CN218099471U

CN218099471U - Tester for detecting high and low temperature performance of microelectronic relay chip

Info

Publication number: CN218099471U
Application number: CN202221781727.4U
Authority: CN
Inventors: 余泽敏; 李春华; 王桢; 何思齐
Original assignee: Changzhou Jiuzhao New Energy Technology Co ltd
Current assignee: Changzhou Jiuzhao New Energy Technology Co ltd
Priority date: 2022-07-12
Filing date: 2022-07-12
Publication date: 2022-12-20
Anticipated expiration: 2032-07-12

Abstract

The utility model discloses a detect high low temperature performance tester of microelectronic relay chip, bearing assembly including top demountable installation has bearing structure, bearing assembly includes that up end fixed mounting has the loading board of test base placed in the middle, the rectangle leads to the groove has been seted up between two parties to the inner wall bottom of test base, and the movable installation of rectangle leads to inslot has the extrusion board, the lower terminal surface symmetry fixed mounting of loading board has electric telescopic handle, electric telescopic handle's member stretches out and fixed connection in the lower terminal surface that pushes away the extrusion board, bearing structure includes the backup pad that two symmetries set up, two construct jointly between the opposite one side top of backup pad and be connected with the bearing plate, the up end symmetry demountable installation of bearing plate has the mounting panel, the up end fixed mounting of mounting panel placed in the middle has pneumatic telescopic handle, should detect high low temperature performance tester of microelectronic relay chip, and rational in infrastructure, be convenient for take out after the chip test is accomplished, and the practicality is strong.

Description

Tester for detecting high and low temperature performance of microelectronic relay chip

Technical Field

The utility model belongs to the technical field of the chip capability test, concretely relates to detect high low temperature capability test appearance of microelectronic relay chip.

Background

Microelectronics is a new technology developed with integrated circuits, especially very large scale integrated circuits. The theoretical basis of the development is modern physics established from the end of the 19 th century to the 30 th century, and the microelectronic technology comprises a series of special technologies such as system circuit design, device physics, process technology, material preparation, automatic test, packaging and assembly, and is the sum of all process technologies in microelectronics.

A relay, also known as a relay, is an electronic control device having a control system and a controlled system, typically used in an automatic control circuit, which is actually an "automatic switch" that uses a small current to control a large current. Therefore, the circuit has the functions of automatic regulation, safety protection, circuit conversion and the like. The relay coil is represented in the circuit by a long box symbol, and if the relay has two coils, two parallel rectangular boxes are drawn. Meanwhile, the character symbol J of the relay is marked in the long square frame or beside the long square frame. There are two ways to represent the contacts of a relay: one is to draw them directly on one side of the rectangular frame, which is more intuitive.

The existing microelectronic relay is usually internally provided with a chip, in order to test the working performance of the chip under the conditions of high temperature and low temperature, the chip is usually required to be arranged in a tester for testing before factory sale, the existing chip is usually arranged in a test base during testing, a contact pin and a test circuit are arranged in the test base, the chip is connected with the circuit through the contact pin after being arranged in the test base, so that the test is realized, the chip can be connected with the test circuit through the contact pin, the chip is usually tightly connected with the test base, and the chip is inconvenient to take out after the test is finished, and the chip is very inconvenient.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a detect high low temperature capability test appearance of microelectronic relay chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme does:

a tester for detecting high and low temperature performance of a microelectronic relay chip comprises a bearing assembly, the top of which is detachably provided with a supporting structure;

the bearing component comprises a bearing plate, the upper end face of the bearing plate is fixedly mounted with a test base in the middle, a rectangular through groove is formed in the bottom of the inner wall of the test base in the middle, a pushing plate is movably mounted in the rectangular through groove, an electric telescopic rod is symmetrically and fixedly mounted on the lower end face of the bearing plate, and a rod piece of the electric telescopic rod stretches out and is fixedly connected to the lower end face of the pushing plate.

Furthermore, the supporting structure comprises two symmetrically arranged supporting plates, a bearing plate is jointly constructed and connected between the tops of the opposite surfaces of the two supporting plates, and the mounting plates are symmetrically and detachably mounted on the upper end surfaces of the bearing plate.

Further, the up end of mounting panel fixed mounting has pneumatic telescopic link between two parties, pneumatic telescopic link's member stretches out and fixedly connected with rectangular plate.

Furthermore, a fastening cover fastened to the top of the test base is movably mounted on one surface, far away from the bearing plate, of the rectangular plate, and positioning rods are symmetrically formed on the upper end face of the fastening cover.

Furthermore, one end of the positioning rod, which is far away from the buckling cover, extends out of the rectangular plate and is constructed with a limiting plate, and a pressure-bearing spring which is abutted between the buckling cover and the rectangular plate is sleeved on the outer edge surface of the positioning rod.

Furthermore, the bottoms of the opposite surfaces of the two support plates are respectively provided with a fixing plate, and the upper end surface of each fixing plate is centrally provided with a fixing bolt of which one end can be screwed into the bearing plate.

Furthermore, H-shaped supporting legs are formed on four sides of the lower end face of the bearing plate, and heating pieces and refrigerating pieces are symmetrically and fixedly mounted in the test base.

Compared with the prior art, the utility model discloses following beneficial effect has: thanks to the arrangement of the bearing plate, the test base, the pushing plate and the electric telescopic rod, a chip to be tested can be placed in the test base, the performance of the chip is tested through the test base, after the performance test of the chip is completed, the electric telescopic rod is started, so that the rod piece of the electric telescopic rod extends out, the pushing plate can be pushed to move, the chip in the test base is pushed out through the pushing plate, the chip is taken out, and the test base is very convenient and fast;

benefit from the backup pad, the bearing plate, the mounting panel, air telescopic rod, the rectangular plate, the lock joint lid, the locating lever, limiting plate and pressure-bearing spring's setting, through starting air telescopic rod, can make air telescopic rod's member stretch out and promote the rectangular plate and remove, make the lock joint lid remove towards the test base, after lock joint lid and test base looks butt, the elastic action through pressure-bearing spring can realize the lock joint lid and the contact buffering of test base, avoid the too big chip that leads to the fact of impact force impaired.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the load-bearing assembly of the present invention;

FIG. 3 is a cross-sectional view of the support assembly of the present invention;

fig. 4 is an enlarged schematic view of a structure a in fig. 1 according to the present invention.

In the figure: 1. a load bearing assembly; 101. a carrier plate; 102. h-shaped supporting legs; 103. testing the base; 104. pushing the plate; 105. an electric telescopic rod; 106. a heating plate; 107. a refrigeration plate; 2. a support plate; 3. a fixing plate; 4. fixing the bolt; 5. a bearing plate; 6. mounting a plate; 7. a pneumatic telescopic rod; 8. a rectangular plate; 9. buckling a cover; 10. positioning a rod; 11. a limiting plate; 12. a pressure-bearing spring.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In order to facilitate taking out the microelectronic relay chip after the chip performance test is completed, as shown in fig. 1-3, the tester for detecting the high and low temperature performance of the microelectronic relay chip comprises a bearing component 1 with a supporting structure detachably mounted at the top, the bearing component 1 comprises a bearing plate 101 with an upper end surface fixedly mounted in the middle and a test base 103, a rectangular through groove is formed in the middle of the bottom of the inner wall of the test base 103, a pushing plate 104 is movably mounted in the rectangular through groove, electric telescopic rods 105 are symmetrically and fixedly mounted on the lower end surface of the bearing plate 101, rods of the electric telescopic rods 105 extend out and are fixedly connected to the lower end surface of the pushing plate 104, the bearing plate 101, the test base 103, the pushing plate 104 and the electric telescopic rods 105 are arranged, a chip to be tested can be placed in the test base 103, the performance of the chip can be tested through the test base 103, after the chip performance test is completed, the rods 105 can be started to extend out, so that the pushing plate 104 can push the chip in the test base 103 out, and the chip can be taken out conveniently.

For buffering in the process of contact between the fastening cover 9 and the test base 103, as shown in fig. 1 and fig. 4, the support structure comprises two support plates 2 symmetrically arranged, a bearing plate 5 is jointly constructed and connected between the opposite top surfaces of the two support plates 2, a mounting plate 6 is detachably mounted on the upper end surface of the bearing plate 5, a pneumatic telescopic rod 7 is fixedly mounted on the upper end surface of the mounting plate 6 in the middle, a rod of the pneumatic telescopic rod 7 extends out and is fixedly connected with a rectangular plate 8, a fastening cover 9 fastened to the top of the test base 103 is movably mounted on one surface of the rectangular plate 8 far away from the bearing plate 5, a positioning rod 10 is symmetrically constructed on the upper end surface of the fastening cover 9, one end of the positioning rod 10 far away from the fastening cover 9 extends out of the rectangular plate 8 and is constructed with a limiting plate 11, a pressure-bearing spring 12 abutted between the fastening cover 9 and the rectangular plate 8 is sleeved on the outer edge surface of the positioning rod 10, the support plate 2, the bearing plate 5, the mounting plate 6, the pneumatic telescopic rod 7, the rectangular plate 8, the fastening cover 9, the positioning rod 10, the mounting plate 9 can be pushed to move towards the test base 103 and can avoid the impact force generated by the impact of the test base 9 and the impact-testing base 103.

In order to facilitate the disassembly and assembly of the supporting assembly, as shown in fig. 1, the bottom of the facing surface of the two supporting plates 2 is configured with a fixing plate 3, and the upper end surface of the fixing plate 3 is centrally provided with a fixing bolt 4, one end of which can be screwed into the bearing plate 101.

In order to create a high-temperature and low-temperature test environment, as shown in fig. 1 to 3, H-shaped supporting legs 102 are configured on four sides of the lower end surface of the loading plate 101, and a heating plate 106 and a cooling plate 107 are symmetrically and fixedly installed in the test base 103.

The working principle is as follows: this detect high low temperature capability tester of microelectronic relay chip, in use, can arrange the chip that awaits measuring in test base 103 in, test base 103 tests the performance of chip through testing base 103, and after switching on heating plate 106 and refrigeration piece 107 respectively, can build high temperature and low temperature environment in test base 103, simulate the performance of test chip under high temperature and low temperature environment, through starting pneumatic telescopic rod 7, can make the member of pneumatic telescopic rod 7 stretch out and promote the rectangular plate 8 and remove, make lock joint lid 9 remove towards test base 103, after lock joint lid 9 and test base 103 looks butt, can realize the contact buffering of lock joint lid 9 and test base 103 through the elastic force effect of pressure-bearing spring 12, after the chip capability test is accomplished, the accessible starts electric telescopic rod 105, make the member of electric telescopic rod 105 stretch out, thereby can promote the crowded board 104 and remove, push out the chip in the test base 103 through crowded board 104, realize taking out of chip, this detect microelectronic relay chip high low temperature capability tester, and reasonable in structure, be convenient for take out after the chip test is accomplished, therefore, the clothes hanger is strong in practicability.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A tester for detecting high and low temperature performance of a microelectronic relay chip comprises a bearing assembly (1) with a supporting structure detachably mounted at the top;

the method is characterized in that: bearing component (1) includes that up end fixed mounting has bearing board (101) of test base (103) placed in the middle, the rectangle is led to the groove has been seted up between two parties to the inner wall bottom of test base (103), and the inslot mobile installation of rectangle leads to pushes away crowded board (104), the lower terminal surface symmetry fixed mounting of bearing board (101) has electric telescopic handle (105), electric telescopic handle (105)'s member stretches out and fixed connection in the lower terminal surface that pushes away crowded board (104).

2. The tester for detecting the high and low temperature performance of the microelectronic relay chip according to claim 1, characterized in that: the supporting structure comprises two supporting plates (2) which are symmetrically arranged, a bearing plate (5) is jointly constructed and connected between the tops of the opposite surfaces of the two supporting plates (2), and a mounting plate (6) is symmetrically and detachably mounted on the upper end surface of the bearing plate (5).

3. The tester for detecting the high and low temperature performance of the microelectronic relay chip according to claim 2, characterized in that: the up end fixed mounting between two parties of mounting panel (6) has pneumatic telescopic link (7), the member of pneumatic telescopic link (7) stretches out and fixedly connected with rectangular plate (8).

4. The tester for detecting the high and low temperature performance of the microelectronic relay chip according to claim 3, characterized in that: one surface of the rectangular plate (8) far away from the bearing plate (5) is movably provided with a fastening cover (9) fastened at the top of the test base (103), and the upper end face of the fastening cover (9) is symmetrically provided with a positioning rod (10).

5. The tester for detecting the high and low temperature performance of the microelectronic relay chip according to claim 4, wherein: one end of the positioning rod (10) far away from the buckling cover (9) extends out of the rectangular plate (8) and is constructed with a limiting plate (11), and a pressure-bearing spring (12) which is abutted between the buckling cover (9) and the rectangular plate (8) is sleeved on the outer edge surface of the positioning rod (10).

6. The tester for detecting the high and low temperature performance of the microelectronic relay chip according to claim 2, characterized in that: the bottom of the opposite surface of the two support plates (2) is provided with a fixing plate (3), and the upper end surface of the fixing plate (3) is provided with a fixing bolt (4) with one end capable of being screwed into the bearing plate (101) in the middle.

7. The tester for detecting the high and low temperature performance of the microelectronic relay chip according to claim 1, characterized in that: h-shaped supporting legs (102) are constructed on four sides of the lower end face of the bearing plate (101), and heating sheets (106) and refrigerating sheets (107) are symmetrically and fixedly installed in the testing base (103).