CN218099278U - Structure for preventing SOC chip from being crushed in test - Google Patents

Abstract

The utility model aims at providing an elastic support, reliability height prevent SOC chip by the structure of crushing in the test. The utility model discloses a test module, test module is including fixed supporting shoe, PCB board, SOC chip and enhancement piece, and it is still including preventing weighing wounded the module, it includes base, unsteady supporting shoe and stopper to prevent weighing wounded the module, unsteady supporting shoe through wait the altitude screw with the base is connected, unsteady supporting shoe with be provided with a plurality of springs between the base, the stopper sets up on the base, the stopper with the spacing cooperation of unsteady supporting shoe, the base is provided with the uide pin, unsteady supporting shoe be provided with uide pin matched with guiding hole, unsteady supporting shoe upper surface is provided with the profile modeling groove, the profile modeling groove is including the enhancement piece profile modeling groove that is located the middle part and two keep away the position groove that is located both sides around being located. The utility model relates to a product test protection architecture.

Description

Structure for preventing SOC chip from being crushed in test

Technical Field

The utility model relates to a product test protection architecture specifically relates to a prevent structure that SOC chip was crushed in the test.

Background

Along with electronic product's development, PCB mainboard function is more and more powerful, and the computing power of SOC chip is higher and more high, and the consumption of SOC also increases thereupon, and the heat that the SOC chip produced can sharply increase, in order to guarantee going on smoothly of test, needs carry out the contact heat dissipation to the SOC chip. Generally, a heat sink is used to dissipate heat from the SOC chip, and in order to efficiently transfer the heat of the SOC chip to the heat sink, the heat sink needs to apply a relatively large pressure to the SOC chip to ensure good contact between the heat sink and the SOC chip.

The existing solution is that after a certain force is applied to the SOC chip by the radiator, the PCB mainboard is supported by the maximized rigid support below the SOC chip, so that the SOC chip is prevented from being deformed due to the external force of the radiator, and the SOC chip is prevented from being damaged, but a large number of components and PCB reinforcing pieces are arranged below the SOC chip, the thickness of the PCB reinforcing pieces cannot be controlled, at the moment, the rigid support is added to the PCB mainboard without a method, at present, the SOC chip is prevented from being deformed and damaged by reducing the force applied to the SOC chip by the radiator, but the smaller force can increase the thermal resistance of the radiator, at the moment, the radiator with a more complex structure and higher cost is required to offset the adverse effect caused by the increased thermal resistance, and the over-high cost can reduce the competitiveness of the product.

For example, a chinese utility model patent of publication No. CN207586365U discloses a prevent weighing wounded and leak protection survey's PCB testing arrangement, responds to through two supports and the infrared induction head that sets up on the support in this application, realizes preventing weighing wounded's function through data feedback manual control, has reached the effect of preventing weighing wounded although, but with high costs, needs the manual cooperation, has consequently increased the manufacturing cost and the cost of labor of device.

For example, a chinese utility model patent with publication number CN212514699U discloses a crush-proof PCB board testing device, this application utilizes the probe that is provided with the spring to realize the crush-proof effect, but for the test of SOC chip, it is necessary to make the radiator and SOC chip carry out contact type heat dissipation, so compared with the conventional one, it can produce bigger contact force more easily, therefore, only adopt the probe that has the spring to test can't realize the crush-proof effect to the SOC chip, therefore, need the PCB reinforcing sheet to carry out the auxiliary stay, and only use the conventional PCB reinforcing sheet, its support effect can't satisfy the pressure that the radiator brought for the SOC chip completely, therefore, need the design of more suitable crush-proof structure.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide a structure that elastic support, reliability height prevent that the SOC chip from being weigh wounded in the test, solve current radiator and push down can cause the damage to the SOC chip, and improve radiator self performance cost too high scheduling problem.

The utility model adopts the technical proposal that: the utility model discloses a test module, test module includes fixed stay block, PCB board, SOC chip and enhancement piece, the PCB board sets up on the fixed stay block, the SOC chip sets up on the PCB board, the enhancement piece sets up SOC chip below, it still includes prevents weighing wounded the module, it includes base, floating support piece and stopper to prevent weighing wounded the module, floating support piece through such as high screw with the base is connected, floating support piece with be provided with a plurality of springs between the base, the stopper sets up on the base, the stopper with the spacing cooperation of floating support piece, the base is provided with the uide pin, floating support piece be provided with the uide pin matched with guiding hole, floating support piece upper surface is provided with the profile groove, the profile groove is including the enhancement piece profile groove that is located the middle part and two keep away the position groove that is located both sides around, strengthen the piece profile groove with the enhancement piece cooperatees, keep away the groove with PCB board cooperatees.

According to the above technical scheme, the utility model discloses a floating structure removes to support the SOC chip back strengthen the piece, support the bottom the absorption that the spring can be fine strengthen the thickness tolerance of piece, and the utility model discloses the elasticity that produces is applyed with external radiator the power on the SOC chip is opposite, can offset each other, avoids the SOC chip takes place too big deformation when the test and right the SOC chip causes the damage, strengthen the piece profile groove and can not only provide strengthen piece part holding power, can also with strengthen the piece spacing strengthen reducing in the piece profile groove strengthen rocking of piece, improve the supporting effect, prevent the landing, it can with to keep away the position groove electronic components on the PCB board avoids, thereby realizes right the protection of PCB board.

According to a preferable scheme, the floating supporting block comprises two mounting blocks, limiting grooves are formed in the mounting blocks, the guide holes are formed in the limiting grooves, limiting protrusions in limiting fit with the limiting grooves are arranged on the limiting blocks, and reserved grooves separated from the guide pins are formed in the limiting protrusions.

According to the scheme, in the process that the floating supporting block moves up and down, the guide pin is matched with the guide hole to guide and limit, the limit groove is matched with the limit bulge, the height of the floating supporting block is limited, the safety of the up-and-down movement of the floating supporting block is guaranteed, and the secondary limit of the floating supporting block in the horizontal direction is realized.

One preferred scheme is that the base is a gantry structure, and a heat dissipation device is arranged right below the gantry structure.

According to the above technical scheme, the utility model discloses a will the base sets up to gantry structure, can increase the space of bottom to increased radiator unit's the region of placing, provided sufficient assembly space for radiator unit, thereby improved the utility model discloses a radiating effect.

One preferred scheme is that the reinforcing sheet profiling groove is provided with a pressure relief opening.

By the above scheme visibly, the pressure release opening can be placed when pressure increases, prevents strengthen the piece profile modeling inslot and form airtight space, probably take place quick resilience damage when preventing to reset the SOC chip has improved the utility model discloses the security.

Preferably, the avoiding groove is provided with avoiding openings at four corners of the edge.

By the above technical scheme, keep away a opening and can prevent to produce the negative pressure, can also prevent work or change during the PCB board with the PCB board produces to cut to pieces to rub or damage, improved the utility model discloses the security.

Drawings

Fig. 1 is a schematic view of the vertical plane structure of the present invention;

FIG. 2 is a schematic perspective view of the anti-crush module;

FIG. 3 is an exploded perspective view of the crush injury prevention module;

fig. 4 is a perspective view of the floating support block.

Detailed Description

In order to clearly understand the features and advantages of the present invention, the present invention will be further described below by way of example with reference to fig. 1 to 4. In this embodiment, the utility model discloses a test module, test module includes fixed supporting shoe 1, PCB board 2, SOC chip 3 and enhancement piece 4, PCB board 2 sets up on the fixed supporting shoe 1, SOC chip 3 sets up on the PCB board 2, it sets up to strengthen piece 4 SOC chip 3 below, its characterized in that, it still includes prevents weighing wounded the module, it includes base 5, supporting shoe 6 and stopper 7 to prevent weighing wounded, supporting shoe 6 that floats through wait high screw with base 5 is connected, supporting shoe 6 that floats with be provided with a plurality of springs 51 between the base 5, stopper 7 sets up on the base 5, stopper 7 with the spacing cooperation of supporting shoe 6 that floats, base 5 is provided with uide pin 52, supporting shoe 6 that floats be provided with the uide pin 52 matched with guiding hole 61, the 6 upper surface that floats is provided with imitative groove 62, imitative groove 62 keeps away the position groove 622 that the enhancement piece 621 and two front and back sides that are located the middle part, strengthen the piece 4 with strengthen the imitative groove 4 cooperation of imitative piece, PCB board 2 cooperatees.

In this embodiment, the floating support block 6 includes two installation blocks 63, the installation block 63 is provided with a limiting groove 631, the guide hole 61 is disposed in the limiting groove 631, the limiting block 7 is provided with a limiting protrusion 71 in limiting fit with the limiting groove 631, and the limiting protrusion 71 is provided with a preformed groove separated from the guide pin 52.

In this embodiment, the base 5 is configured as a gantry structure, and a heat dissipation device is disposed under the gantry structure.

In this embodiment, the reinforcing sheet profile groove 621 is provided with a pressure relief opening.

In this embodiment, the avoiding groove 622 is provided with avoiding openings at four corners of the edge.

The utility model discloses a theory of operation:

the utility model discloses a floating structure removes the support 3 backs of SOC chip strengthen piece 4, support the bottom the absorption that the spring can be fine strengthen the thickness tolerance of piece 4, and the utility model discloses the elasticity of production is exerted with external radiator the last power of SOC chip 3 is opposite, can offset each other, avoids SOC chip 3 takes place too big deformation when the test and is right SOC chip 3 causes the damage, strengthen 4 partial holding power of piece, can also with strengthen 4 spacing strengthen piece copy inslot reduces strengthen rocking of piece copy 621, improve the supporting effect, prevent the landing, keep away a groove 622 can with electronic components on the PCB board avoids to it is right to realize PCB board 2's protection.

In the process that the floating supporting block moves up and down, the guide pin is matched with the guide hole to guide and limit, and then the limit groove is matched with the limit bulge, so that the height of the floating supporting block is limited to ensure the safety of the floating supporting block during moving up and down, and secondary limit on the floating supporting block in the horizontal direction is realized.

The utility model discloses a will the base sets up to gantry structure, can increase the space of bottom to increased radiator unit's the region of placing, provided sufficient assembly space for radiator unit, thereby improved the utility model discloses a radiating effect. Pressure release opening can be placed when pressure increases, prevents strengthen the piece profile modeling inslot and form airtight space, probably take place quick resilience damage when preventing to reset SOC chip has improved the utility model discloses the security. Keep away a position opening and can prevent to produce the negative pressure, can also prevent to work or change during the PCB board with the PCB board produces to cut rubbing or damage, improved the utility model discloses the security.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications and combinations with other embodiments will be apparent to those skilled in the art in light of the description.

Claims (5)

1. The structure for preventing the SOC chip from being crushed in the test comprises a test module, wherein the test module comprises a fixed supporting block (1), a PCB (2), the SOC chip (3) and a reinforcing sheet (4), the PCB (2) is arranged on the fixed supporting block (1), the SOC chip (3) is arranged on the PCB (2), the reinforcing sheet (4) is arranged below the SOC chip (3), the structure is characterized by further comprising a crush-proof module, the crush-proof module comprises a base (5), a floating supporting block (6) and a limiting block (7), the floating supporting block (6) is connected with the base (5) through an equal-height screw, a plurality of springs (51) are arranged between the floating supporting block (6) and the base (5), the limiting block (7) is arranged on the base (5), the limiting block (7) is in limit fit with the floating supporting block (6), the base (5) is provided with a guide pin (52), the floating supporting block (6) is provided with a guide hole (52) matched with the guide pin (61), the middle part of the floating supporting block (6) is provided with a copying groove (62), the upper surface (62) and two upper surfaces of the copying groove (622) are positioned on the front and the back of the reinforcing sheet (62), strengthen piece profile groove (621) with strengthen piece (4) and cooperate, keep away position groove (622) with PCB board (2) cooperate.

2. The structure for preventing the SOC chip from being crushed during the test according to claim 1, wherein the floating support block (6) comprises two mounting blocks (63), the mounting blocks (63) are provided with limit grooves (631), the guide holes (61) are disposed in the limit grooves (631), the limit blocks (7) are provided with limit protrusions (71) in limit fit with the limit grooves (631), and the limit protrusions (71) are provided with pre-grooves separated from the guide pins (52).

3. The structure for preventing the SOC chip from being crushed in the test according to claim 1, wherein the base (5) is configured as a gantry structure, and a heat sink is disposed right below the gantry structure.

4. The structure for preventing the SOC chip from being damaged by pressure during the test according to claim 1, wherein the dummy grooves (621) are provided with pressure relief openings.

5. The structure for preventing the SOC chip from being damaged by pressure during the test as claimed in claim 1, wherein the avoiding slots (622) are provided with avoiding openings at four corners of the edge.

Images