insulating support, one end of the elastic probe is electrically connected with the negative output end, and the other end of the elastic probe penetrates through the through hole and the acoustic damping component and is electrically connected with the electret polar plate.

5. An electret electrostatic earphone structure according to claim 1, wherein: the acoustic damping component is made of sound-absorbing cotton.

6. An electret electrostatic earphone structure as claimed in claim 1, wherein: and the electret polar plate is provided with an opening.

7. An electret electrostatic earphone structure as claimed in claim 1, wherein: go out the phonate hole before being provided with on the metal protecgulum, electret static earphone structure still includes waterproof dust screen, waterproof dust screen sets up the metal protecgulum is kept away from one side of static vibrating diaphragm, just waterproof dust screen covers go out the phonate hole before.

8. An electret electrostatic earphone structure as claimed in claim 1, wherein: the electret electrostatic earphone structure comprises an insulation support and is characterized in that a rear sound outlet is formed in the insulation support, the electret electrostatic earphone structure further comprises a tone tuning paper, the tone tuning paper is arranged on one side of the sound damping component, and the tone tuning paper covers the rear sound outlet.

9. A headset, comprising:

a head beam;

the two brackets are respectively arranged at two ends of the head beam;

the earphone shell is rotatably connected with the support and comprises an earphone front cover and an earphone rear shell, and the earphone front cover and the earphone rear shell are buckled to form a second containing cavity;

an electret electrostatic earphone structure as claimed in any one of claims 1 to 8, disposed in said second cavity.

10. A headphone as claimed in claim 9, wherein: the headset further comprises an earmuff, and the earmuff is installed on one side, away from the rear shell of the headset, of the headset front cover.

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